JP2013120955A - Imaging device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an imaging device capable of efficiently cooling an imaging element by transmitting heat of the imaging element to an outer package of a camera.SOLUTION: An imaging device comprises: a chassis member 101 having an imaging element 103 and a metal exposure section 101a obtained by insert-molding metal with resin; a fixing member 109 with high heat conductivity fixed to an outer package 111, and fixing a rotation unit 110a in which a display device 110 can be rotated and moved with the outer package; a first fixing section 109a provided to the fixing member and fixing the fixing member, the rotation unit 110a and the outer package; a connection member 105 with high heat conductivity connecting the metal exposure section and the fixing member; and a flexible heat transfer member 104. The heat transfer member is connected to the imaging element on one end, and to any one or both of the metal exposure section of the chassis member and the connection member on the other end on a side opposite to a grip 100 to an imaging optical axis 10.

Description

  The present invention relates to an image pickup apparatus having an image pickup element such as a CCD or a CMOS, and particularly relates to a heat dissipation technique for the image pickup element.

  2. Description of the Related Art Conventionally, an imaging apparatus having an imaging element such as a CCD or CMOS has a circuit board (hereinafter referred to as an imaging board) on which a drive circuit for driving the imaging element is mounted. In order to connect the image pickup device and the image pickup substrate as short as possible electrically, the image pickup device is arranged on the image pickup substrate, or the image pickup device and the image pickup substrate are arranged in the vicinity.

  However, since the image sensor and the drive circuit for the image sensor have a large electrical load and generate a large amount of heat, the image sensor has an increased dark current as the temperature rises, causing deterioration in image quality.

  For example, Patent Document 1 discloses a configuration in which heat of an image sensor is radiated to a member having a high heat capacity in the camera by connecting the image sensor and a chassis member of the camera with a heat transfer member.

JP 2011-049623 A

  However, in the related art disclosed in the above-mentioned patent document, when the camera chassis member is not a metal member but a member in which a metal is inserted into a resin, heat conduction is difficult to be efficiently performed to the camera exterior. For this reason, the chassis member may become partially hot, and the image pickup device may not be sufficiently cooled.

  Accordingly, an object of the present invention is to provide an imaging device that can efficiently cool the imaging device by conducting heat of the imaging device to the exterior of the camera even in an imaging device having a chassis member in which a metal is inserted into resin. It is to be.

In order to achieve the above object, the imaging apparatus of the present invention provides:
An image sensor (103),
A chassis member (101) having a metal exposed portion (101a) in which a metal is insert-molded into a resin;
The rotating unit (110a) fixed to the exterior (111) and configured to allow the display device (110) to rotate and the fixing member (109) having high thermal conductivity for fixing the exterior (111) and the fixing A first fixing portion (109a), the metal exposed portion (101a), and a fixing member (fixed to the fixing member (109), the rotation unit (110a), and the exterior (111) provided on the member (109). 109) and a high thermal conductivity connecting member (105);
A flexible heat transfer member (104),
The heat transfer member (104) has one end connected to the image sensor (103) and the other end connected to one or both of the metal exposed portion (101a) of the chassis member and the connection member (105). The optical axis (10) is connected on the opposite side of the grip (100).

  According to the present invention, since the imaging element to the display device are connected by a member having a low thermal resistance, heat is not generated inside the camera, and the imaging element can be efficiently radiated.

1 is an exploded perspective view showing a schematic configuration of an imaging system and a chassis member of an electronic camera to which the present invention is applied. The perspective view which shows the schematic structure of the imaging system and chassis member of the electronic camera to which this invention is applied. The side view which shows the schematic structure of the chassis member of the electronic camera to which this invention is applied. Sectional view showing the schematic configuration around the jack connector

  Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

[Example 1]
FIG. 1 is an exploded perspective view showing a schematic configuration of an imaging system and a chassis member of an electronic camera according to an embodiment of the present invention. FIG. 2 shows a schematic configuration of an imaging system and a chassis member of the electronic camera to which the present invention is applied. It is a perspective view. FIG. 1 and FIG. 2 are views as seen from the camera photographer side.

  1 and 2, reference numeral 101 denotes a chassis member in which a metal is insert-molded into a resin. The chassis member 101 is fixed with components forming a mirror box (not shown), a camera exterior, and the like. The chassis member 101 has a metal exposed portion 101 a on a surface perpendicular to the imaging optical axis 10 on the opposite side of the camera grip 100 with respect to the imaging optical axis 10. The exposed metal portion 101 a is located at substantially the same position as the back surface of the image sensor 103.

  Reference numeral 103 denotes an image sensor that converts light incident from a photographing lens (not shown) into an electrical signal. Reference numeral 102 denotes an image sensor holding member that holds the image sensor 103. The drive image sensor holding member 102 is supported by a part forming a mirror box (not shown). Reference numeral 106 denotes an image pickup board, which is a circuit board on which a drive circuit element group for driving the image pickup element 103 and processing signals of the image pickup element 103 is mounted. An electronic element 107 for converting an analog signal from the imaging element into a digital signal in the drive circuit group is disposed on the opposite side of the grip 100 with respect to the imaging optical axis 10. A lead terminal group 103a for taking out an electric signal from the image sensor 103 is formed on the upper and lower side surfaces of the image sensor 103, and the lead terminal group 103a is fixed to the image pickup substrate 106 by soldering.

  Reference numeral 109 denotes a metal fixing member for fixing the display device 110 to an exterior part 111 (hereinafter referred to as a back cover) on the back of the camera. Note that the fixing member 109 is not limited to metal, and may be a conductive member having high thermal conductivity. Reference numeral 110 denotes a display device, and the hinge portion 110a and the first fixing portion 109a of the fixing member 109 sandwich and fasten the back cover 111, and are fixed to the back cover 111 so as to be rotatable. Further, the hinge part 110a is connected to an exterior part of the display device.

  104 and 108 are graphite sheets which function as heat conducting members. The first graphite sheet 104 is bonded to the back surface of the image sensor 103 and the metal exposed portion 101a of the chassis member 101 with an adhesive.

  The second graphite sheet 108 is connected to the electronic element 107 disposed on the imaging substrate 106 and the metal exposed portion 101a of the chassis member 101 with an adhesive.

  Reference numeral 105 denotes a metal connection member for connecting the metal exposed portion 101 a of the chassis member 101 and the fixing member 109 of the display device 110. Note that the connecting member 105 is not limited to a metal, and may be a conductive member having high thermal conductivity. The connection member 105 is fastened to the metal exposed portion 101a of the chassis member 101 on a plane perpendicular to the photographing optical axis 10 at the first connection portion 105a. The connecting member 105 is disposed in the vicinity of the connecting portion between the first graphite sheet 104 and the exposed metal portion 101a of the chassis member. The connecting member 105 has a second connecting portion 105 b bent toward the camera side opposite to the grip 100 with respect to the photographing optical axis 10, and the second fixing portion 105 b is provided on the fixing member 109 of the display device 110. The second fixing portion 109b and the resin portion of the chassis member 101 are fastened together.

  In the above description, the first graphite sheet 104 has one end connected to the image sensor 103 and the other end connected to the metal exposed portion 101a of the chassis. However, the first graphite sheet 104 may have one end connected to the image sensor 103 and the other end connected to the connection member 105 or both the metal exposed portion 101a and the connection member 105 of the chassis member. Similarly, the second graphite sheet 108 may have one end connected to the electronic element 107 and the other end connected to the connection member 105 or both the metal exposed portion 101a of the chassis member and the connection member 105.

  FIG. 3 is a side view showing a schematic configuration around the connecting member 105 and the fixing member 109 of the display device 110.

  Reference numeral 112 denotes an HDMI connector jack, and reference numeral 113 denotes a USB connector jack. The HDMI connector jack 112 and the USB connector jack 113 are mounted on the board 114. The connection member 105 is disposed so as to cover the HDMI connector jack 112 and the USB connector jack 113 on the subject side and in the vertical direction of the camera. The fixing member 109 of the display device 110 is disposed so as to cover the photographer side of the HDMI connector jack 112 and the USB connector jack 113. Reference numeral 115 denotes a gasket, which is disposed between the mounting portion of the HDMI connector jack 112 and the USB connector jack 113 of the substrate 114 and the fixing member 109 of the display device. As described above, an effect of electromagnetically shielding unnecessary radio waves emitted from the HDMI connector jack 112 and the USB connector jack 113 can be obtained. However, the gasket 115 is not indispensable, and it may be determined whether or not it is necessary if necessary.

  FIG. 4 is a cross-sectional view showing a schematic configuration around the connector jack 113. Reference numeral 116 denotes a capacitor for causing the flash device built in the camera to emit light. Reference numeral 101 b denotes a notch provided in the chassis member 101. The HDMI connector jack 112, the USB 113 connector jack, and the connection member 105 are arranged so as to enter the notch 101b of the chassis member 101. The connecting member 105 has a first standing bent portion 105c on the side surface of the HDMI connector jack 112 and the connector jack 113 on the imaging optical axis 10 side, and has a second standing bent portion 105d on a surface substantially the same as the chassis member 101. It is in contact with the member 101.

  The capacitor 116 and the chassis member 101 are arranged so that the distance between the resin portion 101 c near the notch portion of the chassis member 101 is closer to the distance between the capacitor 116 and the connection member 105. As a result, even if the capacitor 116 is shaken in the camera due to an external shock applied to the camera during assembly, the capacitor 116 and the metal connecting member 105 do not come into contact with each other. There is no worry that will break.

  With the above configuration, the heat generated in the image sensor 103 is transmitted to the exposed metal portion 101 a of the chassis member 101 through the graphite sheet 104. The heat transmitted to the exposed metal portion 101 a of the chassis member 101 is transmitted to the connection member 105 by fixing the connection member 105 on a surface parallel to the image sensor 103. The heat transmitted to the connection member 105 is transmitted to the fixing member 109 by being fastened together with the fixing member 109 on the side surface of the camera. The heat transmitted to the fixing member 109 is transmitted to the hinge portion 110b of the display device via the fastening screw. Further, the heat transmitted to the hinge portion 110b of the display device is transmitted to the exterior component of the display device 110 that is in contact. In the meantime, it is possible to efficiently dissipate the heat of the image sensor 103 because no component having low thermal conductivity is interposed.

10: Shooting optical axis 100: Camera grip part 101: Chassis member 101a: Metal exposed part of chassis member 103: Image sensor 104: Heat transfer member (graphite sheet)
105: Connection member 106: Imaging substrate 107: Electronic element 108: Heat transfer member (graphite sheet)
109: Display device fixing member 110: Display device 111: Back cover

Claims (7)

In the imaging apparatus having the imaging element (103),
A chassis member (101) having a metal exposed portion (101a) in which a metal is insert-molded into a resin;
The rotating unit (110a) fixed to the exterior (111) and configured to allow the display device (110) to rotate and the fixing member (109) having high thermal conductivity for fixing the exterior (111) and the fixing A first fixing portion (109a), the metal exposed portion (101a), and a fixing member (fixed to the fixing member (109), the rotation unit (110a), and the exterior (111) provided on the member (109). 109) and a high thermal conductivity connecting member (105);
A flexible heat transfer member (104),
The heat transfer member (104) has one end connected to the image sensor (103) and the other end connected to one or both of the metal exposed portion (101a) of the chassis member and the connection member (105). An image pickup apparatus connected to the optical axis (10) on the opposite side of the grip (100). The exposed metal portion (101a) of the chassis member (101) to which the heat transfer member (104) is connected is a surface perpendicular to the imaging optical axis (10), and the position thereof is the same as that of the imaging element (103). The imaging apparatus according to claim 1, wherein the imaging apparatus is on the same plane. The connection member (105) includes a first connection part (105a) for connecting the connection member (105) to a metal exposed part (101a) of the chassis member (101),
A second connecting portion (105b) for connecting the connecting member (105) to the fixing member (109);
The fixing member (109) includes a second fixing portion (109b) for fixing the fixing member (109) to the chassis member (101),
The connecting member (105) is fastened by a metal exposed portion (101a) of the chassis member and the first connecting portion (105a) on a plane perpendicular to the photographing optical axis (10), so that the grip ( 100), the chassis member (101), the second fixing portion (109b) of the fixing member (109), and the second connection portion (101b) are fastened by the side surface on the opposite side. The imaging device according to claim 1 or 2. An electronic element (107) for converting an analog signal output from the image sensor (103) into a digital signal is mounted on a substrate (105) connected to the image sensor (103), and the electronic element (107) is The imaging apparatus according to claim 1, wherein the imaging apparatus is disposed on the opposite side of the grip with respect to the imaging optical axis. The imaging device according to claim 1, wherein the connection member (105) and the fixing member (109) are made of a highly conductive material. Connector jacks (112) and (113) for electrically connecting the imaging device and external electronic devices are arranged on the opposite side of the grip (100) with respect to the imaging optical axis (10),
The connecting member (105) covers the connector jacks (112), (113) on the upper and lower sides of the connector jacks (112), (113) and the subject side
The fixing member (109) covers the connector jacks (112) and (1130) on the photographer side of the connector jack,
The connecting member (105) and the fixing member (109) are connected to the connector jacks (112) and (113) in the vicinity of the connector jacks (112) and (113) in the vertical direction of the camera and the second connecting portion (104b) and the The imaging device according to any one of claims 1 to 5, wherein the second fixing portion (109b) is electrically connected. The imaging apparatus according to claim 1, wherein the heat transfer member (104) is a sheet-like graphite.