JPH05167219A - Substrate printing method - Google Patents
Substrate printing methodInfo
- Publication number
- JPH05167219A JPH05167219A JP33348991A JP33348991A JPH05167219A JP H05167219 A JPH05167219 A JP H05167219A JP 33348991 A JP33348991 A JP 33348991A JP 33348991 A JP33348991 A JP 33348991A JP H05167219 A JPH05167219 A JP H05167219A
- Authority
- JP
- Japan
- Prior art keywords
- printed
- substrate
- board
- component layout
- back side
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0266—Marks, test patterns or identification means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
Landscapes
- Structure Of Printed Boards (AREA)
Abstract
Description
【0001】[0001]
【産業上の利用分野】本発明は基板の印刷方法、特に電
気回路が搭載されるプリント基板に印刷される部品配置
図が、搭載部品の接続関係を追跡しやすいように工夫さ
れた基板の印刷方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of printing a board, and in particular, a board layout in which a component layout printed on a printed circuit board on which an electric circuit is mounted is designed so that the connection relation of mounted parts can be easily traced. Regarding the method.
【0002】[0002]
【従来の技術】電気回路が搭載された回路基板を検査あ
るいは修理する場合、抽象的に描かれた電気配線図を用
いるだけでは具体的な搭載部品と配線図との対照が困難
であるため、搭載部品の部品配置が一目で見れるような
部品配置図が必要となる。2. Description of the Related Art When inspecting or repairing a circuit board on which an electric circuit is mounted, it is difficult to compare a specific mounting component with a wiring diagram only by using an abstractly drawn electric wiring diagram. It is necessary to have a component layout diagram that allows the component placement of mounted components to be seen at a glance.
【0003】すなわち、そのような従来の部品配置図は
図面用紙に記載され、基板を表側から見た基板平面図
と、裏側から見た基板平面図とから構成されるのが一般
的であった。特に、両面に回路パターンを形成したプリ
ント回路基板では、基板の両面における搭載部品の接続
状態や、特定のチェック用ピンの位置を即座に知ること
が不可欠であるとして、従来から各種の部品配置図が提
案されている。That is, such a conventional component layout drawing is described on a drawing sheet and is generally composed of a board plan view of the board viewed from the front side and a board plan view viewed from the back side. .. Especially for printed circuit boards with circuit patterns formed on both sides, it is indispensable to immediately know the connection status of mounted components and the position of specific check pins on both sides of the board. Is proposed.
【0004】図3は、そのような回路基板の表裏に構成
される搭載部品の接続関係を容易に追跡できるように工
夫された従来の部品配置図であって、実開昭61−15
3361号公報に示されたものである。FIG. 3 is a conventional component layout drawing devised so as to easily trace the connection relationship of mounted components formed on the front and back of such a circuit board.
This is disclosed in Japanese Patent No. 3361.
【0005】図において、従来の図面用紙に記載された
部品配置図には、電気回路部品が実装された基板を表面
から見た表面図21と、この表面図21が描いたプリン
ト基板をそのまま対称軸23を中心に180゜展開した
時得られるプリント基板の裏面図22が描かれている。
これらの表面図21及び裏面図22には、前記対称軸2
3の方向に所定の間隔で番地記号1,2,3,
4....が付けられた縦軸24と、対称軸23を中心
にして左右対称に所定の間隔で番地記号A,B,C,
D....が付けられた横軸25とが付記されている。In the drawings, in a component layout drawing described on a conventional drawing sheet, a front view 21 of a board on which an electric circuit component is mounted is viewed from the front side and a printed circuit board drawn by the front view 21 is symmetrical. A rear view 22 of the printed circuit board obtained when developed 180 ° about axis 23 is depicted.
These front view 21 and back view 22 show the symmetry axis 2
Address symbols 1, 2, 3, at predetermined intervals in the direction of 3
4. . . . The vertical axis 24 marked with and the symmetry axis 23 as the center, and the address symbols A, B, C
D. . . . The horizontal axis 25 is attached.
【0006】次に、以上のような従来の図面用紙に記載
された部品配置図を用いて、プリント基板に搭載された
電気回路部品の配置位置を探索する場合について説明す
る。図3に示す部品配置図には縦軸24及び横軸25に
番地記号が付加されているが、表面図21に示す円内に
ある部品、例えばコンデンサC1 は、表面図21上で4
D番地にあることがわかる。これを裏面図22において
探索する場合は、表面図21の番地記号に対応する裏面
図22の4D番地内を捜せば容易に見いだすことが出来
る。Next, a description will be given of the case of searching the layout position of the electric circuit component mounted on the printed circuit board by using the component layout drawing described above on the conventional drawing paper. In the component layout diagram shown in FIG. 3, address symbols are added to the vertical axis 24 and the horizontal axis 25, but the components within the circle shown in the front view 21, such as the capacitor C1, are indicated by 4 on the front view 21.
You can see that it is at address D. When searching for this in the rear view 22, it can be easily found by searching in the 4D address of the rear view 22 corresponding to the address symbol of the front view 21.
【0007】このように、従来の部品配置図は対称軸2
3を中心に対照にプリント基板の表面と裏面が描かれて
いるので、表面パターンと裏面パターンの追跡が容易に
出来ることになる。[0007] As described above, the conventional component layout is based on the symmetry axis 2
Since the front surface and the back surface of the printed circuit board are drawn with 3 as the center, the front surface pattern and the back surface pattern can be easily traced.
【0008】[0008]
【発明が解決しようとする課題】しかし、従来の部品配
置図を用いた場合、プリント基板に搭載された電気回路
部品の配置位置を探索する時は、かならず図3に示すよ
うな図面用紙を参照して作業しなければならないので大
変面倒となるだけでなく、回路部品をプリント基板に実
装する作業時には、基板に部品配置図が描かれているわ
けではないので基板の表面と裏面を間違えて実装する可
能性があるという問題点があった。However, in the case of using the conventional component layout drawing, always refer to the drawing sheet as shown in FIG. 3 when searching the layout position of the electric circuit components mounted on the printed circuit board. It is not only very troublesome to do, but also when mounting circuit components on the printed circuit board, the component layout is not drawn on the substrate, so the front and back of the substrate are mistakenly mounted. There was a problem that there is a possibility of doing.
【0009】本発明は上記のような問題点を解消するた
めになされたもので、基板の表面と裏面に部品配置図が
直接印刷されており、しかも表面と裏面が明確に区別で
きるだけでなく、裏面から容易に電気回路部品の実装位
置が判断できる基板の印刷方法を得ることを目的として
いる。The present invention has been made in order to solve the above-mentioned problems, and the component layout is directly printed on the front surface and the back surface of the substrate, and moreover, the front surface and the back surface can be clearly distinguished, and It is an object of the present invention to obtain a method for printing on a substrate that allows the mounting position of an electric circuit component to be easily determined from the back surface.
【0010】[0010]
【課題を解決するための手段】上記目的を達成するため
に、本発明の第1の発明に係わる基板の印刷方法は、プ
リント基板の表面に部品配置図を印刷すると共に、基板
裏面から表面の部品配置を透視した部品配置図を表面印
刷文字の逆字で、基板の裏面に印字することを特徴とす
る。In order to achieve the above object, a method of printing a board according to a first aspect of the present invention is to print a component layout diagram on the front surface of a printed board and to print from the back surface to the front surface of the board. It is characterized in that a component layout diagram through which the component layout is seen is printed on the back surface of the substrate by the reverse letters of the front surface printing characters.
【0011】また、本発明の第2の発明に係わる基板の
印刷方法は、プリント基板表面に部品配置図を所定の書
体で印刷すると共に、基板裏面から表面の部品配置を透
視した部品配置図を表面の印字書体とは明らかに異なる
書体で、基板裏面に印刷することを特徴とする。According to a second aspect of the present invention, in the method of printing a board, the board layout is printed on the front surface of the printed board in a predetermined typeface, and the board layout is seen through the board rear surface from the back surface of the board. It is characterized by printing on the back surface of the substrate with a typeface that is clearly different from the printed typeface on the front side.
【0012】[0012]
【作用】従って、本発明の基板の印刷方法によれば、搭
載すべき部品の部品配置図が基板の両面に直接印刷され
ており(例えば、シルク印刷で)、しかもプリント基板
の表面と裏面は印字書体などで明確に区別できるので、
図面を用いることなくプリント基板面から容易に電気回
路部品の実装位置が判断できるようになる。Therefore, according to the board printing method of the present invention, the component layout of the parts to be mounted is directly printed on both sides of the board (for example, by silk printing), and the front and back surfaces of the printed board are Because it can be clearly distinguished by the typeface, etc.
It becomes possible to easily determine the mounting position of the electric circuit component from the surface of the printed circuit board without using a drawing.
【0013】[0013]
【実施例】以下、本発明の好適な実施例を図に基づいて
説明する。図1及び図2は本実施例に係る印刷方法によ
るプリント基板に印刷された部品配置図を示すための基
板平面図である。図1には、本実施例のプリント基板の
基板表面に印刷された部品配置図11が描かれており、
図2には本実施例のプリント基板の基板裏面に印刷され
た部品配置図12が描かれている。この図1及び図2か
ら明らかなように、プリント基板の表面に印刷された部
品配置図11は正字で搭載部品名が印字されているが、
基板裏面の部品配置図12は逆字で搭載部品名が印字さ
れている。そして、基板裏面に印刷された部品配置は、
表面の部品配置を裏面側から透視した形式で印字されて
いる。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT A preferred embodiment of the present invention will be described below with reference to the drawings. FIG. 1 and FIG. 2 are board plan views for showing a component layout printed on a printed board by the printing method according to the present embodiment. FIG. 1 shows a component layout diagram 11 printed on the substrate surface of the printed circuit board of this embodiment.
FIG. 2 shows a component layout diagram 12 printed on the back surface of the printed circuit board of this embodiment. As can be seen from FIGS. 1 and 2, the component layout diagram 11 printed on the surface of the printed circuit board has the characters of the mounted components printed in regular characters.
The component layout diagram on the back surface of the substrate is shown in reverse letters in FIG. And the component layout printed on the back of the board is
It is printed in a format in which the arrangement of parts on the front side is seen through from the back side.
【0014】また、本実施例のプリント基板において
は、基板各部は縦軸の番地記号と横軸の番地記号により
識別される複数のロケーションに分割される。例えば、
縦軸の番地記号が12で横軸の番地記号がGであるロケ
ーションの番地記号は、G12である。そして、図1に
示すように、前記ロケーションG12番地に搭載される
ICは、基板表面の部品配置図11においては実装位置
がロケーション部分11−1で示されている。また、そ
のICの基板裏面の部品配置図12における実装位置は
図2のロケーション部分12−1で示される。Further, in the printed circuit board of this embodiment, each part of the board is divided into a plurality of locations which are identified by an address symbol on the vertical axis and an address symbol on the horizontal axis. For example,
The address code of the location where the address code on the vertical axis is 12 and the address code on the horizontal axis is G is G12. As shown in FIG. 1, the mounting position of the IC mounted at the location G12 is indicated by the location portion 11-1 in the component layout diagram 11 on the substrate surface. The mounting position of the IC on the back surface of the board in the component layout diagram 12 is indicated by a location portion 12-1 in FIG.
【0015】次に、以上のような部品配置図が印刷され
た本実施例のプリント基板を用いて、搭載部品の配置位
置を探索する場合について説明する。Next, a description will be given of a case where the placement position of the mounted component is searched for by using the printed circuit board of this embodiment on which the component placement diagram as described above is printed.
【0016】図1及び図2に示すプリント基板におい
て、基板表面に印刷された部品配置図11は、搭載部品
が実際に実装された場合は部品に隠されて見えにくくな
るが、基板の裏面にも搭載部品の配置を示す部品配置図
12が印刷されているため裏面を見ることにより容易に
搭載部品の探索が行なうことができる。また、基板裏面
の部品配置図12は逆字で搭載部品名が印字されてお
り、さらに、表面の部品配置を裏面側から透視した形式
で印字されている。従って、作業者は基板の表面と裏面
を容易に区別することができるので、基板表面と裏面を
間違えることもなく部品の搭載が容易に行うことができ
る。また、回路基板を検査あるいは修理する場合におい
ても搭載部品の探索・追跡が容易に行うことができる。In the printed circuit board shown in FIGS. 1 and 2, the component layout diagram 11 printed on the surface of the substrate is hidden by the mounted components when the mounted components are actually mounted, which makes it difficult to see the components. Also, since the component layout diagram 12 showing the layout of the mounted components is printed, it is possible to easily search for the mounted components by looking at the back surface. Further, in the component layout diagram 12 on the back surface of the substrate, the mounted component names are printed in reverse letters, and further, the layout of the components on the front surface is printed in a format seen through from the back surface side. Therefore, the operator can easily distinguish the front surface and the back surface of the board, and the components can be easily mounted without making a mistake in the front surface and the back surface of the board. Further, even when inspecting or repairing the circuit board, it is possible to easily search and track the mounted components.
【0017】なお、上記実施例では、プリント基板の表
面に印刷された部品配置図は正字で印字され、裏面の部
品配置図は逆字で印字されている場合に付いて説明した
が、基板の表面と裏面を容易に区別する方法はそれに限
られるものではない。例えば、プリント基板の表面に部
品配置図を所定の書体で印字すると共に、基板裏面側か
ら表面の部品配置を透視した形式の部品配置図を、表面
の印字書体とは明らかに異なる書体で、基板の裏面に印
字するようにしてもよい。In the above embodiment, the case where the component layout printed on the front surface of the printed circuit board is printed in normal characters and the component layout printed on the back surface is printed in reverse character has been described. The method for easily distinguishing the front surface and the back surface is not limited to that. For example, a component layout drawing is printed on the front surface of a printed circuit board in a predetermined typeface, and a component layout drawing in a format in which the front surface component layout is seen through from the back side of the substrate You may make it print on the back surface of.
【0018】[0018]
【発明の効果】以上説明したように、本発明の基板の印
刷方法においては、搭載すべき部品の部品配置図が基板
の両面に直接印刷でき、しかもプリント基板の表面と裏
面は印字書体などで明確に区別できるので、図面用紙を
用いる必要がなく、基板に直接印刷された部品配置図を
見ることにより容易に電気回路部品の実装位置が判断で
きるようになる。従って、回路基板の検査あるいは修理
する時間が短縮できるという効果がある。As described above, in the method of printing a board of the present invention, the component layout of the components to be mounted can be printed directly on both sides of the board, and the front and back surfaces of the printed board are printed fonts or the like. Since they can be clearly distinguished, it is not necessary to use a drawing sheet, and the mounting position of the electric circuit component can be easily determined by looking at the component layout printed directly on the board. Therefore, there is an effect that the time for inspecting or repairing the circuit board can be shortened.
【図1】本実施例に係る印刷方法による基板表面に印刷
された部品配置図を示すための平面図である。FIG. 1 is a plan view showing a component layout printed on a substrate surface by a printing method according to an embodiment.
【図2】本実施例に係る印刷方法による基板裏面に印刷
された部品配置図を示すための平面図である。FIG. 2 is a plan view showing a component layout printed on the back surface of the substrate by the printing method according to the present embodiment.
【図3】回路基板の表裏に構成される搭載部品の接続関
係を容易に追跡できるように工夫された従来の部品配置
図である。FIG. 3 is a conventional component layout plan devised so as to easily trace the connection relationship of the mounted components formed on the front and back of the circuit board.
11 プリント基板の表面に印刷された部品配置図 12 プリント基板の裏面に印刷された部品配置図 21 図面用紙に印刷された基板表面の部品配置図 22 図面用紙に印刷された基板裏面の部品配置図 11 Component layout diagram printed on the front surface of the printed circuit board 12 Component layout diagram printed on the back surface of the printed circuit board 21 Component layout diagram on the board surface printed on the drawing paper 22 Component layout diagram on the back surface of the board printed on the drawing paper
Claims (2)
刷方法において、 プリント基板の表面に部品配置図を印刷すると共に、基
板裏面から表面の部品配置を透視した部品配置図を表面
印刷文字の逆字で、基板の裏面に印字することを特徴と
する基板の印刷方法。1. A method of printing a printed circuit board on which an electric circuit is mounted, wherein a component layout drawing is printed on the front surface of the printed circuit board, and the component layout drawing is a reverse view of the printed characters on the surface of the printed board. A method for printing on a substrate, which comprises printing on the back surface of the substrate with letters.
刷方法において、 プリント基板表面に部品配置図を所定の書体で印刷する
と共に、基板裏面から表面の部品配置を透視した部品配
置図を表面の印字書体とは明らかに異なる書体で、基板
裏面に印刷することを特徴とする基板の印刷方法。2. A method of printing a printed circuit board on which an electric circuit is mounted, wherein a component layout drawing is printed on a front surface of the printed circuit board in a predetermined typeface, and a component layout drawing is seen from the rear surface of the substrate through the surface of the component layout. A printing method for a substrate, which is characterized by printing on the back surface of the substrate with a typeface that is clearly different from the printed typeface.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP33348991A JPH05167219A (en) | 1991-12-17 | 1991-12-17 | Substrate printing method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP33348991A JPH05167219A (en) | 1991-12-17 | 1991-12-17 | Substrate printing method |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH05167219A true JPH05167219A (en) | 1993-07-02 |
Family
ID=18266634
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP33348991A Pending JPH05167219A (en) | 1991-12-17 | 1991-12-17 | Substrate printing method |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH05167219A (en) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5732464A (en) * | 1996-08-21 | 1998-03-31 | Seagate Technology, Inc. | Method of facilitating installation or use of an electromechanical information-storage device drive assembly |
US5977488A (en) * | 1994-11-30 | 1999-11-02 | Lg Electronics, Inc. | Printed circuit board having coordinate values of electronic components to be mounted thereon and a method of numbering the electronic components thereon |
JP2007257150A (en) * | 2006-03-22 | 2007-10-04 | Sanden Corp | Lighting device of vending machine |
JP2008177739A (en) * | 2007-01-17 | 2008-07-31 | Nippon Signal Co Ltd:The | Attachment for rfid tag and directivity-changeable rfid tag |
JP2015204967A (en) * | 2014-04-18 | 2015-11-19 | 株式会社藤商事 | Game machine |
JP2018130280A (en) * | 2017-02-15 | 2018-08-23 | 株式会社ソフイア | Game machine |
-
1991
- 1991-12-17 JP JP33348991A patent/JPH05167219A/en active Pending
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5977488A (en) * | 1994-11-30 | 1999-11-02 | Lg Electronics, Inc. | Printed circuit board having coordinate values of electronic components to be mounted thereon and a method of numbering the electronic components thereon |
US5732464A (en) * | 1996-08-21 | 1998-03-31 | Seagate Technology, Inc. | Method of facilitating installation or use of an electromechanical information-storage device drive assembly |
JP2007257150A (en) * | 2006-03-22 | 2007-10-04 | Sanden Corp | Lighting device of vending machine |
JP2008177739A (en) * | 2007-01-17 | 2008-07-31 | Nippon Signal Co Ltd:The | Attachment for rfid tag and directivity-changeable rfid tag |
JP2015204967A (en) * | 2014-04-18 | 2015-11-19 | 株式会社藤商事 | Game machine |
JP2018130280A (en) * | 2017-02-15 | 2018-08-23 | 株式会社ソフイア | Game machine |
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