KR101579215B1 - Apparatus for Surface Mount Technology in chip mounter - Google Patents

Abstract

The present invention relates to a surface mounting device and, more specifically, to a device to mount a surface through the component position correction of a chip mounter. According to an embodiment of the present invention, the device includes a loader supplying multiple carriers on which multiple printed circuit boards are placed; a mark decoder decoding a board mark which is displayed on the surface of each of the printed circuit boards, to generate board mark decoding information, and transmitting the generated board mark decoding information to the chip mounter with carrier identification information; a screen printer receiving the carriers, on which the printed circuit boards are placed, to apply solder paste onto patterns of the printed circuit boards; a screen printer inspector decoding a carrier identifier, displayed on each of the carriers, transmitting the carrier decoding information to the chip mounter, and inspecting a state of the solder paste applied from the screen printer; the chip mounter calculating a board separation amount of each of the printed circuit boards, included in a carrier, by using the board mark decoding information, included in the carrier of which the carrier identification information and the carrier decoding information are matched, when the pattern printing of the printed circuit boards is normal and mounting an electronic component on the printed circuit boards after the correction of a mounting position of the component according to the calculated board separation amount, or not mounting the component on the printed circuit boards by omitting the mounting of the electronic component when the pattern printing is abnormal; a reflow melting the solder paste, applied onto the printed circuit boards, to fix the electronic component on the printed circuit boards; a sorter sorting a board of which surface is completely mounted; and an unloader removing the sorted board from a surface mount line.

Description

Technical Field [0001] The present invention relates to a surface mount device for chip mount,

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a surface mount apparatus, and more particularly, to a surface mount apparatus for surface mounting through correction of a component position of a chip mount.

Surface Mount Technology (SMT) is a technology in which a solder paste is printed on a printed circuit board (PCB), and various surface mount devices (SMD) , And then bonding the leads of the printed circuit board (PCB) and the surface mount components through the reflow process.

A process for manufacturing an electronic component mounting board on which semiconductor components are mounted includes a loader (not shown) for supplying a substrate to a line as shown in Fig. 1, and a solder paste A chip mounter for mounting a surface mount component on a substrate, and a chip mounter for mounting the components on the substrate, and then melting the solder paste to apply the solder paste to the chip mount, an SOI (Solder Inspection) for inspecting a mounting state, a sorter for sorting a substrate on which surface mounting is completed, and an unloader (not shown) for removing the sorted substrate from the line Respectively.

Each piece of equipment constituting the surface mount line is connected via a conveyor, and the work board, which has been finished in each equipment, is transferred to the next equipment through the conveyor.

Among the equipment constituting such a surface mounting line, a chip mounter is a surface mounting and assembling apparatus for mounting electronic components on a printed circuit board, Is fed from the feeder to the mounting position of the printed circuit board, and then mounted on the printed circuit board at a specified position.

The chip mounter includes a feeder portion (hereinafter, referred to as a 'tape feeder') for supplying electronic components to be mounted, an X-Y gantry portion for determining a work position, a conveyor portion for conveying a printed circuit board to be operated, And a head portion for picking up the electronic components to be mounted in order and mounting them on the printed circuit board.

When electronic parts are mounted on a printed circuit board by using a chip mounter, in order to connect a large number of electrodes to the leads of a mounting object at a time, electronic parts must be located at precise positions so that all the electrodes are firmly bonded to the leads of the mounting object .

However, when the printed circuit board deviates from the correct position, the electronic component is mounted at a position where the XY gantry is previously registered, resulting in a problem that the mounting of the electronic component is out of the predetermined position.

Korea Registration No. 10-0772601

SUMMARY OF THE INVENTION The present invention is directed to an electronic component mounted in a precise position even if a printed circuit board is displaced in a carrier.

An embodiment of the present invention is a loader including a plurality of carriers on which a plurality of printed circuit boards are placed, the loader supplying a plurality of carriers; A mark reader for reading the substrate mark displayed on the surface of each printed circuit board to generate substrate mark readout information and transmitting the generated substrate mark readout information to the chip mount together with the carrier identification information; A screen printer for receiving a carrier on which a printed circuit board is placed and applying solder paste on a pattern of the printed circuit board; A screen printer inspector that reads the carrier identifier displayed on each carrier and transmits carrier read information to the chip mounter and inspects the state of the solder paste applied by the screen printer; When the pattern printing is a normal printed circuit board, the amount of substrate deviation of each printed circuit board placed on the carrier is calculated using the substrate mark read information stored in the carrier whose carrier identification information matches the carrier readout information, A chip mounter which mounts the electronic component on the printed circuit board after correcting the mounting position of the electronic component or does not mount the electronic component on the printed circuit board in the case of a printed circuit board having poor pattern printing; A reflow step of melting solder paste applied to a plurality of printed circuit boards placed on a carrier to fix the electronic parts on a printed circuit board; A sorter for sorting the surface-mounted substrates; And an unloader for removing the sorted substrate from the surface mount line.

The chip mounter may receive the reference mark readout information and the carrier identification information in a direct transfer method directly transmitted from the mark reader or a DB transmission method in which a database is transmitted through a server.

The substrate mark includes a substrate reference point mark displayed on a printed circuit board, and the substrate mark readout information may include a substrate reference point mark position indicating a position of the substrate reference point mark on the printed circuit board.

When the substrate reference mark position is received as the substrate mark readout information, the chip mounter compares the substrate reference point mark position of the printed circuit board mounted on the carrier with the registered substrate reference point registration position for each carrier, , The electronic component mounting position is corrected by the amount of deviation of the substrate by mounting the electronic component on the printed circuit board when the amount of deviation of the substrate is within a preset allowable deviation range of the substrate, , And electronic components are omitted without being mounted on a printed circuit board.

Wherein the mark reader reads a carrier reference mark mark displayed on a surface of each carrier and provides a carrier reference mark position to the chip mounter, and when the substrate reference mark position is received as the substrate mark reading information, Calculating a variation amount between a distance between the carrier reference mark position and a substrate reference mark position as a substrate deviation amount; and, when the substrate deviation amount is within a predetermined substrate separation allowance range, And the electronic parts are mounted on a printed circuit board, and when the amount of out-of-substrate displacement is out of a preset allowable range of the substrate separation allowance, electronic parts are omitted without being mounted on a printed circuit board.

The substrate mark may include a defective substrate mark indicating a defective printed circuit board and the substrate mark reading information may include defective substrate determination information indicating a defective printed circuit board when the defective substrate mark is read .

The chip mounter may be characterized in that, when the defective substrate determination information is received as the substrate mark read information, the electronic mounter is omitted without mounting the electronic part on the printed circuit board.

The surface mounting apparatus may include an optical tester for inspecting the mounting state of the electronic component mounted on the printed circuit board through the reflow before supplying the printed circuit board to the sorter.

And the carrier is supplied to the screen printer in an in-line mode or a batch mode.

The screen printer tester can read the carrier identifier made of RFID or bar code and provide the carrier read information to the chip mounter.

According to the embodiment of the present invention, even if the position of the printed circuit board is displaced in the carrier, the electronic part can be mounted at the correct position. Further, according to the embodiment of the present invention, by correcting the component mounting position in consideration of the amount of deviation of the printed circuit board, it is possible to correct accurately according to the amount of deviation from the substrate.

1 is a diagram showing a process of manufacturing an electronic component mounting board on which semiconductor components are mounted.
FIG. 2 is a view showing a general operation of a chip mounter. FIG.
FIG. 3 is a view showing the printed circuit board in the carrier in a correct position and the printed circuit board in a detached position; FIG.
FIG. 4 is a view illustrating a surface mounting apparatus through correction of parts position of an in-line chip mounter according to an embodiment of the present invention. FIG.
FIG. 5 is a view showing a surface mounting apparatus through position correction of a chip mounter in a batch mode according to an embodiment of the present invention. FIG.
6 is a diagram illustrating the separation distance between a carrier reference point mark and a substrate reference point mark when the first printed circuit board is positioned in position according to an embodiment of the present invention.
FIG. 7 is a diagram illustrating a separation distance between a carrier reference point mark and a substrate reference point mark when the first printed circuit board is displaced in a predetermined position according to an embodiment of the present invention. FIG.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings, in order to explain the present invention in detail so that those skilled in the art can easily carry out the present invention. . Other objects, features, and operational advantages of the present invention, including its effects and advantages, will become more apparent from the description of the preferred embodiments. It should be noted that the same reference numerals are used to denote the same or similar components in the drawings.

2 is a view showing an operation of a general chip mounter.

It will be appreciated that the chip mounter 500 may have a structure of various chip mounters 500 in addition to the structure of FIG. 2, the chip mounter 500 (10) includes a substrate transferring portion 11 for transferring a printed circuit board S, and an electronic component mounting portion And a component mounting apparatus 12. The substrate transfer section 11 transfers the printed circuit board S to the mounting position A. [ When the printed circuit board S is positioned at the mounting position A, the electronic component mounting apparatus 12 performs mounting work for mounting the electronic component on the printed circuit board S located at the mounting position A. When the mounting operation for the printed circuit board S is completed, the substrate transfer unit 11 transfers the printed circuit board S such that the printed circuit board S is ejected from the chip mounter 500 (10). The electronic component mounting apparatus 12 picks up the electronic component from the electronic component supplying apparatus 20 provided in the chip mounter 500 or 10 and then mounts the picked up electronic component on the printed circuit board S). The electronic component supply device 20 is for supplying electronic components. For example, the electronic component supplying apparatus 20 may be a tape feeder.

The electronic component mounting apparatus 12 includes a gantry 121 mounted on the body 101 of the chip mounter 500 so as to be movable in a first axial direction (Y-axis direction), and a gantry 121 mounted on the gantry 121 in a second axial direction And a picker portion 122 provided movably in the direction of the arrow. The first axis direction (Y axis direction) and the second axis direction (X axis direction) are perpendicular to each other.

The gantry 121 is elongated in the second axial direction (X-axis direction) as compared with the first axial direction (Y-axial direction). As the gantry 121 moves in the first axial direction (Y axis direction), the picker section 122 moves in the first axial direction (Y axis direction). A power source (not shown) for moving the gantry 121 in the first axial direction (Y axis direction) is installed in the body 101 of the chip mounter 500. The picker portion 122 moves along the gantry 121 in the second axial direction (X-axis direction). The electronic component mounting apparatus 12 moves the gantry 121 in the first axis direction (Y axis direction) and the picker section 122 moves in the second axis direction (X axis direction) The electronic component can be picked up from the mounting portion 20 and mounted on the printed circuit board S positioned at the mounting position A. [

In the case where electronic parts are mounted on a printed circuit board using the chip mounter 500, in order to connect a large number of electrodes to the leads of a mounting object at a time, electronic parts must be positioned at precise positions. It can be surely bonded to the lead.

3 (a), the first printed circuit board S1 and the sixth printed circuit board S6 laid on the carrier are placed in the correct positions, and the correct positions are set as shown in Fig. 3 (b) The XY gantry may place the electronic component at the pre-registered position, resulting in the problem that the electronic component is mounted out of the correct position.

In order to solve this problem, the present invention corrects any deviation of the substrate placed on the carrier during the line transfer from the correct position, so that the electronic component is mounted in the correct position. This will be described in detail below.

FIG. 4 is a view illustrating a surface mounting apparatus for correcting the position of an in-line chip mounter according to an embodiment of the present invention. FIG. FIG. 2 is a view showing a surface mounting apparatus through a semiconductor device.

FIG. 4 shows an in-line system in which a plurality of printed circuit boards are sequentially provided to the screen printer 300. FIG. The present invention can be applied not only to the inline method but also to the arrangement in which a plurality of carriers are provided to the screen printer 300 as shown in FIG.

The loader 100 is a device for automatically supplying a substrate, and can supply the substrate using, for example, a medium called a magazine. That is, the loader 100 is provided with a plurality of carriers on which a plurality of printed circuit boards are placed, and can supply a plurality of carriers to the mark reader 200. The carrier is a substrate carrier on which a plurality of printed circuit boards are aligned, and carrier reference mark marks (cp1, cp2) are marked on at least one corner of the carrier. The carrier reference mark marks cp1 and cp2 are marks that serve as reference points at the time of operation according to the carrier transport.

The FMI (Fiducial Mark Inspection) 200 reads the substrate mark displayed on the surface of each printed circuit board, generates the substrate mark read information, and transfers it to the chip mounter 500. The mark reader 200 includes a camera to read a substrate mark displayed on the surface of a printed circuit board, and generates substrate mark reading information.

The substrate mark may include substrate reference mark sp1, sp2 displayed on the printed circuit board and a defective substrate mark indicating a defect in the printed circuit board.

The substrate reference mark sp1, sp2 is an identification mark (e.g., a "cross mark") displayed on a part of the printed circuit board so that the position of the printed circuit board can be grasped during operation of the printed circuit board. In general, the substrate reference mark marks (sp1, sp2) are engraved on the edges of the printed circuit board.

The defective substrate mark is an identifier indicating a defective printed circuit board. For example, a substrate supplier that manufactures and supplies a printed circuit board can display a defective substrate mark of an 'X' character on a defective printed circuit board through self-inspection. In FIG. 3, it can be seen that the defective board mark 'X' is displayed on the eighth printed circuit board S8.

The substrate mark readout information includes a substrate reference mark mark position indicating the position of the substrate reference mark sp1 or sp2 of the printed circuit board and a defective substrate determination information indicating a defect in the printed circuit board when the defective substrate mark is read.

The substrate reference mark mark positions indicate the X and Y coordinate positions of the read substrate reference mark sp1, sp2 by reading the substrate reference mark sp1, sp2 displayed on the substrate. The carrier and substrate reference point marks sp1 and sp2 are read through the camera and the substrate reference point marks sp1 and sp2 in the carrier are expressed as X and Y coordinates. For example, when the [X, Y] coordinate of the center point of the carrier is [0, 0], the position of the reference point mark of each substrate can be represented as the X and Y coordinates. The defective substrate determination information is determination information indicating that the printed circuit board is defective when a defective substrate mark having an "X" shape is read on the substrate.

The mark reader 200 also transmits carrier identification information when transmitting the substrate mark read information to the chip mounter 500. [ The carrier identification information is a unique number for identifying a carrier, and carrier identification information of the carrier provided to the mark reader 200 can be received from the manager and transmitted to the chip mounter 500. [ Or the carrier identifier displayed on the carrier, and transfer the read carrier identification information to the chip mounter 500 together with the substrate mark read information. Such a carrier identifier may be implemented by an RFID or a barcode attached to the carrier, and may read the RFID or the barcode and transmit the carrier identification information to the chip mounter 500.

The mark reader 200 can also read the carrier reference mark marks cp1 and cp2 displayed on the surface of each carrier and provide the carrier reference mark marks cp1 and cp2 to the chip mounter 500. [

The function of the mark reader 200 described above can be performed by integrating all or a part of the screen printer tester 400 to be described later.

The screen printer 300 receives the carrier on which the printed circuit board is placed, and applies the solder paste on the pattern of the printed circuit board. The pattern can be printed by applying solder paste to the surface of the charged substrate. At this time, the solder paste may be disposed corresponding to the surface mount component, for example, the position where the electronic component is to be mounted.

The Screen Printer Inspector (400) inspects the state of the solder paste applied in the screen printer (300). Further, the screen printer 300 reads the carrier identifier indicated in each carrier, and transmits the read carrier read information to the chip mounter 500. [ The carrier identifier may be implemented by an RFID, a barcode, or the like. Therefore, the screen printer tester 400 reads the carrier identifier of the RFID or the bar code, and provides the read carrier read information to the chip mounter 500.

The chip mounter 500 can position and secure various surface mount components including chips to the land portion on the substrate to which the solder paste is applied. And may be composed of a plurality of chip mounters 500 according to the types of various surface mount components mounted on the substrate.

After mounting the electronic component on the printed circuit board in the chip mounter 500, the reflow 600 melts the solder paste applied to the plurality of printed circuit boards placed on the carrier to fix the electronic component on the printed circuit board . Then, the sorter sort the substrate on which the surface mounting is completed, and the unloaders 800 and 100 (unload) remove the sorted substrate from the surface mounting line. An optical tester 700 (AOI; Auto Optical Inspection (AOI)) which inspects the mounting state of the electronic parts mounted on the printed circuit board via the reflow 600 before supplying the printed circuit board to the sort, ). ≪ / RTI >

On the other hand, the chip mounter 500 receives the carrier identification information and the substrate mark readout information from the mark reader 200 and receives the carrier readout information from the screen printer 300. The receiving method can be provided with the reference mark read information and the carrier identification information by the DB transmission method which receives the DB directly through the mark reader 200 or through the server.

Directly, it is provided directly from the mark reader 200 via wireless or wire. That is, wired communication methods such as Ethernet, universal serial bus, IEEE 1394, serial communication, and parallel communication can be used, and infrared communication, (Bluetooth), a home radio frequency (RF), and a wireless LAN may be used.

The mark reader 200 updates the carrier identification information and the substrate mark read information to the server in real time and registers the data in the database. The chip mounter 500 updates the carrier identification information and the substrate mark read information, Can download and receive the corresponding database from the server.

The chip mounter 500 judges whether or not the electronic component is mounted by judging whether the pattern mounter 500 is a printed circuit board having a normal pattern print or a printed circuit board having a defective pattern print. That is, the chip mounter calculates the amount of substrate deviation of each printed circuit board placed on the carrier by using the substrate mark read information stored in the carrier whose carrier identification information matches the carrier identification information in the first case, which is a printed circuit board with normal pattern printing The electronic parts are mounted on the printed circuit board after correcting the mounting position of the electronic parts according to the calculated amount of deviation of the board, or the second case, which is a printed circuit board with poor pattern printing, is omitted, Do not mount.

In the first case where the pattern printing is normal, the chip mounter 500 uses the substrate mark read information stored in the carrier whose carrier identification information and carrier read information coincide with each other, Thereby calculating the substrate removal amount. For example, when the carrier read information received from the screen printer tester 400 is' SD2541 ', the information of the SD2541' is read using the substrate mark read information having the carrier identification information 'SD2541' received from the mark reader 200 And calculates the amount of substrate deviation of each printed circuit board mounted on the carrier.

When the calculated substrate removal amount is within a predetermined substrate removal allowance range, the electronic component mounting position is corrected by the substrate removal amount to mount the electronic component on the printed circuit board, and the electronic component mounting position is corrected by the substrate removal amount , A half of Δ [+ 3, -1] in the registered mounting position [X1, Y1] when the substrate leaving amount has a deviation amount Δ of Δ [+ 3, -1] on the [X, Y] Correct the mass and mount on the coordinates of [X1-3, Y1 + 1].

On the other hand, when the substrate removal amount deviates from the predetermined substrate removal allowance range, the electronic parts are omitted from being mounted on the printed circuit board. Even if the electronic component is mounted on the printed circuit board through correction by the amount corresponding to the amount of deviation from the substrate, it is difficult to finally implement a normal circuit operation. Therefore, mounting of the electronic component is omitted will be.

On the other hand, in the case of the second case where the pattern printing is defective, when the bad substrate determination information is received from the mark reader 200 as the substrate mark reading information, mounting is performed without mounting the electronic component on the printed circuit board It is omitted. Even if an electronic component is mounted on a printed circuit board having poor pattern printing, normal circuit operation can not be realized, and mounting of the electronic component is omitted in the defective substrate. For reference, the bad pattern printing means that the printed circuit pattern does not print according to the designed standard.

On the other hand, the chip mounter 500 can be calculated in two ways in calculating the substrate deviation amount.

In the first method for calculating the substrate deviation amount, when the substrate reference mark position is received as the substrate mark reading information, the substrate reference mark position of the printed circuit board mounted on the carrier is compared with the registered carrier reference point registration position for each carrier, And the amount of deviation is calculated. For example, when it is assumed that the pre-registered substrate-based first reference point registration position has the X, Y coordinates of [9, 22], the first reference mark of the first printed circuit board S1 mounted on the carrier the amount of deviation of the substrate of the first printed circuit board S1 is the deviation amount? of? [+3, -1] when the position of the first printed circuit board sp1 has the coordinates of [X, Y] of [12,21] Can be calculated. Similarly, when the first reference mark position of the substrate reference point of the second printed circuit board S2 placed on the carrier has the [X, Y] coordinates of [9, 18], the substrate leaving amount of the second printed circuit board S2 is Can be calculated as the deviation amount? Of? [0, -2].

Another method for calculating the substrate deviation amount is a method of calculating the substrate deviation amount by comparing the distance between the carrier reference point marks cp1 and cp2 and the substrate reference mark position. The mark reader 200 reads the carrier reference mark marks cp1 and cp2 displayed on the surface of each carrier and provides the carrier reference mark marks cp1 and cp2 to the chip mounter 500, When the substrate reference point mark position is received, the amount of deviation between the positions of the carrier reference point marks (cp1, cp2) and the substrate reference point mark position is calculated as the substrate deviation amount. For example, when the first printed circuit board S1 is in the correct position without being detached from the correct position as shown in Fig. 6, the first reference mark sp1 of the substrate reference point of the first printed circuit board S1, Has a distance of [X, Y] of DELTA [5,5] from the reference point first mark (cp1). 7, the substrate first reference mark sp1 of the first printed circuit board S1 is shifted from the carrier reference first mark (sphere) by Δ [5, The amount of deviation of the substrate of the first printed circuit board S1 is DELTA [5-5, 5-1] and DELTA [0, 4]. Therefore, when correcting the substrate mounting position considering the amount of deviation from the substrate, the X coordinate is corrected to 0 and the Y coordinate is corrected to -4 at the originally registered substrate mounting position.

The embodiments of the present invention described above are selected and presented in order to assist those of ordinary skill in the art from among various possible examples. The technical idea of the present invention is not necessarily limited to or limited to these embodiments And various changes, modifications, and equivalents may be made without departing from the spirit and scope of the present invention.

100: Loader
200: Mark Reader
300: Screen printer
400: Screen Printer Inspector
500: chip mounter
600; Reflow
700: Optical Inspector
800: Unloader

Claims (10)

A loader that is provided with a plurality of carriers on which a plurality of printed circuit boards are placed and supplies a plurality of carriers; A mark reader for reading the substrate mark displayed on the surface of each printed circuit board to generate substrate mark readout information and transmitting the generated substrate mark readout information to the chip mount together with the carrier identification information; A screen printer for receiving a carrier on which a printed circuit board is placed and applying solder paste on a pattern of the printed circuit board; A screen printer inspector that reads the carrier identifier displayed on each carrier and transmits carrier read information to the chip mounter and inspects the state of the solder paste applied by the screen printer; When the pattern printing is a normal printed circuit board, the amount of substrate deviation of each printed circuit board mounted on the carrier is calculated using the substrate mark read information stored in the carrier whose carrier identification information matches the carrier readout information, A chip mounter that mounts the electronic component on the printed circuit board after correcting the mounting position of the electronic component or does not mount the electronic component on the printed circuit board when the pattern printing is poor; A reflow step of melting solder paste applied to a plurality of printed circuit boards placed on a carrier to fix the electronic parts on a printed circuit board; A sorter for receiving and sorting a surface-mounted printed circuit board from the reflow; And an unloader for removing the classified printed circuit board from the surface mount line; A surface mount apparatus for correcting a position of a chip mounter,
Wherein the substrate mark includes a substrate reference point mark displayed on a printed circuit board,
Wherein the substrate mark reading information includes a substrate reference mark mark position indicating a position of a substrate reference mark of the printed circuit board,
When the substrate reference mark position is received as the substrate mark readout information, the chip mounter compares the substrate reference point mark position of the printed circuit board mounted on the carrier with the registered substrate reference point registration position for each carrier, ,
The electronic component mounting position is corrected by the amount of deviation of the board to mount the electronic component on the printed circuit board,
Wherein the electronic component is omitted without mounting the electronic component on the printed circuit board when the substrate removal amount is out of the preset allowable range of substrate removal allowance.
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