JPH09188383A - Storage tray for semiconductor component - Google Patents

Abstract

PROBLEM TO BE SOLVED: To make it possible to automatically identify the type of semiconductor component to be stored or the directionality of a tray. SOLUTION: This tray 11 for semiconductor components storage is used for treatment such as heat treatment or transportation of semiconductor components in a stored condition. A mark to identify the type of the semiconductor components to be stored or the directionality of the tray 11 when stacking the tray 11 is added at a predetermined position on the side of the tray 11.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor component storage tray for storing semiconductor components such as IC and LSI.

[0002]

2. Description of the Related Art There are three types of storage forms (packaging forms) for storing semiconductor components. The first form is a form in which semiconductor components are arranged side by side in a matrix form in a matrix form and is called a tray system, and is mainly applied to semiconductor components (types such as QFP, QFJ) in which leads extend in four directions.
The second form is called a magazine method in which semiconductor parts are vertically and vertically stored in a stick shape, and the semiconductor parts (DIP, SOP, SOJ) having leads in two directions are mainly used.
And so on). The third form is a form in which semiconductor parts are attached in a line in the longitudinal direction of the tape and wound around a reel and housed, which is called a taping system, and is mainly applied to semiconductor parts such as capacitors.

In the tray system, the shape and size of the tray are standardized. The JEDEC specifications have been standardized internationally. In addition, each semiconductor component manufacturer in Japan has its own in-house standard in addition to the JEDEC specifications. Even if the types and dimensions of the semiconductor components to be stored are different from the JEDEC standard and the in-house standards of each semiconductor component manufacturer in Japan, the outer dimensions of the tray are unified within each semiconductor component manufacturer. When stacking trays, a plurality of trays can be stacked so that another tray fits on the tray. It goes without saying that the trays can be stacked even if the types and sizes of the semiconductor components to be stored are different.

[0004]

On the other hand, the conventional semiconductor component storage tray has the following problems. That is, when the trays having different types and sizes of the semiconductor components to be stored are stacked, it is not possible to know which tray applies to which semiconductor component in the state as it is. Further, although the tray is reused, the used tray often returns without being sorted by the type of semiconductor component to be stored. It is complicated to sort and sort the trays in such a state. Of course, it is general that each tray is provided with a symbol indicating the type at the edge of the tray and the like at the same time as the tray is molded. However, the symbols of many trays are manually read and classified one by one. Is a very complicated task. There is also a demand for easy tray inventory management. Furthermore, in an automatic mounting device that mounts semiconductor components on a printed wiring board,
Since the semiconductor components must have the same orientation, the trays must also have the same orientation when housing the semiconductor components. It is possible to recognize the directionality of the tray by the position of the symbols formed on the tray, but even in this case, it is extremely difficult to recognize the directionality of the tray by manually looking at the positions of the symbols on the many trays. It is a complicated task.

The present invention has been made to solve the above-mentioned problems relating to a tray for storing semiconductor components, and can automatically identify the type of semiconductor components to be stored and the direction of the tray. An object is to provide a tray for storing semiconductor components.

[0006]

Means for Solving the Problems A first invention of the present invention is:
Identify the type of semiconductor components to be stored in the semiconductor component storage tray that is used to carry out heat treatment, etc. in the state where the semiconductor components are stored or to be transported, and the direction of the tray when stacking the trays. A semiconductor component storage tray, characterized in that a mark for identifying the sex is added to a predetermined position on the side surface of the tray.

A second aspect of the invention is the semiconductor component storage tray according to the first aspect of the invention, wherein the mark can be identified by a color difference.

Furthermore, a third aspect of the present invention is the semiconductor component storage tray according to the first aspect, wherein the mark can be identified by an encoded identification symbol.

Furthermore, a fourth aspect of the present invention is the semiconductor component storage tray according to the first aspect of the present invention, wherein the mark can be identified by the position or number of notches.

The mark is required to have some properties such as heat resistance and solvent resistance. That is, first, since this tray may be subjected to heat treatment in the state where the semiconductor parts are housed, it is required to have heat resistance up to 200 ° C. Second, the tray is cleaned with solvent when it is reused. Normally, the tray material is synthetic resin such as polypropylene, polyphenylene ether, polyvinyl chloride, etc., in which conductive carbon is kneaded, so the cleaning solvent does not attack or adversely affect these materials. Things apply. Therefore, the mark must be resistant to the solvent. Third,
The marks must not be easily removed from the tray to avoid contaminating the semiconductor components it contains. 4th
The mark itself has no conductivity so that even if the mark is peeled from the tray and adheres to the semiconductor component, it does not cause a short circuit between the terminals of the semiconductor component and adversely affect the semiconductor component. thing. For these reasons, the mark may be formed by applying ink to the tray, or may be formed by attaching a label or the like to the tray. Also, as the encoded identification symbol, a bar code or OCR is used.
Characters etc. can be considered.

[0011]

As described above, according to the present invention, since the identification mark is added at a predetermined position on the side surface of the tray, it is possible to easily recognize the directionality of the tray by looking at the surface to which the mark is added. it can. In addition, by observing the color of the mark, it is possible to immediately determine the type of semiconductor component to be stored based on the color difference. Furthermore, the coded marks can be read by a reading device, and the trays can be classified according to the type of semiconductor components to be stored. Furthermore, read the position or number of notches with a reading device,
The trays can be classified according to the type of semiconductor parts to be stored.

[0012]

BEST MODE FOR CARRYING OUT THE INVENTION Next, an embodiment of the present invention will be described with reference to the drawings. 1, FIG. 2, FIG. 3 and FIG. 4 show an example of a tray for storing semiconductor parts according to the present invention.
Reference numerals 31 and 41 denote semiconductor component storage trays, and 12, 2
Reference numerals 2, 32 and 42 denote identification marks.

The semiconductor component storage trays 11 and 31 are trays for storing QFP type semiconductor components having 100 pins, and the semiconductor component storage trays 21 and 41 have 160 pins. It is a tray for storing a QFP type semiconductor component which is a book. Each of the trays 11, 21, 31, and 41 is made by injection-molding a resin in which conductive carbon is kneaded in polyphenylene ether.

The mark 12 is a label attached to one side (right side in this embodiment) of the tray 11, and a label made of yellow polybutylene terephthalate film is attached to the tray 11 via a heat resistant adhesive. .

The mark 22 is a label attached to one side surface (right side in this embodiment) of the tray 21, and a label made of red polybutylene terephthalate film is attached to the tray 21 via a heat resistant adhesive. .

In FIG. 3, a mark 32 is a notch formed on one side surface (front surface in this embodiment) of the tray 31. The shape and size of the notch are not particularly limited, but a radius of 0.
A semicircular shape of about 5 to 0.8 mm is preferable.

In FIG. 4, a mark 42 is a notch formed on one side surface (front surface in this embodiment) of the tray 41 and is an example in which two marks are formed.

Even when the tray 11 and the tray 21 are stacked, it is possible to easily judge which semiconductor component each tray is applied to by looking at the color difference between the label 12 and the label 22. It was Also, tray 1
Even when 1 and the tray 21 are mixed in a state where they are not sorted, the tray 11 and the tray 21 are classified in a short time without any trouble due to the color difference between the label 12 and the label 22,
I was able to sort. Furthermore, since both the label 12 and the label 22 are attached to the right side surfaces of the tray 11 and the tray 21, respectively, the directionality when the trays are stacked can be immediately recognized.

Similarly, even when the trays 31 and 41 are stacked, notches 32 and notches 32 are formed.
By looking at the difference of 42 (in this case, the number), it was possible to easily determine which semiconductor component each tray applies to. Further, even when the trays 31 and 41 are mixed without being separated,
Due to the difference in the number of the notches 32 and the notches 42, the tray 31 and the tray 41 can be sorted and sorted in a short time without any trouble. Furthermore, since the notch 32 and the notch 42 are notched on the front side surface of the tray 31 and the tray 41, respectively, it is possible to immediately recognize the directionality when the trays are stacked.

[0020]

As described above, according to the present invention, since the identification mark is added at a predetermined position on the side surface of the tray, even if the trays having different kinds and sizes of the semiconductor parts to be housed are stacked, the same mark remains. In this state, it is possible to instantly know which tray applies to which semiconductor component, thereby eliminating complicated work. Further, there is an effect that the operation of sorting and sorting the trays that are returned without being sorted according to the type of semiconductor components to be stored can be performed easily. In addition, tray inventory management becomes simple.

[Brief description of the drawings]

FIG. 1A is a plan view showing an embodiment of a semiconductor component storage tray of the present invention, and FIG. 1B is a right side view thereof.

FIG. 2A is a plan view showing another embodiment of the semiconductor component storage tray of the present invention, and FIG. 2B is a right side view thereof.

FIG. 3A is a plan view showing still another embodiment of the semiconductor component storage tray of the present invention, and FIG. 3B is a front view thereof.

FIG. 4A is a plan view showing still another embodiment of the semiconductor component storage tray of the present invention, and FIG. 4B is a front view thereof.

[Explanation of symbols]

 11 ... semiconductor component storage tray 12 ... label 21 ... semiconductor component storage tray 22 ... label 31 ... semiconductor component storage tray 32 ... notch 41 ... semiconductor component storage tray 42 ... Notches

Claims (4)

[Claims] 1. A semiconductor component storage tray used for carrying out a process such as heat treatment or transporting a semiconductor component in a stored state, for identifying the type of the semiconductor component to be stored and for stacking the trays. A tray for storing semiconductor parts, characterized in that a mark for identifying the directionality of the tray is added at a predetermined position on the side surface of the tray. 2. The tray for storing semiconductor parts according to claim 1, wherein the marks can be identified by different colors. 3. The tray for storing a semiconductor component according to claim 1, wherein the mark can be identified by an encoded identification code. 4. The tray for storing semiconductor parts according to claim 1, wherein the mark can be identified by the position or number of notches.