WO2017002720A1 - Dispositif électronique - Google Patents

Dispositif électronique Download PDF

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Publication number
WO2017002720A1
WO2017002720A1 PCT/JP2016/068790 JP2016068790W WO2017002720A1 WO 2017002720 A1 WO2017002720 A1 WO 2017002720A1 JP 2016068790 W JP2016068790 W JP 2016068790W WO 2017002720 A1 WO2017002720 A1 WO 2017002720A1
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WO
WIPO (PCT)
Prior art keywords
main
substrate
electrode
slit
solder
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Application number
PCT/JP2016/068790
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English (en)
Japanese (ja)
Inventor
北川　惣康
佐々木　俊介
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三菱電機株式会社
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Filing date
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Application filed by 三菱電機株式会社 filed Critical 三菱電機株式会社
Publication of WO2017002720A1 publication Critical patent/WO2017002720A1/fr

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits

Definitions

  • the present invention relates to an electronic device, and more particularly, to an electronic device having a printed wiring board having a structure in which a standing substrate is inserted so as to intersect substantially vertically with respect to a main substrate.
  • An apparatus is disclosed in, for example, Japanese Patent Application Laid-Open No. 2004-153178 (Patent Document 1).
  • the standing substrate is inserted into the slit so that one and the other main surfaces of the standing substrate intersect the one and the other main surfaces of the main substrate almost perpendicularly.
  • the width of the slit is smaller than the desired median and the thickness of the standing substrate is processed larger than the desired median, the main surface of the standing substrate contacts the inner wall surface of the slit of the main substrate, and both substrates The insertion property between them decreases. Further, if the inner wall surface of the slit of the main board comes into contact with the electrode of the standing board, the solderability and reliability between the two boards are lowered. Conversely, if the slit width is processed to be larger than the desired median value, the clearance between the electrode on the main board and the electrode on the standing board increases, and the solderability between the two decreases.
  • the present invention has been made in view of the above problems, and the object of the present invention is, even when the plate thickness of one of the two substrates and the processing accuracy of the hole of the other substrate vary. It is an object of the present invention to provide an electronic device having a configuration capable of suppressing deterioration in insertability, solderability, and reliability between two substrates when one substrate is inserted into a hole of the substrate.
  • the electronic device of the present invention includes a first substrate and a second substrate.
  • the first substrate has one first main surface and the other first main surface opposite to the first main surface, and reaches from the first main surface to the other first main surface.
  • a hole is formed.
  • the second substrate has one second main surface and the other second main surface opposite to the one second main surface, and intersects the first substrate in the hole of the first substrate. Has been inserted.
  • a pair of one and the other first electrodes are formed on one or the other first main surface of the first substrate with the hole therebetween.
  • One second electrode is formed on one second main surface of the second substrate, and the other second electrode is formed on the other second main surface so as to face the second electrode. . At least a part of one and the other second electrodes is disposed in the hole.
  • One and the other second electrodes are connected to each of the one and the other first electrodes by solder.
  • the second substrate is formed with a protrusion that extends from a region inside the outermost periphery of one and the other of the second electrodes toward the inner wall surface of the hole in the hole.
  • the second substrate can be disposed at a position closer to the center in the width direction of the hole without causing the electrode of the second substrate to contact the inner wall surface of the hole due to the protrusion. For this reason, the clearance between the first electrode and the second electrode can be reduced, and the insertability, solderability, and reliability between the two substrates can be improved.
  • FIG. 4 is a schematic perspective view (A) showing the mode of the main board in the first to third embodiments, and a schematic perspective view (B) showing the mode of the standing board in the first to third embodiments. It is a schematic perspective view which shows the aspect of the three-dimensional printed wiring board formed by assembling the main board
  • FIG. 3 is a schematic cross-sectional view showing a soldering aspect of a portion along the line AA in FIG. 2 in the first embodiment.
  • FIG. 2 is a schematic enlarged cross-sectional view in a region B surrounded by a dotted line in FIG. 1B in the first embodiment.
  • FIG. 3 is a schematic cross-sectional view showing a soldering aspect of a portion along the line AA in FIG. 2 in the first embodiment.
  • FIG. 2 is a schematic enlarged cross-sectional view in a region B surrounded by a dotted line in FIG. 1B in the first embodiment
  • FIG. 6 is a schematic cross-sectional view showing a soldering aspect of a portion along the line AA in FIG. 2 in the second embodiment.
  • FIG. 3 is a schematic enlarged cross-sectional view in a region B surrounded by a dotted line in FIG. 1B in the second embodiment.
  • FIG. 10 is a schematic cross-sectional view showing a soldering aspect of a portion along the line AA in FIG. 2 in the third embodiment.
  • FIG. 6 is a schematic enlarged cross-sectional view in a region B surrounded by a dotted line in FIG. 1B in the third embodiment.
  • Embodiment 1 FIG. First, the structure of a main substrate and a standing substrate as first and second substrates constituting the electronic device of this embodiment will be described with reference to FIGS.
  • a main substrate 100 as a first substrate of the present embodiment has, for example, a rectangular flat plate shape in plan view.
  • the main substrate 100 includes a main substrate body 11 having one main surface 11a as one first main surface and the other main surface 11b as the other first main surface opposite to the main surface 11a.
  • the main substrate 100 has a hole penetrating the main substrate 100 so as to reach the main surface 11b from the main surface 11a.
  • the hole includes a main support slit 12, a first auxiliary support slit 13, and a second auxiliary support slit 14.
  • the first auxiliary support slit 13 and the second auxiliary support slit 14 are formed on the left side and the right side of FIG.
  • the main support portion slit 12 is formed at the central portion in the left-right direction in FIG. 1A so as to be sandwiched between the first auxiliary support portion slit 13 and the second auxiliary support portion slit 14.
  • the main support slit 12 has a long rectangular shape extending in the left-right direction in FIG.
  • the first auxiliary support portion slit 13 and the second auxiliary support portion slit 14 have a square shape in a plan view or a rectangular shape close thereto (a relatively small aspect ratio).
  • the width in the depth direction of FIG. 1A that intersects the extending direction of the main support slit 12 is the depth of the first auxiliary support slit 13 and the second auxiliary support slit 14 in the depth direction of FIG. It is almost equal to the width.
  • a pair of main female electrodes 15 are arranged on one main surface 11a of the main substrate body 11 so as to sandwich the main support slit 12 in the depth direction of FIG. 1A, that is, the width direction of the main support slit 12 and the like. ing. Specifically, the main female electrode 15 as one first electrode is provided on the back side of the main support slit 12 in FIG. 1A, and the other is provided on the front side of the main support slit 12 in FIG. Main female electrodes 15 are formed as first electrodes. A plurality of pairs of main female electrodes 15 are formed at intervals from each other along the left-right direction of FIG. 1A, that is, the direction in which the main support slit 12 extends.
  • first auxiliary female electrodes 16 so as to sandwich the first auxiliary support portion slit 13 in the depth direction of FIG.
  • the second auxiliary female electrodes 17 are respectively formed.
  • a first auxiliary female electrode 16 as one first electrode is provided on the back side of the first auxiliary support slit 13 in FIG. 1A, and the first auxiliary support electrode in FIG.
  • a first auxiliary female electrode 16 as the other first electrode is formed on the front side of the support portion slit 13.
  • a second auxiliary female electrode 17 as one first electrode is provided in the second auxiliary support in FIG. 1 (A).
  • a second auxiliary female electrode 17 as the other first electrode is formed on the front side of the slit 14.
  • a plurality of main female electrodes 15 are arranged in the left-right direction in FIG. 1A, whereas the first auxiliary female electrode 16 and the second auxiliary female electrode 17 are provided with the first auxiliary support slit 13 and Only one pair each is formed so as to sandwich the second auxiliary support slit 14.
  • the main female electrode 15, the first auxiliary female electrode 16, and the second auxiliary female electrode 17 may be formed on the other main surface 11b instead of the one main surface 11a.
  • a standing substrate 200 as a second substrate of the present embodiment has one main surface 21a as one second main surface and the other second surface facing the main surface 21a. It comprises a standing substrate body 21 having the other main surface 21b as a main surface.
  • the standing substrate body 21 forms the main support portion 22, the first auxiliary support portion 23, and the second auxiliary support portion 24, particularly in the lower region of FIG. is doing.
  • the main support portion 22, the first auxiliary support portion 23, and the second auxiliary support portion 24 are protruding portions extending downward in FIG.
  • the main support portion 22 can be inserted into the main support portion slit 12 so that the vertical direction in FIG. 1B penetrates the main support portion slit 12.
  • each of the first auxiliary support portion 23 and the second auxiliary support portion 24 can be inserted into the first auxiliary support portion slit 13 and the second auxiliary support portion slit 14.
  • the first auxiliary support portion 23 and the second auxiliary support portion 24 are formed on the left side and the right side of FIG.
  • the main support portion 22 is formed at the central portion in the left-right direction in FIG. 1B so as to be sandwiched between the first auxiliary support portion 23 and the second auxiliary support portion 24.
  • the main support portion 22, the first auxiliary support portion 23, and the second auxiliary support portion 24 are respectively connected to the main support portion slit 12, the first auxiliary support portion slit 13, and the second auxiliary support portion 24 in the left-right direction of the drawing. It is formed at a position corresponding to (equal to) each of the auxiliary support slits 14.
  • the main support portion 22, the first auxiliary support portion 23, and the second auxiliary support portion 24 can be inserted into the main support portion slit 12, the first auxiliary support portion slit 13, and the second auxiliary support portion slit 14. ing.
  • the one and other main surfaces 21a and 21b of the standing substrate body 21 can be assembled so as to intersect (for example, vertically) the one and other main surfaces 11a and 11b of the main substrate body 11.
  • a main male electrode 25 as one second electrode is formed on the one main surface 21a of the main support portion 22 in FIG.
  • a main male electrode 25 as the other second electrode is formed on the other main surface 21 b of the main support portion 22.
  • On the one main surface 21a and the other main surface 21b a plurality of main male electrodes 25 are formed spaced apart from each other along the left-right direction in FIG. 1B, that is, the direction in which the main support portion 22 extends.
  • Each of the plurality of main male electrodes 25 is formed to form a pair facing each other.
  • the first auxiliary male electrode 26 as one and the other second electrode is opposed to each other. It is formed to do.
  • the second auxiliary male electrode 27 serving as one and the other second electrodes is opposed to each other on the one main surface 21a and the other main surface 21b in the second auxiliary support portion 24 of FIG. Is formed.
  • the main male electrode 25, the first auxiliary male electrode 26 and the second auxiliary male electrode 27 of the standing board 200 are respectively the main female electrode 15, the first auxiliary female electrode 16 and the second auxiliary male electrode 16 of the main board 100 in the left-right direction of the drawing. Are formed at positions corresponding to (equal to) each of the auxiliary female electrodes 17. Therefore, a plurality of pairs of main male electrodes 25 are formed, whereas a pair of first and second auxiliary male electrodes 26 and 27 are formed.
  • the main female electrode 15 and the main male electrode 25 can be connected by solder.
  • the first auxiliary female electrode 16 and the first auxiliary male electrode 26 and the second auxiliary female electrode 17 and the second auxiliary male electrode 27 can be connected by solder.
  • the main board body 11 and the standing board body 21 are made of, for example, a generally known glass epoxy material.
  • the main female electrode 15, the first and second auxiliary female electrodes 16 and 17, the main male electrode 25, and the first and second auxiliary male electrodes 26 and 27 are formed by, for example, a generally known copper thin film pattern. ing.
  • FIG. 2 shows a state in which the standing substrate 200 of FIG. 1 is fixed to the main substrate 100 and integrated.
  • the three-dimensional printed wiring board 300 is formed by assembling the main board 100 of FIG. 1 (A) and the standing board 200 of FIG. 1 (B).
  • the main support portion 22 is in the main support portion slit 12
  • the first auxiliary support portion 23 is in the first auxiliary support portion slit 13
  • the second auxiliary support portion is in the second auxiliary support portion slit 14. 24 are inserted respectively.
  • the one main surface 11a of the main substrate 100 and the one main surface 21a of the standing substrate 200 intersect with each other (for example, vertically).
  • the horizontal dimension of the first auxiliary support slit 13 and the horizontal dimension of the second auxiliary support slit 14 are different from each other.
  • the horizontal dimension of the first auxiliary support portion 23 and the horizontal dimension of the second auxiliary support portion 24 are different from each other. .
  • the dimension of the first auxiliary support part slit 13 is larger than the dimension of the second auxiliary support part slit 14
  • the dimension of the first auxiliary support part 23 is the second auxiliary support part. It is preferably formed so as to be larger than the dimension of 24.
  • first auxiliary support portion 23 can be securely inserted into the first auxiliary support portion slit 13 and the second auxiliary support portion 24 can be reliably inserted into the second auxiliary support portion slit 14. It is possible to suppress problems such as accidentally inserting the first auxiliary support portion 23 into the second auxiliary support portion slit 14.
  • the electronic printed circuit board 300 is used as an electronic device by mounting and electrically connecting electronic components or the like in blank areas in the main board 100 and the standing board 200 in FIGS.
  • FIG. 3 is a schematic cross-sectional view including a portion along line III-III in FIG. 4 to be described later.
  • main female electrode 15 or the like is formed on one main surface 11 a of main substrate 100, it is preferably set so that one main surface 11 a faces downward in the vertical direction.
  • the pair of main male electrodes 25 facing each other formed on the one main surface 21a and the other main surface 21b. Some are arranged. That is, at least part of the pair of main male electrodes 25 facing each other is disposed in the main support slit 12. However, here, at least a part of the main male electrode 25 in the main support slit 12 is arranged as a clearance suppression region 28.
  • the clearance suppression region 28 is a part of the main male electrode 25, but a removal portion 29 of the main male electrode 25 is formed between the inside and the outside of the clearance suppression region 28, and the clearance suppression region 28 is formed by the removal portion 29. Is partitioned from the main male electrode 25 other than the clearance suppression region 28.
  • a part and one part of each of the one and other main female electrodes 15 formed so as to sandwich the main support part slit 12 are connected by solder. That is, on both the left side and the right side of the standing substrate 200, solder fillets 31 are formed that are fixed so as to be in contact with both the main male electrode 25 and the main female electrode 15. By forming the solder fillet 31, the main board 100 and the standing board 200 are fixed to each other.
  • the main male electrode 25 and the main female electrode 15 mainly fix the main board 100 and the standing board 200, and the parts and wirings formed on the main board 100, the parts formed on the standing board 200, and the like. It is possible to input / output electric signals between both substrates by electrically connecting wirings and the like.
  • the width of the main support slit 12 shown in the left-right direction in FIG. 3, that is, the width that intersects the direction in which the main support slit 12 extends (in the depth direction of FIG. 1A) is the thickness of the standing substrate 200 (FIG. 3). Larger than the horizontal dimension of the standing substrate 200 in the middle).
  • the width of the first and second auxiliary support slits 13 and 14 is also larger than the thickness of the standing substrate 200. That is, if the standing substrate 200 is disposed at the center portion in the width direction of the main support portion slit 12, the standing substrate 200 is arranged so that the one main surface 21 a and the other main surface 21 b do not contact the inner wall surface of the main support portion slit 12. Inserted. Thereby, the insertion property of the standing substrate 200 with respect to the main substrate 100 is improved.
  • each of the first auxiliary female electrode 16 and the second auxiliary female electrode 17 is located in the left-right direction of FIG.
  • the first auxiliary male electrode 26 and the second auxiliary male electrode 27 are larger in the horizontal direction in FIG. 1B than the individual main male electrode 25.
  • the second auxiliary female electrode 17 and the second auxiliary male electrode 27 can achieve the same effects as described above. As described above, the solderability between the first and second auxiliary female electrodes 16 and 17 and the first and second auxiliary male electrodes 26 and 27 is improved, and the displacement is suppressed, so that the main female electrode 15 Therefore, the solderability between the main male electrode 25 and the main male electrode 25 is inevitably improved, and displacement is suppressed.
  • the first and second auxiliary female electrodes 16 and 17 and the first and second auxiliary male electrodes 26 and 27 are made larger, the amount of soldering thereto is increased, and the joint strength is increased. Thereby, the influence of the expansion amount or shrinkage amount at the time of soldering due to the difference in the linear expansion coefficient between the main substrate body 11 and the standing substrate body 21 can be reduced. Moreover, this can relieve the stress of the solder fillet formed by soldering the first and second auxiliary female electrodes 16 and 17 and the first and second auxiliary male electrodes 26 and 27, and as a result. The reliability of the soldered part can be improved.
  • the first and second auxiliary female electrodes 16 and 17 and the first and second auxiliary male electrodes 26 and 27 having a large size mainly include linear expansion of the main board body 11 and the standing board body 21. It is possible to reduce and absorb the amount of expansion or contraction during soldering due to the difference in coefficient.
  • the insertability, solderability and reliability can be improved to some extent at least after soldering.
  • the standing board 200 is inserted as shown in FIG. 3 during the time from when the standing board 200 is inserted into the slit of the main board 100 to soldering. Needs to be held at the center in the width direction of the main support slit 12.
  • a solder pile 32 is formed as a protrusion extending from the surface toward the inner wall surface of the main support slit 12 (in the left-right direction in FIG. 3). More specifically, the solder pile 32 is formed from the surface of the clearance suppression region 28 formed as the same layer as the main male electrode 25 in a part of the region inside the outermost periphery of the main male electrode 25 from the surface of the main support portion slit 12. It extends toward the inner wall surface.
  • solder pile 32 as a protrusion part which has the aspect similar to the above is formed also on the surface of the 1st auxiliary
  • annular main male is formed on a part of the surface of main male electrode 25 and second auxiliary male electrode 27 on one main surface 21 a and other main surface 21 b of standing substrate 200.
  • a removal portion 29 for the electrode 25 and the second auxiliary male electrode 27 is formed.
  • annular removal portion 29 is formed so as to draw a square shape slightly above the center in the vertical direction of the main male electrode 25 and the second auxiliary male electrode 27.
  • the planar shape can be an arbitrary annular shape such as a circular shape.
  • the removal portion 29 and the solder pile 32 are also formed in the first auxiliary male electrode 26 as in FIG. 4.
  • the main male electrode 25 and the like are removed so as to be cut out. That is, the second electrode such as the main male electrode 25 remains in the region other than the removal portion 29. However, here, the region outside the removal portion 29 is shown as the main male electrode 25, but the region inside the removal portion 29 (island-shaped surrounded by the removal portion 29) is shown as the clearance suppression region 28.
  • a solder pile 32 is formed on the surface of the clearance suppression region 28.
  • the solder pile 32 prints solder on the clearance suppression area 28 at the same time as printing solder paste for mounting electronic components or the like on the marginal areas of the main surfaces 21a and 21b of the standing substrate 200 in each figure. Is supplied. These solder paste and solder pile 32 are then solidified and fixed by being heated in a reflow bath or the like. In this way, it is not necessary to add a process for forming the solder pile 32, and at the same time, the solder paste 32 is printed on a desired area by using a solder paste printing process on another existing area. Can be supplied to. Therefore, the cost can be reduced by reducing the number of processes.
  • a metal mask is used for the above-described solder paste and solder pile 32 supplying process. For this reason, the variation in the dimension of the protrusion from the surface of the second electrode in the left-right direction in FIG. 3 can be suppressed. That is, for example, the difference in the horizontal dimension (projection height) in FIG. 3 between the left solder pile 32 and the right solder pile 32 of the standing substrate 200 in FIG. 3 can be reduced.
  • the protrusion height T (the dimension in the direction of protrusion from the surface of the main male electrode 25 or the like as the second electrode toward the inner wall surface of the main support portion slit 12) of the solder pile 32 is as follows. It is preferable that it is 10% or more and 40% or less of the width W of the main support slit 12 or the like (the dimension related to the protruding direction of the solder pile 32).
  • the solder pile 32 is disposed inside the main support slit 12 or the like. For this reason, it is preferable that at least a part of the removal portion 29 for forming the clearance suppression region 28 where the solder pile 32 is formed be formed inside a slit such as the main support portion slit 12.
  • a part of the solder pile 32 may come into contact with the inner wall surface of the slit such as the main support portion slit 12 but may not come into contact therewith. Since the conductive film is not formed on the inner wall surface of the slit, even if a part of the solder plate 32 contacts the inner wall surface of the slit, the solder plate 32 and the main substrate 100 are not short-circuited.
  • solder is applied from the surface of the main male electrode 25, which is the second electrode, on both the one main surface 21a and the other main surface 21b of the standing substrate 200 particularly in the hole (slit of the main substrate 100).
  • a scale 32 is formed.
  • This solder scale 32 is in contact with the inner wall surface such as the main support slit 12 or opposed at a close distance in the left-right direction of FIG. 3 (direction in which the solder scale 32 protrudes). Further, as described above, the difference in projection height is small between the solder deposit 32 on the one main surface 21a side and the solder deposit 32 on the other main surface 21b side. For this reason, the solder pile 32 can suppress that the space
  • the standing board 200 inserted into the main support portion slit 12 is maintained by the both solder pegs 32 so as to be arranged at the central portion in the width direction of the slit, that is, substantially at the central position even before the soldering. Can do. That is, it is possible to maintain the state in which the standing substrate 200 is disposed such that the virtual center line in the thickness direction of the standing substrate 200 substantially overlaps the position of the virtual center line in the slit width direction. Further, even before soldering, it is possible to maintain a state where the one main surface 21a and the other main surface 21b of the standing substrate 200 intersect each other so as to be substantially perpendicular to the one main surface 11a and the other main surface 11b of the main substrate 100.
  • the standing substrate 200 is obtained. Can be held at the center position in the width direction of the slit. Further, the interelectrode clearance between, for example, the main male electrode 25 of the standing substrate 200 and the main female electrode 15 of the main substrate 100 can be reduced to 50% or less of the assumed maximum variation value.
  • the solder pile 32 formed on both the one main surface 21a side and the other main surface 21b side of the standing substrate 200 functions as a spacer in the slit.
  • the standing board 200 is soldered and fixed to the main board 100 so that the standing board 200 intersects with the main board 100 so as to be substantially perpendicular and the standing board 200 is disposed at the center of the slit.
  • the solderability of the main male electrode 25 and the main female electrode 15 by the solder fillet 31 is improved, and for example, the standing board 200 is inserted obliquely with respect to the main board 100 and the soldering ability is lowered. It is possible to suppress poor conduction with the main substrate 100. That is, the solder pile 32 can improve the reliability and quality (conductivity, etc.) of the three-dimensional printed wiring board 300 including the main male electrode 25 and the main female electrode 15.
  • the surface of the solder pile 32 is formed. It may contact the inner wall surface of the slit.
  • 2nd electrodes such as the main male electrode 25 of the standing board 200, do not contact the inner wall face of the slit in which this is inserted.
  • production of malfunctions such as a damage
  • a large jig or the like for holding it in a state substantially perpendicular to the main board 100 is provided. There is no need to use it, and a combination of the main substrate 100 and the standing substrate 200 can be put into a reflow tank or the like as it is. For this reason, the manufacturing process can be simplified and the cost can be reduced.
  • the solder pile 32 is formed in an island-shaped clearance suppression region 28 defined by the removal portion 29 in the region inside the outermost periphery of the main male electrode 25 and the like.
  • the solder paste supplied to the location for forming the solder pile 32 is excessively wet spread on the surface of the main male electrode 25 when heated and melted, so that the protruding solder pile 32 cannot be formed. Can be suppressed.
  • the main male electrode 25 having high solder wettability (the clearance suppression region 28 as the same layer) is cut by the removal portion 29, and the solder reaching the removal portion 29 is less likely to spread outward. is there.
  • the solder is surely retained in the region 28, so that the protrusion-shaped solder pile 32 is reliably formed. Can be formed.
  • the solder pile 32 may not contact the inner wall surface of the slit. However, if the contact is made, a gap does not exist between the solder pile 32 and the inner wall surface of the slit. For this reason, it is possible to more reliably place the standing substrate 200 substantially perpendicular to the main substrate 100 and at the center position in the slit. For this reason, said insertion property, solderability, and reliability can be improved further.
  • the solder pile 32 if the solder pile 32 does not contact the inner wall surface of the slit, the solder pile 32 applies stress to the clearance suppression area 28 immediately below it when inserted, and the clearance suppression area 28 (such as the same copper thin film as the main male electrode 25). The possibility of peeling from the main surfaces 21a and 21b of the standing substrate body 21 can be reduced.
  • the solder constituting the solder pile 32 formed in the clearance suppression region 28 is preferably a solder that fixes the main substrate 100 and the standing substrate 200, that is, a solder having a higher melting point than the solder constituting the solder fillet 31. . If it does in this way, it can suppress that the solder pile 32 fuse
  • FIG. If such a solder pile 32 is formed before the assembly of the main board 100 and the standing board 200, the standing board 200 does not collapse during the soldering process, and the one main surface 21a is one main surface of the main board 100. It is fixed while being surely kept substantially perpendicular to 11a. That is, the high quality of the three-dimensional printed wiring board 300 can be ensured.
  • FIG. FIG. 5 is a schematic cross-sectional view including a portion along line VV in FIG. 6 to be described later.
  • the present embodiment differs from the first embodiment shown in FIGS. 3 and 4 in the configuration of the clearance suppression region where solder pile 32 is formed.
  • the other configurations of the present embodiment are almost the same as the configurations of the first embodiment, and the configurations of the main board 100, the standing board 200, and the three-dimensional printed wiring board 300 are the same as those of FIGS. It is almost the same.
  • the same elements as those in the first embodiment are denoted by the same reference numerals, and the description thereof will not be repeated.
  • an over resist 33 as an insulating film is formed.
  • a solder deposit 32 similar to that of the first embodiment is formed on the surface of the over resist 33. That is, the region where the over resist 33 is formed corresponds to the clearance suppression region 28 in the first embodiment.
  • the solder piles 32 are formed from above the surfaces of the main male electrode 25 and the second auxiliary male electrode 27 in the hole (slit of the main substrate 100) (although sandwiching the over resist 33). It is a projection part extended toward the inner wall surface of a part.
  • a rectangular over resist 33 pattern is formed so as to match the planar shape of the main male electrode 25 and the like.
  • the present invention is not limited to this, and the over resist 33 may have an arbitrary planar shape such as a circular shape. Can do.
  • an over resist 33 and a solder pile 32 are also formed on the first auxiliary male electrode 26 as in FIG.
  • the over-resist 33 is formed on the surface of the second electrode at the same time as printing a photoresist as a photoconductor to form various patterns in the blank areas of the main surfaces 21a and 21b of the standing substrate 200 shown in each figure. Is formed. In this way, it is not necessary to add a process for forming the over resist 33, and at the same time, the pattern of the over resist 33 is formed in a desired area by using a photoresist pattern forming process in another existing area. Can be supplied to. Therefore, the cost can be reduced by reducing the number of processes.
  • the solder pile 32 is formed inside the main support slit 12 or the like, as in the first embodiment. For this reason, it is preferable that at least a part of the over resist 33 serving as a clearance suppression region in which the solder pile 32 is formed be formed inside a slit such as the main support slit 12.
  • the present embodiment has the following functions and effects.
  • the over resist 33 is formed so as to cover the surface of the second electrode such as the main male electrode 25, particularly in the hole (the slit of the main substrate 100). That is, since the surface of the second electrode such as the main male electrode 25 is protected by the over resist 33, the occurrence of defects such as scratches and dirt on the surface of the main male electrode 25 and the like can be suppressed.
  • the strength against peeling and turning of the main male electrode 25 covered with the over resist 33 can be increased.
  • the thickness of the standing substrate 200 is processed so as to be larger than the desired median value, and the width of the slit into which the standing substrate 200 is inserted is smaller than the desired median value, the surface of the solder pile 32 is slit. May contact the inner wall of Usually, after the second electrode and the solder pile 32 are formed on the one main surface 21a and the other main surface 21b of the standing substrate 200, the standing substrate 200 is inserted into the slit of the main substrate 100. If 200 is thick, the solder scale 32 contacts the inner wall surface of the slit during insertion, and stress is applied to the solder scale 32.
  • the clearance suppression region 28 is formed by cutting out a part of the electrode as in the first embodiment, the solder pile 32 is substantially formed on the surface of the electrode. For this reason, if stress is applied to the solder pile 32 at the time of insertion or the like, the clearance suppression region 28 (such as the same copper thin film as the main male electrode 25) may stand up and peel off from the main surfaces 21a and 21b of the substrate body 21.
  • an over resist 33 for protecting the second electrode is formed as a clearance suppression region in a portion where the solder pile 32 is formed. For this reason, even if the solder pile 32 receives stress from the inner wall surface of the slit or the like at the time of insertion as described above, peeling of the second electrode just below the over resist 33 and occurrence of turning-up can be suppressed.
  • the standing substrate 200 can be stably fixed at the center position of the slit so as to intersect the main substrate 100 substantially perpendicularly, and the second electrode is peeled off. It is possible to suppress the quality deterioration due to.
  • the solder pile 32 is used to suppress clearance at the same time as printing a solder paste for mounting electronic components or the like on the marginal areas of the main surfaces 21a and 21b of the standing substrate 200 in each figure. It is formed by printing solder on the surface of the over resist 33 as a region.
  • the solder supplied onto the surface of the over resist 33 which is an insulating film is less likely to be excessively wet spread on the surface of the over resist 33 even by subsequent heating and melting in a reflow bath or the like. For this reason, in the present embodiment, the protrusion-shaped solder pile 32 can be reliably formed without providing the removal portion 29 as in the first embodiment.
  • the solder constituting the solder pile 32 is preferably a solder having a higher melting point than the solder constituting the solder fillet 31.
  • FIG. 7 is a schematic cross-sectional view including a portion taken along line VII-VII in FIG. 8 described later.
  • the present embodiment is different from the first and second embodiments in the configuration of the protruding portion formed as solder pile 32 in the first and second embodiments.
  • the other configurations of the present embodiment are almost the same as the configurations of the first embodiment, and the configurations of the main board 100, the standing board 200, and the three-dimensional printed wiring board 300 are the same as those of FIGS. It is almost the same.
  • the same elements as those in the first embodiment are denoted by the same reference numerals, and the description thereof will not be repeated.
  • the protrusion formed on the second electrode such as the main male electrode 25 of the standing substrate 200 is a silk 34 instead of the solder pile 32.
  • the silk 34 is a printed matter of an insulator made of resin or the like formed by silk screen printing.
  • the silk 34 is directly formed on the surface of the main male electrode 25 and the second auxiliary male electrode 27 on both the one main surface 21a and the other main surface 21b of the standing substrate 200 in the hole (the slit of the main substrate 100).
  • the clearance suppression region 28 partitioned by the removing unit 29 as in the first embodiment and the clearance suppression region by covering the over resist 33 as in the second embodiment are not provided.
  • the silk 34 itself is a clearance suppression region.
  • the silk 34 of the present embodiment is in contact with the inner wall surface of a slit such as the main support slit 12 or opposed at a close distance, like the solder pile 32 of the first and second embodiments. For this reason, the silk 34 enables the standing substrate 200 to be inserted and fixed at the center position of the slit so as to intersect the main substrate 100 substantially perpendicularly. Therefore, as in the first and second embodiments, the solderability of the main male electrode 25 and the main female electrode 15 by the solder fillet 31 is improved, and the reliability and quality of the three-dimensional printed wiring board 300 can be improved.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Structure Of Printed Boards (AREA)
  • Combinations Of Printed Boards (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

L'invention concerne un dispositif électronique ayant une configuration qui rend possible, même lorsqu'il existe des variations dans l'épaisseur de feuille d'un substrat parmi deux substrats et dans la précision de traitement d'une partie trou de l'autre substrat, de supprimer une diminution de la facilité d'insertion entre les substrats lors de l'insertion du premier substrat dans la partie trou de l'autre substrat, et des diminutions de la soudabilité et de la fiabilité. Le dispositif électronique est pourvu : d'un premier substrat (100) dans lequel une partie trou (12) est formée ; et d'un second substrat (200) qui est inséré dans la partie trou (12) du premier substrat (100) de manière que le premier substrat (100) et le second substrat (200) se croisent. Une paire de premières électrodes (15) sont formées sur le premier substrat (100) de part et d'autre de la partie trou (12), et une paire de secondes électrodes (25) sont formées sur le second substrat (200), les premières et secondes électrodes étant connectées au moyen d'une brasure (31). Au moins une partie de chacune des deux secondes électrodes (25) est disposée dans la partie trou (12). Dans le second substrat (200), une saillie (32) est formée qui s'étend, dans la partie trou (12), vers la surface de paroi intérieure de la partie trou (12) à partir d'une zone située du côté intérieur de la périphérie la plus à l'extérieur de chacune des deux secondes électrodes (25).
PCT/JP2016/068790 2015-06-29 2016-06-24 Dispositif électronique WO2017002720A1 (fr)

Applications Claiming Priority (2)

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JP2015129666A JP2018137249A (ja) 2015-06-29 2015-06-29 電子装置
JP2015-129666 2015-06-29

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WO2017212964A1 (fr) * 2016-06-08 2017-12-14 三菱電機株式会社 Structure de connexion de cartes de circuit imprimé
WO2019087352A1 (fr) * 2017-11-02 2019-05-09 三菱電機株式会社 Ensemble carte de circuit imprimé
WO2019111906A1 (fr) * 2017-12-08 2019-06-13 三菱電機株式会社 Carte de circuit imprimé et son procédé de production
CN110326371A (zh) * 2017-03-02 2019-10-11 三菱电机株式会社 印刷布线板

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JPS59149082A (ja) * 1983-02-15 1984-08-25 松下電器産業株式会社 厚膜ハイブリツド集積回路基板
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Cited By (15)

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Publication number Priority date Publication date Assignee Title
WO2017212964A1 (fr) * 2016-06-08 2017-12-14 三菱電機株式会社 Structure de connexion de cartes de circuit imprimé
CN109196961A (zh) * 2016-06-08 2019-01-11 三菱电机株式会社 印刷基板的连接结构
CN109196961B (zh) * 2016-06-08 2021-03-16 三菱电机株式会社 印刷基板的连接结构
EP3592120A4 (fr) * 2017-03-02 2020-03-11 Mitsubishi Electric Corporation Carte de circuit imprimé
CN110326371A (zh) * 2017-03-02 2019-10-11 三菱电机株式会社 印刷布线板
JPWO2018159004A1 (ja) * 2017-03-02 2019-11-07 三菱電機株式会社 プリント配線板
US10757807B2 (en) 2017-03-02 2020-08-25 Mitsubishi Electric Corporation Printed wiring board and method for manufacturing printed wiring board
US11089679B2 (en) 2017-03-02 2021-08-10 Mitsubishi Electric Corporation Printed wiring board and method for manufacturing printed wiring board
CN110326371B (zh) * 2017-03-02 2022-12-06 三菱电机株式会社 印刷布线板以及印刷布线板的制造方法
CN111279803A (zh) * 2017-11-02 2020-06-12 三菱电机株式会社 印刷电路基板组装体
WO2019087352A1 (fr) * 2017-11-02 2019-05-09 三菱電機株式会社 Ensemble carte de circuit imprimé
US11277914B2 (en) 2017-11-02 2022-03-15 Mitsubishi Electric Corporation Printed circuit board assembly
CN111279803B (zh) * 2017-11-02 2023-02-03 三菱电机株式会社 印刷电路基板组装体
WO2019111906A1 (fr) * 2017-12-08 2019-06-13 三菱電機株式会社 Carte de circuit imprimé et son procédé de production
US11266018B2 (en) 2017-12-08 2022-03-01 Mitsubishi Electric Corporation Printed wiring board and method for manufacturing the same

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