JP3615920B2 - Electronic component mounting method - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to an electronic component mounting method in which an electronic component is held by a mounting head and mounted at a predetermined position on a circuit board.
[0002]
[Prior art]
In recent years, electronic component mounting apparatuses are required to have high-speed and highly reliable component mounting performance. In a conventional electronic component mounting apparatus, a component is taken out and held by a mounting head from a component supply unit that accommodates the component, a component holding unit is detected by a component detection unit, and the component is rotated in an arbitrary direction by a rotating unit. And is configured to be mounted on the substrate at a predetermined mounting position. On the other hand, a table for positioning the substrate at a predetermined position is provided below the mounting head, and a substrate detection unit provided in the vicinity of the mounting head is configured to detect the installation position of the substrate on the table. . Recognition marks for detecting the position of the substrate are provided at corners at both ends of the substrate.
[0003]
A component mounting method using the electronic component mounting apparatus configured as described above will be described.
[0004]
First, based on the program, move the board on the table to the board detection unit, measure how far the board position is from the normal position, and simultaneously move the mounted component specified by the component supply unit to the take-out position. Take out the parts with the mounting head. Then, the component detection unit detects whether or not the component taken out by the mounting head has been correctly taken out, and the component is directed to the specified mounting direction by the rotating unit, while the table is corrected according to the detection position of the board. While moving, the board is moved to a predetermined mounting position and positioned, and the operation of mounting the component on the board with the mounting head is repeated to perform a series of mountings.
[0005]
[Problems to be solved by the invention]
However, in the above-described conventional configuration, if the position of the substrate on the table is shifted during mounting or if a position shift occurs due to a signal error of the positioning encoder of the motor that positions the table, it cannot be detected. However, there is a problem that the mounting component cannot be mounted at an accurate position, and a defective substrate is produced and passed to a subsequent process.
[0006]
In view of the above-described conventional problems, an object of the present invention is to provide an electronic component mounting method capable of appropriately detecting a positional deviation of a substrate and performing highly reliable substrate production.
[0007]
[Means for Solving the Problems]
Electronic component mounting method of the present invention comprises a substrate upon by eject the by Ri parts mounting head from the component supply unit is mounted on the substrate, for detecting the position of the detected and board recognition marks formed on a substrate It has a detection process, and before mounting the component taken out by the mounting head to the specified component mounting position on the board, the component mounting position is corrected based on the detection result obtained in the board detection process, and the component is mounted. After the mounting, the position of the recognition mark is detected again by the substrate detection process, and the value compared with the value detected before mounting exceeds a certain amount. Therefore, it is possible to prevent the defective substrate from flowing into the subsequent process, and to perform highly reliable substrate production.
[0008]
Further, if a warning is issued when the value obtained by comparing the positions of the recognition marks detected before and after mounting exceeds a certain amount, the operator can be notified immediately and necessary measures can be taken quickly.
[0009]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, an embodiment of an electronic component mounting method of the present invention will be described with reference to FIGS.
[0010]
In FIG. 1 showing the overall configuration of the electronic component mounting apparatus, reference numeral 1 denotes a mounting head, which takes out a component 3 from a component supply unit 2 that accommodates the component, and mounts the component 3 on a substrate 4.
[0011]
The component detection unit 5 detects whether or not the component 3 has been properly taken out by the mounting head 1. Reference numeral 6 denotes a rotating unit for rotating the posture of the component 3 in an arbitrary direction. A table 7 is provided below the mounting head 1 and the substrate 4 placed on the table 7 is moved to the mounting position for positioning. A substrate detector 8 for detecting the position of the substrate is provided in the vicinity of the mounting head 1 and a pair of recognition marks 9 for detecting the position of the substrate 4 on the diagonal line is provided on the substrate 4 as shown in FIG. Is provided at the corner.
[0012]
An electronic component mounting method by the electronic component mounting apparatus configured as described above will be described.
[0013]
First, the substrate 4 on the table 7 is moved to the substrate detection unit 8 based on the program, and the substrate detection unit 8 recognizes the position of the recognition mark 9 on the substrate 4 to determine how much the position of the substrate 4 is different from the normal position. Measure whether or not On the other hand, at the same time, the designated component 3 is moved to the takeout position in the component supply unit 2 and taken out by the mounting head 1.
[0014]
Then, the component detection unit 5 detects whether or not the component 3 taken out by the mounting head 1 has been correctly taken out, and directs the component 3 in the specified mounting direction by the rotating unit 6, while the table 7 is set to a regular one. The position of the table 7 is corrected and positioned according to the detection position of the substrate 4, and then the component 3 is mounted at a predetermined position on the substrate 4.
[0015]
Thereafter, the component 3 is taken out from the component supply unit 2 by the mounting head 1, detected by the component detection unit 5, rotated by the rotation unit 6, and the substrate 4 is corrected by the table 7 according to the detection result and positioned. The operation of mounting the component 3 on the substrate 4 is repeated according to the program to perform a series of mounting.
[0016]
Position correction during the mounting operation will be described. In FIG. 3, 9a is the position of the recognition mark 9 when the substrate 4 is in a normal position, 9b is the position of the actual recognition mark 9, and 10 is an electrode on which the component 3 formed on the substrate 4 is mounted. 10a is a normal position and 10b is an actual position. Before mounting, the positional deviation amounts ΔXa and ΔYa between the regular position 9a and the actual position 9b of the recognition mark 9 are measured, and the component 3 is corrected and mounted by the measured positional deviation amount. 10 actual positions 10b can be sequentially mounted.
[0017]
However, as shown in FIG. 4, when the substrate 4 is shifted by ΔXb and ΔYb for some reason during the mounting operation, the component 3 to be mounted on the shifted electrode 10c is mounted at the position of the electrode 10b before the substrate 4 is shifted. As a result, all the electronic components to be mounted thereafter are poorly mounted on the electrodes 10 and the circuit as a whole substrate is also defective.
[0018]
In the present embodiment, after the mounting operation on the substrate 4 is completed, the position 9c of the recognition mark 9 is measured again, compared with the position 9b of the recognition mark 9 measured before the mounting operation, and the measured ΔXb and ΔYb are When a certain amount that causes mounting failure is exceeded, a command is given to a control unit of a facility (not shown) as a defective substrate, and a warning is issued to notify the operator.
[0019]
FIG. 5 shows an outline of the above operation.
[0020]
Thus, it is possible to prevent the substrate 4 from being displaced during the mounting operation and mounting the component 3 at an accurate position, and even when a defective substrate is produced, it is prevented from flowing to a subsequent process.
[0021]
【The invention's effect】
According to the electronic component mounting method of the present invention, as is apparent from the above description, the position of the substrate before mounting the electronic component and the position of the substrate after mounting the electronic component are detected and compared, and the substrate during the mounting operation By reliably detecting the mounting displacement due to the positional displacement, it is possible to prevent the defective substrate from flowing into the post-process, and to implement highly reliable electronic component mounting.
[0022]
In addition, by issuing a warning, the worker can be notified immediately and necessary measures can be taken quickly.
[Brief description of the drawings]
FIG. 1 is a perspective view of an electronic component mounting apparatus to which an electronic component mounting method of the present invention is applied.
FIG. 2 is a plan view of a substrate in the electronic component mounting apparatus.
FIG. 3 is a plan view of a substrate in an embodiment of the electronic component mounting method of the present invention.
FIG. 4 is a plan view for explaining the operation when the substrate moves during mounting in the embodiment;
FIG. 5 is a flowchart showing an outline of an operation in the embodiment.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Mounting head 2 Component supply part 3 Component 4 Board | substrate 8 Board | substrate detection part 9 Recognition mark

Claims (2)

Upon from the component supply unit eject the by Ri parts mounting head for mounting on a substrate, comprising a substrate detection step of detecting a position of a detected and board recognition marks formed on the substrate, the mounting head Prior to mounting the picked-up component at a predetermined component mounting position on the board, the component mounting position is corrected based on the detection result obtained in the board detection process, and the component is mounted again after mounting. An electronic component mounting method comprising: detecting a position of the recognition mark , and determining that the value compared with a value detected before mounting exceeds a certain amount . 2. The electronic component mounting method according to claim 1, wherein a warning is issued when a value obtained by comparing the positions of the recognition marks detected before and after mounting exceeds a certain amount.

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