WO2017002640A1 - Electronic component storage tray, multiple electronic component storage element, and method for handling electronic components - Google Patents

Electronic component storage tray, multiple electronic component storage element, and method for handling electronic components Download PDF

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Publication number
WO2017002640A1
WO2017002640A1 PCT/JP2016/068053 JP2016068053W WO2017002640A1 WO 2017002640 A1 WO2017002640 A1 WO 2017002640A1 JP 2016068053 W JP2016068053 W JP 2016068053W WO 2017002640 A1 WO2017002640 A1 WO 2017002640A1
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Prior art keywords
component storage
electronic component
tray
position recognition
recess
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PCT/JP2016/068053
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French (fr)
Japanese (ja)
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福田謙一
野々垣裕
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株式会社村田製作所
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Priority to CN201680037994.1A priority Critical patent/CN107709193B/en
Priority to JP2017526283A priority patent/JP6481760B2/en
Publication of WO2017002640A1 publication Critical patent/WO2017002640A1/en

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/02—Feeding of components

Definitions

  • the present invention relates to a tray for storing electronic components, a multiple electronic component storage body in which a plurality of electronic components are stored in a tray, and a method for handling electronic components in relation to the tray.
  • Patent Document 1 discloses a semiconductor component storage tray in which component storage recesses for storing semiconductor components are formed in a matrix shape on the surface thereof.
  • a semiconductor component storage tray in which a reference mark indicating the direction of the semiconductor component storage tray is provided at a predetermined location has been proposed.
  • the tray direction can be easily identified when the tray is set in a semiconductor component visual inspection apparatus or the like. This is possible, and it can be surely prevented from causing a setting mistake of setting the tray in the wrong direction.
  • a transparent, semi-transparent or opaque resin material is usually used as a constituent material, and for example, carbon black or the like is kneaded with a conductive material in order to suppress or prevent static electricity.
  • resin materials are used, there is a problem that it is difficult to optically recognize the reference marks when the reference marks are formed on these resin materials by an embossing method.
  • the present invention solves the above-described problems, and includes a position recognition mark that can be reliably recognized, and reliably detects the positions of a plurality of component storage recesses from the position of the position recognition mark.
  • Electronic component storage tray that can be reliably taken out from each component storage recess and stored in each component storage recess, and a plurality of electronic components in which electronic components are stored in a plurality of component storage recesses of the electronic component storage tray It is an object of the present invention to provide an electronic component handling method capable of reliably handling an electronic component in relation to a container and an electronic component storage tray.
  • an electronic component storage tray includes: The tray body, A plurality of component storage recesses disposed in predetermined positions of the tray body, each of which should store an electronic component; A position recognition mark provided in at least two places of the tray main body having a predetermined positional relationship with the component storage recess, and A boundary line defined by a boundary line between the planar region and the inclined region, wherein the position recognition mark includes a planar region that can be recognized from the upper surface or the lower surface side, and an inclined region adjacent to the planar region. It is characterized by a circular shape when viewed from the upper or lower surface side of the surrounding area.
  • the position recognition mark is (A) An inverted frustoconical recess provided on the upper surface of the tray body, wherein the bottom surface of the inverted frustoconical recess serves as the planar region, and the side surface of the inverted frustoconical recess is inclined. What will become an area, (B) A frustoconical convex portion provided on the upper surface of the tray body, wherein the upper surface of the frustoconical convex portion becomes the planar region, and a side surface of the frustoconical convex portion is inclined.
  • the position recognition mark By using a position recognition mark having any one of the above-described configurations (a), (b), (c), and (d), the position recognition mark can be more reliably recognized. At the same time, it is possible to reliably detect and specify the position of the component storage recess having a predetermined positional relationship with the position recognition mark. As a result, it is possible to reliably pick up and take out the electronic component stored in the component storage recess, and to store the electronic component in a predetermined component storage recess of the electronic component storage tray. It can be announced.
  • the position recognition mark is configured as described in (a), (b), (c), (d) above in the boundary surrounding region.
  • the shape when viewed from the upper surface side is circular and can be reliably recognized by an optical method, and the inclined area around the circular boundary line surrounding area is an obstacle to optically recognizing the boundary surrounding area. This is because the reflected light or the like is less likely to be biased, and the boundary line surrounding region can be reliably recognized by an optical method.
  • the concave or convex part of the inverted triangular frustum shape or the inverted quadrangular frustum shape is formed as the position recognition mark, the shape of the boundary line surrounding area and the bending of the inclined area located outside the boundary line surrounding area Due to the influence of the part or the like, it may not be easy to recognize the boundary between the planar region and the inclined region (that is, the boundary line surrounding region), and the reliability is lowered.
  • the multiple electronic component storage body of the present invention is characterized in that electronic components are detachably stored in the multiple component storage recesses of the electronic component storage tray of the present invention described above.
  • the electronic component handling method of the present invention is At least two of the position recognition marks provided in the electronic component storage tray of the present invention described above are optically recognized from the upper surface or the lower surface side of the tray body, and the component storage is in a predetermined positional relationship with the position recognition mark. Detecting the position of the recess; A step of holding and taking out an electronic component stored in the component storage recess whose position is detected by an electronic component holding means, and an electronic component held in the component storage recess whose position is detected by an electronic component holding means And at least one process of storing the container.
  • An electronic component storage tray includes a tray main body, a plurality of component storage recesses that are disposed at predetermined positions of the tray main body and in which electronic components are to be stored, respectively, Position recognition marks provided at least in two positions, and the position recognition mark includes a plane area and an inclined area adjacent to the plane area, and is defined by a boundary line between the two. Since the shape when viewed from the upper surface or the lower surface side of the boundary line enclosing area is circular, the position recognition mark is surely recognized and the component storage recess having a predetermined positional relationship with the position recognition mark is formed. The position can be reliably detected. For this reason, it is possible to reliably pick up and take out an electronic component from the specified component storage recess, and to store the electronic component in the component storage recess whose position is reliably detected. It is possible to provide an electronic component storage tray that can be used.
  • the position recognition mark is configured such that the shape of the boundary surrounding area defined by the boundary line between the planar area and the inclined area is circular, by satisfying the above requirements, This is because, for example, the boundary surrounding region can be reliably detected when the position recognition mark is recognized by an optical method. In other words, by making the shape of the boundary line surrounding area circular, it is less affected by illumination when recognizing the position recognition mark by an optical method, and the boundary line (boundary line surrounding area) is reliably recognized. become able to.
  • a resin material is usually used as a material constituting the electronic component storage tray of the present invention.
  • a transparent, translucent or opaque material is used.
  • a black resin material kneaded with a conductive material such as carbon black may be used.
  • these materials in the case of a transparent material or a black material, it has been considered difficult to optically recognize the position recognition mark. It has been experimentally confirmed that it is possible to recognize the position recognition mark by an optical method by adopting a configuration in which the lens is circular.
  • the multiple electronic component storage body of the present invention is one in which an electronic component is removably stored in the multiple component storage recesses of the electronic component storage tray of the present invention described above, and the position recognition mark is reliably recognized.
  • the electronic component can be reliably picked up and taken out from the component storage recess whose position is specified. It is possible to provide a plurality of electronic component storage bodies that are excellent in handling and reliability when taking out the electronic components.
  • the electronic component handling method of the present invention optically recognizes at least two position recognition marks provided on the electronic component storage tray of the present invention, and stores the components in a predetermined positional relationship with the position recognition mark.
  • the electronic component is not limited to the case where the electronic component stored in the component storage recess is taken out or the electronic component is stored in the component storage recess.
  • a mode in which an electronic component that has been removed from the component storage recess and subjected to predetermined processing and processing and then subjected to the processing and processing is stored again in the component storage recess (for example, a multilayer as an electronic component from the component storage recess)
  • the board mount (mount) the surface mounting component on the multilayer board to form a module part, and then handle the module part in such a manner that the module part is stored in the component storage recess of the electronic component storage tray.
  • FIG. 1A is a plan view showing an electronic component storage tray according to an embodiment of the present invention
  • FIG. 1B is a front sectional view taken along line AA
  • FIG. 2 is a front view showing an enlarged main part. It is sectional drawing.
  • an electronic component storage tray 1 As shown in FIGS. 1A, 1B, and 2, an electronic component storage tray 1 according to this embodiment is provided with a tray body 3 and electronic components disposed at predetermined positions on the tray body 3, respectively.
  • 10 (FIG. 1 (b), FIG. 2) two position recognition marks formed on a plurality of component storage recesses 2 to be stored and corner portions 3a, 3b located diagonally on the upper surface side of the tray body 3. 4 (4a, 4b).
  • the type of electronic component 10 accommodated in the electronic component storage tray 1 of the present invention is not particularly limited.
  • the present invention is applied to a tray for storing various electronic components such as semiconductor chips, multilayer substrates, LEDs, and the like. It is possible to apply.
  • the component storage recesses 2 are arranged in a matrix on the tray body 3, and each component storage recess 2 is open on the upper surface side so that the electronic component 10 can be stored and taken out from the opened upper surface side. It is configured.
  • the component storage recess 2 has a rectangular planar shape and is a shallow substantially rectangular parallelepiped recess, but there is no particular restriction on the specific shape of the electronic component storage tray of the present invention. .
  • each of the plurality of component storage recesses 2 is not limited to the same shape, and component storage recesses 2 having different shapes may be included. Moreover, you may be comprised so that the electronic component from which a kind and a shape differ may be accommodated in the component storage recessed part 2 which has a different shape.
  • the two position recognition marks 4 (4a, 4b) provided on the corner portions 3a, 3b at the diagonal positions of the tray body 3 are formed on the upper surface 13 of the tray body 3 as the concave truncated cone-shaped recesses 33. ing.
  • the bottom surface 14 of the inverted frustoconical recess 33 is a plane region in the present invention, and the side surface 15 of the inverted frustoconical recess 33 is an inclined region in the present invention.
  • the boundary enclosing region 17 defined by the boundary line 16 between the planar region (bottom surface) 14 and the inclined region (side surface) 15 is configured to be circular when viewed from the top surface side.
  • the position recognition mark 4 (4a, 4b) is configured so that the position can be reliably recognized by recognizing the boundary surrounding area 17 from the upper surface side of the tray body 3.
  • each of the plurality of component storage recesses 2 arranged in a matrix on the tray body 3 is arranged so as to have a predetermined positional relationship with the position recognition marks 4 (4a, 4b). By detecting the positions of the two position recognition marks 4 (4a, 4b), the position of each component storage recess 2 can be reliably recognized.
  • the electronic component storage tray 1 of this embodiment is formed by using a mold having a pair of protrusions to be the component storage recesses 2 and the position recognition marks 4 (4a, 4b).
  • Each component storage recess 2 of the storage tray 1 and the position recognition mark 4 are configured to reliably have a predetermined positional relationship.
  • thermoplastic resin is melted at a high temperature and then placed in a low-temperature mold and solidified, or a thermosetting resin is heated to a predetermined temperature (for example, around 50 ° C.) to impart fluidity. Thereafter, a method of injection molding such as a method of filling a high-temperature mold (for example, around 150 ° C.) and curing (solidifying),
  • B It is possible to use a vacuum forming method or a pressure forming method in which a sheet-like material extruded in advance is softened by heating, set in a mold before being cooled and solidified, and formed into a final shape with vacuum pressure or compressed air.
  • the surface of the sheet-like material that comes into contact with the mold has an inverted frustoconical recess 33 that forms the position recognition mark 4 described above. It is desirable to have a bottom surface (planar region 14) and a side surface (inclined region 15). This is because the surface of the sheet-shaped material that contacts the mold is the bottom surface 14 and the side surface 15 of the recess 33, so that the sheet-shaped material is bound to the bottom surface 14 and the side surface 15 in the molding step.
  • the boundary change between the flat region (bottom surface) 14 and the inclined region (side surface) 15 of the obtained electronic component storage tray becomes clear, and the boundary line 16 This is because the shape of the boundary surrounding region 17 defined by the above is clarified and can be surely recognized by an optical method.
  • the manufacturing method of the electronic component storage tray 1 of the present invention is not particularly limited, and can be manufactured using a method such as press molding other than the method described above.
  • FIGS. 4A and 4B show the present invention formed by detachably storing an electronic component 10 in each component storage recess 2 of the electronic component storage tray 1 configured as described above. It is a figure which shows the multiple electronic component storage body 20 concerning one Embodiment.
  • the multiple electronic component storage body 20 is formed by storing the electronic component 10 in each component storage recess 2 of the electronic component storage tray 1.
  • each of the component storage recesses 2 of the electronic component storage tray 1 for example, a plurality of electronic components are arranged so as to correspond to the arrangement of the component storage recesses 2 of the electronic component storage tray 1.
  • the component storage recesses 2 of the electronic component 10 are transferred to the component storage recesses 2 of the electronic component storage tray 1 from a holding plate (not shown) that holds the components in a matrix. Containment. Thereby, the multiple electronic component housing 20 is obtained (see FIGS. 4A and 4B).
  • two position recognition marks 4 (4a, 4b) of the electronic component storage tray 1 are detected by an optical method using a camera or the like, and each component storage recess is determined from the detection result. 2, and the electronic component 10 held by the electronic component holding means such as a vacuum suction nozzle is stored in a predetermined component storage recess 2, and the electronic component 10 is sequentially stored in each component storage recess 2.
  • the multiple electronic component storage body 20 (see FIGS. 4A and 4B) can be obtained.
  • (1) Input of conditions such as electronic component storage tray (a) Dimensions (length, width, thickness) of electronic component storage tray 1, position and shape of position recognition mark 4 (4a, 4b), component storage recess 2 Information such as the shape and the positional relationship between the component housing recess 2 and the position recognition mark 4 (4a, 4b) is input to the control means.
  • a predetermined posture for example, the upper surface of the electronic component storage tray is Install in a horizontal position.
  • two position recognition marks 4 (4a and 4b) are recognized by a camera (optical apparatus) 11 which is an imaging means.
  • the camera 11 is configured to move to a position above the position recognition mark 4 (4a, 4b) under a predetermined condition to recognize the position recognition mark 4 (4a, 4b). Yes.
  • the camera 11 recognizes the two position recognition marks 4 (4a, 4b)
  • one camera 11 is moved to move the two position recognition marks 4 (4a, 4b).
  • the position of 4b) may be recognized, or the two cameras 11 may be used to recognize the position of the position recognition mark 4 (4a, 4b).
  • the above operation is repeated to take out the plurality of electronic components 10 accommodated in the component accommodating recesses 2 of the electronic component accommodating tray 1 and sequentially mount and mount them on the mounting target.
  • the electronic component 10 When the electronic component 10 is stored in the component storage recess 2, the electronic component 10 is taken out from the component storage recess 2 of the electronic component storage tray 1 in both cases (a) and (b).
  • the electronic components 10 are housed in a substantially reverse order. 4A and 4B and FIGS. 5A and 5B, etc., for a method of handling the electronic component 10 when the electronic component 10 is stored in the component storage recess 2 of the electronic component storage tray 1 below. Will be described with reference to FIG.
  • the camera 11 recognizes two position recognition marks 4 (4a, 4b) on the electronic component storage tray.
  • each component storage recess 2 is calculated from the positional relationship between the position recognition mark 4 (4a, 4b) and the component storage recess 2, and the position information of each component storage recess 2 is obtained.
  • the electronic component 10 (including the electronic component such as a module product in which another surface mount component is mounted on the multilayer substrate as in the above (a)) 10 is moved by an electronic component holding means such as a vacuum suction nozzle.
  • the components are stored in the respective component storage recesses 2 obtained as described above.
  • the position recognition mark 4 is the inverted truncated cone-shaped recess 33 provided on the upper surface 13 of the tray body 3, and the bottom surface 14 of the inverted truncated cone-shaped recess 33 becomes a planar region
  • the side surface 15 of the truncated cone-shaped concave portion is the position recognition mark (FIGS. 1, 2, and 3) configured to be an inclined region
  • the position recognition is performed in the electronic component storage tray of the present invention.
  • the configuration of the mark 4 is not limited to that shown in the above embodiment, and various configurations can be adopted.
  • a position recognition mark configured to be an area, and the side surface 115 of the truncated cone-shaped convex portion 34a is an inclined area;
  • C As shown in FIG. 8, an inverted frustoconical recess 33 a formed in the convex region 233 provided on the upper surface 13 of the tray body 3, and the bottom surface 14 a of the inverted frustoconical recess 33 a Examples thereof include a position recognition mark configured to be a planar region and the side surface 15a of the inverted frustoconical recess 33a to be an inclined region.
  • a hemispherical recess 33b is provided in the tray main body 3 as shown in FIG. 9, and the upper surface 13 of the tray main body 3 serves as a planar region 14, and the hemispherical recess 33b It is also possible to provide the position recognition mark 4 having a configuration in which the peripheral surface becomes the inclined region 15.
  • a semielliptical spherical concave portion 33c as shown in FIG. 10 is provided, and the upper surface 13 of the tray body 3 becomes a planar region, and the inner periphery of the semielliptical spherical concave portion 33c is provided. It is also possible to provide the position recognition mark 4 having a configuration in which the surface is an inclined region.
  • position recognition mark 4 in FIGS. 9 and 10 is modified in accordance with the position recognition mark 4 (see FIGS. 6, 7, and 8) shown in the above (b), (c), and (d). It is also possible.

Abstract

Provided are: an electronic component storage tray with which the locations of respective component storage recesses are detected from the locations of position recognition marks, and it is possible to reliably take electronic components out from the respective component storage recesses or store the electronic components in the respective component storage recesses; a multiple electronic component storage element in which electronic components are stored in a plurality of component storage recesses of an electronic component storage tray; and a method for handling electronic components, in which electronic components can be reliably handled in relation to an electronic component storage tray.　The present invention is configured so that: a plurality of component storage recesses 2 are disposed at predetermined positions on a tray main body 3; position recognition marks 4 are disposed on the tray main body 3 at two or more places that are in a predetermined positional relationship with the component storage recesses 2; each position recognition mark is provided with a plane region 14 which can be recognized from the top surface side or bottom surface side, and a slope region 15 which is adjacent to the plane region; and each position recognition mark has a circular shape when viewed from the top surface side or bottom surface side of a border line surrounded region 17 which is defined by a border line 16 between the plane region and the slope region.

Description

電子部品収納トレイ、複数電子部品収納体、および電子部品取り扱い方法Electronic component storage tray, multiple electronic component storage body, and electronic component handling method
　本発明は、電子部品を収納するためのトレイ、トレイに複数の電子部品が収納された複数電子部品収納体、およびトレイとの関係における電子部品の取り扱い方法に関する。 The present invention relates to a tray for storing electronic components, a multiple electronic component storage body in which a plurality of electronic components are stored in a tray, and a method for handling electronic components in relation to the tray.
　例えば、電子部品を出荷したり、実装に供したりするにあたって、複数の部品収容凹部を備えたトレイを用い、電子部品をトレイの複数の部品収納凹部のそれぞれに収納して取り扱うことが広く行われている。 For example, when shipping electronic components or for mounting, it is widely performed to use a tray having a plurality of component receiving recesses and store and handle the electronic components in each of the component storing recesses of the tray. ing.
　そのような電子部品の収納トレイとして、特許文献１には、表面に半導体部品を収納するための部品収納凹部がマトリックス状に形成されている半導体部品収納用トレイであって、半導体部品収納部の所定の箇所に半導体部品収納用トレイの方向を示す基準マークが設けられた半導体部品収納用トレイが提案されている。 As such a storage tray for electronic components, Patent Document 1 discloses a semiconductor component storage tray in which component storage recesses for storing semiconductor components are formed in a matrix shape on the surface thereof. A semiconductor component storage tray in which a reference mark indicating the direction of the semiconductor component storage tray is provided at a predetermined location has been proposed.
　そして、特許文献１の半導体部品収納用トレイ（以下、単に「トレイ」ともいう）によれば、半導体部品外観検査装置などにトレイをセットする場合などにおいて、トレイの方向を容易に識別することが可能で、トレイの方向を間違ってセットするというセットミスが発生することを確実に防止することができるとされている。 According to the semiconductor component storage tray (hereinafter also simply referred to as “tray”) in Patent Document 1, the tray direction can be easily identified when the tray is set in a semiconductor component visual inspection apparatus or the like. This is possible, and it can be surely prevented from causing a setting mistake of setting the tray in the wrong direction.
特開２００１－２８７７８５号公報JP 2001-287785 A
　しかしながら、特許文献１に記載されている半導体部品収納用トレイの場合、トレイの方向を示す基準マークが設けられていることから、トレイの方向を間違ってセットすることは防止できるが、部品を収納するための部品収納凹部と、トレイ自体の位置関係を特定するための構成は示されておらず、例えば、基準マークに基づいてトレイを所定の方向に向けておいたとしても、部品収納凹部の位置を正確に検知することができず、部品収納凹部の平面寸法が小さく、そこに収納されている電子部品も寸法が小さい場合、電子部品を真空吸着などの方法でピックアップして取り出す際に、取り出しミスが生じやすくなるという問題点がある。 However, in the case of the semiconductor component storage tray described in Patent Document 1, since the reference mark indicating the direction of the tray is provided, it is possible to prevent the tray from being set incorrectly, but the component is stored. The configuration for specifying the positional relationship between the component storage recess and the tray itself is not shown. For example, even if the tray is directed in a predetermined direction based on the reference mark, the component storage recess When the position cannot be accurately detected, the planar dimension of the component storage recess is small, and the electronic component stored therein is also small, when picking up and removing the electronic component by a method such as vacuum suction, There is a problem that a mistake in taking out tends to occur.
　また、従来のトレイにおいては、通常その構成材料として、透明、半透明あるいは不透明の樹脂材料が用いられ、また、静電気の抑制、防止のため、例えば、カーボンブラックなどが導電性材料を練り込んだ樹脂材料が用いられているが、これらの樹脂材料に型押しの方法で基準マークを形成した場合、光学的に基準マークを認識することが困難であるという問題点がある。 In addition, in a conventional tray, a transparent, semi-transparent or opaque resin material is usually used as a constituent material, and for example, carbon black or the like is kneaded with a conductive material in order to suppress or prevent static electricity. Although resin materials are used, there is a problem that it is difficult to optically recognize the reference marks when the reference marks are formed on these resin materials by an embossing method.
　本発明は、上記課題を解決するものであり、確実に認識することが可能な位置認識マークを備え、位置認識マークの位置から、複数の部品収納凹部の位置を確実に検知して、電子部品を各部品収納凹部から確実に取り出したり、各部品収納凹部に収容したりすることが可能な電子部品収納トレイ、該電子部品収納トレイの複数の部品収納凹部に電子部品が収納された複数電子部品収容体、および、電子部品収納トレイとの関係において電子部品を確実に取り扱うことが可能な電子部品の取り扱い方法を提供することを目的とする。 The present invention solves the above-described problems, and includes a position recognition mark that can be reliably recognized, and reliably detects the positions of a plurality of component storage recesses from the position of the position recognition mark. Electronic component storage tray that can be reliably taken out from each component storage recess and stored in each component storage recess, and a plurality of electronic components in which electronic components are stored in a plurality of component storage recesses of the electronic component storage tray It is an object of the present invention to provide an electronic component handling method capable of reliably handling an electronic component in relation to a container and an electronic component storage tray.
　上記課題を解決するために、本発明の電子部品収納トレイは、
　トレイ本体と、
　前記トレイ本体の所定の位置に配設された、それぞれに電子部品が収納されるべき複数の部品収納凹部と、
　前記トレイ本体の、前記部品収納凹部と所定の位置関係にある少なくとも２箇所に設けられた位置認識マークと
　を備え、かつ、
　前記位置認識マークが、上面または下面側から認識することが可能な平面領域と、前記平面領域に隣接する傾斜領域とを備え、前記平面領域と前記傾斜領域との境界線により規定される境界線包囲領域の上面または下面側からみた場合の形状が円形であること
　を特徴としている。 In order to solve the above problems, an electronic component storage tray according to the present invention includes:
The tray body,
A plurality of component storage recesses disposed in predetermined positions of the tray body, each of which should store an electronic component;
A position recognition mark provided in at least two places of the tray main body having a predetermined positional relationship with the component storage recess, and
A boundary line defined by a boundary line between the planar region and the inclined region, wherein the position recognition mark includes a planar region that can be recognized from the upper surface or the lower surface side, and an inclined region adjacent to the planar region. It is characterized by a circular shape when viewed from the upper or lower surface side of the surrounding area.
　また、本発明の電子部品収納トレイにおいては、
　前記位置認識マークが、
　（ａ）前記トレイ本体の前記上面に設けられた逆円錐台形状の凹部であって、前記逆円錐台形状の凹部の底面が前記平面領域となり、前記逆円錐台形状の凹部の側面が前記傾斜領域となるもの、
　（ｂ）前記トレイ本体の前記上面に設けられた円錐台形状の凸部であって、前記円錐台形状の凸部の上面が前記平面領域となり、前記円錐台形状の凸部の側面が前記傾斜領域となるもの、
　（ｃ）前記トレイ本体の前記上面に設けられた凹部領域に形成された円錐台形状の凸部であって、前記円錐台形状の凸部の上面が前記平面領域となり、前記円錐台形状の凸部の側面が前記傾斜領域となるもの、
　（ｄ）前記トレイ本体の前記上面に設けられた凸部領域に形成された逆円錐台形状の凹部であって、前記逆円錐台形状の凹部の底面が前記平面領域となり、前記逆円錐台形状の凹部の側面が前記傾斜領域となるもの
　からなる群より選ばれる少なくとも１種であることが好ましい。 In the electronic component storage tray of the present invention,
The position recognition mark is
(A) An inverted frustoconical recess provided on the upper surface of the tray body, wherein the bottom surface of the inverted frustoconical recess serves as the planar region, and the side surface of the inverted frustoconical recess is inclined. What will become an area,
(B) A frustoconical convex portion provided on the upper surface of the tray body, wherein the upper surface of the frustoconical convex portion becomes the planar region, and a side surface of the frustoconical convex portion is inclined. What will become an area,
(C) A frustoconical protrusion formed in a recessed area provided on the upper surface of the tray body, the upper surface of the frustoconical protrusion serving as the planar area, and the frustoconical protrusion The side surface of the part becomes the inclined region,
(D) An inverted frustoconical recess formed in a convex region provided on the upper surface of the tray body, wherein the bottom surface of the inverted frustoconical recess becomes the planar region, and the inverted frustoconical shape It is preferable that the side surface of the recess is at least one selected from the group consisting of the inclined regions.
　位置認識マークとして、上述の（ａ），（ｂ），（ｃ），（ｄ）のいずれかの構成を備えたものを用いることにより、位置認識マークをより確実に認識することが可能になるとともに、位置認識マークと所定の位置関係にある部品収納凹部の位置を確実に検出し、特定することが可能になる。
　その結果、部品収納凹部に収容された電子部品を確実にピックアップして取り出したり、電子部品を電子部品収納トレイの所定の部品収納凹部に収納したりすることが可能になり、本発明をより実効あらしめることができる。 By using a position recognition mark having any one of the above-described configurations (a), (b), (c), and (d), the position recognition mark can be more reliably recognized. At the same time, it is possible to reliably detect and specify the position of the component storage recess having a predetermined positional relationship with the position recognition mark.
As a result, it is possible to reliably pick up and take out the electronic component stored in the component storage recess, and to store the electronic component in a predetermined component storage recess of the electronic component storage tray. It can be announced.
　なお、本発明の電子部品収納トレイにおいて、位置認識マークが上述の（ａ），（ｂ），（ｃ），（ｄ）のような構成のものが好ましいのは、上述の境界線包囲領域の上面側からみた場合の形状が円形で、光学的な方法で確実に認識できること、円形の境界線包囲領域の周囲の傾斜領域には、光学的に境界線包囲領域を認識する場合に妨げとなるような反射光などが偏って生じることが少なく、境界線包囲領域を光学的な方法で確実に認識できることなどによる。 In the electronic component storage tray of the present invention, it is preferable that the position recognition mark is configured as described in (a), (b), (c), (d) above in the boundary surrounding region. The shape when viewed from the upper surface side is circular and can be reliably recognized by an optical method, and the inclined area around the circular boundary line surrounding area is an obstacle to optically recognizing the boundary surrounding area. This is because the reflected light or the like is less likely to be biased, and the boundary line surrounding region can be reliably recognized by an optical method.
　因みに、位置認識マークとして、逆三角錐台形状や、逆四角錐台形状の凹部あるいは凸部を形成した場合、境界線包囲領域の形状、および境界線包囲領域の外側に位置する傾斜領域の曲折部の影響などにより、平面領域と傾斜領域の境界（すなわち、境界線包囲領域）を認識することが容易ではなくなる場合があり、信頼性が低下する。 By the way, when the concave or convex part of the inverted triangular frustum shape or the inverted quadrangular frustum shape is formed as the position recognition mark, the shape of the boundary line surrounding area and the bending of the inclined area located outside the boundary line surrounding area Due to the influence of the part or the like, it may not be easy to recognize the boundary between the planar region and the inclined region (that is, the boundary line surrounding region), and the reliability is lowered.
　また、本発明の複数電子部品収納体は、上述の本発明の電子部品収納トレイの前記複数の部品収納凹部に、電子部品が取り出し可能に収納されていることを特徴としている。 Also, the multiple electronic component storage body of the present invention is characterized in that electronic components are detachably stored in the multiple component storage recesses of the electronic component storage tray of the present invention described above.
　また、本発明の電子部品取り扱い方法は、
　上述の本発明の電子部品収納トレイが備える少なくとも２つの前記位置認識マークを、前記トレイ本体の前記上面または下面側から光学的に認識し、前記位置認識マークと所定の位置関係にある前記部品収納凹部の位置を検出する工程と、
　位置が検出された前記部品収納凹部に収納されている電子部品を、電子部品保持手段により保持して取り出す工程および、位置が検出された前記部品収納凹部に、電子部品保持手段により保持した電子部品を収納する工程の少なくとも一つの工程と
　を備えていることを特徴としている。 The electronic component handling method of the present invention is
At least two of the position recognition marks provided in the electronic component storage tray of the present invention described above are optically recognized from the upper surface or the lower surface side of the tray body, and the component storage is in a predetermined positional relationship with the position recognition mark. Detecting the position of the recess;
A step of holding and taking out an electronic component stored in the component storage recess whose position is detected by an electronic component holding means, and an electronic component held in the component storage recess whose position is detected by an electronic component holding means And at least one process of storing the container.
　本発明の電子部品収納トレイは、トレイ本体と、トレイ本体の所定の位置に配設された、それぞれに電子部品が収納されるべき複数の部品収納凹部と、トレイ本体の、部品収納凹部と所定の位置関係にある少なくとも２箇所に設けられた位置認識マークとを備えているとともに、位置認識マークが、平面領域と、平面領域に隣接する傾斜領域とを備え、両者の境界線により規定される境界線包囲領域の上面または下面側からみた場合の形状が円形となるように構成されているので、位置認識マークを確実に認識するとともに、位置認識マークと所定の位置関係にある部品収納凹部の位置を確実に検出することができる。そのため、位置が検出され、特定された部品収納凹部から電子部品を確実にピックアップして取り出したり、位置が確実に検出された部品収納凹部に電子部品を収納したりすることを確実に行うことができる電子部品収納トレイを提供することが可能になる。 An electronic component storage tray according to the present invention includes a tray main body, a plurality of component storage recesses that are disposed at predetermined positions of the tray main body and in which electronic components are to be stored, respectively, Position recognition marks provided at least in two positions, and the position recognition mark includes a plane area and an inclined area adjacent to the plane area, and is defined by a boundary line between the two. Since the shape when viewed from the upper surface or the lower surface side of the boundary line enclosing area is circular, the position recognition mark is surely recognized and the component storage recess having a predetermined positional relationship with the position recognition mark is formed. The position can be reliably detected. For this reason, it is possible to reliably pick up and take out an electronic component from the specified component storage recess, and to store the electronic component in the component storage recess whose position is reliably detected. It is possible to provide an electronic component storage tray that can be used.
　なお、本発明において、位置認識マークを、上述の平面領域と傾斜領域との境界線により規定される境界線包囲領域の形状が円形となるように構成したのは、上記要件を満たすことにより、例えば光学的な方法で、位置認識マークを認識する際に境界線包囲領域を確実に検出することができることによる。すなわち、境界線包囲領域の形状を円形とすることにより、光学的な方法で位置認識マークを認識する際に、照明の影響などを受けにくくなり、境界線（境界線包囲領域）を確実に認識できるようになる。 In the present invention, the position recognition mark is configured such that the shape of the boundary surrounding area defined by the boundary line between the planar area and the inclined area is circular, by satisfying the above requirements, This is because, for example, the boundary surrounding region can be reliably detected when the position recognition mark is recognized by an optical method. In other words, by making the shape of the boundary line surrounding area circular, it is less affected by illumination when recognizing the position recognition mark by an optical method, and the boundary line (boundary line surrounding area) is reliably recognized. become able to.
　また、本発明の電子部品収納トレイを構成する材料としては、通常、樹脂材料が用いられる。さらに、樹脂材料としては、透明、半透明のものや、不透明のものが用いられる。また、静電気の抑制、防止のため、カーボンブラックなどの導電性材料を練り込んだ黒色の樹脂材料が用いられる場合もある。
　これらの材料のうちでも、透明の材料や黒色の材料などの場合、光学的に位置認識マークを認識することは、困難であるとされてきたが、上述のように、境界線包囲領域の形状が円形となるような構成とすることにより、光学的な方法により、位置認識マークを認識することが可能であることが実験にて確認されている。 In addition, a resin material is usually used as a material constituting the electronic component storage tray of the present invention. Further, as the resin material, a transparent, translucent or opaque material is used. Further, in order to suppress or prevent static electricity, a black resin material kneaded with a conductive material such as carbon black may be used.
Among these materials, in the case of a transparent material or a black material, it has been considered difficult to optically recognize the position recognition mark. It has been experimentally confirmed that it is possible to recognize the position recognition mark by an optical method by adopting a configuration in which the lens is circular.
　また、本発明の複数電子部品収納体は、上述の本発明の電子部品収納トレイの複数の部品収納凹部に、電子部品が取り出し可能に収納されたものであり、位置認識マークを確実に認識することができるとともに、位置認識マークと所定の位置関係にある部品収納凹部の位置を確実に検出することができるため、位置が特定された部品収納凹部から電子部品を確実にピックアップして取り出すことが可能で、電子部品の取り出し時の取り扱い性や信頼性に優れた複数電子部品収納体を提供することができるようになる。 Moreover, the multiple electronic component storage body of the present invention is one in which an electronic component is removably stored in the multiple component storage recesses of the electronic component storage tray of the present invention described above, and the position recognition mark is reliably recognized. In addition, since the position of the component storage recess having a predetermined positional relationship with the position recognition mark can be reliably detected, the electronic component can be reliably picked up and taken out from the component storage recess whose position is specified. It is possible to provide a plurality of electronic component storage bodies that are excellent in handling and reliability when taking out the electronic components.
　また、本発明の電子部品取り扱い方法は、上述の本発明の電子部品収納トレイに設けられた少なくとも２つの位置認識マークを、光学的に認識し、位置認識マークと所定の位置関係にある部品収納凹部の位置を検出する工程と、位置が検出された部品収納凹部に収納されている電子部品を、例えば電子部品保持手段により保持して取り出す工程および、位置が検出された部品収納凹部に、例えば電子部品保持手段により保持した電子部品を収納する工程の少なくとも一つの工程を備えているので、位置認識マークとの関係からその位置が確実に特定された部品収納凹部に収納された電子部品を確実に取り出したり、位置認識マークとの関係からその位置が確実に特定された部品収納凹部に、電子部品を確実に収納したりすることが可能になる。 The electronic component handling method of the present invention optically recognizes at least two position recognition marks provided on the electronic component storage tray of the present invention, and stores the components in a predetermined positional relationship with the position recognition mark. The step of detecting the position of the recess, the step of taking out the electronic component stored in the component storage recess where the position is detected, for example, by holding the electronic component holding means, and the component storage recess where the position is detected, for example, Since at least one step of storing the electronic component held by the electronic component holding means is provided, the electronic component stored in the component storage recess whose position is surely specified from the relationship with the position recognition mark is securely And electronic components can be securely stored in the component storage recesses whose positions have been reliably identified from the relationship with the position recognition marks. .
　なお、本発明の電子部品取り扱い方法によれば、上述のように、部品収納凹部に収納された電子部品を取り出したり、部品収納凹部に電子部品を収納したりする場合に限らず、電子部品を部品収納凹部から取り出して所定の処理や加工を施した後、当該処理や加工が施された電子部品を再び、上記部品収納凹部に収納するような態様（例えば、部品収納凹部から電子部品として多層基板を取り出し、この多層基板に表面実装部品を搭載（実装）してモジュール部品とした後、このモジュール部品を電子部品収納トレイの部品収納凹部に収納するような態様）で取り扱うことも可能である。 According to the electronic component handling method of the present invention, as described above, the electronic component is not limited to the case where the electronic component stored in the component storage recess is taken out or the electronic component is stored in the component storage recess. A mode in which an electronic component that has been removed from the component storage recess and subjected to predetermined processing and processing and then subjected to the processing and processing is stored again in the component storage recess (for example, a multilayer as an electronic component from the component storage recess) It is also possible to take out the board, mount (mount) the surface mounting component on the multilayer board to form a module part, and then handle the module part in such a manner that the module part is stored in the component storage recess of the electronic component storage tray. .
本発明の一実施形態にかかる電子部品収納トレイの構成を示す図であって、（ａ）は平面図、（ｂ）は正面断面図である。It is a figure which shows the structure of the electronic component storage tray concerning one Embodiment of this invention, Comprising: (a) is a top view, (b) is front sectional drawing. 本発明の一実施形態にかかる電子部品収納トレイの要部構成を示す正面断面図である。It is front sectional drawing which shows the principal part structure of the electronic component storage tray concerning one Embodiment of this invention. 本発明の一実施形態にかかる電子部品収納トレイの位置認識マークの構成を示す図であって、（ａ）は正面断面図、（ｂ）は平面図である。It is a figure which shows the structure of the position recognition mark of the electronic component storage tray concerning one Embodiment of this invention, Comprising: (a) is front sectional drawing, (b) is a top view. 本発明の一実施形態にかかる複数電子部品収納体の構成を示す図であって、（ａ）は平面図、（ｂ）は正面断面図である。It is a figure which shows the structure of the multiple electronic component storage body concerning one Embodiment of this invention, Comprising: (a) is a top view, (b) is front sectional drawing. 本発明の一実施形態にかかる電子部品取り扱い方法を説明する図であって、（ａ）は平面図、（ｂ）は正面断面図である。It is a figure explaining the electronic component handling method concerning one Embodiment of this invention, Comprising: (a) is a top view, (b) is front sectional drawing. 本発明の電子部品収納トレイの位置認識マークの他の構成例を示す正面断面図である。It is front sectional drawing which shows the other structural example of the position recognition mark of the electronic component storage tray of this invention. 本発明の電子部品収納トレイの位置認識マークのさらに他の構成例を示す正面断面図である。It is front sectional drawing which shows the other structural example of the position recognition mark of the electronic component storage tray of this invention. 本発明の電子部品収納トレイの位置認識マークのさらに他の構成例を示す正面断面図である。It is front sectional drawing which shows the other structural example of the position recognition mark of the electronic component storage tray of this invention. 本発明の電子部品収納トレイの位置認識マークのさらに他の構成例を示す図であって、（ａ）は正面断面図、（ｂ）は平面図である。It is a figure which shows the further another structural example of the position recognition mark of the electronic component storage tray of this invention, Comprising: (a) is front sectional drawing, (b) is a top view. 本発明の電子部品収納トレイの位置認識マークのさらに他の構成例を示す図であって、（ａ）は正面断面図、（ｂ）は平面図である。It is a figure which shows the further another structural example of the position recognition mark of the electronic component storage tray of this invention, Comprising: (a) is front sectional drawing, (b) is a top view.
　以下に本発明の実施形態を示して、本発明の特徴とするところをさらに詳しく説明する。 Embodiments of the present invention will be described below, and the features of the present invention will be described in more detail.
　［電子部品収納トレイ］
　図１（ａ）は本発明の一実施形態にかかる電子部品収納トレイを示す平面図、図１（ｂ）はＡ－Ａ線による正面断面図、図２は、要部を拡大して示す正面断面図である。 [Electronic component storage tray]
1A is a plan view showing an electronic component storage tray according to an embodiment of the present invention, FIG. 1B is a front sectional view taken along line AA, and FIG. 2 is a front view showing an enlarged main part. It is sectional drawing.
　図１（ａ），（ｂ）および図２に示すように、この実施形態にかかる電子部品収納トレイ１は　トレイ本体３と、トレイ本体３の所定の位置に配設された、それぞれに電子部品１０（図１（ｂ），図２）が収納されるべき複数の部品収納凹部２と、トレイ本体３の上面側の対角に位置するコーナ部３ａ，３ｂに形成された２つの位置認識マーク４（４ａ，４ｂ）を備えている。 As shown in FIGS. 1A, 1B, and 2, an electronic component storage tray 1 according to this embodiment is provided with a tray body 3 and electronic components disposed at predetermined positions on the tray body 3, respectively. 10 (FIG. 1 (b), FIG. 2) two position recognition marks formed on a plurality of component storage recesses 2 to be stored and corner portions 3a, 3b located diagonally on the upper surface side of the tray body 3. 4 (4a, 4b).
　なお、本発明の電子部品収納トレイ１に収容される電子部品１０の種類には特別の制約がなく、例えば、半導体チップ、多層基板、ＬＥＤその他、種々の電子部品を収納するトレイに本発明を適用することが可能である。 The type of electronic component 10 accommodated in the electronic component storage tray 1 of the present invention is not particularly limited. For example, the present invention is applied to a tray for storing various electronic components such as semiconductor chips, multilayer substrates, LEDs, and the like. It is possible to apply.
　部品収納凹部２は、トレイ本体３にマトリックス状に配設されており、各部品収納凹部２は上面側が開口しており、開口した上面側から電子部品１０を収納し、取り出すことができるように構成されている。 The component storage recesses 2 are arranged in a matrix on the tray body 3, and each component storage recess 2 is open on the upper surface side so that the electronic component 10 can be stored and taken out from the opened upper surface side. It is configured.
　なお、この実施形態において、部品収納凹部２は、平面形状が方形で、浅い略直方体形状の凹部とされているが、本発明の電子部品収納トレイにおいてその具体的な形状に特別の制約はない。 In this embodiment, the component storage recess 2 has a rectangular planar shape and is a shallow substantially rectangular parallelepiped recess, but there is no particular restriction on the specific shape of the electronic component storage tray of the present invention. .
　また、複数個の部品収納凹部２のそれぞれが、いずれも同じ形状である場合に限らず、異なる形状を有する部品収納凹部２が含まれていてもよい。
　また、異なる形状を有する部品収納凹部２に、種類や形状の異なる電子部品が収納されるように構成されていてもよい。 In addition, each of the plurality of component storage recesses 2 is not limited to the same shape, and component storage recesses 2 having different shapes may be included.
Moreover, you may be comprised so that the electronic component from which a kind and a shape differ may be accommodated in the component storage recessed part 2 which has a different shape.
　また、トレイ本体３の対角位置のコーナ部３ａ，３ｂに設けられた２つの位置認識マーク４（４ａ，４ｂ）は、トレイ本体３の上面１３に、逆円錐台形状の凹部３３として形成されている。 Further, the two position recognition marks 4 (4a, 4b) provided on the corner portions 3a, 3b at the diagonal positions of the tray body 3 are formed on the upper surface 13 of the tray body 3 as the concave truncated cone-shaped recesses 33. ing.
　この位置認識マーク４においては、図３に示すように、逆円錐台形状の凹部３３の底面１４が本発明における平面領域、逆円錐台形状の凹部３３の側面１５が本発明における傾斜領域となり、平面領域（底面）１４と傾斜領域（側面）１５との境界線１６により規定される境界線包囲領域１７の、上面側からみた場合の形状が円形となるように構成されている。 In this position recognition mark 4, as shown in FIG. 3, the bottom surface 14 of the inverted frustoconical recess 33 is a plane region in the present invention, and the side surface 15 of the inverted frustoconical recess 33 is an inclined region in the present invention. The boundary enclosing region 17 defined by the boundary line 16 between the planar region (bottom surface) 14 and the inclined region (side surface) 15 is configured to be circular when viewed from the top surface side.
　そして、この位置認識マーク４（４ａ，４ｂ）は、トレイ本体３の上面側から上記境界線包囲領域１７を認識することにより、その位置を確実に認識することができるように構成されている。 The position recognition mark 4 (4a, 4b) is configured so that the position can be reliably recognized by recognizing the boundary surrounding area 17 from the upper surface side of the tray body 3.
　また、上述のように、トレイ本体３にマトリックス状に配設されている複数の部品収納凹部２のそれぞれは、位置認識マーク４（４ａ，４ｂ）と所定の位置関係となるように配設されており、２つの位置認識マーク４（４ａ，４ｂ）の位置を検出することにより、各部品収納凹部２の位置を確実に認識することができるように構成されている。 Further, as described above, each of the plurality of component storage recesses 2 arranged in a matrix on the tray body 3 is arranged so as to have a predetermined positional relationship with the position recognition marks 4 (4a, 4b). By detecting the positions of the two position recognition marks 4 (4a, 4b), the position of each component storage recess 2 can be reliably recognized.
　なお、この実施形態の電子部品収納トレイ１は、各部品収納凹部２および位置認識マーク４（４ａ，４ｂ）となるべき突出部を一対に備えた金型を用いて形成されており、電子部品収納トレイ１の各部品収納凹部２と、位置認識マーク４とが、確実に所定の位置関係を備えるように構成されている。 The electronic component storage tray 1 of this embodiment is formed by using a mold having a pair of protrusions to be the component storage recesses 2 and the position recognition marks 4 (4a, 4b). Each component storage recess 2 of the storage tray 1 and the position recognition mark 4 are configured to reliably have a predetermined positional relationship.
　なお、この電子部品収納トレイ１を製造するにあたっては、例えば、
　（ａ）熱可塑性樹脂を高温にして溶融させ、低温の金型に入れて固化させる方法や、熱硬化性樹脂を所定の温度（例えば５０℃前後）に加温し、流動性を持たせた後、高温の金型（例えば、約１５０℃前後）に充填して硬化（固化）させる方法などによる射出成形の方法や、
　（ｂ）あらかじめ押出成形されたシート状材料を加熱軟化させ、冷却固化前に型へセットし、真空圧や圧縮空気で最終形状に成形する真空成形・圧空成形の方法
　などを用いることができる。 In manufacturing the electronic component storage tray 1, for example,
(A) A method in which a thermoplastic resin is melted at a high temperature and then placed in a low-temperature mold and solidified, or a thermosetting resin is heated to a predetermined temperature (for example, around 50 ° C.) to impart fluidity. Thereafter, a method of injection molding such as a method of filling a high-temperature mold (for example, around 150 ° C.) and curing (solidifying),
(B) It is possible to use a vacuum forming method or a pressure forming method in which a sheet-like material extruded in advance is softened by heating, set in a mold before being cooled and solidified, and formed into a final shape with vacuum pressure or compressed air.
　なお、例えば、真空成形・圧空成形の方法で電子部品収納トレイを作製する場合、シート状材料の、型に接する方の面が、上述の位置認識マーク４を構成する逆円錐台形状の凹部３３の底面（平面領域１４）および側面（傾斜領域１５）となるようにすることが望ましい。
　これは、シート状材料の、型に接する方の面が凹部３３の底面１４および側面１５となるようにすることにより、成型工程において、シート状材料が、上述の底面１４および側面１５との境界に対応する領域が鋭く形成された型に沿って変形するため、得られる電子部品収納トレイの平面領域（底面）１４と傾斜領域（側面）１５との境界変化が明確になるとともに、境界線１６により規定される境界線包囲領域１７の形状が明確になり、光学的な方法により確実に認識することが可能になることによる。 For example, when an electronic component storage tray is manufactured by a vacuum forming / pressure forming method, the surface of the sheet-like material that comes into contact with the mold has an inverted frustoconical recess 33 that forms the position recognition mark 4 described above. It is desirable to have a bottom surface (planar region 14) and a side surface (inclined region 15).
This is because the surface of the sheet-shaped material that contacts the mold is the bottom surface 14 and the side surface 15 of the recess 33, so that the sheet-shaped material is bound to the bottom surface 14 and the side surface 15 in the molding step. Therefore, the boundary change between the flat region (bottom surface) 14 and the inclined region (side surface) 15 of the obtained electronic component storage tray becomes clear, and the boundary line 16 This is because the shape of the boundary surrounding region 17 defined by the above is clarified and can be surely recognized by an optical method.
　ただし、本発明の電子部品収納トレイ１の製造方法に特別の制約はなく、上述の方法以外のプレス成形などの方法を用いて作製することも可能である。 However, the manufacturing method of the electronic component storage tray 1 of the present invention is not particularly limited, and can be manufactured using a method such as press molding other than the method described above.
　［複数電子部品収納体］
　また、図４（ａ），（ｂ）は、上述のように構成された電子部品収納トレイ１の各部品収納凹部２に、電子部品１０を取り出し可能に収納することにより形成された、本発明の一実施形態にかかる複数電子部品収納体２０を示す図である。
　この複数電子部品収納体２０は、電子部品収納トレイ１の各部品収納凹部２に電子部品１０を収納することにより形成される。 [Multiple electronic component container]
FIGS. 4A and 4B show the present invention formed by detachably storing an electronic component 10 in each component storage recess 2 of the electronic component storage tray 1 configured as described above. It is a figure which shows the multiple electronic component storage body 20 concerning one Embodiment.
The multiple electronic component storage body 20 is formed by storing the electronic component 10 in each component storage recess 2 of the electronic component storage tray 1.
　そして、電子部品収納トレイ１の各部品収納凹部２のそれぞれに電子部品１０を収納するにあたっては、例えば、電子部品収納トレイ１の各部品収納凹部２の配列に対応するように、複数の電子部品をマトリックス状に整列させた状態で保持するホールディングプレート（図示せず）から、電子部品収納トレイ１の各部品収納凹部２に電子部品１０を移載することにより、電子部品１０の部品収納凹部２への収容を行う。これにより、複数電子部品収納体２０が得られる（図４（ａ），（ｂ）参照）。 In storing the electronic component 10 in each of the component storage recesses 2 of the electronic component storage tray 1, for example, a plurality of electronic components are arranged so as to correspond to the arrangement of the component storage recesses 2 of the electronic component storage tray 1. The component storage recesses 2 of the electronic component 10 are transferred to the component storage recesses 2 of the electronic component storage tray 1 from a holding plate (not shown) that holds the components in a matrix. Containment. Thereby, the multiple electronic component housing 20 is obtained (see FIGS. 4A and 4B).
　また、後述するように、例えば、電子部品収納トレイ１の２つの位置認識マーク４（４ａ，４ｂ）を、カメラなどを用いて光学的な方法で検出し、その検出結果から、各部品収納凹部２の位置を求め、例えば真空吸着ノズルなどの電子部品保持手段により保持した電子部品１０を、所定の部品収納凹部２に収納し、順次各部品収納凹部２に電子部品１０を収納することによっても、複数電子部品収納体２０（図４（ａ），（ｂ）参照）を得ることができる。 Further, as will be described later, for example, two position recognition marks 4 (4a, 4b) of the electronic component storage tray 1 are detected by an optical method using a camera or the like, and each component storage recess is determined from the detection result. 2, and the electronic component 10 held by the electronic component holding means such as a vacuum suction nozzle is stored in a predetermined component storage recess 2, and the electronic component 10 is sequentially stored in each component storage recess 2. The multiple electronic component storage body 20 (see FIGS. 4A and 4B) can be obtained.
　［電子部品収納トレイとの関係における電子部品の取り扱い方法］
　＜１＞電子部品収納トレイからの電子部品の取り出し
　まず、上述の複数電子部品収納体２０（図４（ａ），（ｂ））を構成する電子部品収納トレイ１の部品収納凹部２から電子部品１０を取り出して用いる場合の電子部品の取り扱い方法について、一例を挙げて説明する。 [How to handle electronic components in relation to the electronic component storage tray]
<1> Removal of electronic component from electronic component storage tray First, an electronic component is extracted from the component storage recess 2 of the electronic component storage tray 1 constituting the above-described plurality of electronic component storage bodies 20 (FIGS. 4A and 4B). An example of how to handle an electronic component when 10 is taken out and used will be described.
　ここでは、電子部品収納トレイ１の部品収納凹部２に収納された電子部品１０を取り出して、実装対象である回路基板上に実装する場合の電子部品１０の取り扱い方法について説明する。 Here, a method of handling the electronic component 10 when the electronic component 10 stored in the component storage recess 2 of the electronic component storage tray 1 is taken out and mounted on a circuit board to be mounted will be described.
　（１）電子部品収納トレイなどの条件の入力
　（ａ）電子部品収納トレイ１の寸法（長さ、幅、厚み）、位置認識マーク４（４ａ，４ｂ）の位置、形状、部品収納凹部２の形状や、部品収納凹部２と位置認識マーク４（４ａ，４ｂ）の位置関係などの情報を制御手段に入力する。
　（ｂ）位置認識マーク検出用の光学機器（カメラ）により位置認識マーク４（４ａ，４ｂ）を検出するための必要条件（例えば、カメラの焦点深度、分解能、位置認識マークの判定条件（閾値）（例えば、グレースケール、２５６階調などの条件））を入力する。 (1) Input of conditions such as electronic component storage tray (a) Dimensions (length, width, thickness) of electronic component storage tray 1, position and shape of position recognition mark 4 (4a, 4b), component storage recess 2 Information such as the shape and the positional relationship between the component housing recess 2 and the position recognition mark 4 (4a, 4b) is input to the control means.
(B) Necessary conditions for detecting the position recognition mark 4 (4a, 4b) by the optical device (camera) for detecting the position recognition mark (for example, the camera's focal depth, resolution, position recognition mark determination condition (threshold)) (For example, conditions such as gray scale and 256 gradations)).
　（２）電子部品収納トレイのマウンターへの取り付け
　部品収納凹部に電子部品が収納された電子部品収納トレイ（複数電子部品収納体）をマウンターに、所定の姿勢（例えば、電子部品収納トレイの上面が水平になるような姿勢）で取り付ける。 (2) Attaching the electronic component storage tray to the mounter With the electronic component storage tray (multiple electronic component storage body) in which electronic components are stored in the component storage recess as a mounter, a predetermined posture (for example, the upper surface of the electronic component storage tray is Install in a horizontal position.
　（３）カメラによる認識
　図５（ａ），（ｂ）に示すように、撮像手段であるカメラ（光学機器）１１により、２つの位置認識マーク４（４ａ，４ｂ）を認識する。なお、この実施形態では、カメラ１１が所定の条件で、位置認識マーク４（４ａ，４ｂ）の上方の位置に移動して、位置認識マーク４（４ａ，４ｂ）を認識するように構成されている。ただし、カメラ１１により、２つの位置認識マーク４（４ａ，４ｂ）を認識する際の具体的な動作に特別の制約はなく、一つのカメラ１１を移動させて２つの位置認識マーク４（４ａ，４ｂ）の位置を認識するようにしてもよく、また、２つのカメラ１１を用いて、位置認識マーク４（４ａ，４ｂ）の位置を認識するように構成してもよい。 (3) Recognition by Camera As shown in FIGS. 5A and 5B, two position recognition marks 4 (4a and 4b) are recognized by a camera (optical apparatus) 11 which is an imaging means. In this embodiment, the camera 11 is configured to move to a position above the position recognition mark 4 (4a, 4b) under a predetermined condition to recognize the position recognition mark 4 (4a, 4b). Yes. However, there is no particular restriction on the specific operation when the camera 11 recognizes the two position recognition marks 4 (4a, 4b), and one camera 11 is moved to move the two position recognition marks 4 (4a, 4b). The position of 4b) may be recognized, or the two cameras 11 may be used to recognize the position of the position recognition mark 4 (4a, 4b).
　なお、電子部品収納トレイ１に設けられている部品収納凹部２の設計上の位置と、位置認識マーク４（４ａ，４ｂ）を認識して求めた部品収納凹部２の位置にずれがある場合には、補正処理を行う。この補正処理を行うにあたっては、２つの位置認識マーク４（４ａ，４ｂ）のうちの一方の位置を優先して（基準にして）補正処理を行う場合と、位置の誤差を均等に振り分ける場合が考えられるが、適宜いずれかの方法を選択して適用することができる。 In addition, when there is a deviation between the design position of the component storage recess 2 provided in the electronic component storage tray 1 and the position of the component storage recess 2 obtained by recognizing the position recognition mark 4 (4a, 4b). Performs the correction process. When performing this correction process, there are a case where the correction process is performed with priority given to one of the two position recognition marks 4 (4a, 4b) (based on the reference) and a case where the position error is equally distributed. Though conceivable, any method can be selected and applied as appropriate.
　（４）電子部品の取り出しおよび実装対象上への実装
　（ａ）位置認識マーク４（４ａ，４ｂ）と部品収納凹部２の位置関係から、電子部品１０が収納されている位置、すなわち、各部品収納凹部２の位置を演算して求める。
　（ｂ）そして、演算して求めた各部品収納凹部２の位置に基づいて、所定の部品収納凹部２に収納された電子部品１０を、例えば真空吸着ノズルなどの電子部品保持手段（図示せず）によりピックアップして取り出し、実装対象である回路基板（図示せず）上に搭載、実装する。 (4) Taking out the electronic component and mounting it on the mounting target (a) From the positional relationship between the position recognition mark 4 (4a, 4b) and the component storage recess 2, the position where the electronic component 10 is stored, that is, each component The position of the storage recess 2 is calculated and obtained.
(B) Based on the position of each component storage recess 2 obtained by calculation, the electronic component 10 stored in the predetermined component storage recess 2 is replaced with an electronic component holding means (not shown) such as a vacuum suction nozzle. ) And pick up and mount on a circuit board (not shown) to be mounted.
　それから、上記操作を繰り返して、電子部品収納トレイ１の各部品収納凹部２に収容された複数の電子部品１０を取り出し、順次、実装対象上に搭載、実装する。 Then, the above operation is repeated to take out the plurality of electronic components 10 accommodated in the component accommodating recesses 2 of the electronic component accommodating tray 1 and sequentially mount and mount them on the mounting target.
　ここでは、電子部品収納トレイ１の部品収納凹部２に収納された電子部品１０を取り出す場合の電子部品の取り扱い方法について説明したが、本発明によれば、電子部品収納トレイ１の各部品収納凹部２のそれぞれに電子部品１０を収納することも可能である。 Here, the electronic component handling method when the electronic component 10 stored in the component storage recess 2 of the electronic component storage tray 1 is taken out has been described. However, according to the present invention, each component storage recess of the electronic component storage tray 1 is described. It is also possible to store the electronic component 10 in each of the two.
　以下に、電子部品収納トレイ１の部品収納凹部２に電子部品１０を収納する場合の電子部品の取り扱い方法について説明する。 Hereinafter, a method of handling an electronic component when the electronic component 10 is stored in the component storage recess 2 of the electronic component storage tray 1 will be described.
　＜２＞電子部品収納トレイへの電子部品の収納
　なお、電子部品収納トレイ１の部品収納凹部２に電子部品１０を収納する場合としては、大きく分けて、
　（ａ）電子部品収納トレイ１の各部品収納凹部２に電子部品１０を収納して、複数の部品収納凹部のそれぞれに電子部品が収納された状態の複数電子部品収納体２０を形成する場合と、
　（ｂ）例えば、電子部品収納トレイ１の各部品収納凹部２に収納されていた電子部品１０が多層基板であるような場合に、上述のようにして取り出した多層基板に他の表面実装部品を搭載してモジュール品（これも本発明における電子部品に含まれる）を形成した後、このモジュール品を、再び電子部品収納トレイ１の部品収納凹部２に収納するような場合
　の２つの場合が挙げられる。 <2> Storage of electronic components in electronic component storage tray In addition, when storing the electronic component 10 in the component storage recessed part 2 of the electronic component storage tray 1, it divides roughly,
(A) When the electronic component 10 is stored in each component storage recess 2 of the electronic component storage tray 1 to form a plurality of electronic component storage bodies 20 in a state where the electronic component is stored in each of the plurality of component storage recesses. ,
(B) For example, when the electronic component 10 stored in each component storage recess 2 of the electronic component storage tray 1 is a multilayer substrate, another surface mount component is placed on the multilayer substrate taken out as described above. After mounting and forming a module product (also included in the electronic component in the present invention), the module product is stored again in the component storage recess 2 of the electronic component storage tray 1 in two cases. It is done.
　そして、電子部品１０を部品収納凹部２に収納するにあたっては、上記（ａ）および（ｂ）のいずれの場合も、上述の、電子部品収納トレイ１の部品収納凹部２から電子部品１０を取り出す場合とはほぼ逆の順序で電子部品１０の収納が行われる。以下に、電子部品収納トレイ１の部品収納凹部２に電子部品１０を収納する場合の電子部品１０の取り扱い方法について、図４（ａ），（ｂ）および図５（ａ），（ｂ）などを参照しつつ説明する。 When the electronic component 10 is stored in the component storage recess 2, the electronic component 10 is taken out from the component storage recess 2 of the electronic component storage tray 1 in both cases (a) and (b). The electronic components 10 are housed in a substantially reverse order. 4A and 4B and FIGS. 5A and 5B, etc., for a method of handling the electronic component 10 when the electronic component 10 is stored in the component storage recess 2 of the electronic component storage tray 1 below. Will be described with reference to FIG.
　（１）まず、カメラ１１により、電子部品収納トレイの２つの位置認識マーク４（４ａ，４ｂ）を認識する。 (1) First, the camera 11 recognizes two position recognition marks 4 (4a, 4b) on the electronic component storage tray.
　（２）そして、位置認識マーク４（４ａ，４ｂ）と部品収納凹部２の位置関係から、各部品収納凹部２の位置を演算し、各部品収納凹部２の位置情報を得る。 (2) Then, the position of each component storage recess 2 is calculated from the positional relationship between the position recognition mark 4 (4a, 4b) and the component storage recess 2, and the position information of each component storage recess 2 is obtained.
　（３）それから、電子部品（上記（ａ）のような、多層基板に他の表面実装部品を搭載したモジュール品などの電子部品を含む）１０を、例えば真空吸着ノズルなどの電子部品保持手段により保持し、上述のようにして位置情報を得た各部品収納凹部２に収納する。 (3) Then, the electronic component 10 (including the electronic component such as a module product in which another surface mount component is mounted on the multilayer substrate as in the above (a)) 10 is moved by an electronic component holding means such as a vacuum suction nozzle. The components are stored in the respective component storage recesses 2 obtained as described above.
　そして、上記操作を繰り返して、電子部品収納トレイ１の部品収納凹部２のそれぞれに、電子部品１０を順次収納する。
　これにより、部品収納凹部２のそれぞれに電子部品１０が収容された複数電子部品収納体２０が形成される。 Then, the above operation is repeated to sequentially store the electronic components 10 in each of the component storage recesses 2 of the electronic component storage tray 1.
Thereby, the multiple electronic component storage body 20 in which the electronic component 10 is stored in each of the component storage recesses 2 is formed.
　なお、上記実施形態では、位置認識マーク４が、トレイ本体３の上面１３に設けられた逆円錐台形状の凹部３３であって、逆円錐台形状の凹部３３の底面１４が平面領域となり、逆円錐台形状の凹部の側面１５が傾斜領域となるように構成された位置認識マーク（図１，図２，図３）である場合について説明したが、本発明の電子部品収納トレイにおいて、位置認識マーク４の構成は上記実施形態で示したものに限らず、種々の構成とすることができる。 In the above-described embodiment, the position recognition mark 4 is the inverted truncated cone-shaped recess 33 provided on the upper surface 13 of the tray body 3, and the bottom surface 14 of the inverted truncated cone-shaped recess 33 becomes a planar region, Although the case where the side surface 15 of the truncated cone-shaped concave portion is the position recognition mark (FIGS. 1, 2, and 3) configured to be an inclined region has been described, the position recognition is performed in the electronic component storage tray of the present invention. The configuration of the mark 4 is not limited to that shown in the above embodiment, and various configurations can be adopted.
　例えば、
　（ａ）図６に示すように、トレイ本体３の上面１３に設けられた円錐台形状の凸部３４であって、円錐台形状の凸部の上面２４が平面領域となり、円錐台形状の凸部３４の側面２５が傾斜領域となるように構成された位置認識マーク、
　（ｂ）図７に示すように、トレイ本体３の上面１３に設けられた凹部領域１３３に形成された円錐台形状の凸部３４ａであって、円錐台形状の凸部３４ａの上面１１４が平面領域となり、円錐台形状の凸部３４ａの側面１１５が傾斜領域となるように構成された位置認識マーク、
　（ｃ）図８に示すように、トレイ本体３の上面１３に設けられた凸部領域２３３に形成された逆円錐台形状の凹部３３ａであって、逆円錐台形状の凹部３３ａの底面１４ａが平面領域となり、逆円錐台形状の凹部３３ａの側面１５ａが傾斜領域となるように構成された位置認識マーク
　などが例示される。 For example,
(A) As shown in FIG. 6, a truncated cone-shaped convex portion 34 provided on the upper surface 13 of the tray main body 3, wherein the upper surface 24 of the truncated cone-shaped convex portion becomes a planar region, and the truncated cone-shaped convex portion A position recognition mark configured such that the side surface 25 of the portion 34 is an inclined region;
(B) As shown in FIG. 7, a truncated cone-shaped convex portion 34 a formed in a concave region 133 provided on the upper surface 13 of the tray body 3, and the upper surface 114 of the truncated cone-shaped convex portion 34 a is flat. A position recognition mark configured to be an area, and the side surface 115 of the truncated cone-shaped convex portion 34a is an inclined area;
(C) As shown in FIG. 8, an inverted frustoconical recess 33 a formed in the convex region 233 provided on the upper surface 13 of the tray body 3, and the bottom surface 14 a of the inverted frustoconical recess 33 a Examples thereof include a position recognition mark configured to be a planar region and the side surface 15a of the inverted frustoconical recess 33a to be an inclined region.
　なお、位置認識マークとしては、その他にも、図９に示すような、トレイ本体３に半球状の凹部３３ｂを設け、トレイ本体３の上面１３が平面領域１４となり、半球状の凹部３３ｂの内周面が傾斜領域１５となるような構成の位置認識マーク４を設けるようにすることも可能である。 As other position recognition marks, a hemispherical recess 33b is provided in the tray main body 3 as shown in FIG. 9, and the upper surface 13 of the tray main body 3 serves as a planar region 14, and the hemispherical recess 33b It is also possible to provide the position recognition mark 4 having a configuration in which the peripheral surface becomes the inclined region 15.
　また、図９に示すような半球状の凹部ではなく、図１０に示すような半楕円球状の凹部３３ｃを設け、トレイ本体３の上面１３が平面領域となり、半楕円球状の凹部３３ｃの内周面が傾斜領域となるような構成の位置認識マーク４を設けるようにすることも可能である。 Further, instead of the hemispherical concave portion as shown in FIG. 9, a semielliptical spherical concave portion 33c as shown in FIG. 10 is provided, and the upper surface 13 of the tray body 3 becomes a planar region, and the inner periphery of the semielliptical spherical concave portion 33c is provided. It is also possible to provide the position recognition mark 4 having a configuration in which the surface is an inclined region.
　また、上述のような半球状あるいは半楕円球状の凹部以外にも、部分球状の凹部を設けて位置認識マークとすることが可能である。 In addition to the semispherical or semi-elliptical spherical recesses as described above, it is possible to provide partial spherical recesses as position recognition marks.
　また、図９および図１０の位置認識マーク４について、上述の（ｂ），（ｃ），（ｄ）に示した位置認識マーク４（図６，７，８参照）に準じるような変形を加えることも可能である。 Further, the position recognition mark 4 in FIGS. 9 and 10 is modified in accordance with the position recognition mark 4 (see FIGS. 6, 7, and 8) shown in the above (b), (c), and (d). It is also possible.
　なお、本発明は、上記実施形態に限定されるものではなく、発明の範囲内において、種々の応用、変形を加えることが可能である。 The present invention is not limited to the above-described embodiment, and various applications and modifications can be added within the scope of the invention.
　１　　　　　電子部品収納トレイ
　２　　　　　部品収納凹部
　３　　　　　トレイ本体
　３ａ，３ｂ　トレイ本体の対角に位置するコーナ部
　４（４ａ，４ｂ）　位置認識マーク
　１０　　　　電子部品
　１１　　　　カメラ（光学機器）
　１３　　　　トレイ本体の上面
　１４　　　　凹部の底面
　１４ａ　　　平面領域
　１５　　　　凹部の側面
　１５ａ　　　傾斜領域
　１６　　　　平面領域と傾斜領域の境界線
　１７　　　　境界線包囲領域
　２０　　　　複数電子部品収納体
　２４　　　　円錐台形状の凸部の上面
　２５　　　　円錐台形状の凸部の側面
　３３　　　　逆円錐台状の凹部
　３３ａ　　　凸部領域に形成された逆円錐台形状の凹部
　３３ｂ　　　半球状の凹部
　３３ｃ　　　半楕円球状の凹部
　３４　　　　円錐台状の凸部
　３４ａ　　　凹部領域に形成された円錐台形状の凸部
　１１４　　　凹部領域に形成された円錐台形状の凸部の上面
　１１５　　　凹部領域に形成された円錐台形状の凸部の側面
　１３３　　　凹部領域
　２３３　　　凸部領域 DESCRIPTION OF SYMBOLS 1 Electronic component storage tray 2 Component storage recessed part 3 Tray main body 3a, 3b Corner part 4 (4a, 4b) located in the diagonal of a tray main body 10 Electronic component 11 Camera (optical apparatus)
13 Upper surface of tray body 14 Bottom surface of recess 14a Planar region 15 Side surface of recess 15a Inclined region 16 Boundary line between planar region and inclined region 17 Borderline surrounding region 20 Multiple electronic component storage body 24 Upper surface of frustoconical convex portion 25 Cone Side surface of trapezoidal convex portion 33 Inverted truncated cone-shaped concave portion 33a Inverted truncated cone-shaped concave portion formed in convex region 33b Semispherical concave portion 33c Semi-elliptical spherical concave portion 34 Frustum-shaped convex portion 34a In concave region The frustoconical convex portion 114 formed is the upper surface of the frustoconical convex portion formed in the concave region 115. The side surface of the frustoconical convex portion formed in the concave region 133 The concave region 233 The convex region

Claims (4)

  1. 　トレイ本体と、
    　前記トレイ本体の所定の位置に配設された、それぞれに電子部品が収納されるべき複数の部品収納凹部と、
    　前記トレイ本体の、前記部品収納凹部と所定の位置関係にある少なくとも２箇所に設けられた位置認識マークと
    　を備え、かつ、
    　前記位置認識マークが、上面または下面側から認識することが可能な平面領域と、前記平面領域に隣接する傾斜領域とを備え、前記平面領域と前記傾斜領域との境界線により規定される境界線包囲領域の上面または下面側からみた場合の形状が円形であること
    　を特徴とする電子部品収納トレイ。     The tray body,
    A plurality of component storage recesses disposed in predetermined positions of the tray body, each of which should store an electronic component;
    A position recognition mark provided in at least two places of the tray main body having a predetermined positional relationship with the component storage recess, and
    A boundary line defined by a boundary line between the planar region and the inclined region, wherein the position recognition mark includes a planar region that can be recognized from the upper surface or the lower surface side, and an inclined region adjacent to the planar region. An electronic component storage tray characterized by having a circular shape when viewed from an upper surface or a lower surface side of the surrounding area.
  2. 　前記位置認識マークが、
    　（ａ）前記トレイ本体の前記上面に設けられた逆円錐台形状の凹部であって、前記逆円錐台形状の凹部の底面が前記平面領域となり、前記逆円錐台形状の凹部の側面が前記傾斜領域となるもの、
    　（ｂ）前記トレイ本体の前記上面に設けられた円錐台形状の凸部であって、前記円錐台形状の凸部の上面が前記平面領域となり、前記円錐台形状の凸部の側面が前記傾斜領域となるもの、
    　（ｃ）前記トレイ本体の前記上面に設けられた凹部領域に形成された円錐台形状の凸部であって、前記円錐台形状の凸部の上面が前記平面領域となり、前記円錐台形状の凸部の側面が前記傾斜領域となるもの、
    　（ｄ）前記トレイ本体の前記上面に設けられた凸部領域に形成された逆円錐台形状の凹部であって、前記逆円錐台形状の凹部の底面が前記平面領域となり、前記逆円錐台形状の凹部の側面が前記傾斜領域となるもの
    　からなる群より選ばれる少なくとも１種であることを特徴とする請求項１記載の電子部品収納トレイ。     The position recognition mark is
    (A) An inverted frustoconical recess provided on the upper surface of the tray body, wherein the bottom surface of the inverted frustoconical recess serves as the planar region, and the side surface of the inverted frustoconical recess is inclined. What will become an area,
    (B) A frustoconical convex portion provided on the upper surface of the tray body, wherein the upper surface of the frustoconical convex portion becomes the planar region, and a side surface of the frustoconical convex portion is inclined. What will become an area,
    (C) A frustoconical protrusion formed in a recessed area provided on the upper surface of the tray body, the upper surface of the frustoconical protrusion serving as the planar area, and the frustoconical protrusion The side surface of the part becomes the inclined region,
    (D) An inverted frustoconical recess formed in a convex region provided on the upper surface of the tray body, wherein the bottom surface of the inverted frustoconical recess becomes the planar region, and the inverted frustoconical shape 2. The electronic component storage tray according to claim 1, wherein the side surface of the concave portion is at least one selected from the group consisting of the inclined regions.
  3. 　請求項１または２記載の電子部品収納トレイの前記複数の部品収納凹部に、電子部品が取り出し可能に収納されていることを特徴とする複数電子部品収納体。 3. A multiple electronic component storage body, wherein an electronic component is detachably stored in the plurality of component storage recesses of the electronic component storage tray according to claim 1 or 2.
  4. 　請求項１または２記載の電子部品収納トレイが備える少なくとも２つの前記位置認識マークを、前記トレイ本体の前記上面または下面側から光学的に認識し、前記位置認識マークと所定の位置関係にある前記部品収納凹部の位置を検出する工程と、
    　位置が検出された前記部品収納凹部に収納されている電子部品を、電子部品保持手段により保持して取り出す工程および、位置が検出された前記部品収納凹部に、電子部品保持手段により保持した電子部品を収納する工程の少なくとも一つの工程と
    　を備えていることを特徴とする電子部品取り扱い方法。     The at least two position recognition marks included in the electronic component storage tray according to claim 1 or 2 are optically recognized from the upper surface or the lower surface side of the tray body, and are in a predetermined positional relationship with the position recognition marks. Detecting the position of the component housing recess;
    A step of holding and taking out an electronic component stored in the component storage recess whose position is detected by an electronic component holding means, and an electronic component held in the component storage recess whose position is detected by an electronic component holding means An electronic component handling method comprising: at least one of the steps of storing the product.
PCT/JP2016/068053 2015-07-02 2016-06-17 Electronic component storage tray, multiple electronic component storage element, and method for handling electronic components WO2017002640A1 (en)

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