JPS62155599A - Electronic parts mounting - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Detailed Description of the Invention] Industrial Application Field The present invention relates to an electronic component mounting method that does not use a defective mounting head among a plurality of mounting heads and performs mounting only using the remaining mounting heads. 0 Prior Art Conventionally, in electronic component mounting machines that use a plurality of mounting heads to perform a series of mounting operations sequentially and separately, if there is an abnormality in even one mounting head, the other heads may malfunction. Even with that, I couldn't drive. In addition, if even one of the mounting heads cannot be adjusted to a good condition, the operation should be stopped or even if the operation is forced, many defective mountings may occur. Ta.

Problems that the invention aims to solve: In the above configuration, if there are multiple mounting heads, the probability of abnormality occurring increases, and it is also difficult to adjust all of them to a good condition, resulting in abnormalities and inability to adjust. Due to this, the operation was often stopped and the operating rate was decreasing.

In addition, although it is possible to operate even when adjustment is not possible, many defective mountings occur, and in the case of poor mounting quality or defective mounting, the electronic components concerned are discarded, resulting in a problem of waste.

The electronic component mounting method of the present invention, which is a means for solving the problem, uses multiple capturing heads,
A mounting process in which mounting of a series of electronic components is performed by dividing it into parts, a designation process in which one of multiple mounting heads is designated as not to be used, and based on the designation, the mounting head is not allowed to perform mounting. and a control process to control the process.

Effects of the present invention With the above-described configuration, even if one or more of the plurality of mounting heads has an abnormality or becomes unadjustable, the machine can continue to operate using only other good mounting heads without stopping the operation of the machine. It becomes possible to continue the process and improve the operating rate. Also, defective mounting is reduced.

Example An embodiment of the present invention will be described below with reference to the drawings.

FIG. 4 is a perspective view of a mounting head of a chip component mounting machine to which the present invention is applied. FIG. 3 is a perspective view of the chip component mounting machine, and FIG. 6 is a functional explanatory diagram of each station in the divided mounting process. At A, suction is performed, at C, parts specification ffi, at D, suction detection is performed, at F, installation is performed, and at H, incorrect parts are taken out.

First, a series of mounting operations of a chip type electronic component mounting machine to which the present invention is applied will be explained. Tip clockwise, 3
Rotation operation (index operation) is performed in 6° increments. Furthermore, each of the ten divided stations is equipped with a mechanism that performs the functions of dividing the mounting process, and performs the function of each station for the mounting head 1 that has arrived at each station.

A mounting head 1 located at station A picks up chip components from a component supply section 2. After that, each mounting head 1 has 3
After rotating by 6 degrees, the mounting head 1 that was at station A arrives at station B and does nothing here. Further, the mounting head 1 at station I arrives at station A and picks up the chip component, and the other mounting heads 1 also rotate in the same manner and perform their respective functions at each station. That is, each mounting head 1 rotates every 36 degrees, and performs suction at A, component regulation at C, and part adjustment at D.
At step F, suction detection is performed, at step F, mounting is performed, and at step H, the erroneous component is taken out, thereby completing a series of mounting operations.

In the chip-type electronic component mounting machine having the configuration as described above, if even one of the ten mounting heads 1 malfunctions, it becomes impossible to continue operation immediately. That is, for example, in the case of an abnormality in which suction cannot be performed reliably, if the operation is continued as it is, suction errors will occur frequently. Chip components that are incorrectly picked up are discarded, resulting in wasted chip components. Furthermore, if the mounting head is damaged, it becomes impossible to operate it at all.

These problems have been solved in the present invention as shown below. This will be explained based on the flowcharts of FIGS. 1 and 2. First, as shown in FIG. 2, the operator determines whether or not there is an abnormally installed head, and if there is, the operator registers the abnormally installed head number in the abnormally installed head table by key-in, and then enters the abnormally installed head number in the control device 9. Gives instructions to start driving. When the control device 9 receives an instruction to start operation, it determines whether or not an abnormal mounting head is registered in the abnormal mounting head table, as shown in FIG. 1, and if not, it performs a normal mounting operation.

If there is, the mounting operation is performed without using the abnormal mounting head. That is, for a station that has received an abnormal loading command, a command is issued to the station not to perform the operations of each function on that loading head. Next, during the mounting operation, the suction detection unit 4 checks whether the chip components are properly suctioned, and the cases determined to be suction errors are counted for each mounting head. When the count value reaches a preset value, the placement head is determined to be abnormal, is registered in the abnormal placement head table, and the mounting operation including that placement head is performed without using the abnormal placement head. .

As described in detail, according to the present invention, even if an abnormality occurs in the mounting head, it is possible to continue operation using only other normal mounting heads without stopping the operation of the machine. be. Further, by automatically not using a mounting head that is likely to cause suction errors, it is possible to prevent chip components from being wasted. Therefore, the operating rate of the machine is improved, the suction error rate is reduced, and chip components are used efficiently.

[Brief explanation of drawings]

Fig. 1 is a flowchart showing the flow of operation of the control process in an embodiment of the present invention, Fig. 2 is a flowchart showing the operation of the same operator, and Fig. 3 is a chip type electronic component to which the method of the present invention is applied. FIG. 4 is a perspective view of the mounting machine, FIG. 4 is a perspective view of the mounting head, and FIG. 6 is a functional explanatory diagram of each station of the mounting head. 3... Component regulation section, 4... Suction detection section,
5... Mounting section, 6... Mistaken parts removal section, 7... X-Y table, 8... Printed circuit board. Figure 1 Figure 2 Figure 3 Figure 4 Man Figure 5

Claims (2)

[Claims] (1) A mounting process in which a series of electronic components is sequentially and dividedly mounted using multiple mounting heads, a designation process in which one of the multiple mounting heads is designated as not to be used, and based on the designation, the mounting head is An electronic component mounting method characterized by comprising a control step in which the electronic component is not mounted. (2) A detection process to confirm that the mounting has been performed correctly, and a judgment process to decide not to perform mounting on a mounting head that has many defects based on the information from the detection process. An electronic component mounting method according to claim 1.