JP2018107564A - Imaging device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To improve heat radiation performance of an imaging device.SOLUTION: An imaging device includes: a housing; an image pick-up device provided within the housing; an electrode terminal extending from the inner side to the outer side of the housing; a flexible substrate which connects the image pick-up device to an electrode terminal and has a conductor pattern and an insulation layer covering the conductor pattern; and a heat sink provided on an inner surface of the housing. A part of the conductor pattern positioned between the image pick-up device and the electrode element in the flexible substrate is exposed to be jointed to or placed in contact with the heat sink.SELECTED DRAWING: Figure 3

Description

  The present invention relates to an imaging apparatus.

  As an imaging device, for example, an imaging device described in Patent Document 1 is known.

JP 2013-34082 A

  In recent years, imaging devices are required to have higher pixels and higher functions. Along with this, the amount of heat generated by the image pickup element in the image pickup apparatus is increasing. When the amount of heat generation increases, there is a concern that the thermal noise for the image increases and the image quality deteriorates. Therefore, the imaging device is required to improve heat dissipation.

  An imaging device according to the present invention connects a housing, an imaging device provided inside the housing, an electrode terminal extending from the inside of the housing to the outside, an imaging device and an electrode terminal, and a conductor pattern. And a flexible substrate having an insulating layer covering the conductor pattern, and a heat sink provided on the inner surface of the housing, and one of the conductor patterns located between the imaging element and the electrode terminal in the flexible substrate. The portion is exposed and is joined to or contacted with the heat sink.

  According to the imaging device of the present invention, heat transmitted through the conductor pattern can be released to the heat radiating plate, so that the heat dissipation of the imaging device can be improved.

It is a schematic diagram which shows the installation place in the vehicle of the imaging device which concerns on this embodiment. It is a top view which shows the imaging device shown in FIG. It is sectional drawing which cut the imaging device shown in FIG. 2 by the AA line. It is an enlarged view of the flexible substrate B part shown in FIG. It is sectional drawing which shows the modification of an imaging device.

  FIG. 1 is a schematic diagram illustrating a mounting position of the imaging device 10 according to the present embodiment in the vehicle 1. The imaging device 10 is, for example, a so-called in-vehicle camera. The vehicle 1 is a vehicle such as an automobile.

  As shown in FIGS. 1 to 3, the imaging device 10 is mounted on the vehicle 1 together with the imaging optical system 20 and the display device 50. In the present embodiment, the imaging device 10 is fixed to the rear outside of the vehicle 1 in order to capture a peripheral image of the rear view, for example. The display device 50 is provided so as to be visible from the driver's seat.

The imaging optical system 20 forms a subject image behind the vehicle 1 on the imaging element 31 in the imaging device 10. The imaging device 10 captures a subject image using the imaging element 31 and generates an image signal. Further, the imaging device 10 outputs an image signal to the display device 50 via the signal connection unit 40. The display device 50 displays a subject image corresponding to the image signal acquired from the signal connection unit 40.

  FIG. 2 is a plan view on the imaging optical system side of the imaging apparatus 10 according to the present embodiment. FIG. 3 is a cross-sectional view taken along the line AA of the imaging apparatus 10 shown in FIG. In the following, the direction from the imaging device 10 toward the subject (the direction indicated by the arrow of the imaging optical axis OA) from “back” to “front” when viewed in the direction along the imaging optical axis OA of the imaging optical system 20 in FIG. It will be described as the direction to go. The inside of the imaging device 10 will be described in detail with reference to the cross-sectional view of FIG. The imaging device 10 includes an imaging optical system 20, an imaging element 31, a substrate 32 a, an electronic component 32 b, a flexible substrate 33, and a heat radiating plate 35.

  The imaging optical system 20 has at least one optical element (not shown). The optical element is formed by a lens or the like, for example. The imaging optical system 20 is formed so as to satisfy desired optical characteristics such as a focal length and a focal depth of the optical element.

  The imaging element 31 is disposed behind the imaging optical system 20. The imaging element 31 captures a subject image formed on the light receiving surface via the imaging optical system 20, converts it into an electrical signal, and outputs it. As the image sensor 31, for example, a charge coupled device (CCD) or a complementary metal oxide semiconductor (CMOS) image sensor can be used.

  The imaging device 10 transmits an image signal based on an electrical signal from the imaging element 31 to the outside of the housing 11 by a signal connection unit 40 described later. The image signal may be an electrical signal itself output from the image sensor 31 or may be a signal that has been subjected to necessary image processing by an electronic component described later.

  The housing 11 has an opening through which the imaging optical system 20 is exposed to the subject. The casing 11 holds the imaging optical system 20 in the opening, and holds the imaging device 10 in an enclosed manner. In the present embodiment, the housing 11 has a front case 12 and a rear case 13. The front case 12 holds the optical elements constituting the imaging optical system 20 so as to have a predetermined positional relationship.

  The rear case 13 encloses and holds the substrate 32 a together with the image sensor 31. In particular, the rear case 13 holds the imaging element 31 at the imaging position of the imaging optical system 20.

  In the present embodiment, the front case 12 and the rear case 13 are joined together with a packing P made of, for example, rubber or resin. At this time, the packing P functions as a hermetic seal, and the casing 11 of the image sensor 10 has a hermetic structure.

  FIG. 4 is an enlarged view of part B shown in FIG. As shown in FIG. 4, the flexible substrate 33 has a plurality of conductor patterns 34a. Although most of the conductor pattern 34a in the flexible substrate 33 is covered with an insulating layer, the insulating layer is omitted in FIG. One of the plurality of conductor patterns 34a is a ground wiring 34b. The conductor pattern 34a is joined to the terminal 41 and has a function of transmitting an electrical signal.

  The heat sink 35 is in contact with the rear case 13 and forms a heat dissipation mechanism.

  The signal connection unit 40 has heat conductivity, and transmits an image signal of a subject image captured by the image sensor 31 to the outside of the housing 11. In the present embodiment, the signal connection unit 40 includes a plurality of terminals 41.

  The imaging apparatus 10 according to the present embodiment includes a housing 13, an imaging device 31 provided inside the housing 13, an electrode terminal 41 extending from the inside to the outside of the housing 13, and the imaging device 31 and the electrode terminal. 41, and a flexible substrate 33 having a conductor pattern 34a and an insulating layer covering the conductor pattern 34a, and a heat radiating plate 35 provided on the inner surface of the housing 13, are provided. Among them, a part of the conductor pattern 34 a located between the image sensor 31 and the electrode terminal 41 is exposed and joined to the heat sink 35. Thereby, since the heat transmitted through the conductor pattern 34a can be released to the heat radiating plate 35, the heat dissipation of the imaging device 10 can be improved.

  Further, a part of the conductor pattern 34 a and the heat radiating plate 35 may be joined by a joining material 36. Since a part of the conductor pattern 34a and the heat radiating plate 35 are bonded by the bonding material 36, the bonding material 36 can absorb vibration, so that the flexible substrate 33 and the heat radiating plate 35 are bonded in a vibration environment. Can improve the reliability. As the bonding material 36, for example, solder or conductive paste can be used. As another method for joining a part of the conductor pattern 34a and the heat radiating plate 35, welding or welding can be used.

  Further, the thermal conductivity of the bonding material 36 may be higher than the thermal conductivity of the conductor pattern 34a. Thereby, since heat dissipation from the joint portion to the heat radiating plate 35 can be promoted, the heat dissipation of the imaging device 10 can be further improved. This can reduce the occurrence of thermal noise in the camera image. As the bonding material 36 and the conductor pattern 34a, for example, silver (thermal conductivity: about 430 W / m · k) is used for the bonding material 36, and copper (thermal conductivity: about 400 W / m / k) is used for the conductive pattern 34a. k) can be used.

  In addition, as shown in FIG. 5, a plurality of heat radiating plates 35 are provided along a plurality of adjacent surfaces of the housing 13, and a bonding material 36 is bonded to the plurality of heat radiating plates 35. Good. Thereby, the reliability with respect to the vibration of various directions can be improved by providing the bonding | jointing material 36 in several surfaces.

  In addition, the housing 13, the imaging device 31 provided inside the housing 13, the electrode terminal 41 extending from the inside of the housing 13 to the outside, the imaging device 31 and the electrode terminal 41 are connected, A flexible substrate 33 having a conductor pattern 34a and an insulating layer covering the conductor pattern 34a, and a heat radiating plate 35 provided on the inner surface of the housing 13, are provided. A part of the conductor pattern 34 a located between the two may be exposed and in contact with the heat sink 35. Thereby, since the heat transmitted through the conductor pattern 34a can be released to the heat radiating plate 35, the heat dissipation of the imaging device 10 can be improved.

  An example of a method for bringing the heat sink 35 and the exposed portion of the conductor pattern 34a into contact with each other is a method using the elasticity of the flexible substrate 33. Further, a method of providing a jig for fixing the heat radiating plate 35 and the conductor pattern 34 a inside the housing 11 may be used.

  Further, a part (exposed portion) of the conductor pattern 34a may be the ground wiring 34b. Since the ground wiring 34b is a wiring that is commonly connected to many parts, heat radiation from many parts is possible. Thereby, the heat dissipation of the imaging device 10 can be improved.

10: imaging device 11: housing 12: front case 13: rear case 20: imaging optical system 31: imaging device 32a: substrate 32b: electronic component 33: flexible substrate 34a: conductor pattern 34b: ground wiring 35: heat sink 36 : Bonding material 40: Signal connection part 41: Terminal 50: Display device

Claims (6)

A housing,
An image sensor provided inside the housing;
An electrode terminal extending from the inside of the housing to the outside;
While connecting the imaging device and the electrode terminal, a flexible substrate having a conductor pattern and an insulating layer covering the conductor pattern;
A heat sink provided on the inner surface of the housing,
A part of said conductor pattern located between said image pick-up element and said electrode terminal among said flexible substrates is exposed, and it is joined to said heat sink.   The imaging apparatus according to claim 1, wherein a part of the conductor pattern and the heat radiating plate are bonded together by a bonding material.   The imaging apparatus according to claim 2, wherein a thermal conductivity of the bonding material is higher than a thermal conductivity of the conductor pattern.   The heat sink is provided in plural along a plurality of adjacent surfaces of the casing, and the bonding material is bonded to the heat sink. 4. The imaging device according to any one of 3. A housing,
An image sensor provided inside the housing;
An electrode terminal extending from the inside of the housing to the outside;
While connecting the imaging device and the electrode terminal, a flexible substrate having a conductor pattern and an insulating layer covering the conductor pattern;
A heat sink provided on the inner surface of the housing,
An image pickup apparatus, wherein a part of the conductor pattern located between the image pickup element and the electrode terminal in the flexible substrate is exposed and is in contact with the heat radiating plate.   The imaging apparatus according to claim 1, wherein a part of the conductor pattern is a ground wiring.