JP2002118396A - Apparatus and method for mounting electronic component - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an apparatus and a method for mounting an electronic component without fault of mounting even in a narrow pitch mounting of an infinitesimal component. SOLUTION: The method for mounting the electronic component comprises the steps of picking up the component P by suction nozzles 6 of a plurality of transfer heads provided in a rotary head, and mounting the component P on a board. The method further comprises the steps of detecting and storing nozzle positional deviations Δx and Δy of each nozzle 6 by a component recognition camera, and aligning an origin O of an optical coordinates to a nozzle position of the nozzle 6 based on the stored deviations Δx and Δy when the component P held by the nozzle 6 is recognized. Thus, the positional deviation of the component P to the nozzle 6 is surely detected, a learning value of the attracting position correcting amount when the component is picked up is correctly calculated, and hence the positional deviation of the component P to the nozzle 6 at the attracting time can be prevented.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component mounting apparatus and an electronic component mounting method for mounting an electronic component on a substrate.

[0002]

2. Description of the Related Art As a type of electronic component mounting apparatus, there has been known a rotary mounting apparatus in which a large number of transfer heads having a plurality of suction nozzles mounted thereon are index-rotated and mounted continuously. This rotary type has an advantage that it has a large number of transfer heads and can perform high-speed mounting because mounting is performed sequentially. In this rotary mounting apparatus, a component recognition station is provided while the transfer head that picks up the electronic component at the pickup position rotates and moves to the mounting position, and a suction nozzle holding the electronic component is provided here. Recognition detects the displacement of the electronic component. Then, based on the result of the detection of the positional deviation, a process of correcting a position at the time of mounting and a process of obtaining a correction amount of a suction position when picking up an electronic component as a learning value is performed. The suction position correction based on the learning value is performed by determining the tendency of the position shift from the position shift detection result in the pickup state obtained for a large number of electronic components, and determining an appropriate position correction amount as the learning value. This is to minimize the displacement during suction.

[0003]

By the way, as electronic components become smaller in size and mounting density increases, mounting position accuracy becomes higher and mounting operation control takes into account interference with adjacent components during mounting operation. Is required. For example, when a component having a size of about 0.6 mm has already been put into practical use and many such small components are to be mounted at a narrow pitch, the electronic components must be correctly aligned with the mounting position, and the potential components must be adjusted. The suction position of the electronic component by the suction nozzle must be controlled with high precision so that the suction nozzle holding the nozzle does not protrude from the electronic component.

However, the rotary mounting apparatus has a structure in which a large number of transfer heads sequentially move to perform a suction operation or a mounting operation, and the relative positions of the suction nozzles provided in these transfer heads with respect to the mechanical origin are fixed. It varies. Due to this variation, the following problems occur in the conventional electronic component mounting apparatus. This will be described below with reference to the drawings. FIG. 5 is an explanatory diagram of a conventional electronic component mounting method.

FIG. 5A is an image diagram of the suction nozzle taken from below by a camera for component recognition. The intersection O of the crosshairs indicates the origin of the optical coordinate system. N in image diagram
Indicates a suction nozzle recognized by the recognition camera, and the center position of the suction nozzle N is located at a position deviated from the origin O. As described above, the position of each suction nozzle with respect to the origin O of the optical coordinates of the camera varies from one transfer head to another and does not always coincide with the origin O due to the variation in the position of each transfer head. Therefore, conventionally, an average nozzle position is obtained by recognizing the suction nozzles of a large number of transfer heads, and the imaging position is set so that the origin of the optical coordinates is aligned with the average nozzle position.

When recognizing the picked-up electronic component, the position of the electronic component with respect to the origin O of the optical coordinates is detected irrespective of the nozzle position of the suction nozzle.
At this time, even if the electronic component P is held in a state of being displaced from the center of the suction nozzle N as shown in FIG. 5B, the electronic component is displaced with respect to the origin O of the optical coordinate system. If not, it is determined that there is no component displacement. As a result, the learning function for correcting the suction position does not work.

That is, even if a large number of electronic components are picked up while the suction nozzle N and the electronic component P tend to be displaced in this manner, the suction position correction is not performed, and the mounting operation of the electronic components remains in the displaced state. Had been done. Then, when the electronic component is mounted at a position adjacent to the already mounted component in this misaligned state, the suction nozzle protruding from the electronic component P even if the electronic component P itself is mounted at the correct mounting position as shown in FIG. The lower end of N interferes with the adjacent part P ',
A mounting defect such as a displacement of the adjacent component P 'has been caused.

Accordingly, an object of the present invention is to provide an electronic component mounting apparatus and an electronic component mounting method that do not cause a mounting defect even when a fine component is mounted at a narrow pitch.

[0009]

According to a first aspect of the present invention, there is provided an electronic component mounting apparatus for picking up an electronic component from an electronic component supply unit by a suction nozzle and mounting the electronic component on a substrate. Nozzle position detecting means for detecting a nozzle position indicating the horizontal position of the nozzle, nozzle position storing means for storing the detected nozzle position for each suction nozzle, and recognizing an electronic component held by the suction nozzle And an origin position adjusting means for adjusting the origin of the optical coordinate system of the component recognizing means to the nozzle position of the suction nozzle based on the nozzle position stored in the nozzle position storage means.

According to a second aspect of the present invention, there is provided the electronic component mounting apparatus according to the first aspect, wherein the electronic component with respect to the suction nozzle at the time of picking up the electronic component by the suction nozzle from the component recognition result by the component recognition means. A learning value calculating unit that calculates a learning value of a suction position correction amount at the time of picking up an electronic component by the suction nozzle based on the positioning error amount, and a learning value storage unit that stores the learning value. With.

An electronic component mounting apparatus according to a third aspect is the electronic component mounting apparatus according to the first aspect, wherein the component recognizing means also functions as a nozzle position detecting means.

According to a fourth aspect of the present invention, there is provided an electronic component mounting method for picking up an electronic component from an electronic component supply unit by a suction nozzle and mounting the electronic component on a substrate.
A step of detecting a nozzle position indicating a horizontal position of the suction nozzle by a nozzle position detection means; a step of storing the detected nozzle position in a nozzle position storage means for each suction nozzle; The origin of the optical coordinate system of the component recognition means
Adjusting the nozzle position of the suction nozzle based on the stored nozzle position.

According to a fifth aspect of the present invention, there is provided the electronic component mounting method according to the fourth aspect, wherein the electronic component is mounted on the suction nozzle when the electronic component is picked up by the suction nozzle based on a component recognition result by the component recognition means. A displacement amount of the electronic component is obtained, and a learning value of a suction position correction amount at the time of picking up the electronic component by the suction nozzle is calculated and stored based on the displacement amount. The suction position correction by the suction nozzle is performed based on.

According to a sixth aspect of the present invention, there is provided the electronic component mounting method according to the fourth aspect, wherein the nozzle position detection is performed by the component recognition unit.

According to the present invention, the nozzle position of the suction nozzle is obtained and stored for each suction nozzle, and the origin position of the optical coordinate system of the component recognizing means for recognizing the electronic component is located at the nozzle position of the suction nozzle. By adjusting the position, it is possible to accurately detect the position shift state of the electronic component with respect to the suction nozzle, and further, by obtaining a learning value of the suction position correction amount based on the position shift detection result,
The displacement of the electronic component with respect to the suction nozzle can be prevented.

[0016]

Embodiments of the present invention will now be described with reference to the drawings. FIG. 1 is a plan view of an electronic component mounting apparatus according to one embodiment of the present invention, FIG. 2 is a plan view of a rotary head of the electronic component mounting apparatus according to one embodiment of the present invention, and FIG. FIG. 4 is a block diagram showing a configuration of a control system of the electronic component mounting apparatus according to the embodiment, and FIG. 4 is an explanatory diagram of an electronic component mounting method according to an embodiment of the present invention.

First, the structure of the electronic component mounting apparatus will be described with reference to FIG. In FIG. 1, a plurality of parts feeders 2 for supplying electronic components are provided in parallel in a supply unit 1 for electronic components. The parts feeder 2 is mounted on a feeder base (not shown), and moves in the lateral direction by rotating the feed screw 3.

A rotary head 4 is provided in front of the supply unit 1. The rotary head 4 rotates in an index around the main shaft S, and a plurality of transfer heads 5 are provided on the circumference thereof. The transfer head 5 includes a plurality of suction nozzles 6 (see FIG. 2), and the transfer head 5 moves up and down in a state where the transfer head 5 is located at the pick-up position T of the electronic component. The electronic component is sucked and picked up by the nozzle 6.

In the pick-up operation of the electronic parts, the feed screw 3 containing the desired electronic parts is moved laterally to the pickup position T by rotating the feed screw 3 by the motor M3. . Then, the parts feeder 2 is driven by the motor M3.
By adjusting the relative position with respect to the pickup position T, the suction position at the time of picking up the electronic component by the transfer head 5 can be corrected as described later.

Next, the rotary head 4 and the transfer head 5 will be described with reference to FIG. As shown in FIG.
The transfer head 5 is disposed on a circumference having a radius R centered on the main axis S of the rotary head 4. The transfer head 5 is rotated about its axis (center of rotation of the head) by a motor 11 to select a plurality (four in this example) of suction nozzles 6 provided on the circumference and to select a lower end of the suction nozzle 6. It sets the angle in the horizontal rotation direction of the electronic component vacuum-adsorbed to the section.

The electronic component picked up at the pick-up position T moves in the direction of arrow a by the index rotation of the rotary head 4 and reaches the recognition station 7. As shown in FIG. 2 (b), the recognition station 7 is a component recognition camera 7a disposed with the imaging surface facing upward.
Is mounted on the camera moving table 8.
The camera 7a is driven by driving the camera moving table 8.
Moves horizontally, whereby the origin of the optical coordinate system of the camera 7a can be adjusted to an arbitrary position.

The suction nozzle 6 is positioned above the camera 7a of the recognition station 7, and an image is taken by the camera 7a.
The position of the suction nozzle 6 in the horizontal direction (nozzle position) is detected by recognizing the obtained image data by an image recognition unit 25 described later. Further, the suction nozzle 6 holding the electronic component by suction is positioned above the camera 7a, and image data obtained by imaging the electronic component from below is subjected to image processing by the image recognition unit 25, so that the electronic component is recognized. And a positional deviation is detected. Therefore, the camera 7a and the image recognition unit 25 serve as nozzle position detection means for detecting the position of the suction nozzle 6, and also as component recognition means for recognizing electronic components.

A movable table 10 for positioning the substrate 9 is provided in front of the rotary head 4. The transfer head 5 moved from the recognition station 7 reaches the mounting position M on the substrate 9, where it moves up and down. By performing the operation,
The electronic component held by the suction nozzle 6 is mounted on the substrate 9.

Next, the control system will be described with reference to FIG. In FIG. 3, a CPU 20 is an overall control unit, and performs operation control and calculation of each unit described below according to various programs stored in a program storage unit 21. The program storage unit 21 stores programs necessary for various operations and processes. The mounting data storage unit 22 stores mounting data such as types of electronic components mounted on the board 9 to be mounted and mounting coordinate data. The learning value storage unit 23 stores, for each part feeder, a learning value of a suction position correction amount for correcting a position shift that occurs when an electronic component is picked up from each parts feeder 2.

The image recognizing section 25 detects the position of the suction nozzle 6 of the transfer head 5 by performing image processing on the image data picked up by the camera 7a, and detects the position of the electronic component held by the suction nozzle 6. Perform recognition. The detected position of the suction nozzle 6 is stored in the nozzle position storage unit 24.
(Nozzle position storage means). Learning value calculation unit 2
Numeral 6 is a suction position correction specific to each tape feeder at the pickup position T based on data of a positional shift amount obtained by capturing and electronically recognizing an electronic component picked up from each parts feeder 2 by the camera 7a. Calculate the learning value of the quantity. The learning value obtained here is stored in the learning value storage unit 2 as data for each parts feeder 2.
3 is stored. The mechanism drive unit 27 is provided for the parts feeder 2.
, A movable table 10 for holding a substrate 9, and a camera moving table 8 for moving a camera 7a.

The electronic component mounting apparatus is configured as described above, and the operation will be described below with reference to FIG. First, prior to the start of the mounting operation, each transfer head 5
Of the suction nozzle 6 is detected. That is, by rotating the rotary head 4 by an index, the suction nozzle 6 of the transfer head 5 is moved to the recognition station 7.
On the camera 7a. Then, the suction nozzle 6 is imaged by the camera 7a, and the horizontal position of the suction nozzle 6 is detected as shown in FIG. 4A, and the positional deviation amounts Δx and Δy are detected. This nozzle position detection is performed for each transfer head 5, and the detected nozzle position is stored in the nozzle position storage unit 2.
4 is stored.

Thereafter, the electronic component mounting operation is started.
First, the electronic component P is picked up from the parts feeder 2 of the supply unit 1. Next, by the index rotation of the rotary head 4, the electronic component P held by the suction nozzle 6 of the transfer head 5 moves to the recognition station 7, where an image is taken from below by the camera 7a. In this imaging operation, the suction nozzle 6 is stored in the nozzle position storage unit 24.
Are read out, and the positional deviation amounts Δx, Δ
By driving the camera moving table 8 by a moving amount corresponding to y, the center (nozzle position) of the suction nozzle 6 is made to coincide with the origin O of the optical coordinate system of the camera 7a. The camera moving table 8 serves as origin position adjusting means for adjusting the origin of the optical coordinate system of the camera 7a to the nozzle position of the suction nozzle 6 based on the stored nozzle position.

Instead of moving the camera 7a itself as the origin position adjusting means as in the above-described example, when the image recognizing section 25 performs image processing, the above-described positional deviation amount Δx,
The origin of the optical coordinate system may be adjusted to the nozzle position by data conversion in recognition processing, such as a method of offsetting the optical coordinate system by Δy or a method of converting numerical data by the positional deviation amounts Δx and Δy. In this case, the image recognizing unit 25 functions as an origin position adjusting unit.

As a result, when the electronic component P is recognized by the camera 7a, an image in which the nozzle position always coincides with the origin O of the optical coordinate system can be obtained as shown in FIG. . Then, the relative displacement amount of the electronic component P with respect to the suction nozzle 6 is obtained from this image.
Since the positional deviation of the suction nozzle 6 has already been obtained by the above-described nozzle position detection, the positional recognition information required for correcting the positional deviation of the electronic component P is obtained in a more complete form by the component recognition in the recognition station 7. Is done.

That is, the displacement determined here is:
It is used for correcting a displacement when mounting the electronic component on the substrate 9 at the mounting position M, and the pickup position T
Is used as data for calculating a learning value of the suction position correction amount by the suction nozzle 6 in the above. As a result, FIG.
The positional deviation amount shown in (b) gradually converges within an allowable range by learning the positional deviation tendency by measuring the positional deviation in a plurality of pickup operations. Thereafter, the electronic component P picked up by the suction nozzle 6 is correctly sucked and held without causing a position shift outside the allowable range with respect to the suction nozzle 6 as shown in FIG.

Then, by mounting the electronic component P thus held without displacement with respect to the suction nozzle 6 on the substrate 9, a position adjacent to the mounted component P 'as shown in FIG. Even when the components are mounted at a narrow pitch, good mounting can be performed without causing a problem such as displacement of the mounted component P 'without causing interference between the mounted component P' and the suction nozzle 6.

In the above-described embodiment, an example of a rotary type electronic component mounting apparatus in which a transfer head on which a plurality of suction nozzles are mounted is moved by a rotary head is shown as the electronic component mounting apparatus. The present invention is not limited to this. For a mounting apparatus of a type in which electronic components held by a plurality of suction nozzles are recognized by a common component recognition unit, for example, a mounting apparatus of a type in which a transfer head is driven by a linear motion table The present invention can also be applied to the present invention.

[0033]

According to the present invention, the nozzle position of the suction nozzle is determined and stored for each suction nozzle, and the origin position of the optical coordinate system of the component recognition means for recognizing the electronic component is determined by the nozzle position of the suction nozzle. The position of the electronic component with respect to the suction nozzle can be accurately detected, and the learning value of the suction position correction amount is obtained based on the result of the detection of the position shift. Position of the electronic component can be prevented.

[Brief description of the drawings]

FIG. 1 is a plan view of an electronic component mounting apparatus according to an embodiment of the present invention.

FIG. 2 is a plan view of a rotary head of the electronic component mounting apparatus according to the embodiment of the present invention;

FIG. 3 is a block diagram showing a configuration of a control system of the electronic component mounting apparatus according to the embodiment of the present invention;

FIG. 4 is an explanatory diagram of an electronic component mounting method according to an embodiment of the present invention.

FIG. 5 is an explanatory view of a conventional electronic component mounting method.

[Explanation of symbols]

 Reference Signs List 1 supply unit 2 parts feeder 4 rotary head 5 transfer head 6 suction nozzle 7a camera 7 recognition station 9 substrate 23 learning value storage unit 24 nozzle position storage unit

 ──────────────────────────────────────────────────続 き Continuing on the front page (72) Inventor Hikaru Onizaki 1006 Kadoma Kadoma, Osaka Prefecture Inside Matsushita Electric Industrial Co., Ltd. 72) Inventor Yasuhiro Morima 1006 Kazuma Kadoma, Kadoma-shi, Osaka F-term in Matsushita Electric Industrial Co., Ltd.

Claims (6)

[Claims] An electronic component mounting apparatus for picking up an electronic component from a supply section of an electronic component by a suction nozzle and mounting the electronic component on a substrate, wherein a nozzle position detection unit detects a nozzle position indicating a horizontal position of the suction nozzle. Means, nozzle position storage means for storing the detected nozzle position for each suction nozzle, component recognition means for recognizing the electronic component held by the suction nozzle, and optical coordinate system of the component recognition means. An electronic component mounting apparatus comprising: origin position adjusting means for adjusting the origin to the nozzle position of the suction nozzle based on the nozzle position stored in the nozzle position storage means. 2. The electronic device according to claim 1, further comprising: determining a displacement amount of the electronic component with respect to the suction nozzle when picking up the electronic component by the suction nozzle from a component recognition result by the component recognition means; 2. The electronic component mounting apparatus according to claim 1, further comprising: a learning value calculation unit that calculates a learning value of the suction position correction amount, and a learning value storage unit that stores the learning value. 3. The electronic component mounting apparatus according to claim 1, wherein said component recognition means also functions as a nozzle position detection means. 4. An electronic component mounting method for picking up an electronic component from a supply section of the electronic component by a suction nozzle and mounting the electronic component on a substrate, wherein a nozzle position indicating a horizontal position of the suction nozzle is determined by a nozzle position detecting means. Detecting, the step of storing the detected nozzle position in the nozzle position storage means for each suction nozzle, and the origin of the optical coordinate system of the component recognition means for recognizing the electronic component held by the suction nozzle, Positioning the nozzle position of the suction nozzle based on the stored nozzle position. 5. A position shift amount of the electronic component with respect to the suction nozzle at the time of picking up the electronic component by the suction nozzle is obtained from a result of component recognition by the component recognition means, and the electronic component is picked up by the suction nozzle based on the position shift amount. 5. The electronic component mounting according to claim 4, wherein a learning value of the suction position correction amount at the time is calculated and stored, and when the electronic component is picked up, the suction position correction by the suction nozzle is performed based on the learning value. Method. 6. The electronic component mounting method according to claim 4, wherein said nozzle position detection is performed by said component recognition means.