JP3859266B2 - Component mounting method - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a component mounting method for automatically mounting an electronic component on a circuit board by a component mounting apparatus.
[0002]
[Prior art]
First, a component mounting apparatus for automatically mounting electronic components on a circuit board will be described with reference to FIG.
[0003]
FIG. 1 is a configuration example showing a structure of a rotary head system which is one of the general forms of a component mounting apparatus. In the component mounting apparatus shown in FIG. 1, electronic components to be mounted are supplied in a form called taping supply stored in a row on a carrier tape 31 for each type, and a component obtained by winding the carrier tape 31 on a reel 32 is a component. It is mounted on the supply device 33. The component supply device 33 has a mechanism that pulls out the carrier tape 31 from the reel 32 to the suction position 34 and enables the electronic components to be taken out one by one from the suction position 34.
[0004]
The rotary head portion H1 has nozzles 36a, 36b, 36c, and 36d for adsorbing electronic components around a rotating body 35 that rotates in a direction indicated by an arrow A in the drawing with a vertical axis as a center. . The gripping of the component by the nozzle is performed by sucking the electronic component from the suction position 34 by the nozzle that matches the position of the nozzle 36 b by the rotation of the rotating body 35. At this time, in order to attract a predetermined electronic component to the nozzle, the component supply table 37 on which the component supply device 33 is mounted is arranged in the direction in which the component supply device 33 is arranged in parallel with the arrow Z in the drawing. A drive device composed of a servo motor 38 and a servo motor driver 39 is connected.
[0005]
After the electronic component is picked up, the presence or absence of the electronic component may be inspected before mounting on a circuit board (not shown). If there is no component, the mounting may be stopped. In this configuration example, the presence / absence of the electronic component is detected by measuring the height of the lower end of the electronic component sucked at the position of the nozzle 36c by the line sensor 40 in which the detection elements are arranged in the vertical direction. As another method, an image of the electronic component sucked at the position of the nozzle 36d is captured by the video camera 41, and the presence / absence of the component is detected depending on whether an image having a preset area exists in the screen. There is also.
[0006]
Further, the operation of the series of devices is structured to be centrally managed and executed by the microcomputer control device 42.
Now, after the electronic components in the carrier tape 31 are sucked by the nozzles from the suction position 34 of the component supply device 33, the carrier tape 31 is sent to the discharge port 43 and cut by the cutter 44. Here, when the nozzle misses the electronic component, the electronic component remaining in the carrier tape 31 is cut together with the carrier tape 31 by the cutter 44. Accordingly, when a large component such as SOP or QFP is mistakenly picked up as an electronic component, the cutter 44 will bite it and there is a risk that the cutter 44 will be damaged. Normally, when a nozzle misses an electronic component, it automatically tries to pick up that component and does not stop the operation. However, if a large component such as SOP or QFP is missed, In order to protect the cutter 44, the operation can be stopped at the time of one suction mistake. This function is called a large component suction error detection function.
[0007]
A conventional example of the large component adsorption error detection function in such a component mounting apparatus will be described below with reference to FIGS.
First, an operation program used for operation of the component mounting apparatus will be described with reference to FIG.
[0008]
The operation program shown in FIG. 5A is called an NC program, and designates the mounting order of components, the mounting position, and the number of the component supply device that takes out the components. The parts are mounted sequentially in the ascending order of the block numbers. For each block, the parts are taken out from the part supply apparatus with the specified part supply apparatus number, and the parts are placed at the positions specified by the X and Y coordinates of the circuit board. Implement.
[0009]
The operation program shown in FIG. 5B is referred to as an arrangement program, and designates information on components stored in each component supply apparatus. The column of large parts is 1 when the parts housed in each part supply device are large parts, and 0 otherwise.
[0010]
Next, the operation of the component mounting apparatus will be described with reference to FIG. 1 according to the flowchart shown in FIG.
First, in step 102, it is checked by the component cut-off memory 45 in FIG. 1 whether the component to be next sucked has already been determined to be out of component. To do. Next, at step 104, it is checked whether or not there is a suction error by the component inspection means. Here, the line sensor 40 or the video camera 41 of FIG. 1 is used as the component inspection means.
[0011]
If it is determined in step 104 that there is no suction error, the component is mounted on the substrate in step 105, and the mounting operation for the component is terminated. On the other hand, if it is determined in step 104 that a suction error has occurred, in step 106, the part is stored as a non-sucked part in a memory (not shown) in the microcomputer control device 42. This stored content is also used when determining the next suction component in step 102, and is also used when checking the presence or absence of the unsucked component in later step 111.
[0012]
Thereafter, in step 107, it is checked whether or not the part is a large part by referring to the arrangement program shown in FIG. Here, if it is found that a large component has been picked up, the process proceeds to step 119, and the operation of the component mounting apparatus is stopped at that point. Thereafter, if the error is canceled in step 120, the process returns to step 102 and the operation is resumed.
[0013]
Step 109 and subsequent steps are processing of suction mistakes other than for large-sized parts, and it is checked whether or not the suction for the parts has been picked up consecutively for a predetermined number of times. As shown in FIG. Up to step 110, the suction error processing for one component is completed.
[0014]
Thereafter, in step 111, the NC program in FIG. 5 (a) and the memory of the non-adsorbed parts in the microcomputer control device 42 are searched for whether there is any non-adsorbed parts other than out of parts. Returning to 102, the suction operation for the part is performed. In addition, when the suction of all the parts other than the parts out is completed, it is checked in step 112 whether there is any part out of parts. If there is a part out, the part replenishment is waited in step 115, and the operation returns to step 102 to resume the operation. To do.
[0015]
Further, when there is no unmounted component or no component is out, it indicates that the mounting of the board is completed. Therefore, in step 113, it is determined whether or not the operation is finished. If the operation is continued, the board is replaced in step 114. Returning to step 102, the next board mounting operation is started.
[0016]
[Problems to be solved by the invention]
However, in the conventional component mounting method in the component mounting apparatus as described above, the component mounting apparatus normally has a condition that the same electronic component is mistakenly picked up a predetermined number of times as a criterion for determining whether the component is out. On the other hand, in the large component adsorption error detection function, the operation is stopped only when the electronic component is mistakenly picked once under the condition that the electronic component is missed once. Until it is determined that the part is out of stock and it is judged that the part is out of stock, the operation is stopped every time a suction error occurs, and the operation rate of the component mounting apparatus is lowered.
[0017]
Further, when the supply component is a large component, when a carrier tape feed failure occurs in the component supply device, the carrier tape press of the component supply device may be pushed up because the component thickness is thick. Therefore, when a suction error occurs due to such a feeding failure, if the component supply table is automatically moved to the standby position like a normal component cut, if the carrier tape press is pushed up, There is a risk that the carrier tape presser interferes with other parts. For this reason, when a large part is picked up, it is common to stop the parts supply table on the spot. The table stops on the spot, and the stopped component supply table must be manually moved to the standby position, which also causes a reduction in the operating rate of the component mounting apparatus. Also had problems.
[0018]
The present invention solves the above-mentioned problems, and even when supplying large parts, without stopping the cutter provided for cutting the carrier tape after sucking the parts, the operation stop at the time of sucking mistake and its There is provided a component mounting method capable of minimizing the manual operation for moving the component supply table to the standby position at the time and minimizing the operation rate of the component mounting apparatus.
[0019]
[Means for Solving the Problems]
In order to solve the above-described problems, the component mounting method of the present invention stores a plurality of types of components in a plurality of types for each type. Carrier tape Multiple parts feeder To the suction position, Take out the part and hold it And cut the carrier tape after gripping the parts with a cutter Then, when it is determined that the component is gripped, for the component mounting apparatus that automatically mounts the component, In the operation program of the component mounting apparatus, specify component information specifying whether the size of each component supply device is large or small, A first step of detecting and storing that a specific component supply device among the plurality of component supply devices is replenished, and the specific component supply device immediately after replenishment of the component detected in the first step When removing parts from That Parts are Taken out A second step of determining whether or not it is gripped; It is determined that the size of the component to be gripped based on the component information is large, and When it is determined that the part is not gripped in the second step, the third step of stopping the part taking-out operation is performed at that time.
[0020]
By this method, even when supplying large parts, without stopping the cutter provided for cutting the carrier tape after picking up the parts, the operation stop at the time of picking up and the standby position of the parts supply table at that time It is possible to suppress the manual operation for the movement every time to the minimum necessary, and to suppress the decrease in the operation rate of the component mounting apparatus.
[0021]
DETAILED DESCRIPTION OF THE INVENTION
In the component mounting method according to the first aspect of the present invention, a plurality of types of components are collected and stored for each type. Carrier tape Multiple parts feeder To the suction position, Take out the part and hold it And cut the carrier tape after gripping the parts with a cutter Then, when it is determined that the component is gripped, for the component mounting apparatus that automatically mounts the component, In the operation program of the component mounting apparatus, specify component information specifying whether the size of each component supply device is large or small, A first step of detecting and storing that a specific component supply device among the plurality of component supply devices is replenished, and the specific component supply device immediately after replenishment of the component detected in the first step When removing parts from That Parts are Taken out A second step of determining whether or not it is gripped; It is determined that the size of the component to be gripped based on the component information is large, and When it is determined that the part is not gripped in the second step, the third step of stopping the part taking-out operation is performed at that time.
[0022]
In the component mounting method according to claim 2, a plurality of types of components are collected and stored for each type. Send out the carrier tape to the suction position of the parts Multiple parts feeder And the carrier tape Remove the part from And hold Component gripping means; A cutter for cutting the carrier tape after the component is gripped; By the component gripping means Said Implementation of picking up and gripping parts , And taking out the parts from the plurality of parts supply devices Grip Mounting control means for controlling the order of operations, component replenishment detection means for detecting and storing that a specific part supply device among a plurality of parts is replenished, and the component gripping means By the above Removing parts Grip Its parts after operation But Grip Is For a component mounting apparatus comprising component detection means for determining whether or not In the operation program of the component mounting apparatus, specify component information specifying whether the size of each component supply device is large or small, A first step of detecting and storing that a part has been replenished in the specific part supply device by the part replenishment detection means, and the specific part supply device from the specific part supply device immediately after the part replenishment detected in the first step When taking out a component by the component gripping means, the component gripping means removes the component by the component detection means. Take out A second step of determining whether or not it is gripped; Based on the component information, it is determined that the size of the component gripped by the component gripping means is large, and When it is determined in the second step that the component gripping means is not gripping the component, at that time, the mounting control unit performs a third step of stopping the component take-out operation. .
[0023]
The component mounting method according to claim 3 is: Claim 1 or As a third step according to claim 2, when the component gripping means is not gripping a component, the component supply unit that has been the target of the component take-out operation by the component gripping means from that point onward is supplied. It is a method of stopping the part taking-out operation only for the apparatus.
[0024]
The component mounting method according to claim 4 is: Claim 1 or As a third step according to claim 2, when the component gripping means does not grip a component, if there is a spare component supply device that stores a component of the same type as that component, from that point, The mounting control means stops the part taking-out operation from the part supply apparatus that was the target of the part taking-out operation by the part gripping means, and takes out the part from the spare part supply apparatus.
[0025]
According to these methods, large parts such as SOP and QFP have a large suckable area due to air pressure, and are difficult to cause suction mistakes, and the carrier tape is not set correctly when the parts supply device is refilled. In most cases, suction mistakes occur. These tend to concentrate at the initial stage after replenishment of parts, and after that, there is a tendency that suction mistakes do not occur until the parts run out. The function is made to function only at the initial stage after replenishing parts, and if a suction error occurs after that, it is processed as a part shortage. Continue implementation.
[0026]
Hereinafter, a component mounting method according to an embodiment of the present invention will be specifically described with reference to FIGS. 1, 2, and 3.
First, an operation program used in the rotary head type component mounting apparatus shown in FIG. 1 will be described with reference to FIG.
[0027]
The operation program shown in FIG. 3A is called an NC program, and designates the mounting order of components, the mounting position, and the number of the component supply device that takes out the components. This NC program is equivalent to the NC program of FIG. 5A shown as a conventional example.
[0028]
The operation program shown in FIG. 3B is referred to as an arrangement program, and designates information on components stored in each component supply apparatus. Of these, the spare number column indicates the number of the component supply device used as a spare when the component supply device is out of components. In the case of FIG. 3B, the first component supply is shown. This indicates that the apparatus has no spare, the spare for the second component supply apparatus has the spare for the third and third component supply apparatuses, and the spare for the fourth and fourth component supply apparatuses has no spare. In addition, the part dimension column indicates the vertical dimension and horizontal dimension values of the part. The other items are the same as the array program of FIG. 5B shown as the conventional example.
[0029]
Next, a configuration example of a component mounting apparatus in which the component mounting method of the present embodiment is used will be described with reference to FIG.
The mechanical structure itself of the component mounting apparatus in which this component mounting method is used is the same as that shown in FIG. Therefore, description will be made based on FIG. In the component mounting apparatus shown in FIG. 1, the rotating body 35 and the nozzles 36a, 36b, 36c, 36d correspond to the component gripping means, the microcomputer control device 42 corresponds to the mounting control means, and the line sensor 40 or the video camera 41 is the component. It corresponds to detection means. Further, parts corresponding to the component replenishment detecting means are a component replenishment memory 48 and a component replenishment switch 46. In the part-out memory 45, the microcomputer control unit 42 writes the number of the part supply device that is out of parts during operation. Further, when the parts replenishment switch 46 is pushed by a person, the microcomputer control device 42 senses this, and at that time, the parts replenishment has been performed for the parts supply apparatuses of all the numbers stored in the parts shortage memory 45. Judgment is made, and the contents of the component shortage memory 45 are copied to the component supplement memory 48.
[0030]
Here, when the operation program 47 used for operation is switched, it is not possible to determine which parts have been replenished. Therefore, it is assumed that all the parts supply apparatuses used for operation have been replenished, and all the parts supply apparatuses Is written in the component replenishment memory 48. Of the component supply devices determined to be replenished in this way, the large component suction error detection function is performed only for the component supply device on which large components are mounted. Whether or not it is a large component is determined by whether or not a large component is specified in the arrangement program of FIG. It is also possible to determine whether a part is a large part from the part dimensions described in the array program.
[0031]
Next, the operation of the component mounting apparatus will be described with reference to FIG. 2 showing a flowchart of the component mounting method of the present embodiment used in the component mounting apparatus.
First, when starting the operation of the component mounting apparatus, since it is not possible to determine which component is immediately after replenishment, it is assumed in step 1 that all components are components immediately after replenishment, and the numbers of all component supply devices Is stored in the component replenishment memory 48 of FIG. Step 1 is an example corresponding to the first step of each claim of the present invention.
[0032]
Subsequently, the mounting operation of each component is started. First, in step 2, whether or not the component to be sucked next is already determined to be out of component is checked by the component out memory 45 of FIG. For example, in step 3, the component is sucked and held by the nozzle. Next, in step 4, it is checked whether or not there is a suction error by the component inspection means. Here, when the line sensor 40 of FIG. 1 is used as the component inspection means, it is determined that a suction error has occurred when the measured value does not fall within a predetermined range. Further, when the video camera 41 of FIG. 1 is used as the component inspection means, it is determined that a suction error has occurred when there is no image that matches the component dimensions registered in the array program in the captured screen. In addition to the above, there is a method of using a normal photosensor as the component inspection means. In this case, an adsorption error is determined based on whether the sensor is in an ON state or an OFF state.
[0033]
If it is determined in step 4 that there is no suction error, the component is mounted on the substrate in step 5 and the mounting operation for the component is terminated. However, in the rotary head type component mounting apparatus as shown in FIG. 1, since processing for a plurality of components is performed in parallel, only memory that can be mounted is registered at this point, and at a predetermined timing. You may make it perform mounting operation. When the component is registered, if the component is registered in the component replenishment memory 48, the storage is deleted. As a result, since it is determined that the component is not immediately after the component replenishment at the next and subsequent adsorption, the component is excluded from the large component adsorption error detection function.
[0034]
On the other hand, if it is determined in step 4 that a suction error has occurred, the part is stored as a non-sucked part in a memory (not shown) in the microcomputer control device 42 in step 6. This stored content is used when determining the next suction component in step 2, and is also used when checking the presence or absence of the unsucked component in later step 11. Thereafter, in step 7, it is checked whether or not the part is a large part by referring to the arrangement program shown in FIG. Further, if it is found that a large component has been picked up, it is determined in step 8 whether it is immediately after component replenishment, based on whether it is registered in the component replenishment memory 48 of FIG. Here, the definition immediately after component replenishment may be the first suction after component replenishment, or may be the suction at a predetermined number of times after component replenishment.
[0035]
Of the above processes, steps 4 to 7 are processes corresponding to the second step of each claim in the present invention.
If it is determined in step 8 that the component has just been replenished, this corresponds to a case where a large component suction error has occurred, and the subsequent abnormality processing is performed.
[0036]
Here, if it is a case corresponding to Claim 1 and Claim 2, it transfers to step 19 through the route | root of a in a figure, and the driving | operation of a component mounting apparatus is stopped at that time. Steps 8 and 19 are processes corresponding to the third step of claims 1 and 2. Thereafter, if the error is canceled in step 20, the large part that has been picked up in step 16 is regarded as having been replenished, and is registered in the part replenishment memory 48 of FIG. 1, and the operation returns to step 2 to resume the operation. As a result, even if the component is mistakenly picked up next time, it is determined that the component has just been replenished, so that the operation is stopped at that point. Step 16 is an example corresponding to the first step of each claim of the present invention.
[0037]
If it is determined in step 8 that the part has just been refilled and if it corresponds to claim 3, the step through the route b in FIG. 10, the component is regarded as being out of component and stored in the component out of memory 45 of FIG. As a result, even if the component is to be picked up next time, the step of skipping the component that has run out of the component in step 2 can be prevented from being picked up. This step 8 is a process corresponding to the third step of claim 3.
[0038]
If it is determined in step 8 that the part has just been replenished, and if it corresponds to the fourth aspect, then in order to perform the operation of taking out the spare part, step 17 in FIG. Migrate to In step 17, it is checked whether there is a spare part supply device by the arrangement program shown in FIG. 3B, and if there is no spare, the process proceeds to step 19 and the operation is stopped. If there is a spare, in step 18, the part supply device number for picking up parts from the next time is switched to the spare number. Steps 8, 17 and 18 are processes corresponding to the third step of claim 4.
[0039]
In the case of a component mounting apparatus having a plurality of component supply tables, as a method of switching to a spare component supply apparatus, a method based on the replacement operation of the component supply table is possible in addition to the method of referring to the arrangement program. This method sets component supply devices in the same arrangement in each component supply table, and if a large component adsorption error occurs in a certain component supply table, it switches to another component supply table after the next time that the component is taken out. To continue driving. Since current component mounting apparatuses generally have a plurality of component supply tables, this method can be easily applied.
[0040]
If it is determined in step 8 that it is not immediately after component replenishment, even a large component is processed in the same manner as a normal component, and the process proceeds to step 9. In step 9, it is checked whether or not the suction for the part has been continuously missed for a predetermined number of times, and if so, in step 10 the part is stored as a part out in the part out of memory 45 of FIG. 1. . Up to step 10, the process of picking up mistakes for one component is completed.
[0041]
Thereafter, in step 11, whether there is any unsucked parts other than parts out of the machine is searched from the NC program shown in FIG. 3A and the unsucked parts memory in the microcomputer control device 42. For example, the process returns to step 2 to perform the suction operation for the part. In addition, when the suction of all parts other than parts is finished, it is checked in step 12 whether there are parts that are out of parts. The stored component supply device number is stored in the component replenishment memory 48 shown in FIG. This step 16 is a process corresponding to the first step of each claim of the present invention.
[0042]
In addition, when there is no unmounted component and no component is cut off, it indicates that the mounting of the board is completed. Therefore, it is determined in step 13 whether or not the operation is finished. If the operation is continued, the board is replaced in step 14. Thereafter, the process returns to step 2 to shift to the next board mounting operation.
[0043]
As described above, the large component supply error detection function that stops operation for each suction error is made to function only in the initial stage after the component replenishment. Even in the case of large parts, it is possible to continue mounting other parts by skipping only parts that have run out of parts.
[0044]
As described above, even when large parts are supplied, the cutter provided for cutting the carrier tape after picking up the parts is not damaged, and the operation is stopped when the picking mistake occurs and the parts supply table is moved to the standby position. For this reason, it is possible to suppress the occurrence of manual operation for each time to the minimum necessary, and to suppress a reduction in the operating rate of the component mounting apparatus.
[0045]
【The invention's effect】
As described above, according to the present invention, the cause of a mistake in sucking a large component is distinguished between a case where a carrier tape feeding failure occurs due to a component replenishment error and a case where a simple component breakage occurs. Only in cases can the operation be stopped.
[0046]
Therefore, even when the large component suction error detection function is used, unnecessary operation stop can be eliminated.
In addition, even if a large component is picked up and mistakenly picked up, there is no risk of damage to the equipment unless the component supply device is used. However, the stop due to a large component adsorption error can be caused only once at the end of the mounting of the board.
[0047]
Therefore, unnecessary operation stop can be eliminated more efficiently than the above. Even if a large part is picked up, the operation will continue as long as there is a spare part, so when parts including the spare part run out, replenish and check the parts all at once. be able to.
[0048]
Therefore, it is possible to eliminate the occurrence of the operation stop itself due to a large component adsorption mistake, and it is possible to eliminate the unnecessary operation stop dramatically and efficiently.
As described above, even when large parts are supplied, the cutter provided for cutting the carrier tape after picking up the parts is not damaged, and the operation is stopped when the picking mistake occurs and the parts supply table is moved to the standby position. For this reason, it is possible to suppress the occurrence of manual operation for each time to the minimum necessary, and to suppress a reduction in the operating rate of the component mounting apparatus.
[Brief description of the drawings]
FIG. 1 shows a configuration example of a general component mounting apparatus.
FIG. 2 is a flowchart showing a component mounting method according to the embodiment of the present invention.
FIG. 3 is an operation program of the component mounting apparatus according to the embodiment;
FIG. 4 is a flowchart showing a conventional component mounting method.
FIG. 5 shows an operation program of the component mounting apparatus in the conventional example.
[Explanation of symbols]
35 Rotating body
40 line sensor
41 video camera
42 Microcomputer control device
45 Out-of-part memory
46 Parts replacement switch
36a, 36b, 36c, 36d Nozzle

Claims (4)

Multiple types of parts are gathered for each type, and the stored carrier tape is sent to the suction position by multiple parts supply devices . The parts are picked up and gripped, and the carrier tape after gripping the parts is cut with a cutter. Then, when it is determined that the component is gripped, for the component mounting apparatus that automatically mounts the component,
In the operation program of the component mounting apparatus, specify component information specifying whether the size of each component supply device is large or small,
A first step of detecting and storing that a specific component supply device of the plurality of component supply devices is replenished;
When removing the device from its particular component supplying device immediately detected parts replenishment in the first step, a second step of determining whether the component is gripped is taken out,
When it is determined that the size of the gripped part is large based on the part information and it is determined that the part is not gripped in the second step, at that time, the part is picked up. A component mounting method for executing the third step of canceling. A plurality of component supply devices that collect a plurality of types of components for each type and store the respective carrier tapes to the suction position of the components ;
And parts gripping means for gripping and Eject the component from the carrier tape,
A cutter for cutting the carrier tape after the component is gripped;
A mounting control means for controlling the order in which the object of extraction gripping operation of the component relative to the implementation of the by the component gripping means part extraction gripping operation, and the plurality of component supply device,
Component replenishment detection means for detecting and storing that a part has been replenished in a specific part supply device among a plurality of parts;
To the component mounting apparatus to which the component after extraction gripping action of the part and a determining part detecting means whether it is held by the component holding means,
In the operation program of the component mounting apparatus, specify component information specifying whether the size of each component supply device is large or small,
A first step of detecting and storing that a part has been replenished in the specific part supply device by the part replenishment detection means;
Whether or not the component gripping means takes out and grips the component by the component detection means when the component gripping means takes out the component from the specific component supply apparatus immediately after the component replenishment detected in the first step. A second step of determining
When it is determined that the size of the component gripped by the component gripping unit is large based on the component information and it is determined that the component gripping unit does not grip the component in the second step, A component mounting method for executing a third step of stopping the component take-out operation by the mounting control means at the time. As the third step, when the component gripping means does not grip the component, from that point on, only the component supply device that is the target of the component take-out operation by the component gripping means by the mounting control means, The component mounting method according to claim 1 , wherein the component take-out operation is stopped. As a third step, when the component gripping means does not grip the component, if there is a spare component supply device that stores a component of the same type as that component, from that point on, the mounting control means discontinue the part of the take-out operation from the component supply device which was the subject of part of extraction operation by the component holding means, the component mounting according to claim 1 or claim 2 taken out parts from the spare component feed device Method.

Images