JPH0766595A - Correction method of mounting failure of electronic component - Google Patents

Correction method of mounting failure of electronic component

Info

Publication number
JPH0766595A
JPH0766595A JP5216184A JP21618493A JPH0766595A JP H0766595 A JPH0766595 A JP H0766595A JP 5216184 A JP5216184 A JP 5216184A JP 21618493 A JP21618493 A JP 21618493A JP H0766595 A JPH0766595 A JP H0766595A
Authority
JP
Japan
Prior art keywords
component
mounting
pallet
angle
electronic component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP5216184A
Other languages
Japanese (ja)
Other versions
JP3442109B2 (en
Inventor
Yoshihiko Oda
義彦 小田
Hiroshi Obara
啓史 小原
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP21618493A priority Critical patent/JP3442109B2/en
Publication of JPH0766595A publication Critical patent/JPH0766595A/en
Application granted granted Critical
Publication of JP3442109B2 publication Critical patent/JP3442109B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Landscapes

  • Supply And Installment Of Electrical Components (AREA)
  • Control Of Position Or Direction (AREA)
  • Numerical Control (AREA)

Abstract

PURPOSE:To eliminate a failure of a fixing method of a component installation container and a component arrangement direction in a supply device of a component by making a correction during attraction or mounting by detecting an angle of a component installation container (pallet) of a supply device of a component of an electronic component mounting device and an angle of a component. CONSTITUTION:Four corners of a pallet 1 are searched by moving a tray 2 in directions of arrows (c), (d) and a supply head 3 attached with a sensor 10 in directions of arrows (a), (b). A crack of the pallet 1 is located, information is sent to a controller 11, a value thereof is subtracted from attraction or mounting angle of a part and correction is performed by rotation during attraction or mounting by a main head 12.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は電子部品実装機における
パレットの設置方向や部品の吸着また装着時のミス角度
分またはミス回転分を判別し、そのミス装着を正常に補
正を行う方法に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for correctly correcting the mismounting by determining the installation direction of a pallet in an electronic component mounting machine, the misangled amount or the misrotated amount at the time of sucking or mounting the components.

【0002】[0002]

【従来の技術】以下に、従来の電子部品実装機における
部品方向の判別と部品供給機構について説明する。
2. Description of the Related Art Below, a description will be given of a component direction determination and a component supply mechanism in a conventional electronic component mounter.

【0003】図6は部品設置容器(以下、パレットとい
う)の構成を示す平面略図を示し、パレット1は部品ご
とに様々な設置数,形状のものがあり、これに部品(図
略)をのせて供給装置(図略)に設置する。このパレット
1の角部には正しい設置方向を示すマークの切りかけ1
aを有する。
FIG. 6 is a schematic plan view showing the structure of a parts installation container (hereinafter referred to as a pallet). The pallet 1 has various installation numbers and shapes for each part, and parts (not shown) are placed on it. Installed in the feeding device (not shown). At the corner of this pallet 1, a mark 1 indicating the correct installation direction
have a.

【0004】図7は電子部品実装機の部品供給機構の平
面略図を示し、パレット1はトレー2に固定され、トレ
ー2が矢印c方向へ引き出される。そこで部品は供給ヘ
ッド3のノズル(図略)に吸着され、矢印b方向へ運ばれ
搬出装置4に置かれる。この搬出装置4が矢印a方向へ
移動し、そこで電子部品実装機(図略)の本体ヘッドのノ
ズルに吸着され、装着される。
FIG. 7 is a schematic plan view of the component supply mechanism of the electronic component mounter, in which the pallet 1 is fixed to the tray 2 and the tray 2 is pulled out in the direction of arrow c. There, the component is adsorbed by the nozzle (not shown) of the supply head 3, conveyed in the direction of arrow b, and placed on the unloading device 4. The carry-out device 4 moves in the direction of the arrow a, and is picked up by the nozzle of the main body head of the electronic component mounting machine (not shown) and mounted.

【0005】図8は電子部品の例してのQFPの平面略
図を示し、5aは切りかけ、6はパッケージ、7はリー
ド、8はパッケージ6上に画かれた文字、9はパッケー
ジ6上に画かれたマーク9である。このQFPの部品方
向は、一般的に認識カメラでQFP5の切りかけ5aを
見て部品の方向を判別している。また、パッケージ6の
上方か下方に模様(マーク9)があることで方向を判別し
ているものもある。
FIG. 8 is a schematic plan view of a QFP as an example of an electronic component. 5a is a cut, 6 is a package, 7 is a lead, 8 is a letter drawn on the package 6, and 9 is a letter drawn on the package 6. It is the mark 9 that is drawn. The orientation of the component of this QFP is generally determined by looking at the cut 5a of the QFP 5 with a recognition camera. In some cases, the direction is determined by a pattern (mark 9) above or below the package 6.

【0006】[0006]

【発明が解決しようとする課題】しかしながら、オペレ
ータが供給装置に部品を供給する際に、パレットに部品
を並べる方向やパレットの設置方向を間違えることがあ
る。その場合、間違った方向で部品が装着されてしまう
問題が発生する。また、図8に示すように部品(QFP)
の切りかけ5aでその方向を判別する方法は、部品のバ
リのため精度が低い。また、パッケージ6の模様(マー
ク9)の上下で判別する方法は、マーク9や文字8の位
置が部品によって異なるため、対応しきれない。
However, when the operator supplies the parts to the supply device, the operator may make a mistake in the direction in which the parts are arranged on the pallet or the pallet installation direction. In that case, there arises a problem that components are mounted in the wrong direction. Also, as shown in FIG. 8, parts (QFP)
The method of discriminating the direction by the notch 5a is low in accuracy because of burrs of parts. Further, the method of discriminating between the upper and lower sides of the pattern (mark 9) of the package 6 cannot be supported because the positions of the mark 9 and the character 8 are different depending on the parts.

【0007】本発明は上記従来の問題を解決するもの
で、部品の供給装置におけるパレットの設置方向や部品
並べ方向のミスを、吸着または装着の際に補正をかける
ことでなくすことを目的とする。
The present invention solves the above-mentioned conventional problems, and an object of the present invention is to eliminate mistakes in the pallet installation direction and component arrangement direction in a component supply device by correcting the component during suction or mounting. .

【0008】[0008]

【課題を解決するための手段】本発明は上記課題を解決
するため、第1の手段は、部品設置容器(パレット)の設
置方向をセンサにより判別し、前記センサからの設置方
向の情報を基に部品の吸着または装着時のミス角度分だ
け補正を行うことを特徴とする。
In order to solve the above problems, the first means of the present invention is to determine the installation direction of a parts installation container (pallet) with a sensor, and to use the information of the installation direction from the sensor. The feature is that the correction is performed only for the mis-angle when the component is picked up or mounted.

【0009】第2の手段は、カメラにより部品のマーク
や文字等を認識することによって、マークや文字等の方
向を判別し、前記カメラからのマークや文字等の方向の
情報を基に部品の吸着または装着時のミス回転分だけ補
正を行うことを特徴とする。
The second means is to recognize the mark, character, etc. of the part by the camera, determine the direction of the mark, character, etc., and to identify the part based on the information on the direction of the mark, character, etc. from the camera. The feature is that correction is performed only for the misrotation at the time of adsorption or mounting.

【0010】[0010]

【作用】本発明によれば、(1) 図6に示すパレット1の
切りかけ1aの位置をセンサで判別することにより、図
1に示すように本来の位置(a)より(b),(c),(d)に示す
ように何度ずれているか判別できる。
According to the present invention, (1) the position of the cutting edge 1a of the pallet 1 shown in FIG. 6 is discriminated by the sensor so that (b) and (c) are changed from the original position (a) as shown in FIG. ), As shown in (d), it is possible to determine how many deviations there are.

【0011】(2) 図2に示すように部品のマーク9の位
置が部品のパッケージ6を4分割したどの位置(a)ない
し(d)にあるかをカメラで認識し、予め部品ごとにどの
位置にマークがあるかを入力し、データを比較すること
で角度が判別される。
(2) As shown in FIG. 2, the camera recognizes which position (a) to (d) where the mark 9 of the component is divided into four, and which package 6 of the component is divided. The angle is determined by inputting whether there is a mark at the position and comparing the data.

【0012】(3) 図3のように部品のパッケージ6の文
字(A)8の方向を判別することで、角度が判別される。
(3) The angle is determined by determining the direction of the letter (A) 8 of the package 6 of the component as shown in FIG.

【0013】上記(1)〜(3)の方法で角度もしくは回転分
のずれが判別されれば、実際の吸着または装着角度から
その角度だけ引けば正しく部品が装着される。
If the deviation of the angle or the rotation amount is discriminated by the above methods (1) to (3), the component is correctly mounted by subtracting the angle from the actual suction or mounting angle.

【0014】[0014]

【実施例】図4は本発明方法を実施するパレットの切り
かけの位置を検出する部品供給装置の平面略図である。
図4において、トレー2が矢印c,d方向へ移動し、セ
ンサ10を取り付けた供給ヘッド3が矢印a,b方向へ移
動することで、パレット1の四隅(図1参照)を検索し、
切りかけ1aの位置が判別される。その情報をコントロ
ーラ11に送り、このコントローラ11内でその値を部品の
吸着もしくは装着角度から引いて、本体ヘッド12で吸着
または装着時に回転させ補正する。
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS FIG. 4 is a schematic plan view of a component supply device for detecting the position of the pallet for carrying out the method of the present invention.
In FIG. 4, the tray 2 moves in the directions of arrows c and d, and the supply head 3 attached with the sensor 10 moves in the directions of arrows a and b, thereby searching the four corners of the pallet 1 (see FIG. 1).
The position of the slit 1a is determined. The information is sent to the controller 11, the value is subtracted from the suction or mounting angle of the component in the controller 11, and the main body head 12 is rotated at the time of suction or mounting to correct the value.

【0015】図5は本発明方法を実施する部品の角度を
マーク9もしくは文字8で検出する機構の平面略図であ
る。図5において、実装機の本体ヘッド12の基板を認識
するカメラ13は認識処理装置14に接続されている。前記
図4のような搬出装置4により供給される部品を本体ヘ
ッド12が吸着するときに、基板認識カメラ13で部品を撮
像する。そのデータを認識処理装置14で処理し、図2,
図3に示すそのマーク9や文字8より部品の角度のずれ
を検出し、その値を部品の吸着もしくは装着角度から引
いた角度をチャック15で回転させ補正する。
FIG. 5 is a schematic plan view of the mechanism for detecting the angle of the component for carrying out the method of the present invention by the mark 9 or the character 8. In FIG. 5, a camera 13 that recognizes the substrate of the main body head 12 of the mounting machine is connected to a recognition processing device 14. When the main body head 12 sucks the component supplied by the unloading device 4 as shown in FIG. 4, the substrate recognition camera 13 images the component. The data is processed by the recognition processing device 14,
The deviation of the angle of the component is detected from the mark 9 or the character 8 shown in FIG. 3, and the value obtained by subtracting the value from the component suction or mounting angle is rotated by the chuck 15 and corrected.

【0016】[0016]

【発明の効果】以上説明したように本発明方法は、電子
部品実装機における部品の供給装置の部品設置容器(パ
レット)の固定方法や部品並べ方向をミスしても、吸着
または装着の際に補正をかけることが可能となる。その
ことにより良品生産実装が実現される。
As described above, according to the method of the present invention, even if the method of fixing the component installation container (pallet) of the component supply device in the electronic component mounting machine or the component arrangement direction is mistaken, the method of adsorption or mounting It is possible to make corrections. As a result, non-defective product production mounting is realized.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明の作用を説明する部品設置容器(パレッ
ト)の平面略図である。
FIG. 1 is a schematic plan view of a parts installation container (pallet) for explaining the operation of the present invention.

【図2】本発明の作用を説明する部品の角度をマークで
検出する場合の平面略図である。
FIG. 2 is a schematic plan view in the case of detecting an angle of a component with a mark for explaining the operation of the present invention.

【図3】本発明の作用を説明する部品の角度を文字で検
出する場合の平面略図である。
FIG. 3 is a schematic plan view in the case of detecting an angle of a part by a character, which explains an operation of the present invention.

【図4】本発明方法を実施するパレットの切りかけの位
置を検出する部品供給装置の平面略図である。
FIG. 4 is a schematic plan view of a component supply device for detecting the position where the pallet is being cut for carrying out the method of the present invention.

【図5】本発明方法を実施する部品の角度をマークまた
は文字で検出する機構の平面略図である。
FIG. 5 is a schematic plan view of a mechanism for detecting the angle of a component for carrying out the method of the present invention with a mark or a character.

【図6】電子部品実装機における部品設置容器(パレッ
ト)の構成を示す平面略図である。
FIG. 6 is a schematic plan view showing the configuration of a component installation container (pallet) in the electronic component mounter.

【図7】電子部品実装機における部品供給装置の平面略
図である。
FIG. 7 is a schematic plan view of a component supply device in an electronic component mounter.

【図8】電子部品の例としてのQFPの平面略図であ
る。
FIG. 8 is a schematic plan view of a QFP as an example of an electronic component.

【符号の説明】[Explanation of symbols]

1…部品設置容器(パレット)、 1a,5a…切りかけ、
2…トレー、 3…供給ヘッド、 4…搬出装置、
5…QFP、 6…パッケージ、 7…リード、8…文
字、 9…マーク、 10…センサ、 11…コントロー
ラ、 12…本体ヘッド、 13…基板認識カメラ、 14…
認識処理装置、 15…チャック。
1 ... Parts setting container (pallet), 1a, 5a ...
2 ... Tray, 3 ... Supply head, 4 ... Unloading device,
5 ... QFP, 6 ... Package, 7 ... Lead, 8 ... Character, 9 ... Mark, 10 ... Sensor, 11 ... Controller, 12 ... Main body head, 13 ... Board recognition camera, 14 ...
Recognition processing device, 15 ... Chuck.

Claims (2)

【特許請求の範囲】[Claims] 【請求項1】 部品設置容器の設置方向をセンサにより
判別し、前記センサからの設置方向の情報を基に部品の
吸着または装着時のミス角度分だけ補正を行うことを特
徴とする電子部品の装着ミス補正方法。
1. An electronic component, characterized in that the installation direction of a component installation container is determined by a sensor, and the component is adsorbed or corrected by an error angle when mounting based on the information on the installation direction from the sensor. Mounting error correction method.
【請求項2】 カメラにより部品のマークや文字等を認
識することによって、マークや文字等の方向を判別し、
前記カメラからのマークや文字等の方向の情報を基に部
品の吸着または装着時のミス回転分だけ補正を行うこと
を特徴とする電子部品の装着ミス補正方法。
2. The direction of a mark or a character is discriminated by recognizing a mark or a character of a component by a camera,
A method for correcting a mounting error of an electronic component, which corrects only a misrotation at the time of sucking or mounting a component based on information on directions of marks and characters from the camera.
JP21618493A 1993-08-31 1993-08-31 Electronic component mounting error correction method and component mounting device Expired - Fee Related JP3442109B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP21618493A JP3442109B2 (en) 1993-08-31 1993-08-31 Electronic component mounting error correction method and component mounting device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP21618493A JP3442109B2 (en) 1993-08-31 1993-08-31 Electronic component mounting error correction method and component mounting device

Publications (2)

Publication Number Publication Date
JPH0766595A true JPH0766595A (en) 1995-03-10
JP3442109B2 JP3442109B2 (en) 2003-09-02

Family

ID=16684611

Family Applications (1)

Application Number Title Priority Date Filing Date
JP21618493A Expired - Fee Related JP3442109B2 (en) 1993-08-31 1993-08-31 Electronic component mounting error correction method and component mounting device

Country Status (1)

Country Link
JP (1) JP3442109B2 (en)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10256793A (en) * 1997-03-10 1998-09-25 Matsushita Electric Ind Co Ltd Electronic component mounting method and apparatus
JPH10284878A (en) * 1997-04-09 1998-10-23 Fukuoka Toshiba Electron Kk Carrier for semiconductor component and manufacture of semiconductor device using the carrier
JPH10284899A (en) * 1997-04-01 1998-10-23 Matsushita Electric Ind Co Ltd Method for recognizing electronic component
JP2007507097A (en) * 2003-09-25 2007-03-22 テレント ゲーエムベーハー Manufacturing method of high-frequency assembly
JP2007311472A (en) * 2006-05-17 2007-11-29 Juki Corp Image acquisition method for component-recognition-data preparation, and component mounting machine
JP2010118747A (en) * 2008-11-11 2010-05-27 Daishinku Corp Apparatus and method for manufacturing piezoelectric vibration device
JP2013080747A (en) * 2011-09-30 2013-05-02 Hitachi High-Tech Instruments Co Ltd Determination method of setting direction of tray, and electronic component attaching device
JP2018081999A (en) * 2016-11-15 2018-05-24 株式会社Fuji Recognition device
JP2021145151A (en) * 2017-03-09 2021-09-24 株式会社Fuji Set direction error angle teaching method for supply component

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10256793A (en) * 1997-03-10 1998-09-25 Matsushita Electric Ind Co Ltd Electronic component mounting method and apparatus
JPH10284899A (en) * 1997-04-01 1998-10-23 Matsushita Electric Ind Co Ltd Method for recognizing electronic component
JPH10284878A (en) * 1997-04-09 1998-10-23 Fukuoka Toshiba Electron Kk Carrier for semiconductor component and manufacture of semiconductor device using the carrier
JP2007507097A (en) * 2003-09-25 2007-03-22 テレント ゲーエムベーハー Manufacturing method of high-frequency assembly
US8014890B2 (en) 2003-09-25 2011-09-06 Ericsson Ab Method for manufacturing a high-frequency assembly
JP2007311472A (en) * 2006-05-17 2007-11-29 Juki Corp Image acquisition method for component-recognition-data preparation, and component mounting machine
JP4707607B2 (en) * 2006-05-17 2011-06-22 Juki株式会社 Image acquisition method for component recognition data creation and component mounter
JP2010118747A (en) * 2008-11-11 2010-05-27 Daishinku Corp Apparatus and method for manufacturing piezoelectric vibration device
JP2013080747A (en) * 2011-09-30 2013-05-02 Hitachi High-Tech Instruments Co Ltd Determination method of setting direction of tray, and electronic component attaching device
JP2018081999A (en) * 2016-11-15 2018-05-24 株式会社Fuji Recognition device
JP2021145151A (en) * 2017-03-09 2021-09-24 株式会社Fuji Set direction error angle teaching method for supply component

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