JPH09214078A - Printed board - Google Patents

Printed board

Info

Publication number
JPH09214078A
JPH09214078A JP2077496A JP2077496A JPH09214078A JP H09214078 A JPH09214078 A JP H09214078A JP 2077496 A JP2077496 A JP 2077496A JP 2077496 A JP2077496 A JP 2077496A JP H09214078 A JPH09214078 A JP H09214078A
Authority
JP
Japan
Prior art keywords
component
components
printed
forms
main body
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2077496A
Other languages
Japanese (ja)
Inventor
Kenichi Yamanochi
憲一 山ノ内
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Unisia Automotive Ltd
Original Assignee
Unisia Jecs Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Unisia Jecs Corp filed Critical Unisia Jecs Corp
Priority to JP2077496A priority Critical patent/JPH09214078A/en
Publication of JPH09214078A publication Critical patent/JPH09214078A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0266Marks, test patterns or identification means
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/303Surface mounted components, e.g. affixing before soldering, aligning means, spacing means

Abstract

PROBLEM TO BE SOLVED: To easily and precisely identify a corresponding component from identification code by printing the identification codes on a board main body in forms adjusted to the forms of the components to be mounted. SOLUTION: A prescribed electric circuit is printed on the board main body 11 and a plurality of components 12 are mounted on the prescribed positions of the electric circuit by soldering. The identification codes 13 corresponding to the components to be mounted are printed on the side of the components mounting positions of the board main body 11 with silk printing and the like. The identification codes 13 signify the corresponding components by combining plural alphabets and numbers. A series of character groups are printed in sizes and forms, which are adjusted to the sizes and the forms of the corresponding components 12. When a defective article exists, the components 12 can easily and precisely be recognized by comparing the size and the form of the recognition code 13 and those of the component 12 in addition to the collation of the mark itself of the mark 13 of the code with the component 12 for recognizing whether the component 12 is correct or not.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【発明の属する技術分野】本発明は、複数個の部品がは
んだ付け等によって実装されるプリント基板に関し、と
りわけ、部品実装位置を認識するための識別記号が印刷
されたプリント基板に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a printed circuit board on which a plurality of components are mounted by soldering or the like, and more particularly to a printed circuit board on which an identification mark for recognizing a component mounting position is printed.

【0002】[0002]

【従来の技術】この種のプリント基板として、従来、図
2に示されるようなものが実使用に供されている。
2. Description of the Related Art As a printed circuit board of this type, a printed circuit board as shown in FIG. 2 has been conventionally put into practical use.

【0003】このプリント基板は、基板本体1の実際の
部品実装位置に近接する位置に、部品2に対応する識別
記号3が印刷され、部品交換等の際に、この識別記号3
をもとにして作業者が部品2を正しく実装できるように
なっている。尚、基板本体1に印刷する識別記号3は、
複数の文字或いは記号の組み合わせによって構成されて
いる。
On this printed circuit board, an identification symbol 3 corresponding to the component 2 is printed at a position close to the actual component mounting position on the substrate body 1, and when the component is replaced, etc.
Based on the above, the worker can correctly mount the component 2. The identification symbol 3 printed on the substrate body 1 is
It is composed of a combination of a plurality of characters or symbols.

【0004】この技術は、例えば、CQ出版社発行「ト
ランジスタ技術」1995年9月号211頁写真9−2
等に示されている。
This technology is disclosed, for example, in "Transistor Technology", CQ Publishing Co., September 1995, page 211, Photo 9-2.
Etc.

【0005】[0005]

【発明が解決しようとする課題】しかしながら、上記従
来のプリント基板においては、基板本体に印刷する識別
記号が、構成文字や構成記号の順序や組み合わせを変え
ただけのものであるため、部品交換の際、例えば、検査
工程において、はんだ不良や部品の故障等を発見し、そ
の部品を作業者が取り去って新たな部品と交換する際
(特に、複数個の部品を同時に交換する際)には、印刷
された識別記号から即時に対応する部品を見つけだすこ
とが難しく、部品の交換に多くの時間を要してしまう。
However, in the above-mentioned conventional printed circuit board, since the identification symbols printed on the substrate body are only the constituent characters and the order or combination of the constituent symbols changed, the replacement of parts is not possible. At this time, for example, when a solder defect or a component failure is found in the inspection process, and the worker removes the component and replaces it with a new component (particularly, when replacing a plurality of components at the same time), It is difficult to immediately find the corresponding component from the printed identification symbol, and it takes a lot of time to replace the component.

【0006】そこで本発明は、基板本体に印刷された識
別記号から対応する部品を容易に、かつ、正確に認識で
きるようにして、部品の実装作業能率を高めることので
きるプリント基板を提供しようとするものである。
Therefore, the present invention intends to provide a printed circuit board capable of easily and accurately recognizing the corresponding component from the identification mark printed on the substrate main body and improving the mounting work efficiency of the component. To do.

【0007】[0007]

【課題を解決するための手段】上述した課題を解決する
ための手段として、請求項1の発明は、基板本体に複数
個の部品が実装されると共に、これらの部品の実装位置
に対応して部品の識別記号が印刷されて成るプリント基
板において、前記識別記号を、実装される部品の形状に
合わせた形状で基板本体に印刷するようにした。識別記
号の形状が実装される部品の形状と合っているため、識
別記号の形状からも作業者が実装部品を認識することが
できる。
As means for solving the above-mentioned problems, the invention of claim 1 is such that a plurality of components are mounted on a substrate main body, and the mounting positions of these components are associated with each other. In the printed board on which the identification mark of the component is printed, the identification mark is printed on the substrate body in a shape matching the shape of the component to be mounted. Since the shape of the identification symbol matches the shape of the component to be mounted, the operator can recognize the mounted component also from the shape of the identification symbol.

【0008】また、請求項2の発明は、基板本体に複数
個の部品が実装されると共に、これらの部品の実装位置
に対応して部品の識別記号が印刷されて成るプリント基
板において、前記識別記号を、実装される部品の大きさ
に合わせた大きさで基板本体に印刷するようにした。識
別記号の大きさが実装される部品の大きさと合っている
ため、識別記号の大きさからも作業者が実装部品を認識
することができる。
According to a second aspect of the present invention, a plurality of components are mounted on the substrate main body, and identification symbols of the components are printed corresponding to the mounting positions of these components. The symbols are printed on the board body in a size that matches the size of the components to be mounted. Since the size of the identification symbol matches the size of the component to be mounted, the operator can recognize the mounted component also from the size of the identification symbol.

【0009】[0009]

【発明の実施の形態】次に、本発明の一つの実施の形態
を図1に基づいて説明する。
BEST MODE FOR CARRYING OUT THE INVENTION Next, one embodiment of the present invention will be described with reference to FIG.

【0010】図1は、本発明にかかるプリント基板の平
面図を示すもので、このプリント基板の基板本体11に
は所定の電気回路(図示せず。)が印刷され、その電気
回路の所定位置に複数個の部品12がはんだ付けによっ
て実装されている。また、基板本体11の部品実装位置
の側方には、実装する部品に対応する識別記号13がシ
ルク印刷等によって印刷されている。
FIG. 1 is a plan view of a printed circuit board according to the present invention, in which a predetermined electric circuit (not shown) is printed on a substrate body 11 of the printed circuit board, and a predetermined position of the electric circuit. A plurality of components 12 are mounted on the substrate by soldering. Further, on the side of the component mounting position of the board body 11, an identification symbol 13 corresponding to the component to be mounted is printed by silk printing or the like.

【0011】ここで、前記識別記号13は、複数個のア
ルファベットと数字を組み合わせて対応する部品を意味
させるようになっているが、この一連の文字群は、さら
に対応する部品12の大きさと形状に合わせた大きさ及
び形状で印刷されている。
Here, the identification symbol 13 is designed to mean a corresponding component by combining a plurality of alphabets and numbers, and this series of character groups further includes the size and shape of the corresponding component 12. It is printed in a size and shape that suits.

【0012】前記部品12は基本的に自動実装装置によ
って基板本体11に実装されるが、この実装後の検査工
程において、はんだ不良や部品の故障等を発見した場合
には、不良のある部品が作業者の手作業で別の部品12
と取り替えられる。
The component 12 is basically mounted on the substrate main body 11 by an automatic mounting apparatus. However, if a solder defect or a component failure is found in the inspection process after the mounting, the defective component is detected. Separate parts 12 manually by the operator
Is replaced by

【0013】このとき、作業者は基板本体11に印刷さ
れている識別記号13を頼りに新たな部品12を探し、
その部品12を基板本体11の所定の位置にはんだ付け
するのであるが、新たな部品12を探すにあたり、識別
記号13の(文字群の)形状及び大きさをもとに大まか
な部品の分類を判断することができるため、新たな部品
12を迅速に見つけだすことができる。また、部品12
が正しいものであるかを確認するにあたっても、識別記
号13の記号自体と部品12を照らし合わせることに加
えて、識別記号13と部品12の形状及び大きさを比較
することができるため、部品12を誤りなく正確に選択
することができる。
At this time, the operator looks for the new component 12 by relying on the identification symbol 13 printed on the substrate body 11,
The component 12 is soldered to a predetermined position on the substrate body 11. When searching for a new component 12, the components are roughly classified based on the shape and size of the identification symbol 13 (of the character group). Since the judgment can be made, a new part 12 can be found quickly. Also, the part 12
In order to confirm that the identification number 13 is correct, the shape and size of the identification symbol 13 and the component 12 can be compared with each other in addition to the comparison between the symbol itself of the identification symbol 13 and the component 12. Can be accurately selected without error.

【0014】したがって、このプリント基板によれば、
部品交換等に要する時間を短縮することができ、生産能
率が大幅に向上する。
Therefore, according to this printed circuit board,
The time required for parts replacement, etc. can be shortened and the production efficiency is greatly improved.

【0015】[0015]

【発明の効果】以上のように請求項1の発明は、基板本
体に実装する部品を識別するための識別記号を、実装さ
れる部品の形状に合わせた形状で基板本体に印刷するよ
うにしたため、識別記号から作業者が対応する部品を容
易に、かつ、正確に認識することができ、その結果、部
品交換等に要する時間を短縮して、生産能率を大幅に向
上させることができる。
As described above, according to the invention of claim 1, the identification symbol for identifying the component to be mounted on the substrate body is printed on the substrate body in a shape that matches the shape of the component to be mounted. The operator can easily and accurately recognize the corresponding component from the identification symbol, and as a result, the time required for component replacement and the like can be shortened and the production efficiency can be greatly improved.

【0016】請求項2の発明は、識別記号を、実装され
る部品の大きさに合わせた大きさで基板本体に印刷する
ようにしたため、同様に識別記号から作業者が対応する
部品を容易に、かつ、正確に認識することができる。
According to the second aspect of the present invention, the identification mark is printed on the substrate body in a size corresponding to the size of the component to be mounted. Similarly, the operator can easily identify the corresponding component from the identification mark. , And can be accurately recognized.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明の一つの実施の形態を示す平面図。FIG. 1 is a plan view showing an embodiment of the present invention.

【図2】従来の技術を示す平面図。FIG. 2 is a plan view showing a conventional technique.

【符号の説明】[Explanation of symbols]

11…基板本体、 12…部品、 13…識別記号。 11 ... Board body, 12 ... Component, 13 ... Identification symbol.

Claims (2)

【特許請求の範囲】[Claims] 【請求項1】 基板本体に複数個の部品が実装されると
共に、これらの部品の実装位置に対応して部品の識別記
号が印刷されて成るプリント基板において、前記識別記
号を、実装される部品の形状に合わせた形状で基板本体
に印刷したことを特徴とするプリント基板。
1. A printed circuit board in which a plurality of components are mounted on a substrate body and identification symbols of the components are printed corresponding to mounting positions of these components, and the components on which the identification symbols are mounted are mounted. A printed circuit board characterized by being printed on the substrate body in a shape matching the shape of.
【請求項2】 基板本体に複数個の部品が実装されると
共に、これらの部品の実装位置に対応して部品の識別記
号が印刷されて成るプリント基板において、前記識別記
号を、実装される部品の大きさに合わせた大きさで基板
本体に印刷したことを特徴とするプリント基板。
2. A printed circuit board comprising a board main body on which a plurality of parts are mounted and identification marks of the parts are printed corresponding to the mounting positions of these parts. A printed circuit board characterized by being printed on the substrate body in a size according to the size of.
JP2077496A 1996-02-07 1996-02-07 Printed board Pending JPH09214078A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2077496A JPH09214078A (en) 1996-02-07 1996-02-07 Printed board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2077496A JPH09214078A (en) 1996-02-07 1996-02-07 Printed board

Publications (1)

Publication Number Publication Date
JPH09214078A true JPH09214078A (en) 1997-08-15

Family

ID=12036513

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2077496A Pending JPH09214078A (en) 1996-02-07 1996-02-07 Printed board

Country Status (1)

Country Link
JP (1) JPH09214078A (en)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011071413A (en) * 2009-09-28 2011-04-07 Mitsubishi Electric Corp Printed board and air conditioner
CN102946694A (en) * 2012-11-05 2013-02-27 成都九洲迪飞科技有限责任公司 Surface mounting technology for components of integrated electronic modules
JP2015204970A (en) * 2014-04-18 2015-11-19 株式会社藤商事 Game machine
JP2015204962A (en) * 2014-04-18 2015-11-19 株式会社藤商事 Game machine
JP2015204965A (en) * 2014-04-18 2015-11-19 株式会社藤商事 Game machine
JP2018102989A (en) * 2018-04-02 2018-07-05 株式会社藤商事 Game machine
JP2019205498A (en) * 2018-05-28 2019-12-05 株式会社三共 Game machine
JP2021087855A (en) * 2021-03-05 2021-06-10 株式会社三共 Game machine
JP2022027962A (en) * 2018-11-29 2022-02-14 株式会社三共 Game machine

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011071413A (en) * 2009-09-28 2011-04-07 Mitsubishi Electric Corp Printed board and air conditioner
CN102946694A (en) * 2012-11-05 2013-02-27 成都九洲迪飞科技有限责任公司 Surface mounting technology for components of integrated electronic modules
JP2015204970A (en) * 2014-04-18 2015-11-19 株式会社藤商事 Game machine
JP2015204962A (en) * 2014-04-18 2015-11-19 株式会社藤商事 Game machine
JP2015204965A (en) * 2014-04-18 2015-11-19 株式会社藤商事 Game machine
JP2018102989A (en) * 2018-04-02 2018-07-05 株式会社藤商事 Game machine
JP2019205498A (en) * 2018-05-28 2019-12-05 株式会社三共 Game machine
JP2022027962A (en) * 2018-11-29 2022-02-14 株式会社三共 Game machine
JP2021087855A (en) * 2021-03-05 2021-06-10 株式会社三共 Game machine

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