JP2017086326A - Circuit substrate unit, imaging device, and endoscope - Google Patents

Abstract

PROBLEM TO BE SOLVED: To enable a signal cable or an electronic component for an imaging device to be appropriately disposed in a space limited in a tip of an insertion part of an endoscope.SOLUTION: On a substrate surface of a second circuit substrate 52 which is horizontally extended from a first circuit substrate 51, there are provided: a first land group 71 in which lands are aligned in a width direction in an order of width thickness from thicker land; a second land group 72 in which lands are aligned in a width direction in an order of width thickness from thinner land at a rear side of the first land group 71; a first signal cable group 61 solder-connected to a plurality of lands in the first land group 71 in an order from larger cable outer diameter; and a second signal cable group 62 solder-connected to a plurality of lands in the second land group 72 in an order from smaller cable outer diameter.SELECTED DRAWING: Figure 2

Description

  The present invention relates to a circuit board unit, an imaging apparatus, and an endoscope, and in particular, a circuit board unit connected to an imaging element disposed at a distal end portion of an insertion portion of the endoscope, and an imaging apparatus using the circuit board unit The present invention also relates to an endoscope using the imaging device.

  In recent years, further reduction in diameter has been required for an insertion portion of an endoscope, and accordingly, downsizing of an imaging element disposed at a distal end portion of the insertion portion of the endoscope has been promoted. Furthermore, with the miniaturization of the image sensor, it is required to further miniaturize the image pickup unit using the image sensor.

  On the other hand, the role of electronic components or signal cables mounted on the circuit board unit connected to the image sensor has been diversified along with the enhancement of the functionality of the image sensor, and as a result, the electronic component or signal has been diversified. There are various variations with respect to the size, thickness, or number of the cables themselves.

  Here, when a relatively large electronic component or a thick signal cable overlaps at the endoscope insertion portion that is being reduced in diameter as described above, particularly at the distal end portion thereof, the inside of the distal end portion of the insertion portion of the endoscope is limited. There is a risk that the space may not fit within the projected area of the image sensor disposed at the distal end of the insertion portion.

  On the other hand, as a technique for efficiently disposing these signal cables and lands on the substrate to which the signal cables are connected in the casing at the distal end portion of the endoscope insertion portion to be reduced in diameter, for example, Japanese Unexamined Patent Application Publication No. 2011-249870 (Patent Document 1) discloses a technique in which electronic components including capacitors and the like are arranged in a staggered manner.

JP 2011-249870 A

  However, the description in Patent Document 1 in which electronic components are arranged in a staggered manner makes sense if the distance between lands on the substrate on which the electronic components and the like are arranged is spaced apart by a certain amount. When the circuit board is further reduced in size with the increase in size, that is, when the land interval (particularly, the interval in the width direction) is further reduced, the following problems occur.

  That is, in the technique described in Patent Document 1, since the arrangement of the relatively thick signal cable is not particularly considered with respect to the arrangement position of the land on the substrate, for example, the relatively thick signal cable is used. In some cases, there is a case where the insertion portion must be arranged in the longitudinal direction of the insertion portion, and in this case, a portion where the thick signal cables overlap with each other in the vertical direction of the axis is generated, and the imaging element arranged at the distal end portion of the insertion portion There is a risk that it will not fit within the projected area.

  The present invention has been made in view of the above circumstances, and a circuit board unit capable of appropriately arranging a signal cable or an electronic component according to an imaging element in a limited space in the distal end portion of an endoscope insertion portion, An object is to provide an imaging device and an endoscope.

  A circuit board unit according to an aspect of the present invention extends toward the rear side on the base end side of the circuit board in a circuit board on which an image pickup device can be mounted on the surface and a region on the front end surface side on the circuit board surface A first land group formed by a plurality of lands having different land widths, arranged in a width direction orthogonal to the axial direction when the direction to be performed is an axial direction, and the circuit On the substrate surface, a region on the rear row side of the first land group is configured by a plurality of lands arranged in a width direction orthogonal to the axial direction and having different land widths. A plurality of lands constituting the first land group, the land lands being arranged in order of increasing land width from one side to the other side of the circuit board surface. Multiple Command is the land width is arrayed in a narrow turn toward the other side from the one side of the circuit board surface.

  An imaging device according to an aspect of the present invention includes the circuit board unit and an imaging element mounted on the circuit board.

  An endoscope according to an aspect of the present invention includes an insertion portion for insertion into a subject, and the imaging device disposed in the insertion portion.

  According to the present invention, there are provided a circuit board unit, an imaging apparatus, and an endoscope that can appropriately arrange a signal cable or an electronic component related to an imaging element in a limited space in the distal end portion of the endoscope insertion portion. be able to.

FIG. 1 is an external perspective view showing a schematic configuration of an endoscope according to the first embodiment of the present invention. FIG. 2 is a cross-sectional view illustrating the imaging device disposed at the distal end portion of the insertion portion and the peripheral portion thereof in the endoscope according to the first embodiment. FIG. 3 is an enlarged view of a main part of a part of the configuration of the imaging device in the endoscope according to the first embodiment. FIG. 4 is an enlarged view of a main part showing the surface side of the circuit board unit in the configuration of the imaging device in the endoscope according to the first embodiment. FIG. 5 is an enlarged perspective view of a main part of the configuration of the imaging device in the endoscope according to the first embodiment, with the circuit board unit facing obliquely from above. FIG. 6 is an essential part enlarged view showing the back side of the circuit board unit in the configuration of the imaging device in the endoscope according to the first embodiment. FIG. 7 is a cross-sectional view showing a cross section of the collective signal cable applied to the circuit board unit in the endoscope according to the first embodiment. FIG. 8 is a cross-sectional view showing a cross section of the collective signal cable according to a modification applied to the circuit board unit in the endoscope according to the first embodiment. FIG. 9 is an enlarged view of an essential part of a circuit board unit in a conventional endoscope, partly shown in cross section. FIG. 10 is an enlarged view of a main part showing the surface side of the circuit board unit in the configuration of the imaging device in the endoscope according to the second embodiment of the present invention. FIG. 11 is an essential part enlarged view showing a part of a configuration of an imaging apparatus in an endoscope according to the third embodiment of the present invention in a cross section.

Embodiments of the present invention will be described below with reference to the drawings.
Moreover, this invention is not limited by this embodiment. Furthermore, the same code | symbol is attached | subjected to the same part in description of drawing. Furthermore, the drawings are schematic, and it should be noted that the relationship between the thickness and width of each member, the ratio of each member, and the like are different from the actual ones. Moreover, the part from which a mutual dimension and ratio differ also in between drawings.

<First Embodiment>
FIG. 1 is an external perspective view showing a schematic configuration of the endoscope according to the first embodiment of the present invention, and FIG. 2 is arranged at the distal end portion of the insertion portion in the endoscope according to the first embodiment. It is sectional drawing which showed the provided imaging device and its peripheral part.

  As shown in FIG. 1, an electronic endoscope (endoscope) 1 includes a long insertion portion 2 that is inserted into a body cavity of a subject, and an operation portion 3 that is connected to the proximal end of the insertion portion 2. The universal cord 6 that extends from the operation unit 3 and includes various cables that connect to a light source device (not shown) and a video system center (camera control unit, CCU), and the light source device disposed on the base end side of the universal cord 6 And a video connector 5 that is disposed from the light guide connector 4 via a communication cable 7 and is connected to the video system center.

  The insertion portion 2 is provided with a distal end portion 11 mainly composed of a metal member such as stainless steel, a bending portion 12 and a rigid tube 13 composed of a metal tube such as stainless steel in order from the distal end side. Yes. This insertion portion 2 is a portion to be inserted into the body, and the distal end portion 11 incorporates an imaging unit 20 (see FIG. 2).

  In addition, inside the bending portion 12 and the rigid tube 13, an image pickup cable bundle 27 (see FIG. 2) that includes various cables that are electrically connected to the image pickup unit 20, and a light guide bundle that transmits illumination light to the distal end portion 11. (Not shown) etc. are inserted.

  In addition, although the electronic endoscope 1 of this embodiment has illustrated the rigid endoscope by which the base end side was comprised with the rigid pipe | tube 13 rather than the bending part 12, it is not limited to this, From the bending part 12 Alternatively, the endoscope may be a flexible endoscope configured by a flexible tube having flexibility on the base end side.

  The operation unit 3 includes an angle lever 14 for remotely operating the bending unit 12 and various switches 16 for operating the light source device, the video system center, and the like. The angle lever 14 is a bending operation means that can operate the bending portion 12 of the insertion portion 2 in four directions, up, down, left, and right here. Note that the bending portion 12 is not limited to a configuration that can be bent in four directions, up, down, left, and right, and may be configured to be capable of bending in only two directions, for example, up and down.

  Next, the configuration of the imaging unit 20 built in the distal end portion 11 of the electronic endoscope 1 will be described in detail with reference to FIG.

  As shown in FIG. 2, the imaging unit 25 is connected to the objective optical unit 21, the element frame 22 connected to the base end side of the objective optical unit 21, and the base end side of the element frame 22. The shield frame 23, the heat shrinkable tube 24 sheathed on the shield frame 23, the imaging device 25 held in the element frame 22 and accommodated in the shield frame 23, and the imaging device 25 filled in the shield frame 23 And an insulating sealing resin 26 for sealing.

  The objective optical unit 21 includes, for example, optical members such as a plurality of optical lenses 21a and a diaphragm 21b, and a lens frame 21c that holds the optical lenses 21a and the diaphragm 21b.

  The element frame 22 is configured by a cylindrical member made of stainless steel, for example. The distal end side of the element frame 22 is externally fitted to the proximal end side of the lens frame 21 c, whereby the element frame 22 is continuously provided on the optical axis O of the objective optical unit 21.

  The shield frame 23 is configured by a substantially cylindrical member formed by bending a stainless steel thin plate, for example. The front end side of the shield frame 23 is externally fitted to the element frame 22, and thereby, an accommodation chamber 23 a for accommodating the imaging device 25 is formed behind the element frame 22.

<Configuration of Imaging Device in Present Embodiment>
FIG. 3 is a main part enlarged view showing a part of the configuration of the imaging apparatus in the endoscope according to the first embodiment in cross section, and FIG. 4 is an imaging in the endoscope according to the first embodiment. It is the principal part enlarged view which showed the surface side of the circuit board unit about the structure of the apparatus. FIG. 5 is an enlarged perspective view of a main part of the configuration of the imaging device in the endoscope according to the first embodiment, with the circuit board unit facing obliquely from above.

  The imaging device 25 includes an imaging element 30 and a circuit board unit 50 that is electrically connected to the imaging element 30.

  In the present embodiment, the imaging element 30 is constituted by a complementary metal oxide semiconductor (CMOS) image sensor, and includes a base portion 30b having a plate shape, and a substantially square light receiving surface 30a disposed on the front surface of the base portion 30b. The first cover glass 31 is attached to the front surface of the light receiving surface 30a.

  In addition, a second cover glass 32 is laminated and adhered to the first cover glass 31, and the second cover glass 32 is fitted into the base end side of the element frame 22 (see FIG. 2). Thereby, the image sensor 30 is held at the imaging position of the objective optical unit 21.

<Configuration of Circuit Board Unit in the Present Embodiment>
The circuit board unit 50 is formed on a first circuit board 51 on which the image pickup device 30 can be mounted, a second circuit board 52 connected in contact with the first circuit board 51, and a second circuit board 52. A first land group 71 and a second land group 72 composed of a plurality of lands, and a first signal cable group composed of a plurality of signal cables soldered to the plurality of lands in the first land group 71, respectively. 61 and a second signal cable group 62 constituted by a plurality of signal cables soldered to the plurality of lands in the second land group 72, respectively.

  The first circuit board 51 and the second circuit board 52 are closely related as a circuit board on which the image sensor 30 is mounted, and even if they are physically separate, they are also integrated. It may be a circuit board.

  Here, when the first circuit board 51 and the second circuit board 52 are an integrated circuit board, the imaging element 30 is a portion corresponding to the first circuit board 51 in the integrated circuit board. The first land group 71 and the second land group 72 are mounted on a portion corresponding to the second circuit board 52 (second circuit board part). It becomes.

  Hereinafter, the first circuit board 51 includes the concept of the first circuit board unit described above in the case where the first circuit board 51 and the second circuit board 52 are integrated, Similarly, the circuit board 52 includes the concept of the second circuit board unit described above.

  Further, behind the circuit board unit 50, a collective signal cable 80 is provided, in which the first signal cable group 61 and the second signal cable group 62 are provided. The collective signal cable 80 constitutes a part of the imaging cable bundle 27 that is inserted through the insertion portion 2.

  Note that the signal cables constituting the first signal cable group 61 and the second signal cable group 62 transmit predetermined signals or electric power, and therefore both are electronic members constituting the circuit board unit 50. It can be said that it performs the function (note that the structure of the signal cable will be described in detail later).

  The first circuit board 51 is a circuit board formed by extending a plurality of thin ceramic substrates so as to be laminated in a direction perpendicular to the axial direction on the insertion portion 2 and forming a vertically long substantially rectangular parallelepiped, The imaging element 30 can be mounted on the surface facing the front of the insertion portion 2 (front of the imaging device 25).

  The second circuit board 52 is a circuit board formed by laminating a plurality of thin ceramic substrates (having a surface having a relatively large area as compared to the ceramic substrate in the first circuit board 51) to form a horizontally long substantially rectangular parallelepiped. Then, the front end surface of the first circuit board 51 is in contact with and connected to the back surface of the first circuit board 51 so that the stacked stacking directions are orthogonal to each other. Further, the second circuit board 52 extends in the horizontal direction from the distal end surface toward the proximal side rear side (the proximal side rear side of the insertion portion 2).

  The first land group 71 is composed of a plurality of lands having different land widths. The plurality of lands constituting the first land group 71 are all in the region on the front end surface side (the front side of the insertion portion 2, hereinafter also referred to as the front row side) on the substrate surface 52a of the second circuit board 52. When the direction extending toward the rear side on the base end side is the axial direction, the rows are arranged in the width direction orthogonal to the axial direction.

  Specifically, in the present embodiment, the plurality of lands constituting the first land group 71 include a first A land 71a having a relatively large land width and a land width as shown in FIGS. The first B land 71b is thin.

  In the present embodiment, the plurality of lands constituting the first land group 71 are exemplified by two lands having different land widths. However, the present invention is not limited to this, and the first land group 71 includes the lands. You may be comprised by the 3 or more several land arranged in order from the relatively thick thing to the thin thing.

  When the first land group 71 is composed of three or more lands, the land width is basically arranged in order from the relatively wide land to the thin land, that is, the land width of each land. Are different from each other, but it is not always necessary to arrange all the land widths in order from thick to thin. For example, in the land group arranged, there are lands having substantially the same land width. There may be a portion arranged to be adjacent.

  3, 4, and 5, reference numeral 71 in parentheses indicates the first land group 71, reference numeral 71a indicates the first A land 71a that constitutes the first land group 71, and reference numeral 71b indicates Similarly, the first B land 71b constituting the first land group 71 is shown.

  Here, as described above, the land widths of the first A land 71a and the first B land 71b are relatively “thick” and “thin”, respectively. As shown in FIG. 4, on the substrate surface 52a of the second circuit board 52, from the one side 53 to the other side 54, the thick land width first A land 71a and the narrow land width first B land 71b are arranged in this order. Lined up.

  On the other hand, similarly to the first land group 71, the second land group 72 is composed of a plurality of lands having different land widths. The plurality of lands constituting the second land group 72 have a width orthogonal to the axial direction in a region on the rear row side of the first land group 71 on the substrate surface 52a of the second circuit board 52. Lined up in the direction.

  More specifically, in the present embodiment, the plurality of lands constituting the second land group 72 are, as shown in FIGS. 3 and 4, a second land A having a relatively small land width and a land width that is relatively large. And a second B land 72b.

  In the present embodiment, as for the second land group 72, the plurality of lands constituting the second land group 72 are exemplified by two lands having different land widths. However, the present invention is not limited to this. The second land group 72 may be composed of a plurality of three or more lands arranged in order from a relatively narrow land to a thick land.

  The second land group 72 also has a land width that is substantially the same among the land groups arranged in a row when the second land group 72 is composed of three or more lands as in the first land group 71 described above. There may be places where the lands are adjacent to each other.

  3, 4, and 5, the reference numeral 72 in parentheses indicates the second land group 72, the reference numeral 72a indicates the second A land 72a that constitutes the second land group 72, and the reference numeral 72b indicates Similarly, the second B land 72b constituting the second land group 72 is shown.

  Here, as described above, the second A land 72a and the second B land 72b have a relation that their land widths are relatively “thin” and “thick”, respectively (that is, the first A land 71a). In this embodiment, as shown in FIG. 4, from one side 53 to the other side 54 on the substrate surface 52a of the second circuit board 52 in this embodiment. The second land A having a narrow land width and the second land B having a large land width are arranged in this order.

  The first signal cable group 61 includes a plurality of signal cables having different outer diameters. The plurality of signal cables constituting the first signal cable group 61 are soldered to face the plurality of lands in the first land group 71, respectively.

  Specifically, the plurality of signal cables in the first signal cable group 61 are arranged in order of increasing outer diameter from one side 53 to the other side 54 on the board surface 52a of the second circuit board 52, and Connected to opposing lands in the first land group 71 arranged in order of increasing land width from one side 53 to the other side 54 on the substrate surface 52a, and extends toward the rear in the axial direction. To do.

  More specifically, as shown in FIGS. 3, 4, and 5, the first A land 71 a in the first land group 71 is connected to the conductive wire (in the first A signal cable 61 a constituting the first signal cable group 61 ( The core wire 63a) is solder-connected, and the conductive wire (core wire 63b) in the first B signal cable 61b constituting the first signal cable group 61 is solder-connected to the first B land 71b in the first land group 71. ing.

  In the present embodiment, the plurality of signal cables constituting the first signal cable group 61 are exemplified as two signal cables having different outer diameters. However, as described above, three or more first land groups 71 are provided. In this case, the first signal cable group 61 may be composed of a plurality of signal cables arranged in order from a relatively large cable outer diameter to a small cable outer diameter. .

  Further, at this time, the first signal cable group 61 is basically arranged in order from a relatively large cable outer diameter to a small cable outer diameter, that is, the cable diameters are different from each other. It is not necessary to arrange all cable diameters in order from the largest to the smallest. For example, in the cable group to be arranged, there are places where cables having substantially the same cable diameter are arranged adjacent to each other. There may be.

  3, 4, and 5, similarly to the above, the reference numeral 61 in parentheses indicates the first signal cable group 61, and the reference numeral 61 a indicates the first A signal cable 61 a that constitutes the first signal cable group 61. Reference numeral 61b denotes the first B signal cable 61b that also constitutes the first signal cable group 61.

  Here, as described above, the first A signal cable 61a and the first B signal cable 61b have a relationship in which the cable outer diameters are relatively “large” and “small”, respectively. In the present embodiment, as shown in FIGS. 3, 4, and 5, the first A signal cable 61a is the first land A having the large land width, and the first B signal cable 61b is the first land having the narrow land width. Each conductive wire (core wire 63a, core wire 63b) is soldered to the 1B land 71b.

  Similar to the first signal cable group 61, the second signal cable group 62 includes a plurality of signal cables having different outer diameters. The plurality of signal cables constituting the second signal cable group 62 are soldered to the plurality of lands in the second land group 72, respectively.

  Specifically, the plurality of signal cables in the second signal cable group 62 are arranged in ascending order of the outer diameter from one side 53 to the other side 54 on the board surface 52a of the second circuit board 52, and Connected to opposing lands in the second land group 72 arranged in the order of narrow land width from one side 53 to the other side 54 on the substrate surface 52a, and extends toward the rear in the axial direction. To do.

  More specifically, as shown in FIGS. 3, 4, and 5, the second A land 72 a in the second land group 72 has a conductive wire (in the second A signal cable 62 a constituting the second signal cable group 62 ( The core wire 64a) is solder-connected, and the conductive wire (core wire 64b) in the second B signal cable 62b constituting the second signal cable group 62 is solder-connected to the second B land 72b in the second land group 72. ing.

  In the present embodiment, the second signal cable group 62 is also exemplified by two signal cables having different outer diameters as a plurality of signal cables constituting the second signal cable group 62. When the second land group 72 is composed of three or more lands, the second signal cable group 62 is also arranged in order from the relatively small to the largest cable outer diameter. It may be configured by a plurality of signal cables.

  At this time, the second signal cable group 62 is basically arranged in order from the relatively large cable outer diameter to the smallest cable outer diameter as described above, that is, the cable diameters are different from each other. However, in the cable group arranged in a row, there may be a place where cables having substantially the same cable diameter are arranged adjacent to each other.

  3, 4, and 5, reference numeral 62 in parentheses indicates the second signal cable group 62, and reference numeral 62 a indicates the second A signal cable 62 a that constitutes the second signal cable group 62, Reference numeral 62 b denotes the second B signal cable 62 b that similarly constitutes the second signal cable group 62.

  Here, as described above, the second A signal cable 62a and the second B signal cable 62b have a relationship that the cable outer diameters are relatively “small” and “large”, respectively (that is, the first The 1A signal cable 61a and the first B signal cable 61b have a reverse relationship). In the present embodiment, as shown in FIGS. 3, 4 and 5, the second A signal cable 62a is the second land A having the narrow land width, and the second B signal cable 62b is the second land having the thick land width. The respective conductive wires (core wire 64a and core wire 64b) are solder-connected to the 2B land 72b.

<Description of effects in the first embodiment>
Next, effects of the first embodiment having the above-described configuration will be described.

  Prior to the description of the effect of the present embodiment, in consideration of the fact that a thick signal cable is provided in the circuit board unit having the same shape as the first circuit board 51 and the second circuit board 52 as in the present invention. An example of land layout that is not performed will be described with reference to FIG. 9 showing a conventional reference example.

  FIG. 9 is an enlarged view of an essential part of a circuit board unit in a conventional endoscope, partly shown in cross section.

  As shown in FIG. 9, the first land 211 and the second land 212 are arranged in the axial direction on the front surface side of the second circuit board 52 in the reference example, and the third land is arranged on the back surface side. It is assumed that the land 213 and the fourth land 214 are arranged vertically in the axial direction.

  The first signal cable 201 and the second signal cable 202 having a relatively large outer diameter are connected to the first land 211 and the second land 212, respectively, and extend rearward in the axial direction. On the other hand, the third signal cable 203 and the fourth signal cable 204 having a relatively small outer diameter are connected to the third land 213 and the fourth land 214, respectively, and are rearward in the axial direction. Suppose that they are arranged in a column.

  Thus, the first signal cable 201 and the second signal cable 202, and the third signal cable 203 and the fourth signal cable 204 are all arranged in a column in the axial direction.

  Here, since the third signal cable 203 and the fourth signal cable 204 are arranged in a column, even if they are arranged so as to overlap in a direction perpendicular to the axial direction, the outer diameter is “small” from the beginning. The first signal cable 201 and the second signal cable 202 are arranged in tandem, although they fall within the projected area in the axial direction of the image sensor 30 (within the range of the phantom line indicated by the two-dot chain line in FIG. 9). If they are arranged so as to overlap in a direction perpendicular to the axial direction, the outer diameters are both “large”, so that there is a possibility that they will not fit within the projected area in the axial direction of the image sensor 30 described above.

  As described above, when the arrangement relationship between the outer diameter of the signal cable extending in the axial direction from the second circuit board 52 and the land position on the second circuit board 52 to which the signal cable is connected is not considered, As in the case, a part of the signal cable does not fit within the axial projection area of the image sensor 30, which may hinder the assembly of the imaging unit into the endoscope insertion portion.

  The present invention has the above-described configuration in view of the above circumstances, and proposes means for solving the above problems.

  That is, in the circuit board unit 50 according to the first embodiment, as described above, first, the first land group 71 (the first A land 71a and the first B land 71b) formed on the second circuit board 52 is replaced with the second land group 71. The circuit board surface is arranged in a row in order of increasing land width from one side 53 to the other side 54, and the second land group 72 (second A land 72a and second B land 72b) is arranged in the second side. The circuit boards are arranged in a row in order of increasing land width from one side 53 to the other side 54 of the circuit board surface.

  In addition, the first signal cable group 61 (the first A signal cable 61a and the first B signal cable 61b) is arranged in order of increasing outer diameter from one side 53 to the other side 54 of the surface of the second circuit board. The first land group 71 (first A land 71a and first B land 71b) is connected to the first land group 71 and extends rearward in the axial direction, and further the second signal cable group 62 (second A signal cable 62a and second B land). The signal cable 62b) is arranged in order of decreasing outer diameter from one side 53 to the other side 54 of the second circuit board surface, and the second land group 72 (second A land 72a and second B land 72b). And extending toward the rear in the axial direction.

  As described above, in the first embodiment, the “thin” land having the “land width” on the front row side is arranged on the rear row side of the land having the “thick” land width on the front row side. A land with a thin land width is arranged on the front row side of the land, so that a signal cable with a small outer diameter is always on the rear row side of the “large” signal cable extending from the front row side. In addition, a “small” signal cable having an outer diameter is always arranged on the front row side of the “large” signal cable having the outer diameter on the rear row side.

  As a result, in the first embodiment, the “large” signal cable having the outer diameter is not arranged in a column in the axial direction. Therefore, even if the signal cable extends from the front row side (for example, the first A Even if the signal cable 61a) and the signal cable extending from the rear row side (for example, the second A signal cable 62a) overlap in the vertical direction at the outer skin portion thereof, the projected area in the axial direction of the image sensor 30 shown in FIG. (In FIG. 3, it is within the range of the phantom line indicated by a two-dot chain line), and there is an effect that there is no problem even when the imaging unit is assembled to the endoscope insertion portion.

<Configuration of the back surface of the circuit board unit of this embodiment>
As described above, the circuit board unit 50 of the first embodiment includes the two circuit boards, the first circuit board 51 and the second circuit board 52, on which the image pickup device 30 can be mounted, and the second circuit board 52. First land group 71 and second land group 72 formed on the first land group 71, and a plurality of lands constituting the respective land groups of the first land group 71 and the second land group 72 are solder-connected to each other. The cable group 61 and the second signal cable group 62 include the first land group 71 and the second land group 72, the first signal cable group 61, and the second signal cable group among the above components. 62 is disposed on the substrate surface 52a of the second circuit substrate 52 or in the vicinity of the substrate surface.

  Here, in the circuit board unit 50 of the present embodiment, the land group and the signal cable group similar to the above are also arranged on the back surface side of the second circuit board 52.

  FIG. 6 is an essential part enlarged view showing the back side of the circuit board unit in the configuration of the imaging device in the endoscope according to the first embodiment.

  As shown in FIG. 6, on the substrate back surface 52b of the second circuit board 52, a third land group 171 and a second land group 171 similar to the first land group 71 and the second land group 72 formed on the substrate surface 52a are formed. Four land groups 172 are formed.

  Similar to the first land group 71, the third land group 171 is composed of a plurality of lands having different land widths. The plurality of lands constituting the third land group 171 are all located on the rear side of the base end side in the region on the front end surface side (the front side of the insertion portion 2) on the substrate back surface 52b of the second circuit board 52. When the direction extending toward the axial direction is the axial direction, they are arranged in the width direction perpendicular to the axial direction.

  Specifically, as shown in FIG. 6, the plurality of lands constituting the third land group 171 are composed of a third A land 171a having a relatively small land width and a third B land 171b having a relatively large land width. .

  In FIG. 6, reference numeral 171 in parentheses indicates the third land group 171, reference numeral 171 a indicates the third A land 171 a constituting the third land group 171, and reference numeral 171 b indicates the third land group. It is assumed that the third B land 171b constituting the 171 is shown.

  Here, as described above, the third A land 171a and the third B land 171b have a relation that the land widths are relatively “thin” and “thick”, respectively, and as shown in FIG. On the substrate back surface 52b of the second circuit board 52, the third land A 171a having a narrow land width and the third B land 171b having a large land width are arranged in this order from one side 53 to the other side 54.

  That is, the 3A land 171a having the narrow land width on the back surface side of the substrate is disposed on the back surface side of the 1A land 71a having the large land width on the substrate surface side, and the 3B land 171b having the wide land width on the back surface side of the substrate. Is disposed on the back side of the first B land 71b having a narrow land width on the front surface side of the substrate.

  On the other hand, like the second land group 72, the fourth land group 172 is composed of a plurality of lands having different land widths. The plurality of lands constituting the fourth land group 172 have a width orthogonal to the axial direction in the rear row side region of the third land group 171 on the substrate rear surface 52b of the second circuit board 52. Lined up in the direction.

  More specifically, as shown in FIG. 6, the plurality of lands constituting the fourth land group 172 are composed of a fourth land A 172a having a relatively large land width and a fourth land B 172b having a relatively small land width. The

  Similarly to the above, in FIG. 6, the reference numeral 172 in parentheses indicates the fourth land group 172, the reference numeral 172a indicates the fourth A land 172a constituting the fourth land group 172, and the reference numeral 172b is the same. The fourth land 172b constituting the fourth land group 172 is shown.

  Here, as described above, the 4A land 172a and the 4B land 172b have a relation that their land widths are relatively “thick” and “thin”, respectively, and as shown in FIG. On the substrate rear surface 52b of the second circuit board 52, the fourth land A 172a having a large land width and the fourth B land 172b having a narrow land width are arranged in this order from one side 53 to the other side 54.

  That is, the 4A land 172a having the large land width on the back surface side of the substrate is disposed on the back surface side of the 2nd land A having a narrow land width on the substrate surface side, and the 4B land 172b having the narrow land width on the back surface side of the substrate. Is disposed on the back surface side of the second B land 72b having a large land width on the front surface side of the substrate.

  Similar to the first signal cable group 61, the third signal cable group 161 is composed of a plurality of signal cables having different outer diameters. The plurality of signal cables constituting the third signal cable group 161 are soldered to the plurality of lands in the third land group 171, respectively.

  Specifically, the plurality of signal cables in the third signal cable group 161 are arranged in order of decreasing outer diameter from one side 53 to the other side 54 on the substrate back surface 52b of the second circuit board 52, and Connected to opposing lands in the third land group 171 arranged in the order of narrow land width from one side 53 to the other side 54 on the substrate back surface 52b, and extends toward the rear in the axial direction. To do.

  More specifically, as shown in FIG. 6, the conductive wire (core wire 163a) in the third A signal cable 161a constituting the third signal cable group 161 is solder-connected to the third A land 171a in the third land group 171. Thus, the conductive wire (core wire 163b) in the third B signal cable 161b constituting the third signal cable group 161 is solder-connected to the third B land 171b in the third land group 171.

  In FIG. 6, reference numeral 161 in parentheses indicates the third signal cable group 161, reference numeral 161a indicates the third A signal cable 161a constituting the third signal cable group 161, and reference numeral 161b indicates the same. Similarly, the third B signal cable 161b constituting the third signal cable group 161 is shown.

  Here, as described above, the third A signal cable 161a and the third B signal cable 161b have a relationship in which the cable outer diameters are relatively “small” and “large”, respectively. As shown in FIG. 6, the third A signal cable 161a is electrically connected to the third land 171a having the narrow land width, and the third B signal cable 161b is electrically connected to the third land 171b having the large land width. (Core wire 163a and core wire 163b) are soldered.

  Similar to the second signal cable group 62, the fourth signal cable group 162 is composed of a plurality of signal cables having different outer diameters. The plurality of signal cables constituting the fourth signal cable group 162 are soldered to the plurality of lands in the fourth land group 172, respectively.

  Specifically, the plurality of signal cables in the fourth signal cable group 162 are arranged in order of increasing outer diameter from one side 53 to the other side 54 on the substrate back surface 52b of the second circuit board 52, and Connected to opposing lands in the fourth land group 172 arranged in order of increasing land width from one side 53 to the other side 54 on the substrate back surface 52b, and extends toward the rear in the axial direction. To do.

  More specifically, as shown in FIG. 6, the conductive wire (core wire 164a) in the fourth A signal cable 162a constituting the fourth signal cable group 162 is solder-connected to the fourth A land 172a in the fourth land group 172. The conductive wires (core wires 164b) in the fourth B signal cables 162b constituting the fourth signal cable group 162 are soldered to the fourth B lands 172b in the fourth land group 172.

  In FIG. 6, reference numeral 162 in parentheses indicates the fourth signal cable group 162, reference numeral 162a indicates the fourth A signal cable 162a constituting the fourth signal cable group 162, and reference numeral 162b indicates The 4th B signal cable 162b which comprises the 4 signal cable group 162 shall be shown.

  Here, as described above, the fourth A signal cable 162a and the fourth B signal cable 162b have a relationship in which the outer diameters of the cables are relatively “large” and “small”, respectively. As shown in FIG. 6, the 4A signal cable 162a is connected to the 4A land 172a having the large land width, and the 4B signal cable 162b is connected to the 4B land 172b having the narrow land width. (Core wire 164a and core wire 164b) are solder-connected.

  The third signal cable group 161 (the third A signal cable 161a and the third B signal cable 161b) and the fourth signal cable group 162 (the fourth A signal cable 162a and the fourth B signal cable 162b) are the first signal cable group 61. Like the second signal cable group 62 and the second signal cable group 62, both are installed in the collective signal cable 80.

  Next, the configuration of the signal cable group in the present embodiment will be described in detail.

  FIG. 7 is a cross-sectional view showing a cross section of the collective signal cable applied to the circuit board unit in the endoscope according to the first embodiment.

  As described above, behind the circuit board unit 50, the first signal cable group 61 (first A signal cable 61a and first B signal cable 61b) and second signal cable group 62 (second A signal cable 62a and second B) are provided. Signal cable 62b), third signal cable group 161 (third A signal cable 161a and third B signal cable 161b) and fourth signal cable group 162 (fourth A signal cable 162a and fourth B signal cable 162b). A cable 80 is provided.

  As shown in FIG. 7, inclusions 81 made of, for example, cotton yarn are disposed at the center of the collective signal cable 80, and the signal cables are disposed around the inclusions 81. It has become so.

  In the present embodiment, the first A signal cable 61a and the second B signal cable 62b (hereinafter referred to as the board surface 52a side), the third B signal cable 161b, and the fourth A signal cable, which are the above-described signal cables having a relatively large outer diameter. Each of 162a (the substrate back surface 52b side) is assumed to be a power line that transmits power, and has a structure in which the outer core part covers the core wire having a large diameter.

  The first A signal cable 61a and the second B signal cable 62b (hereinafter referred to as the board surface 52a side), and the fourth A signal cable 162a and the third B signal cable 161b (hereinafter referred to as the board rear surface 52b side) are cross-sectional center lines, respectively. Adjacent to each other so as to be line symmetric. In FIG. 7, the right side corresponds to one side 53 of the second circuit board 52 and the left side corresponds to the other side 54 of the second circuit board 52.

  On the other hand, the 2A signal cable 62a and the 1B signal cable 61b (above, the board surface 52a side), the 3A signal cable 161a, and the 4B signal cable 162b (above), which are relatively “small” signal cables in this embodiment. The substrate back surface 52b side) is assumed to be a low-power signal transmission line, and each has a coaxial cable structure having a shield layer.

  In the present embodiment, the second A signal cable 62a on the substrate surface 52a side and the third A signal cable 161a on the substrate back surface 52b side, and the first B signal cable 61b on the substrate surface 52a side and the substrate back surface 52b side. Each of the 4B signal cables 162b has a twisted so-called twisted pair structure.

  In FIG. 7, the phantom line indicated by a two-dot chain line indicates the phantom outer diameter of the twisted wire structure, and these two twisted pairs are line-symmetric with respect to the center line of the cross section via the inclusions 81. Are arranged as follows.

  In the present embodiment, as described above, the second A signal cable 62a and the third A signal cable 161a, and the first B signal cable 61b and the fourth B signal cable 162b have a twisted pair structure. Like the collective signal cable 80A of the modified example shown, the second A signal cable 62a and the third A signal cable 161a, and the first B signal cable 61b and the fourth B signal cable 162b do not have a twisted pair structure, and each has a single wire structure, It may be arranged so as to be symmetrical with respect to the center line of the cross-section via the inclusion 82 having a diameter slightly larger than that of the inclusion 81.

<Second Embodiment>
Next, a second embodiment of the present invention will be described.

  FIG. 10 is an enlarged view of a main part showing the surface side of the circuit board unit in the configuration of the imaging device in the endoscope according to the second embodiment of the present invention.

  Here, only the differences from the first embodiment will be described, and detailed description of the same configuration as that of the first embodiment will be omitted.

  In the circuit board unit 50 according to the first embodiment, the circuit board unit 50 is arranged in a front row area on the substrate surface of the second circuit board 52 (an area on the tip surface side (front side of the insertion portion 2) of the second circuit board 52). For any land group of the first land group 71 provided and the second land group 72 disposed in the rear row region, a signal cable is soldered to each land. It is characterized by being configured to extend rearward.

  On the other hand, in the circuit board unit of the second embodiment, the circuit board unit is arranged in the front row side area of the second circuit board 52 (the area on the tip surface side of the second circuit board 52 (the front side of the insertion portion 2)). The installed land group is connected to a signal cable having the same size relationship as in the first embodiment, and extends toward the rear in the axial direction. Is characterized in that electronic parts having different vertical sizes are connected by soldering.

  That is, as shown in FIG. 10, the same land as the first land group 71 (the first A land 71a and the first B land 71b) in the first embodiment is provided on the front row side on the substrate surface of the second circuit board 52. A first land group 271 (first A land 271a and first B land 271b) having a width relationship and an arrangement relationship is disposed.

  Further, the first A land 271a and the first B land 271b are respectively provided with a first signal cable group 261 (the first signal cable group 261 having the same outer diameter size and arrangement relationship as the first signal cable group 61 in the first embodiment (the first signal cable group 261). The 1A signal cable 261a and the first B signal cable 261b) are soldered and extended rearward in the axial direction.

  Further, the rear row side on the substrate surface of the second circuit board 52 has the same land width relation and arrangement relation as the second land group 72 (second A land 72a and second B land 72b) in the first embodiment. A second land group 272 (second A land 272a and second B land 272b) is arranged.

  In the second embodiment, the component A 262a and the component B 262b are soldered to the second land group 272 (the second A land 272a and the second B land 272b) on the rear row side, respectively. .

  The component A 262a and the component B 262b are configured by electronic components such as an image sensor, a transistor, a chip capacitor, a chip resistor, or an IC. In the present embodiment, electronic members having different vertical heights with respect to the axial direction are used. Suppose.

  Further, in the present embodiment, the vertical heights of the component A 262a and the component B 262b correspond to the magnitude relationship of the outer diameters related to the second signal cable group 62 in the first embodiment.

<Description of effects in the second embodiment>
Next, effects of the second embodiment having the above-described configuration will be described.

  As described above, in the circuit board unit of the second embodiment, as in the first embodiment, the first land group 271 (the first A land 271a and the first B land 271b) is the surface of the second circuit board. Are arranged in a line in order of increasing land width from one side to the other side, and the second land group 272 (second A land 272a and second B land 272b) is formed on the surface of the second circuit board. They are arranged in a line from the one side to the other side in order of increasing land width.

  Further, the first signal cable group 261 (the first A signal cable 261a and the first B signal cable 261b) is directed from one side of the second circuit board surface to the other side, as in the first embodiment. They are arranged in order of increasing outer diameter and are connected to the first A land 271a and the first B land 271b, respectively, and extend rearward in the axial direction.

  The component A 262a and the component B 262b are arranged in order of increasing vertical height from one side of the second circuit board surface to the other side, and soldered to the second A land 272a and the second B land 272b, respectively. Connecting.

  As described above, in the second embodiment, the “thin” land having the “land width” on the front row side is arranged on the rear row side of the land having the “thick” land width on the front row side. A land with a narrow land width is arranged on the front row side of the land, so that the size in the height direction is always on the rear row side of the “large” signal cable extending from the front row side. A “small” electronic component is arranged, and a “small” signal cable having an outer diameter is always arranged on the front row side of the “large” electronic component whose height in the rear row side is “large”.

  Thereby, in the second embodiment, the “large” signal cable having the outer diameter and the electronic components having the “large” size in the height direction are not arranged in tandem.

  Therefore, even if the signal cable extending from the front row side is a “large” signal cable having an outer diameter (for example, the first A signal cable 261a), the size in the height direction of the electronic component arranged on the rear row side is Since it is “small”, even if the outer portion of the signal cable overlaps with the electronic component in the vertical direction, the signal cable will fit within the projected area in the axial direction of the image pickup device 30, and the image pickup unit is assembled to the endoscope insertion portion. It will not be a problem.

  On the other hand, even when the height of the electronic component arranged on the rear row side is “large”, the signal cable extending from the front row side is a “small” signal cable (for example, the first B signal). Cable 261b), even if the outer skin of the signal cable overlaps with the electronic component in the vertical direction, the signal cable will fit within the projected area in the axial direction of the image pickup device 30. There is no hindrance when assembling to the endoscope insertion section.

  In the second embodiment, only the signal cable is connected to the land group disposed in the area on the front row side of the second circuit board 52, while the signal is connected to the area on the back row side of the second circuit board 52. The provided land group is configured by soldering only electronic components having different vertical sizes from each other. However, the present invention is not limited to this, and each of the plurality of land groups described above includes the technology of the present invention. The signal cable and the electronic component may be mixed and arranged without departing from the concept.

<Third Embodiment>
Next, a third embodiment of the present invention will be described.

  FIG. 11 is an essential part enlarged view showing a part of a configuration of an imaging apparatus in an endoscope according to the third embodiment of the present invention in a cross section.

  Here, only the differences from the first embodiment will be described, and detailed description of the same configuration as that of the first embodiment will be omitted.

  In the first embodiment, the first circuit board 51 is configured by mounting the imaging element 30 on the surface facing the front of the insertion portion 2 (the front of the imaging device 25). When the signal cables (the first signal cable group 61 and the second signal cable group 62) were connected by soldering, the image pickup device 30 was mounted on the first circuit board 51 (see FIG. 3 and the like). .

  On the other hand, in the third embodiment, as shown in FIG. 11, when the signal cables (the first signal cable group 61 and the second signal cable group 62) described above are connected to the second circuit board 52 by soldering. The image pickup device 30 is maintained in a state separated from the first circuit board 51, and is mounted on the first circuit board 51 after the solder connection step.

  Since other configurations are the same as those in the first embodiment, description thereof will be omitted, but it goes without saying that the same effects as those in the first embodiment can be obtained in the third embodiment. .

  The present invention is not limited to the embodiments described above, and various modifications and changes can be made without departing from the spirit of the present invention, and these are also within the technical scope of the present invention.

1: Endoscope 2: Insertion unit 20: Imaging unit 25: Imaging device 30: Imaging device 50: Circuit board unit 51: First circuit board 52: Second circuit board 52a: Substrate surface 53: One side 54: Other Side 61: first signal cable group 61a: first A signal cable 61b: first B signal cable 62: second signal cable group 62a: second A signal cable 62b: second B signal cable 71: first land group 71a: first A Land 71b: First B land 72: Second land group 72a: Second A land 72b: Second B land 80: Collective signal cable

Claims (8)

A circuit board capable of mounting an image sensor on the surface;
In the region on the front end surface side on the surface of the circuit board, when the direction extending toward the rear side of the base end of the circuit board is the axial direction, the rows are arranged in the width direction orthogonal to the axial direction. A first land group composed of a plurality of lands having different land widths,
In the rear row side region of the first land group on the surface of the circuit board, a plurality of lands with different land widths are arranged in the width direction orthogonal to the axial direction. A second land group,
With
The plurality of lands constituting the first land group are arranged in order of increasing land width from one side to the other side of the circuit board surface,
The plurality of lands constituting the second land group are arranged in the order of narrow land width from one side to the other side of the circuit board surface. A first electronic member group configured to include a plurality of electronic members that are solder-connected to the lands in the first land group and have different sizes in the direction perpendicular to the axial direction;
A second electronic member group configured to include a plurality of electronic members that are solder-connected to the lands in the second land group and have different sizes in the direction perpendicular to the axial direction;
Further comprising
The plurality of electronic members in the first electronic member group are arranged in descending order of the size in the direction perpendicular to the axial direction from one side of the circuit board surface to the other side, and are opposed to each other. Connected to a plurality of lands constituting one land group,
The plurality of electronic members in the second electronic member group are arranged in ascending order of size in the direction perpendicular to the axial direction from one side of the circuit board surface to the other side, and are opposed to each other. A circuit board unit connected to a plurality of lands constituting a group of two lands. The circuit board is a circuit board part configured by laminating a first circuit board part and a plurality of plate-like boards which are arranged to extend in the vertical direction so that an image pickup device can be mounted on the surface, A second circuit board portion extending in a horizontal direction from the front end surface toward the rear side of the base end side and connected to the rear surface of the first circuit board portion so that the directions are orthogonal to each other Have
The first land group has an axial direction in the region on the distal end surface side on the surface of the second circuit board portion, the axial direction being the direction extending toward the rear on the proximal side. And a plurality of lands having different land widths arranged in a direction perpendicular to each other, and a plurality of lands constituting the first land group are formed on the second circuit board portion. Lined up in order of increasing land width from one side of the surface to the other side,
The second land group is a land width arranged in a width direction orthogonal to the axial direction in a region on the rear row side of the first land group on the surface of the second circuit board portion. The plurality of lands constituting the second land group have land widths from one side to the other side of the surface of the second circuit board portion. They are arranged in narrow order,
The plurality of electronic members in the first electronic member group are arranged in order of increasing size in the direction perpendicular to the axial direction from one side of the second circuit board portion to the other side, and face each other. Connected to a plurality of lands constituting the first land group,
The plurality of electronic members in the second electronic member group are arranged in ascending order of size in the direction perpendicular to the axial direction from one side of the surface of the second circuit board portion toward the other side, The circuit board unit according to claim 2, wherein the circuit board unit is connected to a plurality of lands constituting the second land group facing each other. The plurality of electronic members in the first electronic member group are arranged in order of increasing outer diameter from one side of the circuit board surface to the other side, and from one side of the circuit board surface to the other side. Connected to the opposing lands in the first land group arranged in order of increasing land width toward the direction, and configured as a first signal cable group extending toward the rear in the axial direction,
The plurality of electronic members in the second electronic member group are arranged in order of decreasing outer diameter from one side of the circuit board surface to the other side, and from one side of the circuit board surface to the other side. A second signal cable group that is connected to the opposing lands in the second land group that are arranged in the order of narrow land width toward the direction, and extends toward the rear in the axial direction. The circuit board unit according to claim 2, wherein: The plurality of electronic members in the first electronic member group are arranged in order of increasing outer diameter from one side of the circuit board surface to the other side, and the tip is on one side of the circuit board surface A signal cable group that is solder-connected to the opposing lands in the first land group arranged in order of increasing land width from one side to the other side and extends toward the rear in the axial direction. ,
The plurality of electronic members in the second electronic member group are arranged in order of decreasing height in the direction perpendicular to the axial direction from one side to the other side of the circuit board surface, and on the surface of the circuit board. The electronic component group is configured to be solder-connected to the opposing lands in the second land group arranged in order of narrow land width from one side to the other side, respectively. The circuit board unit described in 1. The circuit board unit according to claim 5, wherein the electronic component includes an image sensor, a transistor, a chip capacitor, a chip resistor, or an IC. The circuit board unit according to any one of claims 1 to 6,
An image sensor mounted on the circuit board;
An imaging apparatus comprising: An insertion section for insertion into a subject;
The imaging device according to claim 7 disposed in the insertion portion;
An endoscope characterized by comprising: