JPS6041298A - Chip part attaching machine - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention is for removing chip parts that have caused suction errors when automatically mounting square or cylindrical chip parts from chip pin parts or magazines using a chip part mounting machine. This relates to a chip component mounting machine that can be restarted.

Conventional Structure and its Problems In recent years, chip component mounting machines for mounting leadless type components have been gaining importance as FA (factory automation) becomes more widespread.

FIG. 1 is a front view of a conventional chip component mounting machine as shown above.

In FIG. 1, reference numeral 1 denotes a mounting drive shaft 2 that is slidably supported on a mounting head main body (not shown). A mounting drive shaft 2 is provided at the tip of the mounting drive shaft 1 and attracts a chip component 3 to a printed circuit board 8i (hereinafter referred to as (referred to as a printed circuit board.) Suction nozzle attached to 4, 6
6 is a centering claw that moves and holds the chip component sucked by the suction nozzle 2 to the center of the tip of the suction nozzle 2, and 6 is a bar cassette in which the tape on which the chip component 3 is taped is loaded.

The operation of the conventional chip component mounting machine configured as described above will be explained below.

First, the suction nozzle 2 is moved downward by the mounting drive shaft 1 in order to suction the chip component 3 provided in the parts cassette 4. After picking up the chip parts 3 , they are placed in an upper row and the centering claw 6 is used to move the chip parts 3 to the suction nozzle 2 .
Positioning is performed so that the chip component 3 is held in the center. Thereafter, the suction nozzle 2 is mounted on the printed circuit board 4 by the mounting drive shaft 1 which moves forward onto the printed circuit board 4 and then moves downward again to move it onto the printed circuit board 4 and mount the suction nozzle 2 thereon.

However, when the above-mentioned conventional chip component mounting machine adsorbs the chip component 2'f: from the parts cassette 6 by the suction nozzle 2, the taping quality of the parts cassette 6 is not stable, so the chip component that has been sucked from the taped part is adsorbed. There have been cases where the tip of the nozzle 2 cannot be held in a proper shape. In this case, a sensor (not shown) or the like would detect any suction abnormality and stop the chip component mounting machine.

At this time, in order to restart the equipment, parts that have been suctioned and held in an abnormal state must be removed, and in order to avoid quality problems, complicated manual operations are required, which takes a long time and reduces the efficiency of the equipment. This had the disadvantage of significantly lowering the performance.

Purpose of the Invention JP-A No. 41298 (2) The present invention has been made in view of the above-mentioned drawbacks of the conventional art, and the complicated removal and repair operations that occur when a single chip component is suctioned and held in an abnormal state make the work difficult. The purpose is to increase the efficiency of equipment needed.

Structure of the Invention In order to achieve the above object, the chip component mounting machine of the present invention has a means for grasping one chip component from a taping part or a magazine, and responds to a sensor output for detecting the quality of the clamping state of the chip component.

The chip component is configured to be moved and attached to a predetermined position on the printed wiring board, and the chip component is removed to a position different from the printed wiring board only when it is determined that the chip component is held in a bad manner. The structure includes a means for transporting it in this way.

With this configuration, if a chip component is abnormally attracted, the chip component will be removed to another position.

DESCRIPTION OF EMBODIMENTS An embodiment of the present invention will be described with reference to the drawings. FIG. 2Ct is a front view of a chip component mounting machine according to an embodiment of the present invention.

In Figure 2, parts that are the same as those in Figure 1 are designated with the same numbers.
~Description omitted. 1' is a chip component mounting device, 7 is a nozzle whose inner diameter is set so as to suck the chip component 3 abnormally attracted to the suction nozzle 2, and one end of the nozzle is directed toward the chip component 3. 8 is a nozzle to which the other end of the nozzle 7 is connected. A vacuum pump pipe, 9 a removal hopper equipped with a vacuum pump (not shown) for sucking and removing chip parts, 10 a cylinder holding a removal device 11 consisting of a nozzle 7, a vacuum pipe 8 and a removal hopper 9; , 12 is a cylinder shaft for moving the cylinder to the suction nozzle 3; 13 is a drive device that alternately inhales and exhausts air into vacuum pipes 14a and 14b in order to move the cylinder; 16 is a forward drive device that detects the position of the cylinder; A drive circuit 17 that controls the magnet switch 16a, the backward magnet switch 1eb, the removal picker 9, and the drive device 13 includes a vacuum pump that causes the chip component 3 to be sucked by the suction nozzle 2;
Reference numeral 18 denotes an air sensor 2o provided at the suction nozzle 2 and the vacuum nozzle of the vacuum pump 17 (eve 6, 19) to detect air pressure, which is connected to the air sensor 18 and the drive circuit 16 to control the chip component mounting device 1', etc. It is a control device.

The operation of this embodiment configured as described above will be explained below.

Now, FIG. 2 shows a case where a chip component 3 is abnormally attracted to the tip of the suction nozzle 2 due to instability in the quality of the taping loaded in the parts cassette 6.

In this case, the suction nozzle 2 rises and the centering claw 6 operates, but since the chip component 3 is not held in the suction nozzle 2 in a normal state, the air pressure in the vacuum pipe 19 is different from normal. The air sensor 20 detects the abnormality and outputs a signal indicating a suction error. - When the force control circuit 20 receives all the signals indicating this suction error, it stops the chip component mounting machine 1' and at the same time sends a signal to the drive circuit 16 to remove the chip component 3. The drive circuit 15 sends air from the drive device 13 to the vacuum pipe 14b and moves the cylinder 1o forward along the cylinder axis 12 so that the tip of the nozzle 7 covers the chip part 3, and the advancing magnet switch 16
The cylinder 10 is stopped by inputting a signal for confirming the surface of a. Thereafter, the chip parts 3 are sucked into the width of the nozzle 7 with a suction force stronger than that of the suction nozzle 2, and the chip parts 3 are collected in the removal hopper 9. Chip parts 3
After removing the air, send air to the vacuum pipe 14a, move the cylinder 10f backward, and turn the reverse magnetic switch 16b.
The cylinder 10 is stopped due to the output.

Thereafter, by adding a sequence program (not shown), the chip component mounting apparatus 1' causes the chip component 3 that has been removed to pick up the same chip components 3 at all locations, and restarts the mounting operation.

As described above, according to this embodiment, the chip component mounting machine 1
The air sensor 18 detects whether the chip component 3 is properly held in the suction nozzle 2 of The chip component mounting machine 1' is automatically restarted by newly suctioning the same thing as σ.
This eliminates the need for manual removal and correction of the abnormal component when the chip component 3 is abnormally picked up as in the past, and improves the mounting ability of the chip component mounting device 1'. Loss of time and effort can be minimized. ``!Tchip component 3'?: Since the chip component 3 is sucked in, there is no need to worry about the occurrence of secondary defects caused by the chip component 3 falling onto other printed circuit boards 4 without being scattered to other positions.

Effects of the Invention As described above, according to the chip component mounting machine of the present invention, when a chip component is not held in the normal shape in the suction nozzle, the chip component is removed and a new chip component is sucked and the chip component is automatically placed. Since the system is restarted, the complicated work associated with removing and correcting abnormal parts by one person is no longer necessary, the installation ability can be improved, and losses associated with abnormalities can be minimized, which has great effects. There is something.

[Brief explanation of the drawing]

FIG. 1 is a front view of a conventional chip component mounting machine, and FIG. 9-2. FIG. 2 is a front view of a chip component mounting machine according to an embodiment of the present invention. 1'... Chip component mounting device, 2...
Suction nozzle-3...Chip parts-7...
・Nozzle-11---Removal device, 18---
・Air sensor. Name of agent: Patent attorney Toshio Nakao and 1 other person No. 1
figure

Claims (1)

[Claims] A means for grabbing one chip component from a taping part or a magazine, and a means for moving and mounting the chip component to a predetermined position on a printed wiring board in response to a sensor output for detecting whether the chip component is in a good or bad state. A chip component mounting machine comprising: a means for transporting the chip component so as to remove it to a position different from the printed wiring board only when it is determined that the chip component is held in a bad manner;