KR19990026794U - Optimal Thermal Design for Automotive ECU Substrate - Google Patents

Abstract

The present invention relates to an optimal heat dissipation design method of the ECU board for a vehicle, in order to effectively heat dissipation of the IC by inserting the IC inside the printed wiring circuit board and then mounting the heat sink thereon, the printed wiring board (2 The first step of installing a predetermined hole (2a) so that the IC (4) can be inserted into the), and the lead wire (4a) of the IC (4) is coupled to the inner wall surface of the hole (2a) A second step of installing the land 2b of the second step; and mounting the IC 4 in the hole 2a to solder when the land 2b and the lead wire 4a are coupled to each other; When the IC 4 is mounted in the hole 2a of the printed circuit board 2, the fourth step of mounting the heat sink 6 having the same size as the printed circuit board 2 on the upper surface thereof. Characterized in that made.

Description

Optimal Heat Dissipation Design Method for ECC Substrate

The present invention relates to an optimal heat dissipation design method of a vehicle ECU board, and more particularly, by inserting an IC into a printed wiring circuit board, and then mounting a heat sink thereon, an optimal heat dissipation of an ECU board for an automobile can be effectively performed. It relates to a heat dissipation design method.

As is well known, conventional electronic control unit substrates have used Surface Mounting Technology (SMT) or Through Hole Technology (THT).

In addition, heat generated from the elements of the entire electronic control unit substrate can be removed by a heat sink installed on the wall inside the electronic control unit housing.

However, the heat sink installed on the inner wall of the electronic control unit housing has a disadvantage that it does not work properly. When the heat sink is attached on the IC board, the thickness is increased and the heat charge is localized even when the heat sink is attached. Difficult to do

Accordingly, the present invention has been made in view of the above circumstances, and an object of the present invention is to provide an optimal heat dissipation design method for an ECU substrate for a vehicle in which heat transfer can be effectively performed by inserting an IC into a printed circuit board and then installing a heat sink. have.

According to the optimum heat dissipation design method of the vehicle ECU board according to the present invention in order to achieve the above object, in order to effectively heat the IC by inserting the IC inside the printed wiring circuit board and then mounting a heat sink thereon, A first step of installing a predetermined hole so that the IC can be inserted into the printed wiring circuit board, a second step of installing a predetermined land to couple the lead wire of the IC to the inner wall of the hole, and the hole A third step of soldering when the IC is mounted on the land and the lead wires are coupled to each other; and when the IC is mounted in the hole of the PCB for printed wiring, the upper surface of the IC has the same size as the PCB for the printed wiring circuit. Provided is an optimal heat dissipation design method for an ECU substrate for a vehicle, comprising a fourth step of mounting a heat sink.

According to the present invention configured as described above, by installing a hole in which the IC can be inserted into the printed wiring circuit board, and installing a land connected to the wiring in the installed hole, the soldering is performed so that the lead wire and the land of the IC are coupled, and then printed. The heat sink having the same size as the wiring circuit board is mounted on the upper surface thereof.

1 is a schematic diagram showing an example of installing an optimal heat sink of the ECU substrate for a vehicle according to a preferred embodiment of the present invention.

Explanation of symbols on the main parts of the drawings

2: PCB for printed wiring circuit,

2a: Hall,

2b: land, 4: IC,

4a: lead wire, 6: heat sink.

Hereinafter, the present invention configured as described above will be described in detail with reference to the accompanying drawings.

That is, FIG. 1 is a schematic diagram showing an example of installing an optimal heat sink of a vehicle ECU board according to a preferred embodiment of the present invention. According to the drawing, reference numeral 2 denotes a circuit required by coating copper foil on a sheet of paper epoxy or glass epoxy. The printed circuit board (PCB), ie, a printed wiring circuit board, which is printed and removed other parts, and then soldered by attaching other components to the circuit.

Reference numeral 2a denotes a hole in which the land 2b is provided and excavated so that the IC can be inserted into the printed wiring circuit board and coupled to the wiring in the board.

Reference numeral 4 denotes an integrated circuit, or IC, in which passive and active circuit elements are detachably coupled on one substrate or in the substrate.

Reference numeral 4a denotes a lead wire of the IC 4, where the lead wire 4a is bent at a predetermined angle so as to be coupled to a wire in the substrate hole 2a for the printed wiring circuit.

Reference numeral 6 denotes a heat sink for efficient heat transfer into the IC 4, where the heat sink 6 is the same size as the printed circuit board 2 and is attached without deformation.

Next, the operation of the present invention made as described above will be described in detail with reference to the accompanying drawings.

First, a predetermined hole 2a is formed so that the IC 4 can be inserted in a substrate process of the printed wiring circuit 2, and then the lead wire 4a of the IC 4 is formed on the wall surface of the hole 2a. Land (2b) is installed so that it can be combined with.

In addition, during the IC 4 process, the lead wire of the IC 4 is coupled to the land 2b provided on the wall surface of the printed wiring board 2a so as to be bent at a predetermined angle so that soldering can be performed. .

Next, the IC 4 is inserted into the substrate hole 2a for the printed wiring circuit so that the lead wire 4a of the IC 4 is coupled with the land 2b in the hole 2a.

Subsequently, when the lead wire 4a and the land 2b are coupled to each other in position, soldering is performed.

Then, the IC 4 is mounted in the printed circuit board 2 in an integrated form, and then the heat sink 6 is disposed at a predetermined position, ie, an upper surface, in which heat transfer can be efficiently performed to the IC 4. Mount on.

According to the present invention made as described above, by inserting the IC in the hole for the printed wiring circuit board, and then mounting the heat sink on the upper surface, reducing the substrate thickness of the entire electronic control unit, and directly to the heat sink By attaching to the substrate, the heat dissipation effect of the entire electronic control unit substrate can be enhanced.

Claims (1)

A first step of providing a predetermined hole 2a so that the IC 4 can be inserted into the printed wiring circuit board 2; A second step of installing a predetermined land 2b on the inner wall surface of the hole 2a so that the lead wire 4a of the IC 4 can be coupled; A third step of attaching the IC 4 to the hole 2a and soldering the land 2b and the lead wire 4a to each other; A fourth step of mounting the heat dissipation plate 6 having the same size as the printed circuit board 2 when the IC 4 is mounted in the hole 2a of the printed wiring circuit board 2; Optimal heat dissipation design method of a vehicle ECU substrate, characterized in that consisting of.