JP6697244B2 - Circuit board unit, imaging device and endoscope - Google Patents

Description

  The present invention relates to a circuit board unit, an imaging device, and an endoscope, and more particularly, to a circuit board unit connected to an imaging element arranged at a distal end of an insertion portion of the endoscope, and an imaging device using the circuit board unit. And an endoscope using the imaging device.

  In recent years, it has been required to further reduce the diameter of the insertion portion of the endoscope, and therefore, the image pickup element arranged at the distal end portion of the insertion portion of the endoscope is also downsized. Further, as the size of the image pickup device is reduced, it is required to reduce the size of an image pickup unit using the image pickup device.

  On the other hand, the role of electronic parts or signal cables mounted on the circuit board unit connected to the image pickup device has been diversified with the increase in functionality of the image pickup device. There are various variations in the size and thickness of the cable itself or the number of the cables.

  Here, as described above, when relatively large electronic components or thick signal cables are overlapped with each other in the endoscope insertion portion that is becoming thinner, particularly in the tip portion thereof, the inside of the insertion portion of the endoscope is limited. There is a possibility that the space may not fit within the projected area of the image pickup device arranged at the distal end of the insertion portion.

  On the other hand, as a technique for efficiently disposing these signal cables and lands on the substrate to which the signal cables are connected in the casing of the distal end portion of the endoscope insertion portion whose diameter is reduced, for example, Japanese Unexamined Patent Publication No. 2011-249870 (Patent Document 1) discloses a technique in which electronic parts including capacitors are arranged in a staggered manner.

JP, 2011-249870, A

  However, the description in Patent Document 1 in which the electronic components are arranged in a staggered pattern makes sense when the distance between the lands on the substrate on which the electronic components and the like are arranged is a certain distance apart, but the size of the image sensor is small. As the size of the circuit board is further reduced in accordance with the trend, that is, when the land spacing (particularly, the widthwise spacing) is further reduced, the following problems occur.

  That is, in the technique described in Patent Document 1, it is not particularly considered that the relatively thick signal cable is arranged with respect to the arrangement position of the land on the substrate. In some cases, there is no choice but to arrange them vertically in the long axis direction of the insertion section. In this case, there is a portion where thick signal cables overlap each other in the direction perpendicular to the axis, and the image pickup element arranged at the tip of the insertion section There is a possibility that the projection area may not be completely accommodated.

  The present invention has been made in view of the above circumstances, and a circuit board unit capable of appropriately disposing a signal cable, an electronic component, or the like related to an image sensor in a limited space in the distal end portion of the endoscope insertion portion, An object is to provide an imaging device and an endoscope.

In the circuit board unit according to one aspect of the present invention, the first signal cable is connected to the land group on the front row side on the surface of the circuit board such that the imaging element can be mounted on the surface, and the land group on the front row side is connected. The first signal cable that extends rearward in the axial direction and the second signal cable that is arranged in a column in the axial direction and that is connected to the land group on the rear row side are the circuit board. A circuit board unit arranged to overlap in the vertical direction with respect to the surface of the circuit board, in which an image sensor can be mounted on the surface, and in the area on the front end surface side of the circuit board surface, While including a plurality of lands each having a different land width, which are arranged in a row in a width direction orthogonal to the axial direction when the direction extending toward the rear end side is the axial direction. In a region on the rear row side of the first land group on the circuit board surface, a first land group that is arranged in order from one side to the other side of the circuit board surface in order of increasing land width , At least the land width from one side to the other side of the circuit board surface , which includes a plurality of lands arranged in a width direction orthogonal to the axial direction and having different land widths. each land and connected by soldering, the first signal cable outer diameter is configured to include a plurality of different first signal cable, respectively and a second land group being arrayed in a narrow turn, in the first land group Group, and a second signal cable group configured to include a plurality of second signal cables each having a different outer diameter , the second signal cable group being solder-connected to each land in the second land group, and the first signal The plurality of first signal cables in the cable group are arranged in order of increasing outer diameter from one side to the other side of the circuit board surface, and at the same time from one side to the other side of the circuit board surface. at least the land width are connected respectively to opposite the land in a thick sequentially arrayed by said first land group extends toward the rear of the axial, the plurality of the second signal cable group toward towards The second signal cables are arranged in order of decreasing outer diameter from one side to the other side of the circuit board surface, and at least land from the one side of the circuit board surface to the other side. The lands are connected to the opposing lands in the second land group arranged in the order of decreasing width and extend rearward in the axial direction.

  An imaging device according to an aspect of the present invention includes the circuit board unit and an imaging element mounted on the circuit board.

An endoscope according to an aspect of the present invention includes an insertion portion for inserting into a subject, and the imaging device arranged in the insertion portion.

  According to the present invention, there is provided a circuit board unit, an imaging device, and an endoscope capable of appropriately disposing a signal cable or an electronic component related to an imaging device in a limited space inside a distal end portion of an endoscope insertion portion. be able to.

FIG. 1 is an external perspective view showing a schematic configuration of an endoscope according to a first embodiment of the present invention. FIG. 2 is a cross-sectional view showing the image pickup device arranged at the distal end portion of the insertion portion of the endoscope according to the first embodiment and the peripheral portion thereof. FIG. 3 is an enlarged view of an essential part showing a part of the configuration of the imaging device in the endoscope according to the first embodiment. FIG. 4 is an enlarged view of an essential part showing the front surface side of the circuit board unit in the configuration of the imaging device in the endoscope according to the first embodiment. FIG. 5 is an enlarged perspective view of an essential part of the configuration of the imaging device in the endoscope according to the first embodiment, showing the circuit board unit as viewed obliquely from above. FIG. 6 is an enlarged view of an essential part showing the rear surface side of the circuit board unit in the configuration of the imaging device in the endoscope according to the first embodiment. FIG. 7 is a cross-sectional view showing one cross section of the collective signal cable applied to the circuit board unit in the endoscope according to the first embodiment. FIG. 8 is a cross-sectional view showing a cross section of a collective signal cable according to a modification applied to the circuit board unit in the endoscope according to the first embodiment. FIG. 9 is an enlarged view of an essential part showing a part of a circuit board unit in a conventional endoscope in a cross section. FIG. 10 is an enlarged view of an essential part showing the front surface side of the circuit board unit in the configuration of the imaging device in the endoscope according to the second embodiment of the present invention. FIG. 11 is an enlarged view of an essential part showing a part of the configuration of the imaging device in the endoscope according to the third embodiment of the present invention in a cross section.

Hereinafter, embodiments of the present invention will be described with reference to the drawings.
Further, the present invention is not limited to the embodiments. Further, in the description of the drawings, the same parts are designated by the same reference numerals. Furthermore, it should be noted that the drawings are schematic, and the relationship between the thickness and width of each member, the ratio of each member, and the like are different from reality. Further, the drawings also include portions having different dimensions and ratios.

<First Embodiment>
FIG. 1 is an external perspective view showing a schematic configuration of the endoscope according to the first embodiment of the present invention, and FIG. It is sectional drawing which showed the provided imaging device and its peripheral part.

  As shown in FIG. 1, an electronic endoscope (endoscope) 1 includes an elongated insertion portion 2 that is inserted into a body cavity of a subject, and an operation portion 3 that is connected to a proximal end of the insertion portion 2. , A universal cord 6 extending from the operation section 3 and incorporating various cables for connecting to a light source device and a video system center (camera control unit, CCU) not shown, and the light source device arranged on the proximal end side of the universal cord 6. And a video connector 5 connected from the light guide connector 4 via the communication cable 7 and connected to the video system center.

  The insertion portion 2 is provided with a tip portion 11, which is mainly made of a metal member such as stainless steel, a curved portion 12, and a hard tube 13 which is made of a metal tube such as stainless steel. There is. The insertion portion 2 is a portion to be inserted into the body, and the distal end portion 11 has an imaging unit 20 (see FIG. 2) built therein.

  An imaging cable bundle 27 (see FIG. 2) including various cables electrically connected to the imaging unit 20 is provided inside the bending portion 12 and the rigid tube 13, and a light guide bundle that transmits illumination light to the tip portion 11. (Not shown) and the like are inserted.

  Note that the electronic endoscope 1 of the present embodiment exemplifies a rigid endoscope in which the proximal end side of the bending portion 12 is configured by the rigid tube 13, but the electronic endoscope 1 is not limited to this, and the bending portion 12 may be used. Alternatively, the flexible endoscope may be a flexible tube having a flexible tube on the proximal end side.

  The operation section 3 is provided with an angle lever 14 for remotely operating the bending section 12, various switches 16 for operating a light source device, a video system center, and the like. The angle lever 14 is a bending operation means capable of operating the bending portion 12 of the insertion portion 2 in four directions, up, down, left and right, here. The bending portion 12 is not limited to the structure that can be bent in the four directions of up, down, left, and right, and may be, for example, a structure that can be bent in only two directions of up, down, and up.

  Next, the configuration of the image pickup unit 20 built in the distal end portion 11 of the electronic endoscope 1 will be described in detail with reference to FIG.

  As shown in FIG. 2, the imaging unit 25 is provided with an objective optical unit 21, an element frame 22 continuously provided on the proximal end side of the objective optical unit 21, and a proximal end side of the element frame 22. The shield frame 23, the heat-shrinkable tube 24 externally mounted on the shield frame 23, the image pickup device 25 held by the element frame 22 and housed in the shield frame 23, and the image pickup device 25 filled in the shield frame 23. And an insulating sealing resin 26 for sealing.

  The objective optical unit 21 is configured to include, for example, optical members such as a plurality of optical lenses 21a and a diaphragm 21b, and a lens frame 21c that holds the optical lenses 21a and the diaphragm 21b.

  The element frame 22 is made of, for example, a tubular member made of stainless steel. The tip end side of the element frame 22 is externally fitted to the base end side of the lens frame 21c, so that the element frame 22 is continuously provided on the optical axis O of the objective optical unit 21.

  The shield frame 23 is formed of, for example, a substantially tubular member formed by bending a thin stainless steel plate. The tip end side of the shield frame 23 is externally fitted to the element frame 22, so that a housing chamber 23a for housing the imaging device 25 is formed behind the element frame 22.

<Structure of the imaging device in this embodiment>
FIG. 3 is an enlarged view of a main part of the configuration of the image pickup apparatus in the endoscope according to the first embodiment, showing a part of the cross section, and FIG. 4 is an image pickup in the endoscope according to the first embodiment. It is a principal part enlarged view which showed the surface side of the circuit board unit about the structure of an apparatus. Further, FIG. 5 is an enlarged perspective view of an essential part of the configuration of the image pickup apparatus in the endoscope according to the first embodiment, showing the circuit board unit as viewed obliquely from above.

  The image pickup device 25 includes an image pickup element 30 and a circuit board unit 50 electrically connected to the image pickup element 30.

  In the present embodiment, the image pickup device 30 is composed of a CMOS (Complementary Metal Oxide Semiconductor) image sensor, and has a plate-shaped base portion 30b, and a substantially square light-receiving surface 30a provided on the front surface of the base portion 30b. , And a first cover glass 31 attached to the front surface of the light receiving surface 30a.

  Further, a second cover glass 32 is laminated and adhered to the first cover glass 31, and the second cover glass 32 is internally fitted to the base end side of the element frame 22 (see FIG. 2). As a result, the image pickup device 30 is held at the image forming position of the objective optical unit 21.

<Structure of circuit board unit in this embodiment>
The circuit board unit 50 is formed on a first circuit board 51 on which the image pickup device 30 can be mounted, a second circuit board 52 that is in contact with and connected to the first circuit board 51, and a second circuit board 52. A first land group 71 and a second land group 72 each composed of a plurality of lands, and a first signal cable group composed of a plurality of signal cables respectively solder-connected to the plurality of lands in the first land group 71. 61 and a second signal cable group 62 composed of a plurality of signal cables respectively soldered to a plurality of lands in the second land group 72.

  The first circuit board 51 and the second circuit board 52 are closely related as a circuit board on which the image pickup device 30 is mounted. Even if they are physically separate bodies, they are integrated. It may be a circuit board.

  Here, when the first circuit board 51 and the second circuit board 52 are integrated circuit boards, the image pickup device 30 is a portion corresponding to the first circuit board 51 in the integrated circuit board. (First circuit board portion), and the first land group 71 and the second land group 72 are formed in a portion (second circuit board portion) corresponding to the second circuit board 52. Becomes

  Hereinafter, the first circuit board 51 includes the concept of the first circuit board portion described above in the case where the first circuit board 51 and the second circuit board 52 are integrated circuit boards, and the second circuit board Similarly, the circuit board 52 includes the concept of the second circuit board section described above.

  A collective signal cable 80 having the first signal cable group 61 and the second signal cable group 62 therein is disposed behind the circuit board unit 50. The collective signal cable 80 constitutes a part of the imaging cable bundle 27 that is inserted through the insertion portion 2.

  The signal cables forming the first signal cable group 61 and the second signal cable group 62 are for transmitting a predetermined signal, electric power, or the like, and therefore, both are used as electronic members constituting the circuit board unit 50. It can be said that the function is fulfilled (the structure of the signal cable will be described in detail later).

  The first circuit board 51 is a circuit board in which a plurality of thin plate-shaped ceramic boards are extended and stacked in the insertion portion 2 in a direction perpendicular to the axial direction to form a vertically long substantially rectangular parallelepiped. The imaging element 30 can be mounted on the surface facing the front of the insertion portion 2 (front of the imaging device 25).

  The second circuit board 52 is a circuit board formed by stacking a plurality of thin plate-shaped ceramic boards (having a surface having a relatively large area compared to the ceramic board in the first circuit board 51) as a horizontally long substantially rectangular parallelepiped. The tip end surface of the first circuit board 51 is in contact with and connected to the back surface of the first circuit board 51 so that the stacking directions are orthogonal to each other. In addition, the second circuit board 52 extends in the horizontal direction from the tip end surface toward the rear of the base end side (back of the base end side of the insertion portion 2).

  The first land group 71 is composed of a plurality of lands having different land widths. The plurality of lands that form the first land group 71 are all located on the board surface 52a of the second circuit board 52 on the front end surface side (the front side of the insertion portion 2, hereinafter also referred to as the front row side). When the direction extending toward the rear of the base end side is the axial direction, they are arranged in a row in the width direction orthogonal to the axial direction.

  Specifically, in the present embodiment, the plurality of lands that form the first land group 71 are, as shown in FIGS. 3, 4, and 5, a first A land 71 a having a relatively large land width, and a land width. And a thin first B land 71b.

  In addition, in the present embodiment, the plurality of lands that form the first land group 71 is described as an example of two lands having different land widths, but the present invention is not limited to this. It may be configured by three or more lands that are arranged in order from a relatively wide width to a narrow width.

  When the first land group 71 is composed of a plurality of lands of three or more, basically, the land widths are arranged in order from relatively thick to thin, that is, the land width of each land. However, it is not always necessary that all the land widths are arranged in order from thick to thin.For example, in the land group to be arranged, there are lands with approximately the same land width. There may be a portion arranged so as to be adjacent.

  Further, in FIGS. 3, 4, and 5, the reference numeral 71 in parentheses indicates the first land group 71, the reference numeral 71a indicates the first A land 71a forming the first land group 71, and the reference numeral 71b indicates. Similarly, the first B land 71b forming the first land group 71 is shown.

  Here, as described above, the land widths of the first A land 71a and the first B land 71b are relatively “thick” and “thin”, respectively. As shown in FIG. 4, on the board surface 52a of the second circuit board 52, from the one side 53 to the other side 54, a first land A 71a having a wide land width and a first land B 71b having a narrow land width are arranged in this order. Lined up.

  On the other hand, similarly to the first land group 71, the second land group 72 is also composed of a plurality of lands having different land widths. The plurality of lands that form the second land group 72 have a width that is orthogonal to the axial direction in the rear row side region of the first land group 71 on the substrate surface 52a of the second circuit board 52. Lined up in the direction.

  More specifically, the plurality of lands forming the second land group 72 in the present embodiment, as shown in FIGS. 3 and 4, have a second A land 72a having a relatively small land width and a large land width. And a second B land 72b.

  Note that, in the present embodiment, also for the second land group 72, the plurality of lands forming the second land group 72 are exemplified by two lands having different land widths, but the present invention is not limited to this. The second land group 72 may be composed of a plurality of three or more lands that are arranged in order from a relatively small land width to a thick land width.

  As with the first land group 71 described above, when the second land group 72 is composed of three or more lands, the land widths of the land groups arranged in a row are substantially the same. There may be a place where the lands are adjacent to each other.

  Further, in FIGS. 3, 4, and 5, the reference numeral 72 in parentheses indicates the second land group 72, the reference numeral 72a indicates the second A land 72a constituting the second land group 72, and the reference numeral 72b indicates. Similarly, the second B land 72b that constitutes the second land group 72 is shown.

  As described above, the land widths of the second A land 72a and the second B land 72b are relatively "thin" and "thick", respectively (that is, the first A land 71a). And the first B land 71b), in the present embodiment, on the board surface 52a of the second circuit board 52, from one side 53 to the other side 54, as shown in FIG. A second land A 72a having a narrow land width and a second land B 72b having a wide land width are arranged in this order in this order.

  The first signal cable group 61 is composed of a plurality of signal cables having different outer diameters. The plurality of signal cables forming the first signal cable group 61 are soldered so as to face the plurality of lands in the first land group 71, respectively.

  Specifically, the plurality of signal cables in the first signal cable group 61 are arranged in order of increasing outer diameter from one side 53 to the other side 54 on the board surface 52a of the second circuit board 52, and The first land group 71, which is arranged in order of increasing land width from one side 53 to the other side 54 on the substrate surface 52a, is connected to the facing lands, respectively, and extends rearward in the axial direction. To do.

  More specifically, as shown in FIGS. 3, 4, and 5, the first A land 71a in the first land group 71 includes a conductive wire (in the first A signal cable 61a that constitutes the first signal cable group 61). The core wire 63a) is soldered, and the conductive wire (core wire 63b) in the first B signal cable 61b forming the first signal cable group 61 is soldered to the first B land 71b in the first land group 71. ing.

  In the present embodiment, the plurality of signal cables forming the first signal cable group 61 are exemplified by two signal cables having different outer diameters, but as described above, the first land group 71 is three or more. In the case where the first signal cable group 61 is composed of a plurality of lands, the first signal cable group 61 may also be composed of a plurality of signal cables arranged in order from one having a relatively large cable outer diameter to one having a relatively small cable outer diameter. ..

  Further, at this time, the first signal cable group 61 is basically arranged in order from one having a relatively large cable outer diameter to one having a relatively small cable outer diameter, that is, the respective cable diameters are different from each other. It is not necessary to arrange all the cable diameters in order from the largest to the smallest.For example, in a group of cables arranged in a row, there are locations where cables with almost the same diameter are arranged adjacent to each other. It may be.

  Further, in FIGS. 3, 4, and 5, similarly to the above, the reference numeral 61 in parentheses indicates the first signal cable group 61, and the reference numeral 61a indicates the first A signal cable 61a constituting the first signal cable group 61. The reference numeral 61b designates the first B signal cable 61b which also constitutes the first signal cable group 61.

  Here, as described above, the cable outer diameters of the first A signal cable 61a and the first B signal cable 61b are relatively "large" and "small", respectively. In the present embodiment, as shown in FIGS. 3, 4, and 5, the first A signal cable 61a is the first A land 71a with the wide land width, and the first B signal cable 61b is the first with the narrow land width. Each conductive wire (core wire 63a, core wire 63b) is soldered to the 1B land 71b.

  Similarly to the first signal cable group 61, the second signal cable group 62 is composed of a plurality of signal cables having different outer diameters. The plurality of signal cables forming the second signal cable group 62 are soldered to the plurality of lands in the second land group 72, respectively.

  Specifically, the plurality of signal cables in the second signal cable group 62 are arranged in order of decreasing outer diameter from one side 53 to the other side 54 on the board surface 52a of the second circuit board 52, and It is connected to the opposing lands in the second land group 72 that is arranged in the order of the land width from the one side 53 to the other side 54 on the substrate surface 52a, and extends rearward in the axial direction. To do.

  More specifically, as shown in FIGS. 3, 4, and 5, the second A land 72a in the second land group 72 includes a conductive wire (in the second A signal cable 62a forming the second signal cable group 62). The core wire 64a) is soldered, and the conductive wire (core wire 64b) in the second B signal cable 62b forming the second signal cable group 62 is soldered to the second B land 72b in the second land group 72. ing.

  Note that, in the present embodiment, also for the second signal cable group 62, the plurality of signal cables forming the second signal cable group 62 are exemplified by two signal cables having different outer diameters, but the same as above. When the second land group 72 is composed of a plurality of lands of three or more, the second signal cable group 62 is also arranged in order from the relatively small cable diameter to the large cable outer diameter according to this. It may be composed of a plurality of signal cables.

  Further, at this time, the second signal cable group 62 is basically arranged in order from one having a relatively large cable outer diameter to one having a relatively small cable outer diameter, that is, each cable diameter is different from each other. However, in the group of cables arranged in a line, there may be a place where cables having substantially the same cable diameter are arranged adjacent to each other.

  3, 4, and 5, reference numeral 62 in parentheses indicates the second signal cable group 62, reference numeral 62a indicates the second A signal cable 62a forming the second signal cable group 62, The reference numeral 62b designates the second B signal cable 62b which also constitutes the second signal cable group 62.

  Here, as described above, the cable outer diameters of the second A signal cable 62a and the second B signal cable 62b are relatively “small” and “large”, respectively (that is, the second The 1A signal cable 61a and the 1B signal cable 61b have the opposite relationship). In the present embodiment, as shown in FIGS. 3, 4 and 5, the second A signal cable 62a is provided on the second A land 72a having the narrow land width, and the second B signal cable 62b is provided on the second land having the thick land width. Each conductive wire (core wire 64a, core wire 64b) is soldered to the 2B land 72b.

<Explanation of effects in the first embodiment>
Next, the effect of the first embodiment having the above-described configuration will be described.

  Prior to the description of the effects of the present embodiment, in the circuit board unit having the same shape as the first circuit board 51 and the second circuit board 52 according to the present invention, consideration is given to the arrangement of the thick signal cable. An example of the land arrangement that does not occur will be described with reference to FIG.

  FIG. 9 is an enlarged view of an essential part showing a part of a circuit board unit in a conventional endoscope in a cross section.

  As shown in FIG. 9, the first lands 211 and the second lands 212 are arranged in a row in the axial direction on the front surface side of the second circuit board 52 in the reference example, and the third lands are arranged on the back surface side. It is assumed that the lands 213 and the fourth lands 214 are arranged in a row in the axial direction.

  In addition, a first signal cable 201 and a second signal cable 202, which have a relatively large outer diameter, are connected to the first land 211 and the second land 212, respectively, and extend in the axial rear direction to be cascaded. On the other hand, the third signal cable 203 and the fourth signal cable 204, which are relatively small in outer diameter, are connected to the third land 213 and the fourth land 214, respectively, and are rearward in the axial direction. Shall be arranged in a column.

  In this way, the first signal cable 201 and the second signal cable 202, and the third signal cable 203 and the fourth signal cable 204 are all arranged in a column in the axial direction.

  Here, since the third signal cable 203 and the fourth signal cable 204 are arranged in a column, even if they are arranged so as to overlap in the direction perpendicular to the axial direction, the outer diameter is "small" as a matter of course. , Within the projected area in the axial direction of the image sensor 30 (within the range of the phantom line indicated by the two-dot chain line in FIG. 9), the first signal cable 201 and the second signal cable 202 are arranged in a column. When they are arranged so as to overlap each other in the direction perpendicular to the axial direction, both have an outer diameter that is “large”, and thus there is a risk that they will fall outside the projection area in the axial direction of the image pickup device 30 described above.

  As described above, when the outer diameter of the signal cable extending in the axial direction from the second circuit board 52 and the land position on the second circuit board 52 to which the signal cable is connected are not considered, As in the case, a part of the signal cable may not fit within the projected area of the image pickup element 30 in the axial direction, which may be a hindrance when the image pickup unit is assembled in the endoscope insertion portion.

  In view of the above circumstances, the present invention has the above-described configuration, and proposes means for solving the above problems.

  That is, in the circuit board unit 50 of the first embodiment, as described above, first, the first land group 71 (the first A land 71a and the first B land 71b) formed on the second circuit board 52 is divided into the second The second land group 72 (the second A land 72a and the second B land 72b) is arranged in a line in the order of increasing land width from one side 53 to the other side 54 on the surface of the circuit board. The circuit boards are arranged in rows from one side 53 to the other side 54 in order of decreasing land width.

  In addition, the first signal cable group 61 (the first A signal cable 61a and the first B signal cable 61b) is arranged in order of increasing outer diameter from one side 53 to the other side 54 of the surface of the second circuit board. The first land group 71 (the first A land 71a and the first B land 71b) are respectively connected and extended toward the rear in the axial direction, and further, the second signal cable group 62 (the second A signal cable 62a and the second B cable). The signal cables 62b) are arranged from one side 53 to the other side 54 of the surface of the second circuit board in ascending order of outer diameter, and the second land group 72 (the second A land 72a and the second B land 72b) is arranged. To extend rearward in the axial direction.

  As described above, in the first embodiment, the “thin” land having the land width is arranged on the rear row side of the “row” land having the land width on the front row side, and the land width “thick” on the rear row side is arranged. By arranging a land with a “narrow” land width on the front row side, a “small” signal cable with an outer diameter must be provided on the rear row side of the “large” signal cable that extends from the front row side. In addition, the "small" outer diameter signal cable is always arranged on the front row side of the "large" outer diameter signal cable on the rear row side.

  As a result, in the first embodiment, the “large” outer diameter signal cable is not arranged in a column in the axial direction, and therefore, even if the signal cable extending from the front row side (for example, 1A Even if the signal cable 61a) and the signal cable extending from the rear row side (for example, the second A signal cable 62a) are vertically overlapped with each other in the outer skin portion, within the projected area in the axial direction of the image sensor 30 shown in FIG. Since it falls within the range of the phantom line indicated by the two-dot chain line in FIG. 3, there is an effect that there is no hindrance when the imaging unit is assembled to the endoscope insertion portion.

<Backside Configuration of Circuit Board Unit of Present Embodiment>
As described above, in the circuit board unit 50 of the first embodiment, the two circuit boards, that is, the first circuit board 51 and the second circuit board 52 on which the image pickup device 30 can be mounted, and the second circuit board 52. A first land group 71 and a second land group 72 formed on the first land group, and a first signal soldered to a plurality of lands forming the respective land groups of the first land group 71 and the second land group 72. The cable group 61 and the second signal cable group 62 are included, but among the above-mentioned constituent elements, a first land group 71 and a second land group 72, a first signal cable group 61 and a second signal cable group. 62 is disposed on the board surface 52a of the second circuit board 52 or in the vicinity of the board surface.

  Here, in the circuit board unit 50 of the present embodiment, the same land group and signal cable group are arranged on the back surface side of the second circuit board 52.

  FIG. 6 is an enlarged view of an essential part showing the rear surface side of the circuit board unit in the configuration of the imaging device in the endoscope according to the first embodiment.

  As shown in FIG. 6, on the board rear surface 52b of the second circuit board 52, a third land group 171 and a third land group 171 similar to the first land group 71 and the second land group 72 formed on the board front surface 52a are formed. A 4-land group 172 is formed.

  Similar to the first land group 71, the third land group 171 is composed of a plurality of lands having different land widths. All of the plurality of lands forming the third land group 171 are located on the rear surface 52b of the second circuit board 52 in the region on the front end surface side (the front side of the insertion portion 2) on the rear side of the base end side. When the extending direction is the axial direction, they are arranged in the width direction orthogonal to the axial direction.

  Specifically, as shown in FIG. 6, the plurality of lands forming the third land group 171 is composed of a third A land 171a having a relatively small land width and a third B land 171b having a large land width. ..

  In FIG. 6, the reference numeral 171 in parentheses indicates the third land group 171, the reference numeral 171a indicates the third A land 171a forming the third land group 171, and the reference numeral 171b indicates the third land group. The 3rd B land 171b which comprises 171 is shown.

  Here, as described above, the land widths of the third A land 171a and the third B land 171b are relatively "thin" and "thick", respectively, and as shown in FIG. On the back surface 52b of the second circuit board 52, a third land A 171a having a narrow land width and a third land B 171b having a wide land width are arranged in this order from one side 53 to the other side 54.

  That is, the third A land 171a having the narrow land width on the back surface side of the substrate is disposed on the back surface side of the first A land 71a having the wide land width on the front surface side of the substrate, and the third B land 171b having the wide land width on the back surface side of the substrate. Will be disposed on the back surface side of the first B land 71b having a narrow land width on the front surface side of the substrate.

  On the other hand, similarly to the second land group 72, the fourth land group 172 is also composed of a plurality of lands having different land widths. The plurality of lands forming the fourth land group 172 has a width orthogonal to the axial direction in the rear row side region of the third land group 171 on the back surface 52b of the second circuit board 52. Lined up in the direction.

  More specifically, the plurality of lands forming the fourth land group 172 are configured by a fourth A land 172a having a relatively large land width and a fourth B land 172b having a relatively small land width, as shown in FIG. It

  Note that, similarly to the above, in FIG. 6, the reference numeral 172 in parentheses indicates the fourth land group 172, the reference numeral 172a indicates the fourth A land 172a constituting the fourth land group 172, and the reference numeral 172b indicates the same. The 4th B land 172b which comprises the 4th land group 172 is shown.

  Here, as described above, the land widths of the fourth A land 172a and the fourth B land 172b are relatively “thick” and “thin”, respectively, and as shown in FIG. On the back surface 52b of the second circuit board 52, a fourth land A 172a having a wide land width and a fourth land B 172b having a narrow land width are arranged in this order from one side 53 to the other side 54.

  That is, the fourth land A 172a having a large land width on the back surface side of the substrate is disposed on the back surface side of the second land A 72a having a narrow land width on the front surface side of the substrate, and the fourth land land 172b having a narrow land width on the back surface side of the substrate. Will be disposed on the back surface side of the second B land 72b having a large land width on the front surface side of the substrate.

  Similar to the first signal cable group 61, the third signal cable group 161 is composed of a plurality of signal cables having different outer diameters. The plurality of signal cables forming the third signal cable group 161 are soldered to the plurality of lands in the third land group 171.

  Specifically, the plurality of signal cables in the third signal cable group 161 are arranged in the order of decreasing outer diameter from one side 53 to the other side 54 on the back surface 52b of the second circuit board 52, and It is connected to the opposing lands in the third land group 171 arranged in order from the one side 53 to the other side 54 on the back surface 52b of the substrate in order of decreasing land width, and extends rearward in the axial direction. To do.

  More specifically, as shown in FIG. 6, the conductive wire (core wire 163a) in the third A signal cable 161a forming the third signal cable group 161 is soldered to the third A land 171a in the third land group 171. The conductive wire (core wire 163b) of the third B signal cable 161b forming the third signal cable group 161 is soldered to the third B land 171b of the third land group 171.

  In FIG. 6, similarly to the above, the reference numeral 161 in parentheses indicates the third signal cable group 161, the reference numeral 161a indicates the third A signal cable 161a forming the third signal cable group 161, and the reference numeral 161b indicates Similarly, the third B signal cable 161b that constitutes the third signal cable group 161 is shown.

  Here, as described above, the third A signal cable 161a and the third B signal cable 161b have a relationship that their cable outer diameters are relatively "small" and "large", respectively. Then, as shown in FIG. 6, the third A signal cable 161a is connected to the third A land 171a having the narrow land width, and the third B signal cable 161b is connected to the third B land 171b having the wide land width. (The core wire 163a and the core wire 163b) are soldered.

  Similar to the second signal cable group 62, the fourth signal cable group 162 is composed of a plurality of signal cables having different outer diameters. The plurality of signal cables forming the fourth signal cable group 162 are soldered to the plurality of lands in the fourth land group 172, respectively.

  Specifically, the plurality of signal cables in the fourth signal cable group 162 are arranged in order of increasing outer diameter from one side 53 to the other side 54 on the back surface 52b of the second circuit board 52, and It is connected to the opposing lands in the fourth land group 172 arranged in the order of increasing land width from one side 53 to the other side 54 on the back surface 52b of the substrate, and extends rearward in the axial direction. To do.

  More specifically, as shown in FIG. 6, the conductive wire (core wire 164a) in the fourth A signal cable 162a forming the fourth signal cable group 162 is soldered to the fourth A land 172a in the fourth land group 172. The conductive wire (core wire 164b) in the fourth B signal cable 162b forming the fourth signal cable group 162 is soldered to the fourth B land 172b in the fourth land group 172.

  In FIG. 6, the reference numeral 162 in parentheses indicates the fourth signal cable group 162, the reference numeral 162a indicates the fourth A signal cable 162a constituting the fourth signal cable group 162, and the reference numeral 162b indicates the same. It is assumed that the fourth B signal cable 162b forming the four signal cable group 162 is shown.

  Here, as described above, the cable diameters of the fourth A signal cable 162a and the fourth B signal cable 162b are relatively "large" and "small", respectively. As shown in FIG. 6, the fourth A signal cable 162a is connected to the fourth A land 172a having the thick land width, and the fourth B signal cable 162b is connected to the fourth B land 172b having the narrow land width. (The core wire 164a and the core wire 164b) are soldered.

  The third signal cable group 161 (third A signal cable 161a and third B signal cable 161b) and the fourth signal cable group 162 (fourth A signal cable 162a and fourth B signal cable 162b) are the same as the first signal cable group 61. Like the second signal cable group 62, both are internally provided in the collective signal cable 80.

  Next, the configuration of the signal cable group in the present embodiment will be described in detail.

  FIG. 7 is a cross-sectional view showing one cross section of the collective signal cable applied to the circuit board unit in the endoscope according to the first embodiment.

  As described above, at the rear of the circuit board unit 50, the first signal cable group 61 (first A signal cable 61a and first B signal cable 61b), second signal cable group 62 (second A signal cable 62a and second B cable). A signal cable 62b), a third signal cable group 161 (third A signal cable 161a and a third B signal cable 161b), and a fourth signal cable group 162 (fourth A signal cable 162a and a fourth B signal cable 162b) as a collective signal. A cable 80 is provided.

  As shown in FIG. 7, an interposer 81 made of, for example, cotton thread or the like is disposed in the central portion of the collective signal cable 80, and the signal cables are disposed around the interposer 81. It has become so.

  In the present embodiment, the first A signal cable 61a and the second B signal cable 62b (above, the substrate surface 52a side), the third B signal cable 161b, and the fourth A signal cable, which are the above-described "large" outer diameter signal cables. Each of the 162a (above, the back surface 52b side of the substrate) is assumed to be a power line for transmitting power, and has a structure in which the outer core portion covers the thick core wire.

  The first A signal cable 61a and the second B signal cable 62b (above, the substrate front surface 52a side), and the fourth A signal cable 162a and the third B signal cable 161b (above, the substrate back surface 52b side) are respectively located on the center line of the cross section. Adjacent to each other in line symmetry. 7, the right side corresponds to one side 53 of the second circuit board 52, and the left side corresponds to the other side 54 of the second circuit board 52.

  On the other hand, the second A signal cable 62a and the first B signal cable 61b (above, the substrate surface 52a side) and the third A signal cable 161a and the fourth B signal cable 162b (above) which are relatively "small" signal cables in the present embodiment. , And the rear surface 52b of the substrate) are all assumed to be low power signal transmission lines, and each have a coaxial cable structure having a shield layer.

  Further, in the present embodiment, the second A signal cable 62a on the board front surface 52a side, the third A signal cable 161a on the board back surface 52b side, and the first B signal cable 61b and the board back surface 52b side on the board surface 52a side. The 4B signal cables 162b of (4) have a so-called twisted pair structure in which they are twisted.

  In FIG. 7, an imaginary line indicated by a two-dot chain line indicates an imaginary outer diameter of the twisted wire structure, and these two twisted pairs are line-symmetric with respect to the center line of the cross section through the inclusion 81. Are arranged as follows.

  In the present embodiment, as described above, the second A signal cable 62a and the third A signal cable 161a, and the first B signal cable 61b and the fourth B signal cable 162b have a twisted pair structure. Like the collective signal cable 80A of the modified example shown, the second A signal cable 62a and the third A signal cable 161a, and the first B signal cable 61b and the fourth B signal cable 162b do not adopt a twisted pair structure, and each have a single wire structure, It may be arranged so as to be line-symmetric with respect to the center line of the cross section, with the inclusion 82 having a diameter slightly larger than that of the inclusion 81 interposed therebetween.

<Second Embodiment>
Next, a second embodiment of the present invention will be described.

  FIG. 10 is an enlarged view of an essential part showing the front surface side of the circuit board unit in the configuration of the imaging device in the endoscope according to the second embodiment of the present invention.

  Note that, here, only the differences from the first embodiment will be described, and the detailed description of the same configuration as the first embodiment will be omitted.

  In the circuit board unit 50 of the first embodiment, the circuit board unit 50 is arranged in the front row side area (the front end surface side (the front side of the insertion portion 2) of the second circuit board 52) on the board surface of the second circuit board 52. A signal cable is soldered to each of the land groups, that is, the first land group 71 provided and the second land group 72 arranged in the region on the rear row side. It is characterized in that it is configured to extend rearward.

  On the other hand, in the circuit board unit according to the second embodiment, the circuit board unit is arranged in the front row side area of the second circuit board 52 (the tip surface side of the second circuit board 52 (the front side of the insertion portion 2)). A signal cable having the same magnitude relationship as that of the first embodiment is connected to the provided land group and extends toward the rear in the axial direction, while the signal cable having the same magnitude relationship as that of the first embodiment is provided to the land group disposed in the rear row side region. Is characterized in that it is configured by soldering electronic components having mutually different vertical sizes.

  That is, as shown in FIG. 10, the same land as the first land group 71 (first A land 71a and first B land 71b) in the first embodiment is provided on the front row side on the board surface of the second circuit board 52. A first land group 271 (first A land 271a and first B land 271b) having a width relationship and an arrangement relationship is arranged.

  Further, the first signal land 271a and the first signal land 271b respectively have a first signal cable group 261 (first signal cable group 261) having the same outer diameter size relationship and arrangement relationship as the first signal cable group 61 in the first embodiment. The 1A signal cable 261a and the 1B signal cable 261b) are connected by soldering and are extended rearward in the axial direction.

  Further, on the rear row side on the board surface of the second circuit board 52, there is a land width relationship and a layout relationship similar to the second land group 72 (the second A land 72a and the second B land 72b) in the first embodiment. The second land group 272 (second A land 272a and second B land 272b) is arranged.

  In the second embodiment, the component A 262a and the component B 262b are soldered to the rear row side second land group 272 (second A land 272a and second B land 272b), respectively. ..

  The component A 262a and the component B 262b are composed of electronic components such as an image sensor, a transistor, a chip capacitor, a chip resistor, or an IC. In the present embodiment, they are electronic members having mutually different heights in the direction perpendicular to the axial direction. Suppose.

  Further, in the present embodiment, the vertical heights of the component A 262a and the component B 262b respectively correspond to the size relationship of the outer diameters of the second signal cable group 62 in the first embodiment.

<Explanation of Effects in Second Embodiment>
Next, the effect of the second embodiment having the above-mentioned configuration will be described.

  As described above, in the circuit board unit of the second embodiment, the first land group 271 (the first A land 271a and the first B land 271b) has the same surface as the second circuit board surface as in the first embodiment. The second land group 272 (the second A land 272a and the second B land 272b) is arranged in a line in the order of increasing land width from one side to the other side of the second circuit board surface. Lands are arranged in rows from the one side toward the other side in the order of decreasing land width.

  Further, regarding the first signal cable group 261 (the first A signal cable 261a and the first B signal cable 261b), from the one side to the other side of the second circuit board surface, as in the first embodiment. The outer diameters are arranged in descending order and are connected to the first A land 271a and the first B land 271b, respectively, and extend rearward in the axial direction.

  Then, the component A 262a and the component B 262b are arranged in order of increasing vertical height from one side to the other side of the surface of the second circuit board, and are soldered to the second A land 272a and the second B land 272b, respectively. Connecting.

  As described above, in the second embodiment, the "thin" land having the land width is arranged on the rear row side of the land having the "width" land width on the front row side, and the land width "thick" having the land width on the rear row side is arranged. By arranging the “narrow” land width on the front row side of the land, the height direction size must always be “on” the rear row side of the “large” outer diameter signal cable extending from the front row side. The "small" electronic component is arranged, and the "small" outer diameter electronic signal cable is always arranged on the front row side of the "large" electronic component.

  As a result, in the second embodiment, the signal cable having the “large” outer diameter and the electronic component having the “large” in the height direction are not arranged in tandem.

  Therefore, even if the signal cable extending from the front row side is a “large” outer diameter signal cable (for example, the first A signal cable 261a), the size of the electronic components arranged on the rear row side in the height direction is Since it is “small”, even if the outer surface of the signal cable overlaps the electronic component in the vertical direction, it will be within the projected area of the image pickup element 30 in the axial direction, and the image pickup unit will be attached to the endoscope insertion portion. There is no obstacle in the case.

  On the other hand, even when the size of the electronic component arranged on the rear row side in the height direction is “large”, the signal cable extending from the front row side has a “small” outer diameter (for example, the 1B signal). Since it is the cable 261b), even if the outer portion of the signal cable overlaps with the electronic component in the vertical direction, it will be within the projected area of the image pickup element 30 in the axial direction. There is no hindrance when it is assembled to the endoscope insertion part.

  In the second embodiment, only the signal cable is connected to the land group arranged in the front row side region of the second circuit board 52, while the signal cable is connected to the rear row side region of the second circuit board 52. It is assumed that only the electronic components having mutually different vertical sizes are solder-connected to the provided land groups, but the present invention is not limited to this, and the plurality of land groups described above are respectively provided with the technology of the present invention. The signal cable and the electronic component may be mixedly arranged without departing from the concept.

<Third Embodiment>
Next, a third embodiment of the present invention will be described.

  FIG. 11 is an enlarged view of an essential part showing a part of the configuration of the imaging device in the endoscope according to the third embodiment of the present invention in a cross section.

  Note that, here, only the differences from the first embodiment will be described, and the detailed description of the same configuration as the first embodiment will be omitted.

  In the first embodiment, the first circuit board 51 is configured by mounting the image pickup device 30 on the surface facing the front of the insertion portion 2 (front of the image pickup device 25), that is, the second circuit board 52 described above. When the signal cables (the first signal cable group 61 and the second signal cable group 62) were soldered, the image pickup device 30 was mounted on the first circuit board 51 (see FIG. 3, etc.). ..

  On the other hand, in the third embodiment, as shown in FIG. 11, when the above-described signal cables (first signal cable group 61, second signal cable group 62) are soldered to the second circuit board 52, Is characterized in that the image pickup device 30 is kept separated from the first circuit board 51, and is mounted on the first circuit board 51 after the solder connection step.

  Since other configurations are similar to those of the first embodiment, description thereof is omitted here, but it goes without saying that the third embodiment also has the same effect as that of the first embodiment. ..

  The present invention is not limited to the embodiments described above, and various modifications and changes can be made without departing from the spirit of the present invention, which are also within the technical scope of the present invention.

1: endoscope 2: insertion part 20: imaging unit 25: imaging device 30: imaging device 50: circuit board unit 51: first circuit board 52: second circuit board 52a: board surface 53: one side 54: other Side 61: 1st signal cable group 61a: 1st A signal cable 61b: 1st B signal cable 62: 2nd signal cable group 62a: 2nd A signal cable 62b: 2nd B signal cable 71: 1st land group 71a: 1A Land 71b: First B land 72: Second land group 72a: Second A land 72b: Second B land 80: Collective signal cable

Claims (4)

The first signal cable is connected to a land group on the front row side on the surface of the circuit board, which is capable of mounting an image pickup device on the surface, and is connected to the land group on the front row side and extends rearward in the axial direction. The first signal cable and the second signal cable axially arranged in a column and connected to the land group on the rear row side are arranged so as to vertically overlap with the surface of the circuit board. Circuit board unit,
A circuit board on which an image sensor can be mounted on the surface,
In the region on the front end surface side on the surface of the circuit board, when the direction extending toward the rear of the base end side of the circuit board is the axial direction, the columns are arranged in the width direction orthogonal to the axial direction. A first land group that includes a plurality of lands each having a different land width and is arranged in order from the one side to the other side of the surface of the circuit board in the order of increasing the land width,
In the region on the rear row side of the first land group on the surface of the circuit board, a plurality of lands each having a different land width are arranged in a row in a width direction orthogonal to the axial direction. At the same time, a second land group that is arranged in order from at least one side of the circuit board surface toward the other side in order of decreasing land width,
A first signal cable group configured to include a plurality of first signal cables each having a different outer diameter, the first signal cable group being solder-connected to each land in the first land group;
A second signal cable group configured to include a plurality of the second signal cables each having a different outer diameter, the second signal cable group being solder-connected to each land in the second land group;
Equipped with
The plurality of first signal cables in the first signal cable group are arranged in order of increasing outer diameter from one side to the other side of the circuit board surface, and the one side of the circuit board surface. From one side to the other side, at least the land width is respectively connected to the opposing lands in the first land group arranged in a row in the order of increasing, extending toward the rear in the axial direction,
The plurality of second signal cables in the second signal cable group are arranged in order of decreasing outer diameter from one side to the other side of the circuit board surface, and the one side of the circuit board surface. A circuit that is connected to the opposing lands in the second land group arranged in the order of at least the land width from one side to the other side, and extends rearward in the axial direction. Board unit. The circuit board is a circuit board unit configured by stacking a plurality of plate-shaped substrates, and includes a first circuit board unit on which a surface of the image sensor can be mounted and which is vertically extended. Of the plate-shaped substrates are stacked, the front end surface of the first circuit board part is configured to be orthogonal to the stacking direction of the plurality of plate-shaped substrates of the first circuit board part . A second circuit board portion that is connected to the back surface of the circuit board portion while being connected thereto, and that extends in the horizontal direction from the front end surface toward the rear end side rearward;
The first land group has a region on the front end surface side on the surface of the second circuit board portion with respect to the axial direction when the direction extending rearward of the base end side is the axial direction. And a plurality of lands having different land widths, which are arranged in a row in a width direction orthogonal to each other, and at least the land width from one side to the other side of the surface of the second circuit board section. Are arranged in the order of thick,
The second land groups are arranged on the surface of the second circuit board portion in a region on the rear row side of the first land groups and are arranged in a row in a width direction orthogonal to the axial direction. Includes a plurality of lands each having a different thickness, and is arranged in order from one side to the other side of the surface of the second circuit board portion in the order of at least the land width,
The plurality of first signal cables in the first signal cable group are arranged in order of increasing outer diameter from one side to the other side of the surface of the second circuit board portion, and face each other. Connected to a plurality of lands forming the first land group,
The plurality of second signal cables in the second signal cable group are arranged in order of decreasing outer diameter from one side to the other side of the surface of the second circuit board portion, and face each other. The circuit board unit according to claim 1, wherein the circuit board unit is connected to a plurality of lands that form a second land group. The circuit board unit according to claim 1 or 2,
An image sensor mounted on the circuit board;
An image pickup apparatus comprising: An insertion portion for inserting into a subject,
The image pickup apparatus according to claim 3, wherein the image pickup apparatus is arranged in the insertion portion.
An endoscope comprising: