JPH04139788A - Manufacture of wiring board - Google Patents
Manufacture of wiring boardInfo
- Publication number
- JPH04139788A JPH04139788A JP26283790A JP26283790A JPH04139788A JP H04139788 A JPH04139788 A JP H04139788A JP 26283790 A JP26283790 A JP 26283790A JP 26283790 A JP26283790 A JP 26283790A JP H04139788 A JPH04139788 A JP H04139788A
- Authority
- JP
- Japan
- Prior art keywords
- indications
- model number
- wiring board
- printing
- board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 14
- 238000010019 resist printing Methods 0.000 claims abstract description 29
- 239000004020 conductor Substances 0.000 claims abstract description 11
- 238000007639 printing Methods 0.000 abstract description 11
- 238000000034 method Methods 0.000 abstract description 9
- 238000011179 visual inspection Methods 0.000 abstract description 3
- 230000000007 visual effect Effects 0.000 abstract 2
- 239000000463 material Substances 0.000 abstract 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 11
- 239000011889 copper foil Substances 0.000 description 11
- 238000005530 etching Methods 0.000 description 10
- 239000000758 substrate Substances 0.000 description 8
- 238000003780 insertion Methods 0.000 description 4
- 230000037431 insertion Effects 0.000 description 4
- 229910000859 α-Fe Inorganic materials 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
Abstract
Description
【発明の詳細な説明】
〔発明の目的〕
(産業上の利用分野)
本発明は、例えば、インバータ方式の安定器用の放電灯
点灯回路の回路基板などの配線基板の製造方法に関する
。DETAILED DESCRIPTION OF THE INVENTION [Object of the Invention] (Industrial Application Field) The present invention relates to a method of manufacturing a wiring board, such as a circuit board for a discharge lamp lighting circuit for an inverter type ballast, for example.
(従来の技術)
従来のこの種の配線基板は、第3図に示すように、3枚
の基板1を連設し、この連設した配線基板1の両側に補
助基板部2が取外し可能に連設され、この一方の補助基
板部2に電気部品の自動挿入機、および自動装着機用の
基準孔3が形成され、またフェライトコアを挿入される
部分に打抜き可能の補助基板部4が形成されている。そ
して、この連設された基板1に銅箔エツチングにて導電
部5を形成し、さらに、基板1にレジスト印刷してから
シルク印刷にて部品表示6などの表示とともに形番表示
7を印刷形成するようにしている。(Prior art) As shown in FIG. 3, this type of conventional wiring board has three boards 1 arranged in series, and auxiliary board parts 2 are removably mounted on both sides of the arranged wiring boards 1. A reference hole 3 for an automatic electrical component insertion machine and an automatic mounting machine is formed in one of the auxiliary board parts 2, and a punchable auxiliary board part 4 is formed in the part into which the ferrite core is inserted. has been done. Then, a conductive part 5 is formed on the connected substrate 1 by copper foil etching, and after resist printing is performed on the substrate 1, a model number indication 7 is printed along with indications such as the parts indication 6 by silk printing. I try to do that.
(発明が解決しようとする課題)
上記従来の方法では、銅箔エツチング工程の終了時点、
およびレジスト印刷の終了時点でそれぞれ銅箔エツチン
グ、およびレジスト印刷が正しいものであるか否かをそ
れぞれ図面と照合したり、治具なとで確認する作業が必
要であり、製造工数が多く、製造コストが高くなる問題
があった。(Problems to be Solved by the Invention) In the above conventional method, at the end of the copper foil etching process,
And at the end of resist printing, it is necessary to check whether the copper foil etching and resist printing are correct or not, respectively, by comparing them with drawings or using jigs, which requires a large number of manufacturing steps. There was a problem of high costs.
本発明は上記問題点に鑑みなされたもので、導電部の形
成工程で同時に形番表示を形成し、レジスト印刷工程で
同時に形番表示印刷を行い、目視検査で容易に正しいか
否か確認でき、製造工程のコストを低減できる配線基板
の製造方法を提供するものである。。The present invention has been developed in view of the above-mentioned problems.The model number display is simultaneously formed in the process of forming the conductive part, and the model number display is printed simultaneously in the resist printing process, making it possible to easily check whether the model number is correct or not through visual inspection. , provides a method of manufacturing a wiring board that can reduce the cost of the manufacturing process. .
(課題を解決するための手段)
本発明の配線基板の製造方法は、配線基板に導電材にて
導電部の形成と同時にこの導電部を形成した面と同一面
に同一導電材にて形番表示を形成し、前記導電部を印刷
した配線基板にレジスト印刷と同時に同一面にレジスト
印刷による形番表示を形成するものである。(Means for Solving the Problems) In the method for manufacturing a wiring board of the present invention, at the same time a conductive part is formed on a wiring board using a conductive material, a model number is formed on the same surface with the same conductive material on which the conductive part is formed. A display is formed, and a model number display is formed by resist printing on the same surface at the same time as resist printing on the wiring board on which the conductive portion is printed.
(作用)
本発明の配線基板の製造方法は、配線基板に導電材にて
導電部の形成と同時にこの導電面を形成した面と同一面
に同一導電材にて形式表示が形成され、この導電部を印
刷した配線基板にレジスト印刷と同時に同一面にレジス
ト印刷による形番表示が形成され、この導電部の形成と
同時に形成された形番表示とレジスト印刷と同時に印刷
された形番表示とを照合すれば、導電部とレジスト印刷
が合致しているか否かの判定ができ、製造工程の作業性
を向上できるものである。(Function) In the method for manufacturing a wiring board of the present invention, at the same time as a conductive part is formed on the wiring board using a conductive material, a type indication is formed on the same surface with the same conductive material as the conductive surface, and At the same time as the resist printing, a model number display is formed on the same side of the wiring board on which the conductive part is printed, and the model number display formed at the same time as the formation of this conductive part and the model number display printed at the same time as the resist printing are distinguished. By comparing them, it can be determined whether the conductive portion and the resist printing match, and the workability of the manufacturing process can be improved.
(実施例) 本発明の一実施例の構成を第1図について説明する。(Example) The configuration of an embodiment of the present invention will be explained with reference to FIG.
IOはインバータ方式の安定器用の放電灯点灯回路の回
路基板などの配線基板で、3枚の配線基板10を切り離
し可能に連設し、この連設した配線基板filの両側に
補助基板部11. +2が取外し可能に連設されている
。そして、この一方の補助基板部11に電子部品の自動
挿入機、および自動装着機用の基準孔13が形成され、
また、各基板10にはフェライトコアが挿入される部分
に打抜き可能の補助基板部14が形成されている。そし
て、この各補助基板部11.12.14は部品の実装状
態では取外されるようになっている。IO is a wiring board such as a circuit board for a discharge lamp lighting circuit for an inverter-type ballast, and three wiring boards 10 are detachably installed in series, and auxiliary board parts 11. +2 are removably connected. Then, a reference hole 13 for an automatic electronic component insertion machine and an automatic mounting machine is formed in one of the auxiliary board parts 11,
Further, each substrate 10 is formed with a punchable auxiliary substrate portion 14 at a portion into which a ferrite core is inserted. Each of the auxiliary board parts 11, 12, and 14 is designed to be removed when components are mounted.
そして、この連設された各基板10の片面に銅箔エツチ
ングにて導電部15を形成し、この導電部15の形成と
同時に補助基板部14にそれぞれ文字、記号などによる
形番表示16を銅箔エツチングにて形成する。Then, a conductive part 15 is formed on one side of each of the connected boards 10 by copper foil etching, and at the same time as the conductive part 15 is formed, a model number 16 in the form of letters, symbols, etc. is written on the auxiliary board part 14. Formed by foil etching.
さらに、この導電部15を形成した各基板10の導電部
15を形成した同一片面にレジスト印刷18を施す。こ
のレジスト印刷18と同時にそれぞれ文字記号などによ
る形番表示19をレジスト印刷にて形成する。Furthermore, resist printing 18 is performed on the same side of each substrate 10 on which the conductive portion 15 is formed. Simultaneously with this resist printing 18, a model number display 19 using letters and symbols is formed by resist printing.
次いで、シルク印刷により文字、記号などにより電気部
品の接続位置に部品の表示21を印刷形成するとともに
、このシルク印刷と同時に配線基板10に文字、記号な
どによる形番表示22をシルク印刷によって形成する。Next, a component display 21 is printed and formed at the connection position of the electrical component using characters, symbols, etc. by silk printing, and at the same time as this silk printing, a model number display 22 using characters, symbols, etc. is also formed on the wiring board 10 by silk printing. .
次にこの実施例の作用を説明する。Next, the operation of this embodiment will be explained.
配線基板10に導電材にて導電部15の形成と同時にこ
の導電部15を形成した面と同一面の補助基板部14に
それぞれ同一の導電材にて形番表示16が形成される。At the same time as the conductive portion 15 is formed on the wiring board 10 using a conductive material, a model number indication 16 is formed using the same conductive material on the auxiliary substrate portion 14 on the same surface as the surface on which the conductive portion 15 is formed.
この導電部15を印刷した配線基板10にレジスト印刷
18と同時に同一面の補助基板部14にレジスト印刷に
よる形番表示I9がそれぞれ形成される。この状態で、
補助基板部14に形成された銅箔エツチングによる形番
表示16とシルク印刷による形番表示19とを目視で照
合することにより、導電部15とレジスト印刷18とが
正しく一致して形成されたことを確認でき、図面などで
照合する必要がなくなる。Simultaneously with resist printing 18 on the wiring board 10 on which the conductive portion 15 is printed, a model number indication I9 is formed by resist printing on the auxiliary substrate portion 14 on the same side. In this state,
By visually comparing the copper foil etched model number 16 formed on the auxiliary board part 14 and the silk-printed model number 19, it was confirmed that the conductive part 15 and the resist print 18 were formed in correct alignment. This eliminates the need for cross-checking with drawings, etc.
さらに、シルク印刷により文字、記号などにより電気部
品の接続位置に部品の表示21を印刷形成するとともに
、このシルク印刷と同時に配線基板lOに文字、記号な
どによる形番表示22がシルク印刷によって形成される
。そこで、前記銅箔エツチングによる形番表示16とシ
ルク印刷による形番表示19およびシルク印刷による形
番表示22とを目視で照合することによりシルク印刷に
より部品の表示22も正しく形成されたことを確認でき
る。Furthermore, a component display 21 is printed and formed at the connection position of the electrical component using characters, symbols, etc. by silk printing, and at the same time, a model number display 22 using characters, symbols, etc. is formed on the wiring board lO by silk printing. Ru. Therefore, by visually comparing the copper foil etched model number 16 with the silk-printed model number 19 and the silk-printed model number 22, it was confirmed that the part number 22 was also formed correctly by silk-printing. can.
そして、この連設された各配線基板10のフェライトコ
アが挿入される部分の補助基板部14を打ち抜いてから
補助基板部11の基準孔を電子部品の自動挿入機、また
は、自動装着機の基準ピンに合せて装着し、電子部品を
実装する。そして、各配線基板を分離するとともに、補
助基板部II、 12を取外すことにより配線基板!
0に実装回路が形成される。Then, after punching out the auxiliary board part 14 of the part of each interconnected wiring board 10 into which the ferrite core is inserted, the reference hole of the auxiliary board part 11 is inserted into the reference hole of the automatic electronic component insertion machine or the automatic mounting machine. Attach it to the pins and mount the electronic components. Then, by separating each wiring board and removing the auxiliary board parts II and 12, the wiring board is completed!
A mounting circuit is formed on 0.
また、前記実施例では、補助基板部I4にそれぞれ銅箔
エツチングにて文字、記号などによる形番表示16を形
成するとともに、レジスト印刷により文字、記号などに
よる形番表示I9を形成した方法について説明したが、
上下部の補助基板11. 12のいずれか一方または両
方に前記銅箔エツチングによる形番表示とレジスト印刷
による形番表示とシルク印刷による形番表示を形成する
こともてきる。Furthermore, in the above embodiment, a method was described in which a model number display 16 using letters, symbols, etc., was formed by copper foil etching on each of the auxiliary board portions I4, and a model number display I9 using characters, symbols, etc., was formed by resist printing. However,
Upper and lower auxiliary substrates 11. It is also possible to form a model number display by copper foil etching, a model number display by resist printing, and a model number display by silk printing on either or both of 12.
さらに第2図に示すように、前記銅箔エツチングによる
形番表示16とレジスト印刷による形番表示19の他に
補助基板部11に銅箔エツチングによる形番表示23、
レジスト印刷による形番表示24、シルク印刷25によ
る形番表示25をバーコードにて形成することもできる
。Furthermore, as shown in FIG. 2, in addition to the model number display 16 formed by copper foil etching and the model number display 19 formed by resist printing, a model number display 23 formed by copper foil etching on the auxiliary board portion 11;
The model number display 24 by resist printing and the model number display 25 by silkscreen printing 25 can also be formed using a bar code.
そして形番表示16. I7.19.20の他に形番表
示23.24.25をバーコードにて形成することによ
り、この回路基板10をバーコード読取り機により自動
的に銅箔エツチングによる導電部15とレジスト印刷1
8とが正しく形成されたか判別でき、さらに、バーコー
ド読取り機を付設した自動挿入機または自動装着機を使
用すれば、工程作業が容易となる。And model number display 16. By forming the model number 23.24.25 in addition to I7.19.20 as a barcode, this circuit board 10 can be automatically etched with a conductive part 15 by copper foil etching and resist printing 1 by a barcode reader.
It can be determined whether or not 8 has been formed correctly, and furthermore, if an automatic insertion machine or an automatic mounting machine equipped with a barcode reader is used, the process work becomes easier.
本発明によれば、配線基板に導電材にて導電部の形成と
同時にこの導電面を形成した面と同一面に同一導電材に
て形番表示が形成され、この導電部を印刷した配線基板
にレジスト印刷と同時に向−面にレジスト印刷による形
番表示が形成され、この導電部の形成と同時に形成され
た形番表示とレジスト印刷と同時に印刷された形番表示
とを照合すれば、導電部とレジスト印刷が合致している
か否かの判定ができ、導電部とレジスト印刷が正しいか
否か目視検査で容易に確認でき、製造工程のコストを低
減できるものである。According to the present invention, at the same time as a conductive part is formed on a wiring board using a conductive material, a model number indication is formed on the same surface using the same conductive material as the conductive surface, and the wiring board on which this conductive part is printed is formed. At the same time as the resist printing, a model number display is formed on the opposite side by resist printing, and if you compare the model number display formed at the same time as the formation of this conductive part with the model number display printed at the same time as the resist printing, the conductive It is possible to determine whether or not the conductive part and the resist printing match, and whether the conductive part and the resist printing are correct can be easily confirmed by visual inspection, and the cost of the manufacturing process can be reduced.
第1図は本発明の配線基板の製造方法の一実施例を示す
正面図、第2図は本発明の配線基板の製造方法の他の一
実施例を示す正面図、第3図は従来の配線基板の正面図
である。
10・
配線基板、
15・
導電部、
16゜
19゜
形番表示、
18・
・レジス
ト印刷。FIG. 1 is a front view showing an embodiment of the wiring board manufacturing method of the present invention, FIG. 2 is a front view showing another embodiment of the wiring board manufacturing method of the invention, and FIG. 3 is a front view showing an embodiment of the wiring board manufacturing method of the invention. FIG. 3 is a front view of the wiring board. 10. Wiring board, 15. Conductive part, 16°19° model number display, 18. Resist printing.
Claims (1)
導電部を形成した面と同一面に同一導電材にて形番表示
を形成し、 前記導電部を印刷した配線基板にレジスト印刷と同時に
同一面にレジスト印刷による形番表示を形成する ことを特徴とする配線基板の製造方法。(1) At the same time as a conductive part is formed on the wiring board using a conductive material, a model number is formed on the same surface with the same conductive material on which the conductive part is formed, and resist printing is performed on the wiring board on which the conductive part is printed. A method of manufacturing a wiring board, characterized by simultaneously forming a model number display on the same surface by resist printing.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP26283790A JPH04139788A (en) | 1990-09-29 | 1990-09-29 | Manufacture of wiring board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP26283790A JPH04139788A (en) | 1990-09-29 | 1990-09-29 | Manufacture of wiring board |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH04139788A true JPH04139788A (en) | 1992-05-13 |
Family
ID=17381308
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP26283790A Pending JPH04139788A (en) | 1990-09-29 | 1990-09-29 | Manufacture of wiring board |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH04139788A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005520334A (en) * | 2002-03-13 | 2005-07-07 | スチュルス−ハーダー,ジャーヘン | Process for producing a metal-ceramic substrate, preferably a copper-ceramic substrate |
US8342384B2 (en) | 2002-03-13 | 2013-01-01 | Curamik Electronics Gmbh | Method for the production of a metal-ceramic substrate, preferably a copper ceramic substrate |
-
1990
- 1990-09-29 JP JP26283790A patent/JPH04139788A/en active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005520334A (en) * | 2002-03-13 | 2005-07-07 | スチュルス−ハーダー,ジャーヘン | Process for producing a metal-ceramic substrate, preferably a copper-ceramic substrate |
US8342384B2 (en) | 2002-03-13 | 2013-01-01 | Curamik Electronics Gmbh | Method for the production of a metal-ceramic substrate, preferably a copper ceramic substrate |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JPH04139788A (en) | Manufacture of wiring board | |
KR200455025Y1 (en) | Terminal Replacement Type Printed Circuit Board | |
JPH10173299A (en) | Printed wiring board | |
JPH05167219A (en) | Substrate printing method | |
JPH0983116A (en) | Printed wiring board | |
JP2002076543A (en) | Printed board | |
JPH02262390A (en) | Printed-wiring board | |
JP4135256B2 (en) | Printed wiring board having marked component mounting lands | |
JPS6240458Y2 (en) | ||
JPH06209145A (en) | Printed board | |
KR101479041B1 (en) | Printed circuit board panel having replaced printed circuit board and manufacturing method of the same | |
JPH09275262A (en) | Printed board device | |
JP2000031627A (en) | Manufacture of printed wiring board and method for mounting therefor | |
JPH11251696A (en) | Structure of printed wiring board | |
JPS58303Y2 (en) | printed wiring board | |
JPH11214824A (en) | Printing mask and manufacture of printed wiring board using the same | |
JPH0593072U (en) | Printed circuit board modification module | |
JPH05335706A (en) | Printed circuit substrate with part position recognizing mark | |
JPH0218983A (en) | Confirming method for position of printing of marking | |
JPH0936505A (en) | Flexible printed board original sheet | |
KR980007878A (en) | Pattern Formation Method of Printed Circuit Board | |
JPH055765A (en) | Detecting method of presence/absence of printing in printed circuit board | |
JPS59993B2 (en) | Manufacturing method of printed wiring board | |
JPH04127670U (en) | electronic circuit equipment | |
JPS61212093A (en) | Manufacture of printed wiring board |