JP6595388B2 - Imaging module - Google Patents

Description

  The present invention relates to an imaging module.

  As an imaging module, for example, an imaging module described in Patent Document 1 is known.

JP 2013-34082 A

  In recent years, imaging modules have been required to have higher pixels and higher functions. Along with this, the amount of heat generated by the image pickup element in the image pickup module is increasing. When the amount of heat generation increases, there is a concern that the thermal noise for the image increases and the image quality deteriorates. Therefore, the imaging module is required to improve heat dissipation.

  In the imaging module according to the present invention, the substrate, the electronic component mounted on the principal surface on one side of the substrate, the imaging element mounted on the principal surface on the other side of the substrate, and the principal surface on one side of the electronic component are contacted. And a rod-shaped member having one end installed on the substrate and the other end contacting the main surface of the other side of the heat dissipation member.

  According to the imaging module of the present invention, the heat generated from the imaging element and transmitted to the substrate can be transmitted to the heat dissipation member not only through the electronic component but also through the rod-shaped member. Therefore, the heat dissipation of the imaging module can be improved.

It is a schematic diagram which shows the installation place in the vehicle of the imaging module which concerns on this embodiment. It is a top view which shows the imaging module shown in FIG. It is sectional drawing which cut the imaging module shown in FIG. 2 by the AA line. It is sectional drawing which shows the modification of an imaging module.

  FIG. 1 is a schematic diagram illustrating a mounting position of the imaging module 10 according to the present embodiment in the vehicle 1. The imaging module 10 is, for example, a so-called in-vehicle camera. The vehicle 1 is a vehicle such as an automobile.

  As shown in FIG. 1, the imaging module 10 is mounted on the vehicle 1 together with the imaging optical system 20 and the display device 50. In the present embodiment, the imaging module 10 is fixed to the rear outside of the vehicle 1 in order to capture a peripheral image of the rear view, for example. The display device 50 is provided so as to be visible from the driver's seat.

The imaging optical system 20 forms a subject image behind the vehicle 1 on the imaging element 31 in the imaging module 10. The imaging module 10 captures a subject image using the imaging element 31 and generates an image signal. Further, the imaging module 10 outputs an image signal to the display device 50 via the signal connection unit 40. The display device 50 displays a subject image corresponding to the image signal acquired from the signal connection unit 40.

  FIG. 2 is a plan view of the imaging module 10 according to this embodiment on the imaging optical system side. FIG. 3 is a cross-sectional view taken along line AA of the imaging module 10 shown in FIG. In the following, the direction from the imaging module 10 toward the subject (the direction indicated by the arrow of the imaging optical axis OA) from “back” to “front” when viewed in the direction along the imaging optical axis OA of the imaging optical system 20 in FIG. It will be described as the direction to go. The interior of the imaging module 10 will be described in detail with reference to the cross-sectional view of FIG. The imaging module 10 includes an imaging optical system 20, an imaging element 31, a substrate 32a, an electronic component 32b, a heat radiating member 38, and a rod-like member 32c.

  The imaging optical system 20 has at least one optical element (not shown). The optical element is formed by a lens or the like, for example. The imaging optical system 20 is formed so as to satisfy desired optical characteristics such as a focal length and a focal depth of the optical element.

  The imaging element 31 is disposed behind the imaging optical system 20. The imaging element 31 captures a subject image formed on the light receiving surface via the imaging optical system 20, converts it into an electrical signal, and outputs it. As the image sensor 31, for example, a charge coupled device (CCD) or a complementary metal oxide semiconductor (CMOS) image sensor can be used.

  The imaging module 10 transmits an image signal based on an electrical signal from the imaging element 31 to the outside of the housing 11 by a signal connection unit 40 described later. The image signal may be an electrical signal itself output from the image sensor 31 or may be a signal that has been subjected to necessary image processing by an electronic component described later.

  The housing 11 has an opening through which the imaging optical system 20 is exposed to the subject. The housing 11 holds the imaging optical system 20 in the opening, and holds the imaging module 10 in an enclosed manner. In the present embodiment, the housing 11 has a front case 12 and a rear case 13. The front case 12 holds the optical elements constituting the imaging optical system 20 so as to have a predetermined positional relationship.

  The rear case 13 encloses and holds the substrate 32 a together with the image sensor 31. In particular, the rear case 13 holds the imaging element 31 at the imaging position of the imaging optical system 20.

  In the present embodiment, the front case 12 and the rear case 13 are joined together with a packing P made of, for example, rubber or resin. At this time, the packing P functions as a hermetic seal, and the housing 11 of the imaging module 10 has a hermetic structure.

The heat dissipating member 38 generates heat generated from the image sensor 31 via the rod-shaped member 32c.
It is a member to escape from. The heat radiating member 38 can be realized by, for example, a silicone heat transfer member or heat transfer potting, but is not limited thereto.

  The signal connection unit 40 has heat conductivity, and transmits an image signal of a subject image captured by the image sensor 31 to the outside of the housing 11. In the present embodiment, the signal connection unit 40 includes a plurality of terminals 41.

  The imaging module 10 of the present embodiment includes a substrate 32a, an electronic component 32b mounted on the main surface on one side of the substrate 32a, an image sensor 31 mounted on the other main surface of the substrate 32a, and an electronic component 32b. The heat dissipating member 38 is in contact with the main surface on one side, and one end is attached to the substrate 32a, and the rod-like member 32c is in contact with the main surface on the other side of the heat dissipating member 38 at the other end.

  Thereby, the heat generated from the image sensor 31 and transmitted to the substrate 32a can be transmitted to the heat radiating member 38 not only through the electronic component 32b but also through the rod-shaped member 32c. Therefore, the heat dissipation of the imaging module 10 can be improved.

  As the rod-shaped member 32c, for example, a cylindrical member, a quadrangular prism, a polygonal prism, or the like can be used. When a cylindrical member is used as the rod-like member 32c, for example, the diameter can be set to 3 mm and the length can be set to 2 mm. The rod-shaped member 32c is made of, for example, a metal material. As the metal material, for example, a material having good thermal conductivity such as iron, aluminum, or copper can be used.

  Further, the rod-shaped member 32c may have a diameter larger at the other end than at one end. Since the diameter of the rod-shaped member 32c is increased in the direction in which heat is diffused from the substrate 32a toward the heat radiating member 38, heat can be smoothly transferred to the heat radiating member 38. Thereby, a possibility that the focus of the image sensor 31 may shift due to thermal expansion can be reduced.

  When the rod-shaped member 32c is cylindrical, for example, the diameter on one end side can be set to 1.5 mm and the diameter on the other end side can be set to 3 mm. In FIG. 3, the rod-shaped member 32 c has a shape that connects two cylinders having different diameters, but is not limited thereto. For example, the rod-like member 32c may have a shape whose diameter continuously increases from one end side to the other end side.

  As used herein, “a shape in which the diameter continuously increases” refers to, for example, a rod-like member whose outer peripheral surface (a line in the cross-section) is a rod-like member when a cross-section passing through the axial direction of the rod-like member 32c is viewed. The shape which inclines with respect to the axial direction of 3 is mentioned. An example of such a shape is a truncated cone shape. As another example, when the rod-shaped member 3 is viewed in the same cross section, the outer peripheral surface has a plurality of steps (the diameter gradually increases).

  As shown in FIG. 4, the rod-shaped member 32 c may have a recess 33 at the other end, and a part of the heat dissipation member 38 may enter the recess 33. Thereby, since the contact area of the rod-shaped member 32c and the heat radiating member 38 can be increased, heat can be easily transmitted to the heat radiating member 38 via the rod-shaped member 32c. It is possible to reduce a possibility that a positional deviation occurs between the member 38 and the member 38.

  As for the shape of the recess 33, for example, the shape of the longitudinal section can be set to a rectangular shape or a semicircular shape. In addition, the shape of the opening of the recess 33 when viewed in plan can be set to a circular shape, a polygonal shape, or the like. In particular, when the shape of the opening of the concave portion 33 is a polygonal shape, it is possible to further reduce the possibility of a positional deviation between the heat dissipation member 38 and the rod-shaped member 32c. This is because when the shape of the opening of the concave portion 33 is a polygonal shape, the corner portion has a larger distance from the center than the side portion (the diameter of the opening is large), and thus the heat radiating member 32c vibrates. This is because the heat dissipation member 32c that has entered the corner portion can be prevented from shifting to the side portion. For example, the depth of the recess 33 can be set to 1.5 mm. In addition, when the shape of the opening of the recess 33 in a plan view is circular, for example, the diameter can be set to 0.5 mm.

  In addition, a plurality of rod-shaped members 32c are provided, and the electronic component 32b may be positioned between the plurality of rod-shaped members 32c when viewed through a plane. Thereby, the bias of the heat distribution around the electronic component 32b can be reduced. As an example in which a plurality of rod-shaped members 32c are provided, for example, the electronic component 32b may be located on a straight line connecting the two rod-shaped members 32c.

Further, three or more rod-shaped members 32c may be provided, and the electronic component 32b may be located in a region surrounded by the three or more rod-shaped members 32c. Specifically, when four rod-like members 32c are provided, the rod-like member 32c is provided at a position corresponding to the corner of a virtual square or rectangle, and the electronic component 32b is accommodated inside the virtual square or rectangle. Can be positioned as follows.

  Further, by surrounding the electronic component 32b with a plurality of rod-shaped members 32c, for example, the reliability of the imaging module 10 can be improved as compared with the case of surrounding with the frame-shaped member. Specifically, when the electronic component 32b is surrounded by a frame-shaped member, a large temperature difference occurs between the inside and the outside of the frame-shaped member due to heat generated in the space surrounded by the frame-shaped member. There is a risk that. As a result, unexpected deformation may occur in the frame-shaped member, and thermal stress may occur in the imaging module 10. On the other hand, by enclosing the electronic component 32b with the plurality of rod-shaped members 32c, a gap is formed between the rod-shaped members 32c, so that it is possible to reduce the risk of heat flowing into the space surrounded by the rod-shaped members 32c.

  Further, by surrounding the electronic component 32b with a plurality of rod-shaped members 32c, the reliability of the connection between the electronic component 32b and the substrate 32a can be improved as compared with the case where the electronic component is surrounded by a frame-shaped member. This is because when the frame-shaped member surrounds the electronic component b, a large thermal stress may occur in the direction in which the substrate 32a and the heat radiating member 38 are separated from each other when thermal expansion occurs in the frame-shaped member. On the other hand, when the electronic component 32b is surrounded by the plurality of rod-shaped members 32, the thermal stress generated in the direction in which the substrate 32a and the heat radiating member 38 are separated compared to the case where the electronic component 32b is surrounded by the frame-shaped member. This is because the size can be reduced.

  Moreover, as shown in FIG. 4, the other end of the rod-shaped member 32c may be located on one side of the main surface on one side of the electronic component 32b. Thereby, when vibration occurs in the imaging module 10, a load caused by vibration can be more easily applied to the rod-shaped member 32c than to the electronic component 32b. Thereby, the long-term reliability of the electronic component 32b can be improved.

DESCRIPTION OF SYMBOLS 10: Imaging module 11: Housing | casing 12: Front side case 13: Rear side case 20: Imaging optical system 31: Imaging element 32a: Board | substrate 32b: Electronic component 32c: Rod-shaped member 38: Radiation member 40: Signal connection part 41: Terminal 50 : Display device

Claims (5)

  A substrate, an electronic component mounted on the principal surface on one side of the substrate, an image sensor mounted on the principal surface on the other side of the substrate, and a heat dissipation member in contact with the principal surface on one side of the electronic component; And a rod-shaped member having one end attached to the substrate and the other end contacting the main surface on the other side of the heat dissipation member.   The imaging module according to claim 1, wherein the rod-shaped member has a diameter larger at the other end than at the one end.   3. The imaging module according to claim 1, wherein the rod-shaped member has a recess at the other end, and a part of the heat radiating member enters the recess.   4. The electronic component according to claim 1, wherein a plurality of the rod-shaped members are provided, and the electronic component is positioned between the plurality of rod-shaped members when viewed through a plane. Imaging module.   5. The imaging module according to claim 1, wherein the other end of the rod-shaped member is located on one side of a main surface on one side of the electronic component.

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