JP6076048B2 - Imaging apparatus and endoscope - Google Patents

Description

  The present invention relates to an image pickup apparatus having an image pickup element chip and an endoscope including the image pickup apparatus, and more particularly to an image pickup apparatus having a wiring board for connecting an image pickup element chip and a signal cable, and an endoscope including the image pickup apparatus. About.

  An imaging device having an imaging element chip is used, for example, provided at the distal end portion of an endoscope. In order to relieve the pain of the subject, it is important to reduce the diameter of the distal end portion of the endoscope.

  As shown in FIG. 1, Japanese Patent Application Laid-Open No. 2011-217887 includes an image sensor chip 110, a block 120 that is a heat dissipation member, a wiring board 130 on which an electronic component 139 is mounted, and a signal cable 140. An imaging device 101 is described. The imaging element chip 110 has an imaging unit 111 on the front surface 110SA, and a plurality of joint terminals (not shown) on the back surface 110SB. The junction terminal is joined to a junction electrode (not shown) of the wiring board 130. The joining electrode is connected to the terminal electrode 132 joined to the conducting wire 141 of the signal cable 140 through wiring (not shown).

  The wiring board 130 includes a central portion 130M joined to the imaging element chip 110, and extending portions 130S1 and 130S2 extending from the central portion 130M to both sides. The extending portions 130S1 and 130S2 are bent inward. For this reason, the wiring board 130 is contained in the space (in the projection plane) 110 </ b> S of the extended space of the projection plane of the image sensor chip 110. In the imaging apparatus 101, heat generated by the imaging element chip 110 is transferred to the block 120 through the wiring board 130.

  However, in the imaging apparatus 101, if the heat transfer function of the wiring board 130 between the imaging element chip 110 and the block 120 is not sufficient, the temperature of the imaging element chip 110 may increase and the image may deteriorate.

  Japanese Unexamined Patent Application Publication No. 2010-199352 describes a circuit board provided with a signal pattern, a power supply pattern, and a heat dissipation pattern. The heat dissipation pattern is in a region excluding the signal pattern and the power supply pattern and is electrically connected to the power supply pattern.

  However, when the circuit board is used in an imaging device that generates a large amount of heat, the amount of heat that can be dissipated from the heat radiation pattern may not be sufficient, and is especially placed at the distal end of an endoscope where it is important to reduce the diameter. It has not been easy to apply as it is to an ultra-small imaging device.

Japanese Unexamined Patent Publication No. 2011-217887 JP 2010-199352 A

  An object of the present invention is to provide an imaging device that has excellent heat dissipation characteristics that can be disposed in a narrow space, and an endoscope that includes the imaging device.

An imaging device according to an embodiment of the present invention has an imaging unit on the front surface, an imaging element chip having a junction terminal on the back surface connected to the imaging unit via a through-wiring, and the imaging unit connected to the imaging unit chip. A signal cable having a conductive wire, a central portion and a plurality of extending portions extending from the central portion, and formed in the central portion, a bonding electrode bonded to the bonding terminal, and the extending A terminal electrode joined to the conducting wire, a wiring connecting the joining electrode and the terminal electrode, and a region where the joining electrode, the terminal electrode and the wiring are not formed. A heat transfer pattern, and a wiring board disposed in a projection plane of the image pickup device chip by bending the extending portion, and the image pickup device chip is connected to the bonding plate. The same shape as the terminal, the imaging unit, A dummy connecting terminals that are not connected except in ground potential line on the back surface, the wiring board is the same shape as the bonding electrode has a dummy bonding electrode joined to the dummy connecting terminals.

An endoscope according to another embodiment has an imaging unit on the front surface, an imaging element chip on the back surface having a junction terminal connected to the imaging unit via a through-wiring, and is connected to the imaging unit. A signal cable having a conductive wire, a central portion and a plurality of extending portions extending from the central portion, and formed in the central portion, a bonding electrode bonded to the bonding terminal, and the extending A terminal electrode joined to the conducting wire, a wiring connecting the joining electrode and the terminal electrode, and a region where the joining electrode, the terminal electrode and the wiring are not formed. A heat transfer pattern, and a wiring board disposed in a projection plane of the image pickup device chip by bending the extending portion, and the image pickup device chip is connected to the bonding plate. The same shape as the terminal, the imaging unit and the ground A dummy connecting terminals that are not connected except in lines to the back surface, the wiring board is the same shape as the bonding electrode, arrangement in the imaging device tip having a dummy bonding electrode joined to the dummy connecting terminals An insertion portion provided; an operation portion disposed on the proximal end side of the insertion portion; and a universal cord extending from the operation portion.

  ADVANTAGE OF THE INVENTION According to this invention, the endoscope which comprises the imaging device excellent in the thermal radiation characteristic which can be arrange | positioned in a narrow space, and the said imaging device can be provided.

It is a perspective view of the conventional imaging device. It is a perspective view of the imaging device of a 1st embodiment. It is sectional drawing of the imaging device of 1st Embodiment. It is a top view of the back surface of the image pick-up element chip | tip of the imaging device of 1st Embodiment. It is an exploded sectional view for explaining the manufacturing method of the imaging device of a 1st embodiment. It is a top view of the 1st main surface of the wiring board of the imaging device of 1st Embodiment. It is a top view of the 2nd main surface of the wiring board of the imaging device of 1st Embodiment. It is a top view of the 1st main surface of the wiring board of the imaging device of 2nd Embodiment. It is a top view of the 2nd main surface of the wiring board of the imaging device of 2nd Embodiment. It is a top view of the 1st main surface of the wiring board of the imaging device of 3rd Embodiment. It is a top view of the 2nd main surface of the wiring board of the imaging device of 3rd Embodiment. It is a top view of the 1st main surface of the wiring board of the imaging device of 4th Embodiment. It is a top view of the 2nd main surface of the wiring board of the imaging device of 4th Embodiment. It is a disassembled perspective view of the imaging device of 4th Embodiment. It is sectional drawing of the imaging device of 5th Embodiment. It is sectional drawing of the imaging device of 6th Embodiment. It is an external view of the endoscope of 7th Embodiment.

<First Embodiment>
As shown in FIGS. 2 and 3, the imaging device 1 of the first embodiment is similar to the conventional imaging device 101 described above. That is, the imaging device 1 includes an imaging element chip 10, a wiring board 30, and a signal cable (hereinafter also simply referred to as “cable”) 40.

  The wiring board 30 includes a central portion 30M where the imaging element chip 10 and the first main surface 30SA side are joined, and extending portions 30S1 and 30S2 extending from the central portion 30M to both sides. The extending portions 30S1 and 30S2 are bent toward the second main surface 30SB. For this reason, the wiring board 30 is contained in the interior (in the projection plane) 10S of the extended space of the projection plane of the image sensor chip 10.

  The imaging element chip 10 made of a semiconductor has an imaging unit 11 of, for example, a CMOS element, which is a solid-state imaging element, formed on the front surface 10SA. The imaging element chip 10 has a plurality of junction terminals 12 on the back surface 10SB connected to the imaging unit 11 of the front surface 10SA via the respective through wirings 13. In addition, although the wiring which connects the imaging part 11 and the penetration wiring 13 is formed in the front surface 10SA, it is not illustrated.

  The imaging element chip 10 is manufactured by, for example, forming a large number of imaging units 11 and through wirings 13 on a silicon substrate using a known semiconductor process and then cutting the imaging unit chip 10. For this reason, the planar view shape of the imaging element chip 10 is substantially rectangular. The planar view size of the image pickup element chip 10, in other words, the area of the main surface is preferably small for reducing the diameter of the image pickup apparatus 1.

  Here, as shown in FIG. 3 and FIG. 4, the imaging element chip 10 of the imaging apparatus 1 apparently has 16 joint terminals 12 having the same shape. However, eight of them are dummy junction terminals 12 </ b> D that are not connected to the imaging unit 11. In FIG. 4, the dummy junction terminals 12D are indicated by white circles. That is, a junction terminal 12V that supplies power to the imaging unit 11, two junction terminals 12P that supply a pulse signal to the imaging unit 11, four junction terminals 12S that transmit and receive signals to and from the imaging unit 11, and the imaging unit 11 Eight of the 8 junction terminals 12G to be grounded are dummy junction terminals 12D.

  The junction terminal 12V is connected to a conductor 41V that supplies power of the cable 40, the junction terminal 12P is connected to a conductor 41P that supplies a pulse signal, and the junction terminal 12S is connected to a conductor 41S that transmits and receives signals. The junction terminal 12G is connected to a conductor 41G having a ground potential. (Hereinafter, the conductive wires 41V, 41P, 41S and 41G are also simply referred to as “conductive wires 41”, respectively.)

  The number and arrangement of the junction terminals 12 and the dummy junction terminals 12D are selected according to the specifications of the imaging device. Further, the function and the like of the junction terminal 12 are not limited to the above configuration. For example, the number of the junction terminals 12P may be one, and the number of the junction terminals 12G may be plural. (Hereinafter, the dummy junction terminal 12D and the junction terminals 12V, 12P, 12S, and 12G are also simply referred to as “joint terminals 12”.)

  The terminal electrode 32 of the wiring board 30 and the conducting wire 41 of the cable 40 are joined by, for example, solder 49. Note that the ground potential lead 41G may be a shield wire covering the periphery of another lead. Moreover, each conducting wire may have a shield wire. In particular, the conductive wires 41P and 41S that are likely to cause noise or are susceptible to noise are preferably shielded wires. The cable 40 does not need to be disposed in the extended space of the projection plane (hereinafter simply referred to as “in the projection plane”) 10S over the entire length, and at least the joint portion with the wiring board 30 is disposed in the projection plane 10S. Just do it.

  As shown in FIGS. 5 and 6, the wiring board 30 captures an image by bending the extension portions 30S1 and 30S2 with the first main surface 30SA on the outside (the second main surface 30SB on the inside). The element chip 10 is arranged in the projection plane 10S. The bending angle θv is preferably 90 to 50 degrees, particularly preferably 75 to 55 degrees, for example, 65 degrees. If the bending angle θv is within the above range, the joint portion of the wiring board 30 and the cable 40 can be arranged in the projection plane 10S of the image sensor chip 10. As will be described later, the bending angle θv may be most preferably 90 degrees.

  Since the wiring board 30 is a single flexible wiring board, the boundaries between the central portion 30M and the extending portions 30S1 and 30S2 are not clearly defined. The wiring board may be a rigid flexible wiring board in which at least a bent portion is flexible, and a part or all of the central portion 30M and the extended portions 30S1 and 30S2 are formed of a hard substrate.

  The wiring board 30 has a bonding electrode 31 bonded to the bonding terminal 12 of the imaging element chip 10 at the central portion 30M of the first main surface 30SA. The wiring board 30 apparently has 16 junction electrodes 31, of which 8 are dummy junction electrodes 31 </ b> D that are not connected to the imaging unit 11.

  Each of the eight dummy junction electrodes 31D is also joined to the dummy junction terminal 12D of the imaging element chip 10. For this reason, the imaging device 1 can easily join the imaging element chip 10 and the wiring board 30 in parallel, and has a high joining strength. Furthermore, the heat generated by the imaging element chip 10 can be more efficiently transferred to the wiring board 30.

  As shown in FIG. 3, the space between the image sensor chip 10 and the wiring board 30 is preferably sealed with a sealing resin 19. Gold bumps, solder balls, ACP (anisotropic conductive resin), ACF (anisotropic conductive film), or the like is used for bonding the bonding terminal 12 and the bonding electrode 31.

  The bonding electrode 31 of the first main surface 30SA is connected to the wiring 33 of the second main surface 30SB via the through wiring 34A, and the wiring 33 is connected to the extension portions 30S1 and 30S2 via the through wiring 34B. 1 is connected to the terminal electrode 32 of the main surface 30SA. Hereinafter, the through wirings 34 </ b> A and 34 </ b> B are referred to as the through wiring 34. Note that the dummy junction electrode 31D may also have a connection portion on the second main surface 30SB by a through wiring. However, the dummy junction electrode 31D is not connected to anything other than the ground potential line (conductive wire 41G).

  Since the wiring board 30 is a double-sided wiring board, the bonding electrode 31 and the terminal electrode 32 are connected via the wiring 33 and the through wirings 34A and 34B. In the case of a single-sided board, the bonding electrode 31 and the terminal electrode are connected. A through-wiring is not required for the connection to 32. Conversely, a multilayer wiring board having three or more wiring layers may be used. Further, an electronic component may be mounted in the middle of the wiring 33. As electronic components, necessary components are selected from a chip capacitor, a chip resistor, a signal processing IC, a driver IC, a power supply IC, a diode, a coil, or a reed switch.

  As shown in FIGS. 6 and 7, the wiring board 30 has a heat transfer pattern 35 formed in a region where the bonding electrode 31 and the terminal electrode 32 are not formed on the first main surface 30SA. In the wiring board 30 illustrated in FIG. 6, the heat transfer pattern 35 is formed from the central portion 30M of the first main surface 30SA to the extending portions 30S1 and 30S2 so as to surround the bonding electrode 31. The heat transfer pattern 35 transfers heat generated by the imaging unit 11 to the base end side.

  As shown in FIG. 7, no heat transfer pattern is formed on the second main surface 30SB, but the second heat transfer pattern may be formed in a region where the wiring 33 is not formed.

  The joining electrode 31, the terminal electrode 32, and the heat transfer pattern 35 are formed, for example, by pattern-etching a conductor film formed on the entire surface of the first main surface 30SA. That is, the conductor film is etched away in a frame shape so that the bonding electrode 31 and the heat transfer pattern 35 do not conduct. Of course, the heat transfer pattern 35 and the like may be formed by plating. Further, the heat transfer pattern 35 may be formed thicker than the bonding electrode 31 and the terminal electrode 32.

  The area of the heat transfer pattern 35 is preferably large, and particularly preferably 50% or more and 90% or less of the area of the first main surface 30SA. If it is more than the said range, the heat dissipation characteristic improvement effect will be remarkable, and if it is below the said range, the required area of the joining electrode 31 and the terminal electrode 32 is securable.

  In addition, the terminal electrode 32 and the wiring 33 are formed in at least one of the extended portion 30S1 or the extended portion 30S2, and the heat transfer pattern 35 is formed in at least one of the extended portion 30S1 or the extended portion 30S2. It only has to be done.

  Since the imaging apparatus 1 can arrange | position the wiring board 30 grade | etc., In a predetermined narrow space, it is easy to make an external dimension small. For this reason, the imaging device 1 can be stably disposed in a narrow space. The heat generated by the imaging element chip 10 is transferred to the base end side through the heat transfer pattern 35. For this reason, the imaging device 1 is excellent in heat dissipation characteristics.

  Further, since the dummy junction terminal 12D of the imaging element chip 10 and the dummy junction electrode 31D of the wiring board 30 are joined, the imaging device 1 is further excellent in heat dissipation characteristics.

Second Embodiment
Next, an imaging apparatus 1A according to the second embodiment will be described. Since the image pickup apparatus 1A is similar to the image pickup apparatus 1, the same components are denoted by the same reference numerals and description thereof is omitted.

  As shown in FIG. 8, in the wiring board 30A of the imaging apparatus 1A, the terminal electrode 32G joined to the conductor 41G having the ground potential of the cable 40 is integrated with the heat transfer pattern 35A. The dummy bonding electrode 31D is also integrated with the heat transfer pattern 35A. That is, the dummy junction electrode 31D and the heat transfer pattern 35A are connected. The first main surface 30SA of the wiring board 30A is covered with a resin layer (not shown) except for the bonding area with the bonding terminal 12 of the imaging element chip 10.

  The image pickup apparatus 1A has the effects of the image pickup apparatus 1, and further, since the heat transfer pattern 35 having a large area is at the ground potential, noise emission caused by signal transmission / reception and the like is prevented and the influence of external noise It is hard to receive.

<Third Embodiment>
Next, the imaging device 1B of the third embodiment will be described. Since the imaging device 1B is similar to the imaging devices 1 and 1A, the same components are denoted by the same reference numerals and description thereof is omitted.

  As shown in FIGS. 10 and 11, the wiring board 30 </ b> B of the imaging device 1 </ b> B includes a power supply wiring 33 </ b> V that supplies power to the imaging unit 11 on the first main surface 30 </ b> SA and a conductive wire 41 </ b> P that supplies a clock signal that is a pulse signal. Terminal electrode 32P and pulse wiring 33P to be joined to each other, and heat transfer pattern 35B, and terminal electrode 32S and signal wiring to be joined to second main surface 30SB and conducting wire 41S for transmitting and receiving signals to and from imaging unit 11 33S.

  The imaging device 1B has the effects of the imaging devices 1 and 1A. Further, since the pulse wiring 33P and the signal wiring 33S are formed on different main surfaces of the wiring board 30B, it is possible to prevent deterioration of the received image due to signal interference. .

  As long as the pulse wiring 33P and the signal wiring 33S are formed on different main surfaces of the wiring board, the number and arrangement are not limited to the above configuration, and are selected according to the specifications of the imaging device.

  Furthermore, since the wiring board 30B has the second heat transfer pattern 35BB having the ground potential also on the second main surface 30SB, the imaging device 1B has a higher heat dissipation effect and shielding effect than the imaging devices 1 and 1A.

<Fourth embodiment>
Next, an imaging apparatus 1C according to the fourth embodiment will be described. Since the imaging apparatus 1C is similar to the imaging apparatuses 1 to 1B, the same components are denoted by the same reference numerals and description thereof is omitted.

  As illustrated in FIGS. 12 and 13, the wiring board 30 </ b> C of the imaging device 1 </ b> C includes a substantially square center portion 30 </ b> M and four approximately rectangular extension portions 30 </ b> S <b> 1 extending from the center portion 30 </ b> M in directions orthogonal to each other. 30S4.

  As shown in FIG. 14, the four extending portions 30 </ b> S <b> 1 to 30 </ b> S <b> 4 are all bent inward, so that the wiring board 30 </ b> C is disposed in the projection plane 10 </ b> S of the imaging element chip 10.

  In addition, in order to arrange | position the junction part of the terminal electrode 32 and the conducting wire 41 in 10S within a projection surface, although bending angle (theta) v of extension part 30S1, 30S2 is 75-55 degree | times, extension part 30S3, 30S4. The bending angle θv is approximately 90 degrees.

  The image capturing apparatus 1C has the effects of the image capturing apparatuses 1 to 1B, and the heat transfer patterns 35C and 35CB are also formed in the extending portions 30S3 and 30S4. In particular, since the wiring 33 and the like are not formed in the extended portions 30S3 and 30S4, a heat transfer pattern having a larger area can be formed.

  Needless to say, the same effect as that of the imaging apparatus 1 </ b> C can be obtained even in an imaging apparatus including a wiring board having three extending portions extending in directions orthogonal to each other.

<Fifth Embodiment>
Next, an imaging apparatus 1D according to the fifth embodiment will be described. Since the imaging device 1D is similar to the imaging devices 1 to 1C, the same components are denoted by the same reference numerals and description thereof is omitted.

  As shown in FIG. 15, in the imaging apparatus 1D, a cover glass 51 bonded to the front surface 10SA of the imaging element chip 10, an optical unit 52 made of a lens and its support, and an outer cylinder part 50 made of metal. And further. Note that FIG. 16 is a schematic diagram in which cross-sectional views along different planes are combined for easy explanation, and the wiring 33 and the like are not shown. In addition, the optical unit 52 is typically configured by an optical member such as a plurality of lenses, a fixing member, and a support body.

  The distal end portion of the cable 40, the imaging element chip 10, the cover glass 51, and the wiring board 30 are accommodated in the outer cylinder portion 50. That is, the inner dimension of the outer cylinder part 50 is substantially equal to the projection surface of the image sensor chip 10. The outer cylinder portion 50 is filled with a non-conductive resin 53 having a high thermal conductivity such as silicon resin.

  Furthermore, the imaging device 1D includes a block 20 that is a heat radiating member with which the extended portion is in contact. The block 20 is in contact with the second main surface 30SB of the wiring board 30 and functions as a fixing member that arranges the wiring board 30 in a predetermined space, that is, in the projection surface 10S of the imaging element chip 10. Have. Further, since the block 20 holds the wiring board 30 stably, the joining operation of the cable 40 to the wiring board 30 is facilitated.

  The block 20 also has a function as a reinforcing member that integrally holds the imaging element chip 10 and the wiring board 30 and increases mechanical strength. That is, since the imaging element chip 10 is made of, for example, a silicon substrate, the imaging element chip 10 may be deformed or damaged by an external force. However, the mechanical strength of the image sensor chip 10 is increased when the block 20 is joined via the wiring board 30. Similarly, when the wiring board 30 is joined to the block 20, the flexibility is substantially lost, but the strength is increased.

Further, in the image pickup apparatus 1D, since the wiring board 30 is fixed in contact with the block 20, it is always bent at a predetermined angle without using a special jig or the like at the time of bending. That is, the imaging device 1 D can be readily disposed of wiring board 30 or the like to a predetermined narrow space.

  In this specification, “contact” includes not only the case of direct contact without any other member but also the case of bonding through a thin bonding layer. For example, a silicon resin having high thermal conductivity can be preferably used as the bonding layer.

The cable 40 of the imaging device 1D has a shield wire 42 made of mesh-like metal that covers the plurality of conductive wires 41. And the shield wire 42 is joined with the block 20 and the outer cylinder part 50 which are heat-transfer members . For this reason, the heat of the block 20 and the outer cylinder part 50 is efficiently transmitted to the base end part side via the shield wire 42 with high heat conductivity.

  The imaging device 1D has the effects of the imaging devices 1 to 1C, is easy to manufacture, and has excellent heat dissipation characteristics.

<Sixth Embodiment>
Next, an imaging device 1E according to a sixth embodiment will be described. Since the imaging device 1E is similar to the imaging devices 1 to 1D, the same components are denoted by the same reference numerals and description thereof is omitted.

As illustrated in FIG. 16, the imaging device 1E includes a wiring board 30C having extending portions in four directions, like the imaging device 1C. Further, a part of the heat transfer pattern 35 </ b> C is in contact with the inner surface of the outer cylinder part 50. FIG. 17 is a schematic diagram similar to FIG. 15 , and the wiring 33 and the like are not shown.

  In the imaging device 1E, the heat generated by the imaging unit 11 is efficiently transferred to the outer cylinder unit 50 via the heat transfer pattern 35C. For this reason, the imaging device 1E has the effects of the imaging devices 1 to 1D, and further has excellent heat dissipation characteristics.

<Seventh embodiment>
Next, an endoscope 9 according to a seventh embodiment will be described. The endoscope 9 has imaging devices 1 to 1E at the distal end portion 2 of the insertion portion 3. Further, the endoscope 9 includes an operation unit 4 disposed on the proximal end side of the insertion unit 3 and a universal cord 5 extending from the operation unit 4.

  The operation unit 4 is provided with various switches and the like that are operated while being held by an operator. The cable 40 of the imaging device 1 is inserted into the insertion portion and the universal cord 5 and is connected to a main body (not shown) that performs image processing and the like via a connector disposed at the base end portion of the universal cord.

  Since the endoscope 9 includes the imaging devices 1 to 1E excellent in heat dissipation characteristics that can be disposed in a narrow space at the distal end portion, the distal end portion has a small diameter and is excellent in thermal stability.

  The present invention is not limited to the above-described embodiments, and various changes, combinations, modifications, and the like can be made without departing from the scope of the present invention.

DESCRIPTION OF SYMBOLS 1-1E ... Imaging device, 9 ... Endoscope, 10 ... Imaging element chip, 11 ... Imaging part, 12 ... Joint terminal, 12D ... Dummy joint terminal, 13 ... Through wiring, 19 ... sealing resin, 20 ... block, 30-30C ... wiring board, 30M ... central part, 30S1-30S4 ... extension part, 31 ... bonding electrode , 31D ... dummy junction electrode, 32 ... terminal electrode, 33 ... wiring, 34 ... through wiring, 35 ... heat transfer pattern, 40 ... cable, 41 ... conducting wire, 42 ... Shield wire, 50 ... Outer cylinder, 53 ... Non-conductive resin

Claims (9)

An imaging element chip having an imaging unit on the front surface and having a junction terminal on the back surface connected to the imaging unit via a through-wiring;
A signal cable having a conducting wire connected to the imaging unit;
The conductive wire formed of a central portion and a plurality of extended portions extending from the central portion, formed in the central portion, bonded to the bonding terminal, and formed in the extended portion. A terminal electrode joined to each other, a wiring connecting the joining electrode and the terminal electrode, and a heat transfer pattern formed in a region where the joining electrode, the terminal electrode and the wiring are not formed. And a wiring board disposed in the projection plane of the imaging element chip by bending the extending portion , and
The imaging element chip has the same shape as the junction terminal, and has a dummy junction terminal that is not connected to the imaging unit other than the ground potential line on the back surface,
The image pickup apparatus , wherein the wiring board has a dummy junction electrode having the same shape as the junction electrode and joined to the dummy junction terminal . The imaging apparatus according to claim 1, wherein said heat transfer pattern of the wiring board, characterized in that it is connected to the conductor of the ground potential of the signal cable. The wiring board is a double-sided wiring board having wiring layers on the first main surface and the second main surface, and supplies a power signal wiring that supplies power to the imaging unit and a pulse signal to the imaging unit The first main surface has a pulse wiring that is a wiring to be transmitted and the heat transfer pattern, and a signal wiring that is a wiring for transmitting and receiving signals to and from the imaging unit is provided on the second main surface. The imaging apparatus according to claim 2 . The imaging apparatus according to claim 3 , wherein the wiring board has a second heat transfer pattern on the second main surface . The wiring board has three or four extending portions extending in a direction orthogonal to each other from the central portion, and the plurality of terminal electrodes and the plurality of extending portions are provided in at least one of the extending portions. The imaging apparatus according to claim 2 , wherein wiring is formed, and the heat transfer pattern is formed in at least one of the extending portions . An outer cylinder portion made of metal, in which the imaging element chip, the wiring board, and a part of the signal cable are housed;
The imaging apparatus according to claim 2 , wherein a part of the heat transfer pattern is in contact with an inner surface of the outer cylinder portion . The imaging apparatus according to claim 6 , further comprising a heat transfer member in contact with a main surface of the extended portion . The signal cable has a shield wire;
The imaging apparatus according to claim 7 , wherein the shield wire is joined to the heat transfer member and the outer cylinder portion .   An insertion portion in which the imaging device according to any one of claims 1 to 8 is disposed at a tip portion;
  An operation portion disposed on a proximal end side of the insertion portion;
  An endoscope comprising: a universal cord extending from the operation unit.

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