JPH0697720B2 - Electronic component mounting method - Google Patents

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component mounting method in which a mounting process of a series of electronic components is sequentially divided by a plurality of mounting heads.

2. Description of the Related Art A conventional electronic component mounting method will be described below with reference to the drawings.

FIG. 3 is a perspective view of a chip component mounting machine, FIG. 4 is a perspective view of a mounting head of a chip component mounting machine to which this method is applied, and FIG. 5 is a functional explanatory diagram of each station of a divided mounting process. is there. Adsorption at A, parts regulation at C,
The suction detection is performed in D, the mounting is performed in F, and the miss component is taken out in H.

First, a series of mounting operations of a chip-type electronic component mounting machine to which a conventional electronic component mounting method is applied will be described. It has ten identical mounting heads 1 for adsorbing and holding chip parts, and the mounting head 1 performs a rotation operation (index operation) in a clockwise direction at constant intervals of 36 °.
In addition, each station divided into 10 is equipped with a mechanism that performs a function that divides the mounting process,
The mounting head 1 that has arrived at each station performs the function of each station.

The mounting head 1 at the station A sucks the chip component from the component supply unit 2. After that, each mounting head 1
Rotating, the mounting head 1 located at station A arrives at station B and does nothing here. The mounting head 1 located at station J arrives at station A and picks up chip components. Further, the other mounting heads 1 also rotate in the same manner, and the operation of each function is performed in each station. That is, each mounting head 1 is rotated by 36 ° to perform suction at A, component regulation at C, suction detection at D, mounting at F, and removal of an erroneous component at H to complete a series of mounting operations.

Problems to be Solved by the Invention However, in the above configuration, since there are a plurality of mounting heads, the probability that an abnormality will occur in the mounting heads increases,
When an abnormality occurs even in one of the mounting heads, the operation is often stopped due to reasons such as inability to adjust, and the operating rate is reduced.

Further, in the case of an abnormality in which suction cannot be reliably performed, if the operation is continued as it is, suction mistakes frequently occur, and chip components that have failed in suction are discarded, resulting in waste of chip components. Was there.

The present invention solves the above problems, and an object of the present invention is to provide an electronic component mounting method that suppresses a decrease in operating rate as much as possible even if an abnormal mounting head occurs among a plurality of heads.

Means for Solving the Problems In order to achieve the above object, the electronic component mounting method of the present invention is to confirm whether or not the electronic component is correctly adsorbed by the mounting head, and set the number of times determined to be a suction error for each mounting. Each head is counted, and when this count value reaches a preset value, the mounting operation is performed only with the normal mounting head without using the mounting head.

Effect The present invention is configured so that even if one or more of the plurality of mounting heads becomes abnormal or cannot be adjusted, the mounting head is controlled so as not to perform the mounting operation.
The operation can be continued with only another good mounting head without stopping the operation of the machine, and the operation rate can be improved. Moreover, defective mounting is reduced.

Embodiment An electronic component mounting method according to an embodiment of the present invention will be described below with reference to the drawings.

FIG. 1 is a flow chart showing the flow of the operation of the control process in this embodiment, and FIG. 2 is a flow chart showing the operation of the operator.

First, as shown in FIG. 2, the operator judges the presence / absence of an abnormally mounted head, and if there is, the abnormally mounted head number is registered in the abnormally mounted head table by key-in, and then the controller 9 is instructed to start driving. give. When the control device 9 receives the instruction to start the operation, the first
As shown in the figure, it is determined whether or not the abnormal mounting head is registered in the abnormal mounting head table. If not, the normal mounting operation is performed. If there is, the mounting operation is performed without using the abnormal mounting head. That is, the station which has the abnormal mounting head is instructed not to perform the operation of each function to the mounting head.

Next, during the mounting operation, the suction detection unit 4 checks whether or not the chip components are correctly sucked. For those that are determined to be suction errors, the number of times is counted for each mounting head. deep. When the count value reaches a preset value, the mounting head is determined to be abnormal, is registered in the abnormal mounting head table, and the mounting operation including the mounting head is performed without using the abnormal mounting head. .

As described above, according to the present invention, even when an abnormality occurs in the mounting head, it is possible to continue the operation with only another normal mounting head without focusing on the operation of the machine. is there. Further, by not automatically using the mounting head that has a high possibility of occurrence of a suction error, it is possible to prevent waste of the chip component. Therefore, the operation rate of the machine is improved, the suction error rate is reduced, and the chip parts are efficiently used.

[Brief description of drawings]

FIG. 1 is a flow chart showing an operation flow of a control process in one embodiment of the present invention, FIG. 2 is a flow chart showing an operation of the operator, and FIG. 3 is a chip-type electronic component to which the method of the present invention is applied. FIG. 4 is a perspective view of the mounting machine, FIG. 4 is a perspective view of the mounting head portion, and FIG. 5 is a functional explanatory view of each station of the mounting head. 3 ... Parts regulation section, 4 ... Suction detection section, 5 ... Mounting section,
6 ... Missing part removal section, 7 ... XY table, 8 ...
…Printed board.

Claims (1)

[Claims] 1. In an electronic component mounting method in which a series of mounting steps of a series of electronic components is sequentially divided by a plurality of mounting heads, a step of confirming whether or not the electronic components are correctly adsorbed to the mounting head, It is equipped with the step of counting the number of times it is determined that it is a suction error for each mounting head, and when the count value in the above step reaches a preset value, the mounting operation is performed without using the mounting head. An electronic component mounting method characterized by the above.