JP7446499B2 - Component mounting machine - Google Patents

Description

This specification discloses a component mounting machine.

2. Description of the Related Art Conventionally, component mounting machines have been known which include a mounting head having a plurality of suction nozzles and which simultaneously suction a plurality of components with the plurality of suction nozzles. For example, in Patent Document 1, for a plurality of suction nozzles included in a mounting head, a component holding range is set around the center of each component holding center, and a plurality of suction nozzles simultaneously take out components from a plurality of positions. A component mounting machine has been disclosed that aligns each component to be taken out so that each component is taken out within the respective component holding range when a component is to be taken out. This component mounter calculates the amount of positional deviation between the center of gravity of the overlapping range of the virtual component holding range of multiple suction nozzles and the respective component holding center, and uses the calculated positional deviation amount of the head section. This is the amount of correction for the movement position. In addition, the component mounter detects the amount of positional deviation of the holding position of the previously taken out component with respect to the component holding center, and corrects the detected positional deviation by multiplying it by a coefficient in the range of 0.1 to 1. The next target part holding center is set based on the correction value.

Japanese Patent Application Publication No. 2004-356376

However, in the above-mentioned component mounting machine, simultaneous suction of a plurality of components is executed even while the correction of the amount of positional deviation is not stable, so that sufficient accuracy may not be obtained and a suction error may occur.

The main objective of the present disclosure is to accurately perform a simultaneous suction operation in which a plurality of parts are simultaneously suctioned by a plurality of nozzles.

The present disclosure has taken the following measures to achieve the above-mentioned main objective.

The present disclosure is a component mounting machine that sucks components supplied from a plurality of parts feeders arranged in a component supply section and mounts them on a board, the component mounting machine including a head having a plurality of nozzles capable of sucking the components, and a plurality of parts feeders arranged in a component supply section. A lifting device that can lift and lower the nozzles individually; a moving device that moves the head relative to the substrate along a plane perpendicular to the lifting direction of the nozzles; and a suction operation that sucks parts to the nozzles. a first suction operation in which the one nozzle is sucked to the one nozzle by controlling the moving device and the lifting device so that one nozzle is lowered above the component supply portion; A second suction operation in which a plurality of parts are simultaneously suctioned by the plurality of nozzles by controlling the moving device and the lifting device so that the plurality of nozzles descend simultaneously, and When repeatedly performing a suction operation and a mounting operation on a component, first, the first suction operation is performed with each of the plurality of nozzles, and the parts suctioned with each of the plurality of nozzles in the first suction operation are A control device that learns a correction value for correcting a deviation in the suction position of the device, and executes the second suction operation using the learned correction value after a predetermined condition is satisfied. .

The component mounting machine according to the present disclosure includes a control device that can perform a first suction operation and a second suction operation (simultaneous suction operation) as suction operations for sucking components onto a nozzle. In the first suction operation, one nozzle is lowered above the component supply section to cause the one nozzle to suction the component. In the second suction operation, a plurality of nozzles are simultaneously lowered above the component supply section, and a plurality of components are simultaneously suctioned by the plurality of nozzles. When repeatedly performing a suction operation and a mounting operation for the same type of component, the control device first executes a first suction operation with each of the plurality of nozzles, and also performs a first suction operation with each of the plurality of nozzles in the first suction operation. The second suction operation is performed using the learned correction value after a predetermined condition is satisfied. As described above, when the component mounter of the present disclosure repeats the suction operation and the mounting operation for the same type of component, the component mounter performs the first suction operation with each of the plurality of nozzles to correct the deviation of the suction position. After learning the correction value, the second suction operation is started. Thereby, the component mounter of the present disclosure can accurately perform a simultaneous suction operation in which a plurality of components are simultaneously suctioned by a plurality of nozzles. Here, "orthogonal" does not have to be strictly orthogonal, but may be approximately orthogonal (the same applies hereinafter).

1 is a configuration diagram showing an outline of the configuration of a component mounting system 1. FIG. 4 is a configuration diagram showing an outline of the configuration of a mounting head 40. FIG. FIG. 4 is an explanatory diagram illustrating the arrangement of nozzle holders 42 and the arrangement of a first Z-axis drive device 70 and a second Z-axis drive device 75. FIG. It is an explanatory view explaining an air piping route. 2 is a configuration diagram showing an outline of the configuration of a pressure supply device 80. FIG. FIG. 2 is an explanatory diagram showing an electrical connection relationship between a control device 90 and a management device 100. 7 is a flowchart illustrating an example of a head mounting processing routine. 3 is a flowchart illustrating an example of a mounting control routine. 3 is a flowchart illustrating an example of a single adsorption processing routine. 3 is a flowchart illustrating an example of a simultaneous adsorption processing routine.

Next, embodiments for carrying out the present invention will be described with reference to the drawings.

FIG. 1 is a block diagram schematically showing the structure of a component mounting system 1. As shown in FIG. FIG. 2 is a block diagram schematically showing the structure of the mounting head 40. As shown in FIG. FIG. 3 is an explanatory diagram illustrating the arrangement of the nozzle holders 42 and the arrangement of the first Z-axis drive device 70 and the second Z-axis drive device 75. FIG. 4 is an explanatory diagram illustrating the air piping route. FIG. 5 is a configuration diagram showing an outline of the configuration of the pressure supply device 80. FIG. 6 is an explanatory diagram showing the electrical connection relationship between the control device 90 and the management device 100. In addition, the left-right direction in FIG. 1 is the X-axis direction, the front (front) and rear (rear) directions are the Y-axis direction, which is approximately perpendicular to the X-axis direction, and the vertical direction is the X-axis direction and the Y-axis direction (horizontal plane). This is the Z-axis direction which is approximately perpendicular to .

As shown in FIG. 1, the component mounting system 1 includes a component mounting machine 10 and a management device 100 that controls the entire system. The component mounting system 1 includes a plurality of component mounting machines 10 in the embodiment.

As shown in FIG. 1, the component mounting machine 10 includes a housing 12, a component supply section 22, a board transfer device 24, an XY robot 30, a mounting head 40, a control device 90 (see FIG. 6), Equipped with. In addition to these, the component mounting machine 10 also includes a parts camera 26, a mark camera 28, a nozzle station 29, and the like. Note that the parts camera 26 is provided between the component supply section 22 and the substrate transport device 24, and is used to image the posture of the component P sucked by the suction nozzle 44 of the mounting head 40 from below. Further, the mark camera 28 is provided on the mounting head 40 and is used to image and read the positioning reference mark attached to the substrate S from above. The nozzle station 29 is provided between the component supply section 22 and the substrate transport device 24, and is used to stock suction nozzles 44 to be attached to the nozzle holder 42 of the mounting head 40.

As shown in FIG. 1, the component supply section 22 is provided at the front of the component mounting machine 10, and a plurality of tape feeders 23 are arranged along the X-axis direction (left-right direction). The tape feeder 23 includes a reel containing a tape T on which parts P are lined up, and feeds the parts P to the parts supply position by pulling out the tape T from the reel and feeding it backward (in the Y-axis direction). The tape T has a plurality of recesses formed at predetermined intervals in the longitudinal direction. Each of the plurality of recesses accommodates the same type of component P. The component P accommodated in the recess is protected by a film covering the surface of the tape T, and the film is peeled off and exposed before the component supply position, and is sucked by the suction nozzle 44 at the component supply position.

The substrate conveyance device 24 includes a pair of conveyor belts that are spaced apart from each other in the front and back of FIG. 1 and spanned in the X-axis direction (horizontal direction). The substrate S is conveyed by a conveyor belt of the substrate conveyance device 24 from left to right in the figure.

The XY robot 30 moves the mounting head 40 in the XY axis directions (front, rear, left and right directions), and includes an X axis slider 32 and a Y axis slider 34, as shown in FIG. The X-axis slider 32 is supported by a pair of upper and lower X-axis guide rails 31 provided on the front surface of the Y-axis slider 34 so as to extend in the X-axis direction (horizontal direction), and is supported by an X-axis motor 36 (see FIG. 6). It is movable in the X-axis direction by driving. The Y-axis slider 34 is supported by a pair of left and right Y-axis guide rails 33 provided in the upper part of the housing 12 so as to extend in the Y-axis direction (front-back direction), and is supported by a Y-axis motor 38 (see FIG. 6). It can be moved in the Y-axis direction by driving. Note that the position of the X-axis slider 32 in the X-axis direction is detected by an X-axis position sensor 37 (see FIG. 6), and the position of the Y-axis slider 34 is detected in the Y-axis direction by a Y-axis position sensor 39 (see FIG. 6). is detected. A mounting head 40 is attached to the X-axis slider 32. Therefore, the mounting head 40 can be moved to any position on the XY plane (horizontal plane) by driving and controlling the XY robot 30 (X-axis motor 36 and Y-axis motor 38).

As shown in FIG. 2, the mounting head 40 includes a head main body 41, a plurality of (eight in the embodiment) nozzle holders 42, a plurality of (eight in the embodiment) suction nozzles 44, and an R-axis drive. It includes a device 50, a Q-axis drive device 60, a first Z-axis drive device 70, a second Z-axis drive device 75, and side cameras 47 and 48. The mounting head 40 is removable from the X-axis slider 32 and can be replaced as appropriate.

The head main body 41 is a rotating body that can be rotated by an R-axis drive device 50. The nozzle holders 42 are arranged at predetermined angular intervals (45 degree intervals in the embodiment) in the circumferential direction with respect to the head body 41, and are supported by the head body 41 so as to be movable up and down. A suction nozzle 44 is attached to the tip of the nozzle holder 42 . The suction nozzle 44 is removable from the nozzle holder 42, and is replaced with one suitable for suction depending on the type of component P to be suctioned.

The R-axis drive device 50 rotates (revolutions) the plurality of nozzle holders 42 (the plurality of suction nozzles 44) around the central axis of the head main body 41 in the circumferential direction. As shown in FIG. 2, the R-axis drive device 50 includes an R-axis motor 51, an R-axis 52 extending in the axial direction from the central axis of the head body 41, and a rotation of the R-axis motor 51 to the R-axis 52. A transmission gear 53 for transmitting data is provided. The R-axis drive device 50 rotates the head main body 41 by driving the R-axis motor 51 to rotate the R-axis 52 via the transmission gear 53 . Each nozzle holder 42 rotates (revolutions) in the circumferential direction together with the suction nozzle 44 as the head main body 41 rotates. In addition, the R-axis drive device 50 also includes an R-axis position sensor 55 (see FIG. 6) for detecting the rotational position of the R-axis 52, that is, the rotational position of each nozzle holder 42 (suction nozzle 44). .

The Q-axis drive device 60 rotates (rotates) each nozzle holder 42 (each suction nozzle 44) around its central axis. As shown in FIG. 2, the Q-axis drive device 60 includes a Q-axis motor 61, a cylindrical gear 62, a transmission gear 63, and a Q-axis gear 64. The cylindrical gear 62 has the R shaft 52 coaxially and relatively rotatably inserted into the cylindrical gear 62, and spur external teeth 62a are formed on the outer peripheral surface. The transmission gear 63 transmits the rotation of the Q-axis motor 61 to the cylindrical gear 62. The Q-axis gear 64 is provided at the top of each nozzle holder 42, and meshes with the external teeth 62a of the cylindrical gear 62 so as to be slidable in the Z-axis direction (vertical direction). The Q-axis drive device 60 rotationally drives the cylindrical gear 62 via the transmission gear 63 by the Q-axis motor 61, thereby collectively rotating each Q-axis gear 64 that meshes with the external teeth 62a of the cylindrical gear 62 in the same direction. be able to. Each nozzle holder 42 rotates (rotates) around its central axis together with the suction nozzle 44 by rotation of the Q-axis gear 64. In addition, the Q-axis drive device 60 also includes a Q-axis position sensor 65 (see FIG. 6) for detecting the rotational position of the Q-axis gear 64, that is, the rotational position of each nozzle holder 42 (suction nozzle 44). Be prepared.

The first and second Z-axis drive devices 70 and 75 are configured to be able to individually raise and lower the nozzle holder 42 at two locations on the orbit of the nozzle holder 42. In the embodiment, as shown in FIG. 3, the first Z-axis driving device 70 is capable of raising and lowering the nozzle holder 42 at the 0 degree position (hereinafter also referred to as Z1) among the nozzle holders 42 supported by the head main body 41. It is. Further, the second Z-axis driving device 75 can move up and down the nozzle holder 42 supported by the head body 41 at a 180 degree position (hereinafter also referred to as Z2). Note that the 0 degree position is the position on the upstream side in the substrate transport direction of the two points on a line passing through the central axis of the head main body 41 and parallel to the X-axis direction (substrate transport direction) (A in FIG. 3). ), the 180 degree position is the position on the downstream side in the substrate transport direction of the above two points (E in FIG. 3).

The first and second Z-axis driving devices 70 and 75 each include Z-axis sliders 72 and 77, and Z-axis motors 71 and 76 that move the corresponding Z-axis sliders 72 and 77 up and down, as shown in FIG. Equipped with. The first and second Z-axis driving devices 70 and 75 move the nozzle holders below the Z-axis sliders 72 and 77 by driving Z-axis motors 71 and 76 respectively to raise and lower the corresponding Z-axis sliders 72 and 77. 42, the nozzle holder 42 is moved up and down integrally with the suction nozzle 44. Note that the first and second Z-axis driving devices 70 and 75 may use linear motors as the Z-axis motors 71 and 76 to move the Z-axis sliders 72 and 77 up and down, or may use a rotary motor and a feed screw mechanism. The Z-axis sliders 72 and 77 may be moved up and down using the Z-axis sliders 72 and 77. Further, the first and second Z-axis driving devices 70 and 75 may move the Z-axis sliders 72 and 77 up and down using actuators such as air cylinders instead of the Z-axis motors 71 and 76. In this way, the mounting head 40 of the embodiment includes two Z-axis drive devices 70 and 75 that can individually raise and lower the nozzle holder 42 (suction nozzle 44), and uses the Z-axis drive devices 70 and 75 to perform suction. The suction operation of the parts P by the nozzles 44 can be performed individually. Therefore, the mounting head 40 moves the two components P to the corresponding tape feeder so that they are lined up in the X-axis direction (horizontal direction) at the same interval as the two suction nozzles 44 that can be raised and lowered by the two Z-axis drive devices 70 and 75. By supplying from 23, the two suction nozzles 44 can be lowered at the same time to suction the two parts P at the same time. In addition, the first and second Z-axis driving devices 70 and 75 also detect the vertical positions of the corresponding Z-axis sliders 72 and 77, that is, the vertical positions of the corresponding nozzle holders 42 (suction nozzles 44). Z-axis position sensors 73 and 78 (see FIG. 6) are also provided.

The suction nozzle 44 is capable of suctioning the component P and mounting the suctioned component P onto the substrate S using the pressure (negative pressure, positive pressure) supplied by the pressure supply device 80 . As shown in FIG. 5, the pressure supply device 80 includes a negative pressure source (negative pressure pump) 81, a positive pressure source (factory air) 82, and the pressure supplied to the suction port of each suction nozzle 44, which separates the pressure from negative pressure to positive pressure. A switching valve 86 that can switch between pressure and atmospheric pressure is provided. The switching valve 86 communicates with a negative pressure passage 83 that communicates with the negative pressure source 81, a positive pressure passage 84 that communicates with the positive pressure source 82, an atmospheric pressure passage 85 that communicates with the atmosphere, and the suction port of the suction nozzle 44. This is a 4-port, 3-position valve connected to a holder flow path 42a formed inside a nozzle holder 42. The switching valve 86 applies negative pressure to the suction port of the suction nozzle 44 by switching the valve position to a position (negative pressure supply position) where the holder flow path 42a communicates with the negative pressure flow path 83 and is blocked from other flow paths (negative pressure supply position). can be supplied. The switching valve 86 also connects the suction port of the suction nozzle 44 by switching the valve position to a position (atmospheric pressure supply position) where the holder flow path 42a communicates with the atmospheric pressure flow path 85 and is cut off from other flow paths. Can supply atmospheric pressure. Further, the switching valve 86 switches the valve position to a position (positive pressure supply position) in which the holder flow path 42a communicates with the positive pressure flow path 84 and is cut off from other flow paths (positive pressure supply position). pressure can be supplied. As shown in FIG. 4, the switching valve 86 is provided corresponding to each nozzle holder 42 (holder flow path 42a), and connects the negative pressure flow path through a radial flow path 41a extending radially from the axial center of the head body 41. 83 and is connected to a positive pressure flow path 84 via a radial flow path (not shown) that also extends. Further, the negative pressure channel 83 is provided with a pressure sensor 88 for detecting the internal pressure (negative pressure).

Further, the switching valve 86 does not have an automatic return function, and the valve position can be switched between a negative pressure supply position, an atmospheric pressure supply position, and a positive pressure supply position by operating the valve operating lever 87. . The valve operating lever 87 is operated by either the first or second valve driving device 45 or 46, as shown in FIG. The first valve drive device 45 can drive the valve operating lever 87 of the switching valve 86 that corresponds to the nozzle holder 42 in the position (Z1) that can be raised and lowered by the first Z-axis drive device 70 . The second valve drive device 46 can drive the valve operating lever 87 of the switching valve 86 that corresponds to the nozzle holder 42 in the position (Z2) that can be raised and lowered by the second Z-axis drive device 75. Note that the first and second valve drive devices 45 and 46 can be configured using, for example, a motor and a conversion mechanism (such as a cam mechanism or a link mechanism) that converts the rotational motion of the motor into a stroke motion.

The side cameras 47 and 48 are for taking images of the vicinity of the tip of the suction nozzle 44 from the side in order to determine whether or not the suction nozzle 44 is suctioning a component and the posture of suctioning the component after the suction nozzle 44 has performed a suction operation. be. In the embodiment, the side camera 47 detects when the first Z-axis drive device 70 lowers the suction nozzle 44 to perform a suction operation, and then the R-axis drive device 50 rotates the suction nozzle 44 one position first. The suction nozzle 44 can be imaged. Further, the side camera 48 detects the suction when the suction nozzle 44 is rotated one position first by the R-axis drive device 50 after the suction nozzle 44 is lowered by the second Z-axis drive device 75 to perform the suction operation. The nozzle 44 can be imaged.

As shown in FIG. 6, the control device 90 is configured as a microprocessor centered on a CPU 91, and includes a ROM 92, an HDD 93, a RAM 94, an input/output interface 95, etc. in addition to the CPU 91. These are connected via a bus 96. Various detection signals from the X-axis position sensor 37, Y-axis position sensor 39, R-axis position sensor 55, Q-axis position sensor 65, Z-axis position sensors 73, 78, pressure sensor 88, etc. are input to the control device 90. ing. Further, image signals from the parts camera 26 , mark camera 28 , side cameras 47 and 48 are also input to the control device 90 via an input/output interface 95 . On the other hand, from the control device 90, the tape feeder 23, the substrate transport device 24, the X-axis motor 36, the Y-axis motor 38, the R-axis motor 51, the Q-axis motor 61, the Z-axis motors 71 and 76, and the first and second valves Various control signals are output to drive devices 45, 46, parts camera 26, mark camera 28, side cameras 47, 48, etc.

The management device 100 is, for example, a general-purpose computer, and as shown in FIG. 6, it is configured with a CPU 101, a ROM 102, an HDD 103, a RAM 104, an input/output interface 105, and the like. An input signal from an input device 107 is input to the management apparatus 100 via an input/output interface 105 . A display signal to the display 108 is output from the management device 100 via the input/output interface 105. The HDD 103 stores job information including a production program for the substrate S and other production information. Here, the production program is a program that determines which components P are to be mounted on which boards S in which order in the component mounting machine 10, and how many boards S to be manufactured in this way. In addition, the production information includes component information regarding the component P to be mounted on the board S (type of component P and its component supply position), nozzle information regarding the suction nozzle 44 to be used, target mounting position (XY coordinates) of the component P, etc. is included. The management device 100 is communicably connected to the control device 90 of the component mounting machine 10, and exchanges various information and control signals.

The component mounter 10 of the embodiment configured in this manner executes a suction operation, an imaging operation, and a mounting operation as one cycle when job information is received by the management device 100. The suction operation is performed by moving the mounting head 40 above the component supply position and rotating each nozzle holder 42 (suction nozzle 44) so that the component P comes into contact with the suction port of the suction nozzle 44 at the component supply position. This is an operation of lowering the nozzle holder 42 and supplying negative pressure to the suction port of the corresponding suction nozzle 44. The imaging operation is an operation in which the part camera 26 takes an image of the component P that has been suctioned by the suction nozzle 44 in the suction operation, and the obtained image is processed to detect suction deviation and correct the target mounting position of the component P. It is. In the embodiment, the imaging operation is performed by imaging the head mark M attached to the mounting head 40 together with the component P sucked by the suction nozzle 44 using the parts camera 26, thereby imaging the component P based on the head mark M. This is done by recognizing the suction position. In the mounting operation, the mounting head 40 is moved above the target mounting position on the board S, and each nozzle holder 42 (suction nozzle 44) is rotated so that the component P attracted by the suction nozzle 44 comes into contact with the target mounting position. This is an operation of lowering the corresponding nozzle holder 42 and supplying positive pressure to the suction port of the corresponding suction nozzle 44.

Next, the operation of the component mounter 10 when the mounting head 40 is replaced will be described. FIG. 7 is a flowchart showing an example of a head mounting processing routine executed by the CPU 91 of the control device 90. This routine is executed when a new mounting head 40 is attached to the X-axis slider 32. When the head attachment processing routine is executed, the CPU 91 of the control device 90 first executes static operation calibration (S100). Here, the static operation calibration includes the positions of the parts camera 26, mark camera 28, and head mark M, the position of each nozzle holder 42 when it is raised relative to the head mark M, and the tilt position when each nozzle holder 42 is lowered. , the presence or absence of bending of the suction nozzle 44, and the position of the suction nozzle 44 are measured, and these positions are adjusted. Note that the position of the parts camera 26 can be measured using the mark camera 28, and other positions and the like can be measured using the parts camera 26.

Subsequently, the CPU 91 executes dynamic motion calibration (S110). The dynamic operation calibration is performed to adjust these operations by measuring the operation of each nozzle holder 42 assuming a single suction operation (described later) and the operation of each nozzle holder 42 assuming a simultaneous suction operation (described later). This is the process. To measure the operation assuming a single suction operation, the mounting head 40 is moved above the parts camera 26 by the XY robot 30, and while each nozzle holder 42 is rotated by the R-axis drive device 50, This is done by lowering the corresponding nozzle holder 42 using either device 70 or 75 and photographing the stopping position of the nozzle holder 42 using the parts camera 26. In addition, to measure the operation assuming simultaneous suction operation, the XY robot 30 moves the mounting head 40 above the parts camera 26, and the R-axis drive device 50 rotates each nozzle holder 42 while moving the first and second Z This is done by simultaneously lowering two corresponding nozzle holders 42 by both shaft drive devices 70 and 75, and measuring the stopping positions of the two nozzle holders 42 with the parts camera 26. Note that these operations are measured for each nozzle holder 42.

Then, the CPU 91 sets the value 0 to the simultaneous suction permission flag F indicating whether simultaneous suction operation is possible (S120), and ends the head mounting processing routine. Here, the simultaneous adsorption permission flag F is a flag indicating whether or not simultaneous adsorption operations can be performed. When the simultaneous suction flag F has a value of 0, it indicates that simultaneous suction operations are prohibited, and when it has a value of 1, it indicates that simultaneous suction operations are permitted. In the embodiment, when the mounting head 40 is replaced, the CPU 91 determines that the descending position accuracy of the suction nozzle 44 may not be sufficient, sets the simultaneous suction flag F to the value 0, and temporarily stops the simultaneous suction operation. prohibit.

Next, the operation of the component mounter 10 when picking up the component P and mounting it on the board S using a single picking operation or a simultaneous picking operation will be described. FIG. 8 is a flowchart showing an example of a mounting control routine executed by the CPU 91 of the control device 90. This routine is executed when job information is received from the management device 100. In the embodiment, the mounting control routine is applied when the operation of picking up the same type of component P and mounting it on the board S is repeatedly executed. When the mounting control routine is executed, the CPU 91 of the control device 90 first determines whether or not the simultaneous adsorption permission flag F has a value of 0 (S200). If the CPU 91 determines that the simultaneous suction permission flag has a value of 0, it determines that the simultaneous suction operation is prohibited, and executes a single suction operation in which the component P is suctioned to one suction target nozzle (S210). The single suction operation is performed by executing the single suction processing routine illustrated in FIG. Note that the single adsorption processing routine will be explained later. On the other hand, if the CPU 91 determines that the simultaneous suction permission flag is 1, it determines that the simultaneous suction operation is permitted, and executes the simultaneous suction operation in which the two suction target nozzles simultaneously suction the parts P ( S220). The simultaneous suction operation is performed by executing a simultaneous suction processing routine illustrated in FIG. Note that the simultaneous adsorption processing routine will be described later. When the CPU 91 executes the single suction operation or the simultaneous suction operation, it determines whether the planned number of components P has been suctioned by the plurality of suction nozzles 44 of the mounting head 40 (S230). If the CPU 91 determines that the predetermined number of parts P are not picked up by the plurality of suction nozzles 44, the next nozzle to be picked up is set to Z1 or Z2 (which can be raised and lowered by the first Z-axis drive device 70 or the second Z-axis drive device 75). While controlling the R-axis drive device 50 (R-axis motor 51) so as to come to the position (S240), the process returns to S200 and the processes of S200 to S240 (single suction operation or simultaneous suction operation) are repeated.

If the CPU 91 determines in S230 that the planned number of parts P has been suctioned by the plurality of suction nozzles 44, the CPU 91 controls the XY robot 30 so that the mounting head 40 is positioned above the parts camera 26 (S260). Subsequently, the CPU 91 images the parts P sucked by the plurality of suction nozzles 44 using the parts camera 26 (S270). Then, the CPU 91 identifies the component P from the obtained captured image and determines whether a suction error has occurred in which the component P that should be suctioned is not suctioned by any of the plurality of suction nozzles 44 ( S270). If the CPU 91 determines that a suction error has occurred in any of the plurality of suction nozzles 44, it sets the simultaneous suction permission flag F to a value of 0 (S370). Then, the CPU 91 controls the R-axis drive device 50 so that the nozzle holder 42 to which the suction nozzle 44 in which the suction error has occurred comes to Z1 or Z2 (S380), and returns to S200 to confirm that the suction error has occurred. The component P is sucked into the suction nozzle 44 again. On the other hand, if the CPU 91 determines that no suction error has occurred in any of the suction nozzles 44, the CPU 91 recognizes the component P and the head mark M from the captured image and detects the suction deviation of the component P suctioned by each suction nozzle 44. The amount (ΔXd, ΔYd) is measured (S280). The amount of suction deviation (ΔXd, ΔYd) is the amount of deviation between the center of the suction nozzle 44 and the center of the component P in the XY axis direction, and is measured for each suction nozzle 44.

Next, the CPU 91 determines whether or not the simultaneous adsorption permission flag F has a value of 0 (S290). If the CPU 91 determines that the simultaneous adsorption permission flag F is not the value 0 but the value 1, the process proceeds to S350. On the other hand, when the CPU 91 determines that the simultaneous suction permission flag F is 0, the CPU 91 determines that the suction nozzle 44 that has been lowered in Z1 will move the part P next time in Z1 based on the suction deviation amount (ΔXd, ΔYd) of the component P that was suctioned by the suction nozzle 44 that was lowered in Z1. The head position correction values (ΔXhz1, ΔYhz1) of the mounting head 40 when the suction nozzle 44 is lowered to suction the component P are learned (S300). Learning of the head position correction value (ΔXhz1, ΔYhz1) is performed by subtracting the value obtained by multiplying the suction deviation amount (ΔXd, ΔYd) by a coefficient k from the current head position correction value (ΔXhz1, ΔYhz1). The coefficient k is a reflection rate when the amount of adsorption deviation is reflected in the head position correction value, and is set to a value greater than 0 and smaller than 1. The coefficient k may be a fixed value, for example, it may be initially set to a large value (for example, 0.5), and then set to a small value (for example, 0.3 or 0.2). , may be made smaller as learning progresses. Further, the CPU 91 determines the next time when the suction nozzle 44 is lowered in Z2 to suction the component P, based on the amount of suction deviation (ΔXd, ΔYd) of the component P suctioned by the suction nozzle 44 that has been lowered in Z2. The head position correction values (ΔXhz2, ΔYhz2) of the mounting head 40 are learned (S310). Learning of the head position correction value (ΔXhz2, ΔYhz2) is performed by subtracting the value obtained by multiplying the suction deviation amount (ΔXd, ΔYd) by the above-mentioned coefficient k from the current head position correction value (ΔXhz2, ΔYhz2). Then, the CPU 91 calculates the average value and 3σ of the adsorption deviation amount (ΔXd, ΔYd) in the XY-axis directions (S320), and determines whether the calculated value is within a predetermined range (S330). The predetermined range is for determining whether or not the accuracy of the suction position of the component P by the suction nozzle 44 has been stabilized by learning the head movement correction value, and can be determined as appropriate. In the embodiment, the CPU 91 evaluates the suction position accuracy using 3σ, which indicates the variation in the suction deviation amount (ΔXd, ΔYd), but σ or 2σ may be used. If the CPU 91 determines that the calculated value is within the predetermined range, it sets the simultaneous adsorption permission flag F to the value 1 (S340) and proceeds to S350, and if it determines that the calculated value is not within the predetermined range, it skips S340. Then, the process proceeds to S350. In this way, in the embodiment, the CPU 91 first picks up the component P by a single pick-up operation, and then shifts to the simultaneous pick-up operation when the learning of the head movement correction value progresses and the pick-up position accuracy becomes stable. Thereby, it is possible to suppress frequent occurrence of suction errors due to execution of simultaneous suction operations.

Then, the CPU 91 corrects the target mounting position of the component P to be mounted based on the suction deviation amount (ΔXd, ΔYd) measured in S280 (S350), and performs a mounting operation to mount the component P at the corrected target mounting position. The implementation control routine is then executed (S360) and ends.

Next, the single adsorption processing routine shown in FIG. 9 will be explained. In the single suction processing routine, the CPU 91 first determines whether the current single suction operation is to be executed at Z1 (S400). In the embodiment, the execution order is determined such that the single suction operation of Z1 and the single suction operation of Z2 are executed alternately. When the CPU 91 determines that the current single suction operation is to be performed at Z1, the CPU 91 takes action so that the target component to be suctioned by the suction nozzle 44, which is lowered at Z1, is sent by the target feed amount Fz1 and supplied to the component supply position. A control signal is output to the tape feeder 23 (S410). Subsequently, the CPU 91 determines whether the head movement correction values (ΔXhz1, ΔYhz1) set in S300 of the mounting control routine described above exist (S420). When the mounting head 40 is replaced and a single suction operation is performed for the first time, the head movement correction values (ΔXhz1, ΔYhz1) have not been set yet. If the CPU 91 determines that the head movement correction value (ΔXhz1, ΔYhz1) does not exist, the process proceeds to S440. On the other hand, if the CPU 91 determines that the head movement correction value (ΔXhz1, ΔYhz1) exists, the CPU 91 adds the head movement correction value (ΔXhz1, ΔYhz1) to the current target head position (Xh, Yh) to set the target head position (Xh, Yhz1). Yh) is corrected (S430), and the process proceeds to S440. Note that the target head position is corrected by adding a part of the head movement correction value (the head movement correction value multiplied by a coefficient greater than 0 and smaller than 1) to the current target head position. You may be Next, the CPU 91 controls the XY robot 30 so that the mounting head 40 comes to the target head position (Xh, Yh) (S440). Then, the CPU 91 controls the first Z-axis drive device 70 so that the suction target nozzle descends (Z1 holder lowers), and also controls the first valve drive device 45 so that negative pressure is supplied to the suction port of the suction target nozzle. (Z1 valve opens) (S450), and the single adsorption processing routine ends.

If the CPU 91 determines in S400 that the current single suction operation is to be performed at Z2 instead of Z1, the component to be picked up by the suction nozzle 44, which is lowered at Z2, is sent by the target feed amount Fz2 and moved to the component supply position. A control signal is output to the corresponding tape feeder 23 so as to be supplied to the tape feeder 23 (S460). Subsequently, the CPU 91 determines whether the head movement correction values (ΔXhz2, ΔYhz2) set in S310 of the mounting control routine described above exist (S470). When the mounting head 40 is replaced and a single suction operation is performed for the first time, the head movement correction values (ΔXhz2, ΔYhz2) have not been set yet. If the CPU 91 determines that the head movement correction values (ΔXhz2, ΔYhz2) do not exist, the process proceeds to S490. On the other hand, when determining that the head movement correction value (ΔXhz2, ΔYhz2) exists, the CPU 91 adds the head movement correction value (ΔXhz2, ΔYhz2) to the current target head position (Xh, Yh) to determine the target head position (Xh, Yhz2). Yh) is corrected (S430), and the process proceeds to S490. Note that the target head position is corrected by adding a part of the head movement correction value (the head movement correction value multiplied by a coefficient greater than 0 and smaller than 1) to the current target head position. You may be Next, the CPU 91 controls the XY robot 30 so that the mounting head 40 comes to the target head position (Xh, Yh) (S490). Then, the CPU 91 controls the second Z-axis drive device 75 so that the nozzle to be sucked falls (Z2 holder lowers), and controls the second valve drive device 46 so that negative pressure is supplied to the suction port of the nozzle to be sucked. (Z2 valve opens) (S500), and the single adsorption processing routine ends.

Next, the simultaneous adsorption processing routine will be explained. In the simultaneous suction processing routine, the CPU 91 first corrects the target feed amounts Fz1 and Fz2 of the two suction target components to be suctioned by the two suction target nozzles that are simultaneously lowered at Z1 and Z2, respectively (S550). The target feed amount Fz1 is corrected by adding the head movement correction value ΔYhz1 in the Y-axis direction set in S300 of the mounting control routine to the current target feed amount Fz1. Further, the target feed amount Fz2 is corrected by adding the head movement correction value ΔYhz2 in the Y-axis direction set in S310 of the mounting control routine to the current target feed amount Fz2. Note that the target feed amount is corrected by multiplying the current target feed amount by a part of the head movement correction value in the Y-axis direction (the head movement correction value is multiplied by a coefficient greater than the value 0 and smaller than the value 1). It may also be done by adding. Subsequently, the CPU 91 outputs a control signal to the corresponding tape feeder 23 so that the respective suction target parts are supplied at the corrected target feed amounts Fz1 and Fz2 (S560). Next, the CPU 91 corrects the target head position Xh in the X-axis direction (S570). The target head position Xh in the X-axis direction is corrected by adding the head movement correction value ΔXhz1 in the X-axis direction set in S300 of the mounting control routine and the head movement correction value ΔXhz1 in the X-axis direction set in S310 to the current target head position Xh in the X-axis direction. This is performed by adding the sum of the head movement correction value ΔXhz2 divided by the value 2. Note that the correction of the target head position in the X-axis direction is a part of the calculated value obtained by dividing the sum of the head movement correction values ΔXhz1 and ΔZhz2 in the X-axis direction by the value 2 (the current target head position in the X-axis direction). This may be done by multiplying the value by a factor greater than the value 0 and less than the value 1). Note that the target head position Yh in the Y-axis direction is not corrected. Subsequently, the CPU 91 controls the XY robot 30 so that the mounting head 40 comes to the target head position (Xh, Yh) (S580). Then, the CPU 91 controls the first Z-axis driving device 70 and the second Z-axis driving device 75 so that the suction target nozzle in Z1 and the suction target nozzle in Z2 descend simultaneously, and also controls the suction ports of the two suction target nozzles. The first valve drive device 45 and the second valve drive device 46 are controlled so that negative pressure is supplied to (S590), and the simultaneous adsorption processing routine is ended.

Here, when the two suction target nozzles are simultaneously lowered in Z1 and Z2 to simultaneously suction the two suction target parts, since the pitch between the two suction target nozzles (pitch in the X-axis direction) is fixed, Due to the influence of tolerances of each part, the two nozzles to be picked up cannot simultaneously aim at the centers of the two parts to be picked up. Therefore, the smaller the size of the component P to be suctioned, such as a chip component of 0.4 mm x 0.2 mm, the more difficult it becomes for the component mounter 10 to perform simultaneous suction operations. In contrast, the component mounter 10 of the embodiment initially performs a single suction operation and learns the head movement correction values (ΔXhz1, ΔYhz1) and (ΔXhz2, ΔYhz2) of the mounting head 40, and then Once the positional accuracy is stabilized, the simultaneous suction operation begins. By executing the simultaneous suction operation using the learned head movement correction value, the component mounter 10 according to the embodiment can sufficiently secure suction position accuracy even in the simultaneous suction operation, and is able to secure sufficient suction position accuracy for small-sized components P. Also during suction, it is possible to suppress the occurrence of suction errors. Furthermore, in the simultaneous suction operation, the component mounter 10 of the embodiment corrects the target head position Xh of the mounting head 40 in the X-axis direction using the head movement correction values ΔXhz1 and ΔXhz2 in the X-axis direction, and corrects the target head position Xh in the Y-axis direction. The head movement correction values ΔYhz1 and ΔYhz2 are used to correct the target feed amounts Fz1 and Fz2 of the two tape feeders 23 that supply the two parts to be picked up. Thereby, the component mounter 10 can individually correct the suction deviation in the Y-axis direction for Z1 and Z2 in the simultaneous suction operation, and therefore can further improve the suction position accuracy in the Y-axis direction. Note that the smaller the size of the components P, the more difficult the simultaneous suction operation becomes. Therefore, if the size of the component P to be suctioned is larger than a predetermined size, the component mounter 10 does not perform the simultaneous suction operation from the beginning. Of course it's a good thing.

Here, the correspondence between the components of the embodiment and the components of the present disclosure described in the claims will be clarified. The component supply unit 22 of the embodiment corresponds to a component supply unit of the present disclosure, the tape feeder 23 corresponds to a parts feeder, the component mounter 10 corresponds to a component mounter, the suction nozzle 44 corresponds to a nozzle, and the mounting The head 40 corresponds to a head, the first and second Z-axis drive devices 70 and 75 correspond to a lifting device, the XY robot 30 corresponds to a moving device, and the control device 90 corresponds to a control device. Further, the mounting head 40 corresponds to a rotary head, the nozzle holder 42 corresponds to a nozzle holder, the first Z-axis drive device 70 corresponds to a first lifting device, and the second Z-axis driving device 75 corresponds to a second lifting device. do.

The component mounter 10 of the embodiment described above has a first suction operation (as a suction operation) in which one nozzle is lowered and a negative pressure is supplied to the suction port of the one nozzle to suction a component onto one nozzle. (single suction operation), and a second suction operation (simultaneous suction operation) in which multiple nozzles are simultaneously lowered and negative pressure is supplied to the suction ports of the multiple nozzles to simultaneously suction the components to the multiple nozzles. The control device 90 is equipped with a control device 90 capable of executing the following. When repeatedly performing a suction operation and a mounting operation for the same type of component, the control device 90 initially performs a first suction operation with each of the plurality of suction nozzles 44, and also performs a first suction operation with each of the plurality of suction nozzles 44 in the first suction operation. A correction value for correcting the deviation of the suction position of the picked-up component P is learned in each case, and after a predetermined condition is satisfied, the second suction operation is executed using the learned correction value. In this way, when the component mounter 10 of the present disclosure repeats the suction operation and the mounting operation for the same type of component, the component mounter 10 performs the first suction operation with each of the plurality of suction nozzles 44 to learn the correction value. Then, the process moves to the second suction operation. Thereby, the component mounter 10 of the present disclosure can accurately perform a simultaneous suction operation in which the plurality of suction nozzles 44 simultaneously suction a plurality of components.

In addition, the component mounter 10 of the embodiment measures the variation in the suction position (the average value and 3σ of the suction deviation amount) of the component P suctioned by the suction nozzle 44 in the first suction operation (single suction operation), and After the variation converges within a predetermined range, the second suction operation (simultaneous suction operation) is performed. In this way, the component mounter 10 can further improve the accuracy of the second suction operation by executing the second suction operation based on the correction value learned in the first suction operation, for example, 0.4 mm. Simultaneous suction of extremely small parts such as x0.2 mm chip parts can be realized.

Furthermore, in the second suction operation (simultaneous suction operation), the component mounter 10 of the embodiment corrects the target head position Xh of the mounting head 40 in the X-axis direction using the head movement correction values ΔXhz1 and ΔXhz2 in the X-axis direction. Then, the target feed amounts Fz1 and Fz2 of the two corresponding tape feeders 23 are corrected using the head movement correction values ΔYhz1 and ΔYhz2 in the Y-axis direction. In this way, the component mounter 10 can independently correct the suction deviation in the Y-axis direction for Z1 and Z2 in the second suction operation, so that the suction position accuracy in the Y-axis direction can be further improved. can.

Furthermore, when the mounting head 40 is replaced or a suction error occurs during the simultaneous suction operation, the component mounter 10 of the embodiment sets the simultaneous suction permission flag F to a value of 0 to prohibit the simultaneous suction operation. Thereby, it is possible to avoid simultaneous suction operations from being performed under conditions where the suction position accuracy is degraded, and to suppress frequent occurrence of suction errors.

It goes without saying that the present invention is not limited to the embodiments described above, and can be implemented in various forms as long as they fall within the technical scope of the present invention.

For example, in the embodiment described above, the component mounting machine 10 includes a rotary mounting head 40 in which a plurality of nozzle holders 42 are arranged circumferentially around a head main body 41. However, the component mounter 10 is a parallel type mounting device that has nozzle holders (suction nozzles) that are arranged at the same pitch as the parts feeders (tape feeder 23) along the arrangement direction of the parts feeders (tape feeders 23) and can be raised and lowered independently. It may also include a head.

In the embodiment described above, the mounting head 40 includes two Z-axis drive devices 70 and 75 that individually move up and down the two nozzle holders 42 (suction nozzles 44) located at predetermined positions. However, the mounting head 40 may include three or more Z-axis drive devices, and the three or more Z-axis drive devices lower three or more suction nozzles simultaneously, and each suction nozzle has three or more The parts P may also be picked up simultaneously.

In the above-described embodiment, the CPU 91 uses the head movement correction values ΔYhz1 and ΔYhz2 in the Y-axis direction in the simultaneous suction operation to correct the target feed amounts Fz1 and Fz2 of the two tape feeders 23 that supply the two parts to be suctioned. did. Further, the CPU 91 corrects the target head position Xh of the mounting head 40 in the X-axis direction using the head movement correction values ΔXhz1 and ΔXhz2 in the X-axis direction, but does not correct the target head position Yh of the mounting head 40 in the Y-axis direction. I took it as a thing. However, instead of correcting the target feed amounts Fz1 and Fz2, the CPU 91 may correct the target head position Yh of the mounting head 40 in the Y-axis direction using the head movement correction values ΔYhz1 and ΔYhz2 in the Y-axis direction. In this case, the CPU 91 corrects the target head position Yh by adding the sum of the head movement correction value ΔYhz1 and the head movement correction value ΔYhz2 divided by the value 2 to the current target head position Yh in the Y-axis direction. do it.

In the embodiment described above, the CPU 91 shifts to the simultaneous suction operation after the suction position accuracy (the average value of the suction deviation amount and 3σ) of the suction nozzle 44 converges within a predetermined range in the single suction operation. However, the CPU 91 may shift to the simultaneous suction operation when the learning progress of the head movement correction value reaches a predetermined level in the single suction operation (for example, when the number of learning times reaches a predetermined number).

In the embodiment described above, the CPU 91 sets the value 0 to the simultaneous suction permission flag F to prohibit the simultaneous suction operation when the mounting head 40 is replaced and when a suction error occurs during the simultaneous suction operation. And so. However, the present invention is not limited to this, and the CPU 91 may set the simultaneous adsorption permission flag F to the value 0 when the tape feeder 23 is replaced.

In the embodiment described above, the XY robot 30 moves the mounting head 40 in the XY-axis directions, but it may move the substrate B in the XY-axis directions.

In the embodiment described above, the component mounting machine 10 includes position sensors 37, 39, 55, 65, 73, and 78 that detect the position of each axis (X axis, Y axis, R axis, Q axis, and Z axis). However, the "position sensor" may include an encoder and a linear scale.

INDUSTRIAL APPLICATION This invention can be utilized for the manufacturing industry of a component mounting machine, etc.

1 component mounting system, 10 component mounting machine, 12 housing, 22 component supply section, 23 tape feeder, 24 board transfer device, 26 parts camera, 28 mark camera, 29 nozzle station, 30 XY robot, 31 X-axis guide rail , 32 X-axis slider, 33 Y-axis guide rail, 34 Y-axis slider, 36 X-axis motor, 37 X-axis position sensor, 38 Y-axis motor, 39 Y-axis position sensor, 40 mounting head, 41 head main body, 41a radial flow channel, 42 nozzle holder, 42a holder flow path, 44 suction nozzle, 45 first valve drive device, 46 second valve drive device, 47, 48 side camera, 50 R-axis drive device, 51 R-axis motor, 52 R-axis, 53 transmission gear, 55 R-axis position sensor, 60 Q-axis drive device, 61 Q-axis motor, 62 cylindrical gear, 62a external tooth, 64 Q-axis gear, 65 Q-axis position sensor, 70 first Z-axis drive device, 71, 76 Z-axis motor, 72, 77 Z-axis slider, 73, 78 Z-axis position sensor, 75 second Z-axis drive device, 80 pressure supply device, 81 negative pressure source, 82 positive pressure source, 83 negative pressure flow path, 84 positive pressure flow path , 85 atmospheric pressure flow path, 86 switching valve, 87 valve operation lever, 88 pressure sensor, 90 control device, 91 CPU, 92 ROM 93 HDD, 94 RAM, 95 input/output interface, 96 bus, 100 management device, 101 CPU, 102 ROM, 103 HDD, 104 RAM, 105 input/output interface, 107 input device, 108 display, P parts, S board.

Claims (1)

A component mounting machine that sucks components supplied from a plurality of parts feeders arranged in a component supply section and mounts them on a board,
a head having a plurality of nozzles capable of suctioning the component;
a lifting device capable of lifting and lowering the plurality of nozzles individually;
a moving device that moves the head relative to the substrate along a plane perpendicular to the vertical direction of the nozzle;
a parts camera that images the parts sucked by the nozzle;
As the suction operation for suctioning the component to the nozzle, a first operation for suctioning the component to the one nozzle by controlling the moving device and the elevating device so that one nozzle descends above the component supply unit. a second step of suctioning the plurality of components to the plurality of nozzles simultaneously by controlling the moving device and the elevating device so that the plurality of nozzles descend simultaneously above the component supply unit; a control device that is capable of performing a suction operation and selectively executes the first suction operation and the second suction operation based on a suction deviation amount of the component suctioned to the nozzle obtained from the parts camera;
Equipped with
The control device executes the first suction operation as a suction operation, learns a correction value for correcting a suction deviation of a component suctioned in the first suction operation, and learns a degree of variation in the amount of suction deviation. calculating, and if the calculated value falls within a predetermined range, performing the second suction operation using the learned correction value;
Component mounting machine.

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