JPH11177299A - Electronic component mounting method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To prevent a failure board from being sent to a subsequent process by detecting the position of a board prior to electronic component mounting and that after the electronic component mounting, comparing the detected positions, and detecting the mounting deviation clue to the positional deviation of the board during mounting operation. SOLUTION: Prior to mounting a component 3, the positional deviation quantities of the actual position 9b of a recognition mark 9 from its correct position 9a, i.e., ΔXa and ΔYa, are measured. Then, the component 3 is mounted by correcting the position by the measured positional deviation quantities, and the components 3 are successively mounted at the actual positions of an electrode 10. When mounting operation to a board 4 is completed, the position of the recognition mark 9 is remeasured, is compared with the position 9b measured prior to the mounting operation, and when the positional deviation exceeds a fixed quantity that causes mounting failure, a control part is instructed to give the alarm to the operator to inform the operator that the workpiece is a failure board. Thus, even when a failure board is manufactured by not mounting the component at the correct position due to the positional deviation of the board during mounting operation, the failure board is prevented from being sent to the subsequent process.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for mounting an electronic component on a circuit board while holding the electronic component with a mounting head.

[0002]

2. Description of the Related Art In recent years, high-speed and highly reliable component mounting performance has been required for electronic component mounting apparatuses. In a conventional electronic component mounting apparatus, a component is taken out from a component supply unit containing the component and held by a mounting head, a component detection unit detects a holding position of the component, and a rotating unit rotates the component in an arbitrary direction. It is configured to be mounted on a substrate at a predetermined mounting position. On the other hand, a table for positioning the substrate at a predetermined position is provided below the mounting head, and a substrate detection unit provided near the mounting head is configured to detect the installation position of the substrate on the table. . Recognition marks for detecting the position of the substrate are provided at the corners at both ends of the substrate.

A component mounting method using the electronic component mounting apparatus configured as described above will be described.

First, the board on the table is moved to the board detecting section based on a program, and the position of the board is measured to determine how much the board is located at the correct position. And take out the parts with the mounting head. Then, the component detection unit detects whether the component taken out by the mounting head is correctly taken out, and turns the component in the specified mounting direction by the rotating unit, while correcting the table according to the detection position of the board. While the substrate is being moved, the substrate is moved to a predetermined mounting position and positioned, and the operation of mounting components on the substrate by the mounting head is repeated to perform a series of mounting.

[0005]

However, in the above-described conventional configuration, when the mounting position of the substrate on the table is shifted during mounting, or when the positioning error occurs due to a signal error of the positioning encoder of the motor for positioning the table, the positioning error occurs. However, this cannot be detected, and the mounted component cannot be mounted at an accurate position, resulting in a problem that a defective board is produced and sent to a subsequent process.

An object of the present invention is to provide an electronic component mounting method capable of appropriately detecting a displacement of a substrate and producing a highly reliable substrate in view of the above-mentioned conventional problems.

[0007]

According to the electronic component mounting method of the present invention, when a predetermined component is sequentially taken out from a component supply unit by a mounting head and mounted on the substrate, a recognition mark formed on the substrate is detected. It has a board detection step of detecting the position of the entire board, and before mounting the component taken out by the mounting head to a predetermined component mounting position of the board, the component mounting position based on the detection result obtained in the board detection step. After mounting is completed, the position of the board is detected again by the board detection process after mounting is completed, and compared with the position detected before mounting. In addition, it is possible to prevent the defective substrate from flowing to a subsequent process, and to perform highly reliable substrate production.

Further, if a warning is issued when a value obtained by comparing the positions detected before and after the mounting exceeds a certain fixed amount, the worker can be immediately notified and necessary countermeasures can be taken promptly.

[0009]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS One embodiment of an electronic component mounting method according to the present invention will be described below with reference to FIGS.

In FIG. 1 showing the overall configuration of the electronic component mounting apparatus, reference numeral 1 denotes a mounting head, which takes out a component 3 from a component supply unit 2 containing the component, and mounts the component 3 on a substrate 4.

The component detecting section 5 detects whether or not the component 3 has been properly taken out by the mounting head 1. Reference numeral 6 denotes a rotating unit for rotating the posture of the component 3 in an arbitrary direction. A table 7 is provided below the mounting head 1, and a substrate 4 mounted on the table 7 is provided.
Is moved to the mounting position for positioning. In the vicinity of the mounting head 1, a board detection unit 8 for detecting the position of the board is provided, and a recognition mark 9 for detecting the position is provided on the board 4 as shown in FIG. Is provided at the corner.

An electronic component mounting method using the electronic component mounting apparatus configured as described above will be described.

First, the substrate 4 on the table 7 is moved to the substrate detecting section 8 based on a program, and the position of the recognition mark 9 of the substrate 4 is recognized by the substrate detecting section 8 so that the position of the substrate 4 becomes a regular position. And measure how much. On the other hand, at the same time, the designated component 3 is moved to the take-out position in the component supply unit 2 and taken out by the mounting head 1.

Then, the component 3 taken out by the mounting head 1
The component detector 5 detects whether or not the
The rotating unit 6 directs the component 3 in the specified mounting direction, while moving the table 7 to a regular position and correcting and positioning the table 7 in accordance with the detected position of the board 4. The component 3 is mounted at a predetermined position 4.

Thereafter, the component 3 is taken out from the component supply unit 2 by the mounting head 1, detected by the component detection unit 5, rotated by the rotating unit 6, and corrected by the table 7 according to the detection result of the substrate 4. The operation of mounting the component 3 on the substrate 4 is repeated according to a program, and a series of mounting is performed.

The position correction during the mounting operation will be described. In FIG. 3, reference numeral 9a denotes a position of the recognition mark 9 when the substrate 4 is at a regular position, 9b denotes a position of the actual recognition mark 9, and 10 denotes an electrode on which the component 3 formed on the substrate 4 is mounted. Where 10a is the normal position, 10a
b is the actual position. Before mounting, the positional deviation amounts ΔXa and ΔX between the regular position 9a and the actual position 9b of the recognition mark 9 are set.
By measuring Ya and correcting the component 3 by the measured amount of displacement, the component 3 can be sequentially mounted at the actual position 10b of the electrode 10.

However, as shown in FIG. 4, when the substrate 4 is displaced by ΔXb and ΔYb for some reason during the mounting operation, the component 3 to be mounted on the displaced electrode 10c is the same as that of the electrode 10b before the substrate 4 is displaced. This means that the electronic components mounted afterwards will have poor mounting on the electrode 10 and the circuit as a whole substrate will also be defective.

In this embodiment, after the mounting operation on the substrate 4 is completed, the position 9c of the recognition mark 9 is measured again, and the position 9b of the recognition mark 9 measured before the mounting operation is compared.
If the measured ΔXb and ΔYb exceed a certain amount that causes mounting failure, a command is issued to a control unit of equipment (not shown) as a defective board, and a warning is issued to notify the worker.

FIG. 5 schematically shows the following operation.

Thus, it is possible to prevent the board 4 from being displaced during the mounting operation, preventing the component 3 from being mounted at an accurate position, and preventing a defective board from being sent to a post-process even when a defective board is produced. Can be.

[0021]

According to the electronic component mounting method of the present invention, as is clear from the above description, the position of the board before mounting the electronic component and the position of the board after mounting the electronic component are detected and compared. By reliably detecting the mounting displacement due to the positional displacement of the board during the mounting operation, it is possible to prevent the defective board from flowing to the subsequent process, and to implement highly reliable mounting of electronic components.

By issuing a warning, the worker can be immediately notified, and necessary measures can be taken promptly.

[Brief description of the drawings]

FIG. 1 is a perspective view of an electronic component mounting apparatus to which an electronic component mounting method of the present invention is applied.

FIG. 2 is a plan view of a board in the electronic component mounting apparatus.

FIG. 3 is a plan view of a substrate in an electronic component mounting method according to an embodiment of the present invention.

FIG. 4 is a plan view illustrating an operation of the embodiment when a substrate moves during mounting.

FIG. 5 is a flowchart showing an outline of an operation in the embodiment.

[Explanation of symbols]

 REFERENCE SIGNS LIST 1 mounting head 2 component supply unit 3 component 4 substrate 8 substrate detection unit 9 recognition mark

 ──────────────────────────────────────────────────の Continuing on the front page (72) Inventor Koji Yasushi Hamasaki 1006 Kazuma Kadoma, Osaka Pref. Matsushita Electric Industrial Co., Ltd. (72) Inventor Yoichi Makino 1006 Odaka Kadoma Kadoma, Osaka Pref. Matsushita Electric Industrial Co., Ltd.

Claims (2)

[Claims] 1. A board detecting step for detecting a recognition mark formed on a board and detecting a position of the whole board when a predetermined component is sequentially taken out from a component supply unit by a mounting head and mounted on the board. Prior to mounting the component taken out by the mounting head to a predetermined component mounting position on the board, component mounting was performed while correcting the component mounting position based on the detection result obtained in the board detection process, and mounting was completed. An electronic component mounting method, wherein the position of the substrate is detected again in a substrate detection step and compared with the position detected before mounting. 2. The electronic component mounting method according to claim 1, wherein a warning is issued when a value obtained by comparing the positions detected before and after the mounting exceeds a certain fixed amount.