KR980007878A - Pattern Formation Method of Printed Circuit Board - Google Patents

Pattern Formation Method of Printed Circuit Board Download PDF

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Publication number
KR980007878A
KR980007878A KR1019960020819A KR19960020819A KR980007878A KR 980007878 A KR980007878 A KR 980007878A KR 1019960020819 A KR1019960020819 A KR 1019960020819A KR 19960020819 A KR19960020819 A KR 19960020819A KR 980007878 A KR980007878 A KR 980007878A
Authority
KR
South Korea
Prior art keywords
circuit board
printed circuit
component
formation method
pattern formation
Prior art date
Application number
KR1019960020819A
Other languages
Korean (ko)
Inventor
권이장
정구승
Original Assignee
김연혁
대덕산업 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 김연혁, 대덕산업 주식회사 filed Critical 김연혁
Priority to KR1019960020819A priority Critical patent/KR980007878A/en
Publication of KR980007878A publication Critical patent/KR980007878A/en

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  • Manufacturing Of Printed Wiring (AREA)

Abstract

부품이 삽입되는 홀(Hole)의 인접 패턴이 홀에 삽입되는 부품의 리드선 (Lead)과 접촉되지 않는 구조로 형성하여 인쇄회로기판의 신뢰도를 향상시킨 인쇄회로기판의 패턴형성방법에 관한 것이다.The present invention relates to a pattern formation method of a printed circuit board, which has a structure in which adjacent patterns of a hole into which a component is inserted are not in contact with a lead of a component inserted into the hole, thereby improving reliability of the printed circuit board.

본 발명은 기판에 적층된 동박을 인쇄 및 식각공정을 수행하여 배선도형으로 혀성시키는 인쇄회로기판의 패턴형성방법에 있어서, 상기 기판에 부품을 실장시키도록 형성되는 홀에 인접한 상기 동박의 일정영역을 상기 인쇄 및 식각공정에서 더 제거하는 패턴구조로 형성하여 실장되는 상기 부품의 리드선과 접촉하지 않도록 하여 이루어진다. 따라서, 본 발명에 의하면 부품의 리드선과 패턴이 접촉되는 것을 방지하여 불량원인이 제거되어 인쇄회로기판의 신뢰도를 향상시키는 효과가 있다.The present invention relates to a pattern formation method of a printed circuit board which is printed and etched on a copper foil laminated on a substrate to form a wiring diagram, wherein the predetermined region of the copper foil adjacent to a hole formed to mount a component on the substrate is provided. It is formed in a pattern structure that is further removed in the printing and etching process so as not to contact the lead wire of the component to be mounted. Therefore, according to the present invention, it is possible to prevent contact between the lead wires of the parts and the pattern so that defective causes are eliminated, thereby improving the reliability of the printed circuit board.

Description

인쇄회로기판의 패턴형성방법Pattern Formation Method of Printed Circuit Board

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음As this is a public information case, the full text was not included.

제2도는 본 발명에 따른 인쇄회로기판의 패턴형성방법의 실시예를 나타내는 사시도.2 is a perspective view showing an embodiment of a pattern forming method of a printed circuit board according to the present invention.

Claims (1)

기판에 적층된 동박을 인쇄 및 식각공정을 수행하여 배선도형으로 형성시키는 인쇄회로기판의 패턴형성방법에 있어서, 상기 기판에 부품을 실장시키도록 형성되는 홀에 인접한 상기 동박의 일정영역을 상기 인쇄 및 식각공정에서 더 제거하는 패턴구조로 형성하여 실장되는 상기 부품의 리드선과 접촉하지 않도록 이루어짐을 특징으로 하는 인쇄회로기판의 패턴형성방법.A pattern formation method of a printed circuit board for forming copper wiring laminated on a substrate by performing a printing and etching process to form a wiring diagram, the method comprising: printing and printing a predetermined region of the copper foil adjacent to a hole formed to mount a component on the substrate; The pattern forming method of a printed circuit board, characterized in that formed in a pattern structure that is further removed in the etching process so as not to come into contact with the lead wire of the component to be mounted.
KR1019960020819A 1996-06-11 1996-06-11 Pattern Formation Method of Printed Circuit Board KR980007878A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1019960020819A KR980007878A (en) 1996-06-11 1996-06-11 Pattern Formation Method of Printed Circuit Board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019960020819A KR980007878A (en) 1996-06-11 1996-06-11 Pattern Formation Method of Printed Circuit Board

Publications (1)

Publication Number Publication Date
KR980007878A true KR980007878A (en) 1998-03-30

Family

ID=66284021

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019960020819A KR980007878A (en) 1996-06-11 1996-06-11 Pattern Formation Method of Printed Circuit Board

Country Status (1)

Country Link
KR (1) KR980007878A (en)

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