CN105101650A - PCBA (Printed Circuit Board Assembly) manufacturability inspection method - Google Patents
PCBA (Printed Circuit Board Assembly) manufacturability inspection method Download PDFInfo
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- CN105101650A CN105101650A CN201510529272.5A CN201510529272A CN105101650A CN 105101650 A CN105101650 A CN 105101650A CN 201510529272 A CN201510529272 A CN 201510529272A CN 105101650 A CN105101650 A CN 105101650A
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0005—Apparatus or processes for manufacturing printed circuits for designing circuits by computer
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
- H05K2203/1305—Moulding and encapsulation
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/16—Inspection; Monitoring; Aligning
Abstract
The invention discloses a PCBA (Printed Circuit Board Assembly) manufacturability inspection method which utilizes a computer to generate a PCB package datasheet containing position number information in a PCB; checking if the position numbers are sole or not; outputting repetitive position numbers when the position numbers are not sole; utilizing a computer to generate a BOM datasheet containing position number information in an EBOM; checking if the position numbers in the PCB package datasheet are consistent with the position numbers in the BOM datasheet one to one; outputting inconsistent position numbers when inconsistency is found. According to the invention, full check can be conducted to the manufacturability of a PCBA. The method is capable of finding out errors such as repetition of position numbers in a PCB, inconsistency between position numbers in a PCB and an EBOM, non-use of standard package, mistaken use of standard package and the material height beyond technical requirements. With the method, the blind areas and difficult points in manual browsing inspection are overcome, high inspection efficiency can be achieved and the producing cost of a PCBA is reduced.
Description
Technical field
The invention belongs to electronics manufacturing technology field, particularly a kind of PCBA(PrintedCircuitBoardAssembly, printed circuit board assembly) manufacturability checking method.
Background technology
In PCBA manufacturability checking process, it is desirable to pinpoint the problems as much as possible, when avoiding manufacturing experimently, problem just exposes, and causes unnecessary loss.
In current PCBA manufacturability checking process, only formula examination manually being browsed to PCB, therefore can only examining out the detectable problem of range estimation (whether suitable etc. whether whether complete, the silk-screen of mark is overlapping as required, whether bar code frame is placed and placed).
Due to the item quantity on PCB tens at least, hundreds of at most, therefore manually browses formula examination and can not examine following problem: PCB item repeats, PCB exceeds technological requirement etc. than EBOM multidigit number, EBOM than PCB multidigit number, PCB never call standard packaging, standard packaging call error, height of materials.Therefore this kind of problem just can only expose in advanced development in kind, must could be solved, cause unnecessary loss by amendment PCB.
Summary of the invention
Existingly manually browse that formula PCBA manufacturability checking method can not examine out that PCB item repeats, PCB exceeds the problems such as technological requirement than EBOM multidigit number, EBOM than PCB multidigit number, PCB never call standard packaging, standard packaging call error, height of materials, thus cause unnecessary loss.The object of the invention is to, for above-mentioned the deficiencies in the prior art, provide a kind of PCBA manufacturability checking method improved.
For solving the problems of the technologies described above, the technical solution adopted in the present invention is:
A kind of PCBA manufacturability checking method, utilizes Practical computer teaching PCB encapsulation of data table, comprises the item information in PCB in described PCB encapsulation of data table, checks that whether the item in PCB encapsulation of data table is unique; If not unique, export and repeat item.
Further, utilize Practical computer teaching BOM tables of data, in described BOM tables of data, comprise the item information in EBOM, check the item in PCB encapsulation of data table and the item in BOM tables of data whether one_to_one corresponding; If not one_to_one corresponding, export not corresponding item.
Further, also comprise COM code information in EBOM in described BOM tables of data and device is via devices or surface mounting component information, in described PCB encapsulation of data table, also comprise the encapsulation name information in layer information residing for the device in PCB and PCB;
Comprise the following steps:
A. specify Wave crest Welding face and PCBA processing technology is set;
B. device welding manner is judged:
If device is surface mounting component, and on non-Wave crest Welding face, then device welding manner is Reflow Soldering;
If device is surface mounting component, on Wave crest Welding face, and PCBA processing technology is pallet solder wave process, then device welding manner is Reflow Soldering;
If device is surface mounting component, on Wave crest Welding face, and PCBA processing technology is red glue solder wave process, then device welding manner is red glue wave-soldering;
If device is via devices, and on non-Wave crest Welding face, then device welding manner is wave-soldering;
If device is via devices, and on Wave crest Welding face, then device welding manner is manual welding;
C. utilize COM code, the encapsulation name in computer reading material standard packaging tables of data, carry out encapsulation examination:
If the COM code in BOM tables of data can find in the COM code of material standard packaging tables of data, but non-specified value encapsulation name in material standard packaging tables of data, examination result is that standard packaging is unknown;
If the COM code in BOM tables of data can find in the COM code of material standard packaging tables of data, and in material standard packaging tables of data specified value encapsulation name, and device welding manner is Reflow Soldering, and the encapsulation name in PCB encapsulation of data table is Reflow Soldering encapsulation, if the encapsulation name in PCB encapsulation of data table conforms to described standard packaging name of specifying, examination result is that encapsulation is called correctly;
If the COM code in BOM tables of data can find in the COM code of material standard packaging tables of data, and in material standard packaging tables of data specified value encapsulation name, and device welding manner is Reflow Soldering, and the encapsulation name in PCB encapsulation of data table is Reflow Soldering encapsulation, if the encapsulation name in PCB encapsulation of data table does not conform to described standard packaging name of specifying, examination result is that encapsulation is called incorrect, and the encapsulation name in PCB encapsulation of data table should be changed into the standard packaging name of having specified in material standard packaging tables of data by prompting;
If the COM code in BOM tables of data can find in the COM code of material standard packaging tables of data, and in material standard packaging tables of data specified value encapsulation name, and device welding manner is Reflow Soldering, but the encapsulation name in PCB encapsulation of data table is the encapsulation of red glue wave-soldering, examination result is that the encapsulation in PCB should change Reflow Soldering encapsulation into;
If the COM code in BOM tables of data can find in the COM code of material standard packaging tables of data, and in material standard packaging tables of data specified value encapsulation name, and device welding manner is red glue wave-soldering, and the encapsulation name in PCB encapsulation of data table is the encapsulation of red glue wave-soldering, if the encapsulation name in PCB encapsulation of data table conforms to described standard packaging name of specifying, examination result is that encapsulation is called correctly;
If the COM code in BOM tables of data can find in the COM code of material standard packaging tables of data, and in material standard packaging tables of data specified value encapsulation name, and device welding manner is red glue wave-soldering, and the encapsulation name in PCB encapsulation of data table is the encapsulation of red glue wave-soldering, if the encapsulation name in PCB encapsulation of data table does not conform to described standard packaging name of specifying, examination result is that encapsulation is called incorrect, and the encapsulation name in PCB encapsulation of data table should be changed into the standard packaging name of having specified in material standard packaging tables of data by prompting;
If the COM code in BOM tables of data can find in the COM code of material standard packaging tables of data, and in material standard packaging tables of data specified value encapsulation name, and device welding manner is red glue wave-soldering, but the encapsulation name in PCB encapsulation of data table is Reflow Soldering encapsulation, examination result is that the encapsulation in PCB should change the encapsulation of red glue wave-soldering into;
If the COM code in BOM tables of data can find in the COM code of material standard packaging tables of data, and in material standard packaging tables of data specified value encapsulation name, and device welding manner is wave-soldering or manual welding, if the encapsulation name in PCB encapsulation of data table conforms to described standard packaging name of specifying, examination result is that encapsulation is called correctly;
If the COM code in BOM tables of data can find in the COM code of material standard packaging tables of data, and in material standard packaging tables of data specified value encapsulation name, and device welding manner is wave-soldering or manual welding, if the encapsulation name in PCB encapsulation of data table does not conform to described standard packaging name of specifying, examination result is that encapsulation is called incorrect, and the encapsulation name in PCB encapsulation of data table should be changed into the standard packaging name of having specified in material standard packaging tables of data by prompting;
If the COM code in BOM tables of data can not find in the COM code of material standard packaging tables of data, examination result is without this material in material standard packaging tables of data.
Further, also comprise COM code information in EBOM in described BOM tables of data and device is via devices or surface mounting component information, in described PCB encapsulation of data table, also comprise layer information residing for the device in PCB;
Comprise the following steps:
A. specify Wave crest Welding face and PCBA processing technology and element height restriction are set;
B. device welding manner is judged:
If device is surface mounting component, and on non-Wave crest Welding face, then device welding manner is Reflow Soldering;
If device is surface mounting component, on Wave crest Welding face, and PCBA processing technology is pallet solder wave process, then device welding manner is Reflow Soldering;
If device is surface mounting component, on Wave crest Welding face, and PCBA processing technology is red glue solder wave process, then device welding manner is red glue wave-soldering;
If device is via devices, and on non-Wave crest Welding face, then device welding manner is wave-soldering;
If device is via devices, and on Wave crest Welding face, then device welding manner is manual welding;
C. utilize COM code, the element height information in computer reading material standard packaging tables of data, carry out height examination:
If the COM code in BOM tables of data can find in the COM code of material standard packaging tables of data, and layer residing for device is non-Wave crest Welding face, and examination result is that device is in non-Wave crest Welding face;
If the COM code in BOM tables of data can find in the COM code of material standard packaging tables of data, device welding manner is Reflow Soldering, and in wave-soldering junction, then judges the height of device; If element height exceedes the upper limit that pallet solder wave process limits element height, examination result is for highly to exceed restriction; If element height exceedes warning value, examination result is that highly lower device is selected in suggestion; If element height is lower than higher limit, examination result is highly qualified; Otherwise examination result is that element height is unknown;
If the COM code in BOM tables of data can find in the COM code of material standard packaging tables of data, and device welding manner is red glue wave-soldering, then judge the height of device; If element height exceedes the upper limit that red glue solder wave process limits element height, examination result is for highly to exceed restriction; If element height is lower than higher limit, examination result is highly qualified; Otherwise examination result is that element height is unknown;
If the COM code in BOM tables of data can find in the COM code of material standard packaging tables of data, and device welding manner is manual welding, examination result is that device is moved to non-Wave crest Welding face;
If the COM code in BOM tables of data can not find in the COM code of material standard packaging tables of data, and layer residing for device is non-Wave crest Welding face, and examination result is that device is in non-Wave crest Welding face; If layer residing for device is Wave crest Welding face, and type of device is via devices, examination result is that device is moved to non-Wave crest Welding face; Otherwise examination result is that element height is unknown.
As a kind of optimal way, the repetition item in PCB encapsulation of data table, and the PCB encapsulation of data table item not corresponding with BOM tables of data does not judge device welding manner.
The present invention can examine fully to PCBA manufacturability, can examine out that PCB item repeats, inconsistent, the PCB never call standard packaging of item, standard packaging call error, height of materials exceed the mistakes such as technological requirement in PCB and EBOM, solve the examination blind area and difficult point of manually browsing formula examination, examination efficiency is high, reduces the manufacturing cost of PCBA.
Embodiment
One embodiment of the present invention comprises and utilizes Practical computer teaching PCB encapsulation of data table, comprises the item information in PCB in described PCB encapsulation of data table, checks that whether the item in PCB encapsulation of data table is unique; If not unique, export and repeat item.
Utilize Practical computer teaching BOM tables of data, in described BOM tables of data, comprise the item information in EBOM, check the item in PCB encapsulation of data table and the item in BOM tables of data whether one_to_one corresponding; If not one_to_one corresponding, export not corresponding item.
Also comprise COM code information in EBOM in described BOM tables of data and device is via devices or surface mounting component information, in described PCB encapsulation of data table, also comprise the encapsulation name information in layer information residing for the device in PCB and PCB;
Comprise the following steps:
A. specify Wave crest Welding face and PCBA processing technology is set;
B. device welding manner is judged:
If device is surface mounting component, and on non-Wave crest Welding face, then device welding manner is Reflow Soldering;
If device is surface mounting component, on Wave crest Welding face, and PCBA processing technology is pallet solder wave process, then device welding manner is Reflow Soldering;
If device is surface mounting component, on Wave crest Welding face, and PCBA processing technology is red glue solder wave process, then device welding manner is red glue wave-soldering;
If device is via devices, and on non-Wave crest Welding face, then device welding manner is wave-soldering;
If device is via devices, and on Wave crest Welding face, then device welding manner is manual welding;
C. utilize COM code, the encapsulation name in computer reading material standard packaging tables of data, carry out encapsulation examination:
If the COM code in BOM tables of data can find in the COM code of material standard packaging tables of data, but non-specified value encapsulation name in material standard packaging tables of data, examination result is that standard packaging is unknown;
If the COM code in BOM tables of data can find in the COM code of material standard packaging tables of data, and in material standard packaging tables of data specified value encapsulation name, and device welding manner is Reflow Soldering, and the encapsulation name in PCB encapsulation of data table is Reflow Soldering encapsulation, if the encapsulation name in PCB encapsulation of data table conforms to described standard packaging name of specifying, examination result is that encapsulation is called correctly;
If the COM code in BOM tables of data can find in the COM code of material standard packaging tables of data, and in material standard packaging tables of data specified value encapsulation name, and device welding manner is Reflow Soldering, and the encapsulation name in PCB encapsulation of data table is Reflow Soldering encapsulation, if the encapsulation name in PCB encapsulation of data table does not conform to described standard packaging name of specifying, examination result is that encapsulation is called incorrect, and the encapsulation name in PCB encapsulation of data table should be changed into the standard packaging name of having specified in material standard packaging tables of data by prompting;
If the COM code in BOM tables of data can find in the COM code of material standard packaging tables of data, and in material standard packaging tables of data specified value encapsulation name, and device welding manner is Reflow Soldering, but the encapsulation name in PCB encapsulation of data table is the encapsulation of red glue wave-soldering, examination result is that the encapsulation in PCB should change Reflow Soldering encapsulation into;
If the COM code in BOM tables of data can find in the COM code of material standard packaging tables of data, and in material standard packaging tables of data specified value encapsulation name, and device welding manner is red glue wave-soldering, and the encapsulation name in PCB encapsulation of data table is the encapsulation of red glue wave-soldering, if the encapsulation name in PCB encapsulation of data table conforms to described standard packaging name of specifying, examination result is that encapsulation is called correctly;
If the COM code in BOM tables of data can find in the COM code of material standard packaging tables of data, and in material standard packaging tables of data specified value encapsulation name, and device welding manner is red glue wave-soldering, and the encapsulation name in PCB encapsulation of data table is the encapsulation of red glue wave-soldering, if the encapsulation name in PCB encapsulation of data table does not conform to described standard packaging name of specifying, examination result is that encapsulation is called incorrect, and the encapsulation name in PCB encapsulation of data table should be changed into the standard packaging name of having specified in material standard packaging tables of data by prompting;
If the COM code in BOM tables of data can find in the COM code of material standard packaging tables of data, and in material standard packaging tables of data specified value encapsulation name, and device welding manner is red glue wave-soldering, but the encapsulation name in PCB encapsulation of data table is Reflow Soldering encapsulation, examination result is that the encapsulation in PCB should change the encapsulation of red glue wave-soldering into;
If the COM code in BOM tables of data can find in the COM code of material standard packaging tables of data, and in material standard packaging tables of data specified value encapsulation name, and device welding manner is wave-soldering or manual welding, if the encapsulation name in PCB encapsulation of data table conforms to described standard packaging name of specifying, examination result is that encapsulation is called correctly;
If the COM code in BOM tables of data can find in the COM code of material standard packaging tables of data, and in material standard packaging tables of data specified value encapsulation name, and device welding manner is wave-soldering or manual welding, if the encapsulation name in PCB encapsulation of data table does not conform to described standard packaging name of specifying, examination result is that encapsulation is called incorrect, and the encapsulation name in PCB encapsulation of data table should be changed into the standard packaging name of having specified in material standard packaging tables of data by prompting;
If the COM code in BOM tables of data can not find in the COM code of material standard packaging tables of data, examination result is without this material in material standard packaging tables of data.
Also comprise COM code information in EBOM in described BOM tables of data and device is via devices or surface mounting component information, in described PCB encapsulation of data table, also comprise layer information residing for the device in PCB;
Comprise the following steps:
A. specify Wave crest Welding face and PCBA processing technology and element height restriction are set;
B. device welding manner is judged:
If device is surface mounting component, and on non-Wave crest Welding face, then device welding manner is Reflow Soldering;
If device is surface mounting component, on Wave crest Welding face, and PCBA processing technology is pallet solder wave process, then device welding manner is Reflow Soldering;
If device is surface mounting component, on Wave crest Welding face, and PCBA processing technology is red glue solder wave process, then device welding manner is red glue wave-soldering;
If device is via devices, and on non-Wave crest Welding face, then device welding manner is wave-soldering;
If device is via devices, and on Wave crest Welding face, then device welding manner is manual welding;
C. utilize COM code, the element height information in computer reading material standard packaging tables of data, carry out height examination:
If the COM code in BOM tables of data can find in the COM code of material standard packaging tables of data, and layer residing for device is non-Wave crest Welding face, and examination result is that device is in non-Wave crest Welding face;
If the COM code in BOM tables of data can find in the COM code of material standard packaging tables of data, device welding manner is Reflow Soldering, and in wave-soldering junction, then judges the height of device; If element height exceedes the upper limit that pallet solder wave process limits element height, examination result is for highly to exceed restriction; If element height exceedes warning value, examination result is that highly lower device is selected in suggestion; If element height is lower than higher limit, examination result is highly qualified; Otherwise examination result is that element height is unknown;
If the COM code in BOM tables of data can find in the COM code of material standard packaging tables of data, and device welding manner is red glue wave-soldering, then judge the height of device; If element height exceedes the upper limit that red glue solder wave process limits element height, examination result is for highly to exceed restriction; If element height is lower than higher limit, examination result is highly qualified; Otherwise examination result is that element height is unknown;
If the COM code in BOM tables of data can find in the COM code of material standard packaging tables of data, and device welding manner is manual welding, examination result is that device is moved to non-Wave crest Welding face;
If the COM code in BOM tables of data can not find in the COM code of material standard packaging tables of data, and layer residing for device is non-Wave crest Welding face, and examination result is that device is in non-Wave crest Welding face; If layer residing for device is Wave crest Welding face, and type of device is via devices, examination result is that device is moved to non-Wave crest Welding face; Otherwise examination result is that element height is unknown.
Repetition item in PCB encapsulation of data table, and the PCB encapsulation of data table item not corresponding with BOM tables of data does not judge device welding manner.
Claims (5)
1. a PCBA manufacturability checking method, is characterized in that, utilizes Practical computer teaching PCB encapsulation of data table, comprises the item information in PCB in described PCB encapsulation of data table, checks that whether the item in PCB encapsulation of data table is unique; If not unique, export and repeat item.
2. PCBA manufacturability checking method as claimed in claim 1, it is characterized in that, utilize Practical computer teaching BOM tables of data, in described BOM tables of data, comprise the item information in EBOM, check the item in PCB encapsulation of data table and the item in BOM tables of data whether one_to_one corresponding; If not one_to_one corresponding, export not corresponding item.
3. PCBA manufacturability checking method as claimed in claim 2, it is characterized in that, also comprise COM code information in EBOM in described BOM tables of data and device is via devices or surface mounting component information, in described PCB encapsulation of data table, also comprise the encapsulation name information in layer information residing for the device in PCB and PCB;
Comprise the following steps:
A. specify Wave crest Welding face and PCBA processing technology is set;
B. device welding manner is judged:
If device is surface mounting component, and on non-Wave crest Welding face, then device welding manner is Reflow Soldering;
If device is surface mounting component, on Wave crest Welding face, and PCBA processing technology is pallet solder wave process, then device welding manner is Reflow Soldering;
If device is surface mounting component, on Wave crest Welding face, and PCBA processing technology is red glue solder wave process, then device welding manner is red glue wave-soldering;
If device is via devices, and on non-Wave crest Welding face, then device welding manner is wave-soldering;
If device is via devices, and on Wave crest Welding face, then device welding manner is manual welding;
C. utilize COM code, the encapsulation name in computer reading material standard packaging tables of data, carry out encapsulation examination:
If the COM code in BOM tables of data can find in the COM code of material standard packaging tables of data, but non-specified value encapsulation name in material standard packaging tables of data, examination result is that standard packaging is unknown;
If the COM code in BOM tables of data can find in the COM code of material standard packaging tables of data, and in material standard packaging tables of data specified value encapsulation name, and device welding manner is Reflow Soldering, and the encapsulation name in PCB encapsulation of data table is Reflow Soldering encapsulation, if the encapsulation name in PCB encapsulation of data table conforms to described standard packaging name of specifying, examination result is that encapsulation is called correctly;
If the COM code in BOM tables of data can find in the COM code of material standard packaging tables of data, and in material standard packaging tables of data specified value encapsulation name, and device welding manner is Reflow Soldering, and the encapsulation name in PCB encapsulation of data table is Reflow Soldering encapsulation, if the encapsulation name in PCB encapsulation of data table does not conform to described standard packaging name of specifying, examination result is that encapsulation is called incorrect, and the encapsulation name in PCB encapsulation of data table should be changed into the standard packaging name of having specified in material standard packaging tables of data by prompting;
If the COM code in BOM tables of data can find in the COM code of material standard packaging tables of data, and in material standard packaging tables of data specified value encapsulation name, and device welding manner is Reflow Soldering, but the encapsulation name in PCB encapsulation of data table is the encapsulation of red glue wave-soldering, examination result is that the encapsulation in PCB should change Reflow Soldering encapsulation into;
If the COM code in BOM tables of data can find in the COM code of material standard packaging tables of data, and in material standard packaging tables of data specified value encapsulation name, and device welding manner is red glue wave-soldering, and the encapsulation name in PCB encapsulation of data table is the encapsulation of red glue wave-soldering, if the encapsulation name in PCB encapsulation of data table conforms to described standard packaging name of specifying, examination result is that encapsulation is called correctly;
If the COM code in BOM tables of data can find in the COM code of material standard packaging tables of data, and in material standard packaging tables of data specified value encapsulation name, and device welding manner is red glue wave-soldering, and the encapsulation name in PCB encapsulation of data table is the encapsulation of red glue wave-soldering, if the encapsulation name in PCB encapsulation of data table does not conform to described standard packaging name of specifying, examination result is that encapsulation is called incorrect, and the encapsulation name in PCB encapsulation of data table should be changed into the standard packaging name of having specified in material standard packaging tables of data by prompting;
If the COM code in BOM tables of data can find in the COM code of material standard packaging tables of data, and in material standard packaging tables of data specified value encapsulation name, and device welding manner is red glue wave-soldering, but the encapsulation name in PCB encapsulation of data table is Reflow Soldering encapsulation, examination result is that the encapsulation in PCB should change the encapsulation of red glue wave-soldering into;
If the COM code in BOM tables of data can find in the COM code of material standard packaging tables of data, and in material standard packaging tables of data specified value encapsulation name, and device welding manner is wave-soldering or manual welding, if the encapsulation name in PCB encapsulation of data table conforms to described standard packaging name of specifying, examination result is that encapsulation is called correctly;
If the COM code in BOM tables of data can find in the COM code of material standard packaging tables of data, and in material standard packaging tables of data specified value encapsulation name, and device welding manner is wave-soldering or manual welding, if the encapsulation name in PCB encapsulation of data table does not conform to described standard packaging name of specifying, examination result is that encapsulation is called incorrect, and the encapsulation name in PCB encapsulation of data table should be changed into the standard packaging name of having specified in material standard packaging tables of data by prompting;
If the COM code in BOM tables of data can not find in the COM code of material standard packaging tables of data, examination result is without this material in material standard packaging tables of data.
4. PCBA manufacturability checking method as claimed in claim 2, it is characterized in that, also comprise COM code information in EBOM in described BOM tables of data and device is via devices or surface mounting component information, in described PCB encapsulation of data table, also comprise layer information residing for the device in PCB;
Comprise the following steps:
A. specify Wave crest Welding face and PCBA processing technology and element height restriction are set;
B. device welding manner is judged:
If device is surface mounting component, and on non-Wave crest Welding face, then device welding manner is Reflow Soldering;
If device is surface mounting component, on Wave crest Welding face, and PCBA processing technology is pallet solder wave process, then device welding manner is Reflow Soldering;
If device is surface mounting component, on Wave crest Welding face, and PCBA processing technology is red glue solder wave process, then device welding manner is red glue wave-soldering;
If device is via devices, and on non-Wave crest Welding face, then device welding manner is wave-soldering;
If device is via devices, and on Wave crest Welding face, then device welding manner is manual welding;
C. utilize COM code, the element height information in computer reading material standard packaging tables of data, carry out height examination:
If the COM code in BOM tables of data can find in the COM code of material standard packaging tables of data, and layer residing for device is non-Wave crest Welding face, and examination result is that device is in non-Wave crest Welding face;
If the COM code in BOM tables of data can find in the COM code of material standard packaging tables of data, device welding manner is Reflow Soldering, and in wave-soldering junction, then judges the height of device; If element height exceedes the upper limit that pallet solder wave process limits element height, examination result is for highly to exceed restriction; If element height exceedes warning value, examination result is that highly lower device is selected in suggestion; If element height is lower than higher limit, examination result is highly qualified; Otherwise examination result is that element height is unknown;
If the COM code in BOM tables of data can find in the COM code of material standard packaging tables of data, and device welding manner is red glue wave-soldering, then judge the height of device; If element height exceedes the upper limit that red glue solder wave process limits element height, examination result is for highly to exceed restriction; If element height is lower than higher limit, examination result is highly qualified; Otherwise examination result is that element height is unknown;
If the COM code in BOM tables of data can find in the COM code of material standard packaging tables of data, and device welding manner is manual welding, examination result is that device is moved to non-Wave crest Welding face;
If the COM code in BOM tables of data can not find in the COM code of material standard packaging tables of data, and layer residing for device is non-Wave crest Welding face, and examination result is that device is in non-Wave crest Welding face; If layer residing for device is Wave crest Welding face, and type of device is via devices, examination result is that device is moved to non-Wave crest Welding face; Otherwise examination result is that element height is unknown.
5. the PCBA manufacturability checking method as described in claim 3 or 4, is characterized in that, the repetition item in PCB encapsulation of data table, and the PCB encapsulation of data table item not corresponding with BOM tables of data does not judge device welding manner.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510529272.5A CN105101650B (en) | 2015-08-26 | 2015-08-26 | A kind of PCBA manufacturabilitys checking method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510529272.5A CN105101650B (en) | 2015-08-26 | 2015-08-26 | A kind of PCBA manufacturabilitys checking method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105101650A true CN105101650A (en) | 2015-11-25 |
| CN105101650B CN105101650B (en) | 2017-12-01 |
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| CN201510529272.5A Active CN105101650B (en) | 2015-08-26 | 2015-08-26 | A kind of PCBA manufacturabilitys checking method |
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| CN111752886A (en) * | 2020-05-29 | 2020-10-09 | 苏州浪潮智能科技有限公司 | Excel-based PCB inter-board interconnection signal inspection method and system |
| CN112307707A (en) * | 2020-09-22 | 2021-02-02 | 中国电子科技集团公司第二十九研究所 | Manufacturability examination method and system for multi-chip assembly |
| CN117473947A (en) * | 2023-12-28 | 2024-01-30 | 广东美创希科技有限公司 | Drawing package detection method and device, electronic equipment and medium |
| CN117494655A (en) * | 2023-12-28 | 2024-02-02 | 广东美创希科技有限公司 | Device package detection method, device, electronic equipment and storage medium |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN111752886A (en) * | 2020-05-29 | 2020-10-09 | 苏州浪潮智能科技有限公司 | Excel-based PCB inter-board interconnection signal inspection method and system |
| CN111752886B (en) * | 2020-05-29 | 2023-01-10 | 苏州浪潮智能科技有限公司 | Excel-based PCB inter-board interconnection signal inspection method and system |
| CN112307707A (en) * | 2020-09-22 | 2021-02-02 | 中国电子科技集团公司第二十九研究所 | Manufacturability examination method and system for multi-chip assembly |
| CN117473947A (en) * | 2023-12-28 | 2024-01-30 | 广东美创希科技有限公司 | Drawing package detection method and device, electronic equipment and medium |
| CN117494655A (en) * | 2023-12-28 | 2024-02-02 | 广东美创希科技有限公司 | Device package detection method, device, electronic equipment and storage medium |
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| CN105101650B (en) | 2017-12-01 |
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