JPH10284899A - Method for recognizing electronic component - Google Patents
Method for recognizing electronic componentInfo
- Publication number
- JPH10284899A JPH10284899A JP9081766A JP8176697A JPH10284899A JP H10284899 A JPH10284899 A JP H10284899A JP 9081766 A JP9081766 A JP 9081766A JP 8176697 A JP8176697 A JP 8176697A JP H10284899 A JPH10284899 A JP H10284899A
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- tray
- mark
- mounting
- board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Automatic Assembly (AREA)
- Supply And Installment Of Electrical Components (AREA)
Abstract
Description
【0001】[0001]
【発明の属する技術分野】本発明は、基板に電子部品を
実装する際に、その電子部品を基板上に正確に装着する
ための電子部品認識方法に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component recognizing method for accurately mounting an electronic component on a substrate when the electronic component is mounted on the substrate.
【0002】[0002]
【従来の技術】従来から、電子部品実装装置などにより
基板に電子部品を実装する際には、通常、実装する電子
部品を基板上に正確に装着するために、部品認識装置な
どを利用して、基板上に装着する電子部品に対する部品
認識が行われている。2. Description of the Related Art Conventionally, when an electronic component is mounted on a board by an electronic component mounting apparatus or the like, usually, a component recognition device or the like is used to accurately mount the mounted electronic component on the board. Component recognition is performed on electronic components mounted on a substrate.
【0003】以下、従来の電子部品認識方法について、
図面を用いて説明する。図1に示す電子部品実装装置に
おいて、基板5に装着する電子部品11の供給方式の1
つとして、トレイ3に設けた多数の凹部3aに、電子部
品11を格納して供給するトレイ供給方式がある。この
トレイ供給方式により電子部品実装装置に電子部品11
を供給する際には、作業者が、予め、電子部品11を格
納したトレイ3を固定具4に取りつけ、この固定具4を
複数段重ねてケース10内に収納しておく。[0003] Hereinafter, a conventional electronic component recognition method will be described.
This will be described with reference to the drawings. In the electronic component mounting apparatus shown in FIG.
For example, there is a tray supply system in which the electronic components 11 are stored and supplied to a large number of concave portions 3a provided in the tray 3. With this tray supply method, the electronic component 11 is added to the electronic component mounting apparatus.
When supplying the tray, an operator attaches the tray 3 in which the electronic components 11 are stored to the fixture 4 in advance, and stores the fixtures 4 in the case 10 in a plurality of layers.
【0004】このようにしてトレイ3の凹部3aに格納
されている電子部品11を基板5上に装着する際には、
まず、座標軸X、Y、Z上の3次元座標で表される全て
の位置方向に移動可能な装着装置(例えば、負圧を内部
に発生したノズルなど)6が、ケース10の最上段のト
レイ3内にある電子部品11を取り出す。次に、電子部
品11を保持した装着装置6が認識装置7上に移動し、
認識装置7が認識した電子部品11の外観形状から電子
部品11の中心を推定し、装着装置6の中心に対する電
子部品11のずれ量(例えば、X,Y軸方向の各ずれ
量、回転方向のずれ量など)を計算する。When the electronic component 11 stored in the concave portion 3a of the tray 3 is mounted on the substrate 5,
First, a mounting device (for example, a nozzle that generates a negative pressure inside) that can move in all the position directions represented by the three-dimensional coordinates on the coordinate axes X, Y, and Z is mounted on the uppermost tray of the case 10. 3. Take out the electronic component 11 in 3. Next, the mounting device 6 holding the electronic component 11 moves onto the recognition device 7,
The center of the electronic component 11 is estimated from the appearance shape of the electronic component 11 recognized by the recognition device 7, and the shift amount of the electronic component 11 with respect to the center of the mounting device 6 (for example, the shift amount in each of the X and Y axes, the rotation direction). Offset).
【0005】実際に基板5上に電子部品11を装着する
際に、本来装着する位置に対し、装着装置6が上記の
X、Y軸方向のずれ量分だけ動くことにより位置補正し
て電子部品11を基板5上に正確に装着する。When the electronic component 11 is actually mounted on the substrate 5, the mounting device 6 is moved by the above-described displacement amount in the X and Y axes with respect to the original mounting position, and the position is corrected. 11 is accurately mounted on the substrate 5.
【0006】また、基板5上に電子部品11を基板5の
配置方向に対してある角度回転して装着する場合には、
図1に示すように、装着装置6が、電子部品11を取り
出した後に、上記の回転方向のずれ量に基づいて計算し
た回転角による回転指令に応じて矢印Y1のように回転
し、電子部品11を基板5上でその配置方向に対して正
確な向きに装着する。When the electronic component 11 is mounted on the board 5 by rotating the electronic component 11 by a certain angle with respect to the arrangement direction of the board 5,
As shown in FIG. 1, after the mounting device 6 takes out the electronic component 11, the mounting device 6 rotates as indicated by an arrow Y <b> 1 according to a rotation command based on the rotation angle calculated based on the above-described amount of deviation in the rotation direction, and 11 is mounted on the substrate 5 in an accurate direction with respect to the arrangement direction.
【0007】[0007]
【発明が解決しようとする課題】しかしながら上記のよ
うな従来の電子部品実装装置では、電子部品認識方法と
して、認識装置7が認識した電子部品11の外観形状に
基づいて、その電子部品11の装着装置6に対するX,
Y軸方向の各ずれ量および回転方向のずれ量などを測定
し、それらのずれ量を補正して電子部品11を基板5上
に装着するようにしている。However, in the above-mentioned conventional electronic component mounting apparatus, as the electronic component recognition method, the mounting of the electronic component 11 is performed based on the external shape of the electronic component 11 recognized by the recognition device 7. X for device 6,
The shift amount in the Y-axis direction, the shift amount in the rotation direction, and the like are measured, and the shift amounts are corrected so that the electronic component 11 is mounted on the board 5.
【0008】一方、図5に示すように、外観形状的に、
中心点C1で回転対称であり、横・縦・上下・左右の全
てに方向性がない電子部品11であっても、それぞれの
ピンP1に装着すべき定められた向きがあるにもかかわ
らず、上記の電子部品認識方法を用いると、電子部品1
1の装着装置6に対するずれ量は認識するが向きについ
ては認識することができないため、以下のような場合に
は、電子部品11を基板5上で誤った向きに装着(方向
ミス装着という)してしまうという可能性を有してい
た。 (1)作業者が、電子部品11を、図3に示す電子部品
11aのように、その方向を間違えてトレイ3の凹部3
aに格納した場合。 (2)本来ならば、固定具4に対して図4(a)に示す
方向にトレイ3を取り付けるところを、作業者が、トレ
イ3を、図4(b)に示すトレイ3bのように、その方
向を間違えて固定具4に取り付けた場合。On the other hand, as shown in FIG.
Even though the electronic component 11 is rotationally symmetric at the center point C1 and has no direction in all of the horizontal, vertical, vertical, and horizontal directions, there is a predetermined orientation to be mounted on each pin P1. When the above electronic component recognition method is used, the electronic component 1
In the following cases, the electronic component 11 is mounted in the wrong direction on the board 5 (referred to as wrong mounting) because the displacement amount with respect to the first mounting device 6 is recognized but the direction cannot be recognized. Had the potential to end up. (1) The operator places the electronic component 11 in the concave portion 3
When stored in a. (2) Normally, the operator attaches the tray 3 to the fixture 4 in the direction shown in FIG. 4A, as in the case of the tray 3b shown in FIG. When it is attached to the fixture 4 in the wrong direction.
【0009】このような電子部品の方向ミス装着を防止
するため、基板生産工場では、あらかじめ、トレイ3を
固定具4に取り付けることにより固定具4にセットされ
た全ての電子部品11の方向を、作業者が目視により確
認し、上記のような電子部品11のトレイ3への格納ミ
スやトレイ3の固定具4への取り付けミスを発見した場
合には、それらのミスを作業者が手直しするようにして
いる。In order to prevent such mounting of the electronic components in the wrong direction, the board production factory attaches the tray 3 to the fixture 4 in advance so that the directions of all the electronic components 11 set on the fixture 4 can be changed. When the operator visually confirms and finds a mistake in storing the electronic component 11 in the tray 3 or a mistake in attaching the tray 3 to the fixture 4 as described above, the worker corrects the mistake. I have to.
【0010】これらの電子部品に対する目視確認作業や
手直し作業のため、基板生産のための全体の作業効率が
悪化するとともに、その作業者の人件費などにより製品
のコストアップにつながるという問題点を有していた。[0010] The visual confirmation work and the rework work on these electronic components degrade the overall work efficiency for the production of the board and increase the cost of the product due to the labor cost of the worker. Was.
【0011】本発明は、上記従来の問題点を解決するも
ので、基板装着用の電子部品の供給の際に、電子部品の
供給方向に対する目視確認および手直しの作業をなく
し、基板生産の際の全体の作業効率を向上することがで
きるとともに、製品のコストアップを抑えることができ
る電子部品認識方法を提供する。SUMMARY OF THE INVENTION The present invention solves the above-mentioned conventional problems, and eliminates the need for visual confirmation and reworking of the supply direction of electronic components when supplying electronic components for mounting a substrate. Provided is a method for recognizing an electronic component, which can improve the overall work efficiency and can suppress an increase in product cost.
【0012】[0012]
【課題を解決するための手段】上記の課題を解決するた
めに本発明の電子部品認識方法は、基板装着用の電子部
品を供給する際に、その電子部品をトレイに向きを誤っ
て格納したりトレイを固定具に向きを誤って取り付けた
りした場合でも、電子部品を補正回転するための制御指
令に基づいて装着装置を制御し、電子部品を回転してそ
の基板への装着方向に補正することを特徴とする。SUMMARY OF THE INVENTION In order to solve the above-mentioned problems, an electronic component recognition method according to the present invention, when supplying an electronic component to be mounted on a board, stores the electronic component in a tray in a wrong direction. Even if the tray is attached to the fixture incorrectly, the mounting device is controlled based on the control command for correcting and rotating the electronic components, and the electronic components are rotated to correct the mounting direction on the board. It is characterized by the following.
【0013】以上により、基板装着用の電子部品の供給
の際に、電子部品の供給方向に対する目視確認および手
直しの作業をなくし、基板生産の際の全体の作業効率を
向上することができるとともに、製品のコストアップを
抑えることができる。As described above, when supplying the electronic components for mounting the substrate, it is possible to eliminate the work of visually checking and reworking the supply direction of the electronic components, thereby improving the overall work efficiency in the production of the substrate. Product cost increase can be suppressed.
【0014】[0014]
【発明の実施の形態】本発明の請求項1に記載の電子部
品認識方法は、固定具に固定されたトレイ内に格納され
た電子部品を、装着装置により前記トレイから取り出し
て基板へ装着するに際し、予め前記電子部品にその向き
を示す印を付け、前記印を検出して、その印方向により
前記電子部品の方向を認識する方法とする。According to a first aspect of the present invention, there is provided a method for recognizing an electronic component, wherein an electronic component stored in a tray fixed to a fixture is removed from the tray by a mounting device and mounted on a substrate. At this time, a method is used in which a mark indicating the direction is attached to the electronic component in advance, the mark is detected, and the direction of the electronic component is recognized based on the mark direction.
【0015】請求項2に記載の電子部品認識方法は、請
求項1に記載の印方向を検出した電子部品を、その印方
向が前記電子部品の装着時の印方向となるよう補正回転
するように、装着装置に対して制御指令する方法とす
る。According to a second aspect of the present invention, there is provided an electronic component recognizing method for correcting and rotating an electronic component in which a marking direction has been detected according to the first aspect so that the marking direction is a marking direction when the electronic component is mounted. First, a control command is issued to the mounting device.
【0016】これらの方法によると、基板装着用の電子
部品を供給する際に、その電子部品をトレイに向きを誤
って格納したりトレイを固定具に向きを誤って取り付け
たりした場合でも、電子部品を補正回転するための制御
指令に基づいて装着装置を制御し、電子部品を回転して
その基板への装着方向に補正する。According to these methods, when supplying electronic components for mounting a substrate, even if the electronic components are incorrectly stored in the tray or the tray is incorrectly mounted on the fixture, the electronic components may be incorrectly mounted. The mounting device is controlled based on a control command for correcting and rotating the component, and the electronic component is rotated to correct the mounting direction on the board.
【0017】以下、本発明の実施の形態を示す電子部品
認識方法について、図面を参照しながら具体的に説明す
る。図1は本実施の形態の電子部品認識方法を説明する
ための電子部品実装装置の概略を示す構成図であり、図
2は図1に示す電子部品実装装置により部品実装する際
に本実施の形態の電子部品認識方法により実装される電
子部品の構成図である。Hereinafter, an electronic component recognition method according to an embodiment of the present invention will be specifically described with reference to the drawings. FIG. 1 is a configuration diagram schematically showing an electronic component mounting apparatus for explaining an electronic component recognition method according to the present embodiment. FIG. FIG. 3 is a configuration diagram of an electronic component mounted by the electronic component recognition method according to the embodiment.
【0018】この電子部品認識方法では、電子部品2を
製作する際に、あらかじめ図2に示すように、電子部品
2の例えば上面の任意の位置に、図1に示す認識装置7
による自動認識が可能で、かつ電子部品2の向きを示す
ことが可能な例えば正三角形などの印1を取り付ける。
この印1は、全ての電子部品に取り付け、その形状およ
び種類は電子部品業界で規格化されることが望ましい。
このような電子部品2を、図1に示すように、トレイ3
の凹部3aに格納し、トレイ3を固定具4に固定して、
そのようにトレイ3を固定した固定具4を複数段重ねる
ようにした状態でケース10に収納する。In this electronic component recognition method, when the electronic component 2 is manufactured, as shown in FIG. 2, a recognition device 7 shown in FIG.
For example, a mark 1 such as an equilateral triangle, which can be automatically recognized by and can indicate the direction of the electronic component 2, is attached.
The mark 1 is attached to all electronic components, and its shape and type are desirably standardized in the electronic component industry.
As shown in FIG.
And the tray 3 is fixed to the fixture 4,
The fixtures 4 to which the trays 3 are fixed in such a manner are stored in the case 10 in a state of being stacked in a plurality of stages.
【0019】このようにしてトレイ3の凹部3aに格納
されている電子部品2を基板5上に装着する際には、ま
ず、座標軸X,Y,Z上の3次元座標で表される全ての
位置方向に移動可能な装着装置6が、ケース10の最上
段のトレイ3内にある電子部品2を順次取り出してい
く。When the electronic component 2 stored in the recess 3a of the tray 3 is mounted on the substrate 5, all of the electronic components 2 represented by the three-dimensional coordinates on the coordinate axes X, Y, and Z are first set. The mounting device 6 movable in the position direction sequentially takes out the electronic components 2 in the uppermost tray 3 of the case 10.
【0020】次に、装着装置6によってトレイ3内から
取り出され保持された電子部品2は、はじめに、認識装
置7上で停止する。そこで、認識装置7が、図2に示す
ように電子部品2に取り付けられた印1を検出し、現
在、電子部品2がどちらの方向を向いているかを認識す
る。この際には、従来と同様に、電子部品2の中心と装
着装置6の中心のずれ量も測定する。Next, the electronic component 2 taken out of the tray 3 and held by the mounting device 6 first stops on the recognition device 7. Thus, the recognition device 7 detects the mark 1 attached to the electronic component 2 as shown in FIG. 2 and recognizes which direction the electronic component 2 is currently facing. At this time, the displacement between the center of the electronic component 2 and the center of the mounting device 6 is also measured as in the related art.
【0021】さらに、制御装置(図示せず)が、電子部
品2を基板5に装着した時に図2の印1の向くべき方向
を記載したデータ(電子部品2の基板5への装着を開始
する前に、作業者が作成するデータ)と、認識装置7が
装着装置6に保持された状態の電子部品2上の印1によ
り認識した電子部品2の現在の向きをに対応して生成し
たデータとを比較し、その差に相当する角度だけ電子部
品2を補正回転するように、装着装置6に対して制御指
令を与える。Further, when the electronic component 2 is mounted on the board 5, a control device (not shown) writes data describing the direction in which the mark 1 in FIG. 2 should face (the mounting of the electronic component 2 on the board 5 is started). Data generated by the operator before) and data generated by the recognition device 7 corresponding to the current orientation of the electronic component 2 recognized by the mark 1 on the electronic component 2 held in the mounting device 6. And gives a control command to the mounting device 6 so as to correct and rotate the electronic component 2 by an angle corresponding to the difference.
【0022】このようにして制御装置から与えられた制
御指令に基づいて制御された装着装置6が、電子部品2
を回転してその基板5への装着方向に補正するととも
に、電子部品2のずれ量分を補正して、電子部品2を基
板5に装着する。The mounting device 6 controlled based on the control command given from the control device as described above
Is rotated to correct the mounting direction of the electronic component 2 on the substrate 5 and the amount of displacement of the electronic component 2 is corrected, and the electronic component 2 is mounted on the substrate 5.
【0023】以上の方法により、基板装着用の電子部品
の供給の際に、電子部品の供給方向に対する目視確認お
よび手直しの作業をなくし、基板生産の際の全体の作業
効率を向上することができるとともに、製品のコストア
ップを抑えることができる。また、現在でも、多くの電
子部品にその型式および製造業者名を書き込んでいるこ
とと合わせて、電子部品にその向きを示す印を付与する
ことを電子部品業界で容易に規格化することができる。According to the above-described method, when supplying the electronic components to be mounted on the substrate, visual checking and reworking of the supply direction of the electronic components can be eliminated, and the overall work efficiency in the production of the substrate can be improved. At the same time, it is possible to suppress an increase in product cost. In addition, even now, in addition to the fact that many electronic components have their models and manufacturer names, it is possible to easily standardize the marking of electronic components in the electronic component industry to indicate their directions. .
【0024】[0024]
【発明の効果】以上のように本発明によれば、基板装着
用の電子部品を供給する際に、その電子部品をトレイに
向きを誤って格納したりトレイを固定具に向きを誤って
取り付けたりした場合でも、電子部品を補正回転するた
めの制御指令に基づいて装着装置を制御し、電子部品を
回転してその基板への装着方向に補正することができ
る。As described above, according to the present invention, when supplying an electronic component for mounting a substrate, the electronic component is incorrectly stored in a tray or the tray is incorrectly mounted on a fixture. In this case, the mounting device can be controlled based on a control command for correcting and rotating the electronic component, and the electronic component can be rotated and corrected in the mounting direction on the board.
【0025】そのため、基板装着用の電子部品の供給の
際に、電子部品の供給方向に対する目視確認および手直
しの作業をなくし、基板生産の際の全体の作業効率を向
上することができるとともに、製品のコストアップを抑
えることができる。Therefore, when supplying the electronic components for mounting the substrate, visual checking and reworking of the supply direction of the electronic components can be eliminated, and the overall work efficiency during the production of the substrate can be improved, and the product can be improved. Cost increase can be suppressed.
【0026】また、現在でも、多くの電子部品にその型
式および製造業者名を書き込んでいることと合わせて、
電子部品にその向きを示す印を付与することを電子部品
業界で容易に規格化することができる。In addition to the fact that many electronic parts have their models and manufacturer names written,
The provision of a mark indicating the direction of an electronic component can be easily standardized in the electronic component industry.
【図1】本発明の実施の形態の電子部品認識方法の説明
図FIG. 1 is an explanatory diagram of an electronic component recognition method according to an embodiment of the present invention.
【図2】同実施の形態の電子部品認識方法における電子
部品の構成図FIG. 2 is a configuration diagram of an electronic component in the electronic component recognition method according to the embodiment;
【図3】向きを誤って電子部品を格納したトレイを示す
平面図FIG. 3 is a plan view showing a tray storing electronic components in an incorrect orientation.
【図4】向きを誤って固定具に固定したトレイを示す平
面図FIG. 4 is a plan view showing a tray fixed to a fixture in a wrong direction.
【図5】従来の電子部品認識方法の説明図FIG. 5 is an explanatory diagram of a conventional electronic component recognition method.
1 印 2 電子部品 1 mark 2 electronic components
フロントページの続き (72)発明者 瀬野 眞透 大阪府門真市大字門真1006番地 松下電器 産業株式会社内Continued on the front page (72) Inventor Makoto Seno 1006 Kazuma Kadoma, Kadoma City, Osaka Matsushita Electric Industrial Co., Ltd.
Claims (2)
た電子部品を、装着装置により前記トレイから取り出し
て基板へ装着するに際し、予め前記電子部品にその向き
を示す印を付け、前記印を検出して、その印方向により
前記電子部品の方向を認識する電子部品認識方法。When an electronic component stored in a tray fixed to a fixture is taken out of the tray by a mounting device and mounted on a substrate, a mark indicating the direction of the electronic component is marked on the electronic component in advance. An electronic component recognizing method for detecting the direction of the electronic component based on the direction of the mark.
向が前記電子部品の装着時の印方向となるよう補正回転
するように、装着装置に対して制御指令する請求項1に
記載の電子部品認識方法。2. The mounting device according to claim 1, wherein a control command is issued to the mounting device so as to correct and rotate the electronic component whose mark direction has been detected so that the mark direction becomes the mark direction when the electronic component is mounted. Electronic component recognition method.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9081766A JPH10284899A (en) | 1997-04-01 | 1997-04-01 | Method for recognizing electronic component |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9081766A JPH10284899A (en) | 1997-04-01 | 1997-04-01 | Method for recognizing electronic component |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH10284899A true JPH10284899A (en) | 1998-10-23 |
Family
ID=13755592
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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JP9081766A Pending JPH10284899A (en) | 1997-04-01 | 1997-04-01 | Method for recognizing electronic component |
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Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001053499A (en) * | 1999-08-09 | 2001-02-23 | Tdk Corp | Electronic component inserting machine |
JP2009076796A (en) * | 2007-09-24 | 2009-04-09 | Fuji Mach Mfg Co Ltd | Electronic component direction inspection device, electronic component direction inspecting method, and electronic component mounting apparatus |
JP2013080747A (en) * | 2011-09-30 | 2013-05-02 | Hitachi High-Tech Instruments Co Ltd | Determination method of setting direction of tray, and electronic component attaching device |
KR101437096B1 (en) * | 2008-03-20 | 2014-09-02 | 세메스 주식회사 | Method and apparatus for arranging semiconductor module |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6461033A (en) * | 1987-09-01 | 1989-03-08 | Sumitomo Electric Industries | Device for mounting chip |
JPH0440538U (en) * | 1990-08-05 | 1992-04-07 | ||
JPH05206694A (en) * | 1992-01-28 | 1993-08-13 | Matsushita Electric Ind Co Ltd | Loading of circuit elements |
JPH0766595A (en) * | 1993-08-31 | 1995-03-10 | Matsushita Electric Ind Co Ltd | Correction method of mounting failure of electronic component |
-
1997
- 1997-04-01 JP JP9081766A patent/JPH10284899A/en active Pending
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6461033A (en) * | 1987-09-01 | 1989-03-08 | Sumitomo Electric Industries | Device for mounting chip |
JPH0440538U (en) * | 1990-08-05 | 1992-04-07 | ||
JPH05206694A (en) * | 1992-01-28 | 1993-08-13 | Matsushita Electric Ind Co Ltd | Loading of circuit elements |
JPH0766595A (en) * | 1993-08-31 | 1995-03-10 | Matsushita Electric Ind Co Ltd | Correction method of mounting failure of electronic component |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001053499A (en) * | 1999-08-09 | 2001-02-23 | Tdk Corp | Electronic component inserting machine |
JP2009076796A (en) * | 2007-09-24 | 2009-04-09 | Fuji Mach Mfg Co Ltd | Electronic component direction inspection device, electronic component direction inspecting method, and electronic component mounting apparatus |
KR101437096B1 (en) * | 2008-03-20 | 2014-09-02 | 세메스 주식회사 | Method and apparatus for arranging semiconductor module |
JP2013080747A (en) * | 2011-09-30 | 2013-05-02 | Hitachi High-Tech Instruments Co Ltd | Determination method of setting direction of tray, and electronic component attaching device |
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