CN105101650B - A kind of PCBA manufacturabilitys checking method - Google Patents
A kind of PCBA manufacturabilitys checking method Download PDFInfo
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- CN105101650B CN105101650B CN201510529272.5A CN201510529272A CN105101650B CN 105101650 B CN105101650 B CN 105101650B CN 201510529272 A CN201510529272 A CN 201510529272A CN 105101650 B CN105101650 B CN 105101650B
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0005—Apparatus or processes for manufacturing printed circuits for designing circuits by computer
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
- H05K2203/1305—Moulding and encapsulation
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/16—Inspection; Monitoring; Aligning
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- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
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Abstract
The invention discloses a kind of PCBA manufacturabilitys checking method, generates PCB encapsulation of data tables using computer, the position information in PCB is included in the PCB encapsulation of data table, checks whether the position number in PCB encapsulation of data tables is unique；If not unique, repeats bits number are exported.BOM data table is generated using computer, the position information in EBOM is included in the BOM data table, checks whether the position number in PCB encapsulation of data tables corresponds with the position number in BOM data table；If not corresponding, the position number being not correspond to is exported.The present invention can be sufficiently examined PCBA manufacturabilitys, the inconsistent repetition of PCB positions, PCB and EBOM middle positions number, PCB never calls standard packaging, standard packaging call error, height of materials can be examined out beyond mistakes such as technological requirements, solve the artificial examination blind area for browsing formula examination and difficult point, efficiency high is examined, reduces PCBA manufacturing cost.
Description
Technical field
The invention belongs to electronics manufacturing technology field, more particularly to a kind of PCBA（Printed Circuit Board
Assembly, printed circuit board assembly）Manufacturability checking method.
Background technology
In PCBA manufacturability checking process, it is desirable to pinpoint the problems as much as possible, avoid problem during trial-production from just exposing, lead
Cause unnecessary loss.
At present in PCBA manufacturabilitys checking process, the artificial formula that browses only is carried out to PCB and is examined, therefore mesh can only be examined out
Survey detectable problem（Such as require to identify whether whether complete, silk-screen is overlapping, whether bar code frame is placed and placed suitable
Deng）.
Due to the position number amount tens at least on PCB, at most hundreds of, therefore it is artificial browse formula examine can not examine with
Lower problem：The repetition of PCB positions, PCB are than EBOM multidigit number, EBOM than PCB multidigit number, PCB never calls standard packaging, standard packaging
Call error, height of materials are beyond technological requirement etc..Therefore such issues that, can only be in advanced development in kind just exposure, it is necessary to passes through
Modification PCB could be solved, and cause unnecessary loss.
The content of the invention
It is existing that manually browsing formula PCBA manufacturability checking methods can not examine out that the repetition of PCB positions, PCB are more than EBOM
Position number, EBOM exceed technological requirement than PCB multidigit number, PCB never calls standard packaging, standard packaging call error, height of materials
The problems such as, so as to cause unnecessary loss.It is an object of the present invention to it is directed to above-mentioned the deficiencies in the prior art, there is provided a kind of
The PCBA manufacturability checking methods improved.
In order to solve the above technical problems, the technical solution adopted in the present invention is：
A kind of PCBA manufacturabilitys checking method, PCB encapsulation of data tables, the PCB encapsulation of data are generated using computer
The position information in PCB is included in table, checks whether the position number in PCB encapsulation of data tables is unique；If not unique, repeats bits are exported
Number.
Further, BOM data table is generated using computer, the position information in EBOM is included in the BOM data table,
Check whether the position number in PCB encapsulation of data tables corresponds with the position number in BOM data table；If not corresponding, output is not
Corresponding position number.
Further, in the BOM data table also include EBOM in COM code information and device be via devices also
It is surface mounting component information, the encapsulation name in layer information and PCB residing for the device in PCB is also included in the PCB encapsulation of data table
Information；
Comprise the following steps：
A. specify Wave crest Welding face and PCBA processing technologys are set；
B. device welding manner is judged：
If device is surface mounting component, and on non-Wave crest Welding face, then device welding manner is Reflow Soldering；
If device is surface mounting component, on Wave crest Welding face, and PCBA processing technologys are pallet solder wave process, then
Device welding manner is Reflow Soldering；
If device is surface mounting component, on Wave crest Welding face, and PCBA processing technologys are red glue solder wave process, then
Device welding manner is red glue wave-soldering；
If device is via devices, and on non-Wave crest Welding face, then device welding manner is wave-soldering；
If device is via devices, and on Wave crest Welding face, then device welding manner is manual welding；
C. the COM code in material standard packaging tables of data is read using computer, encapsulates name, is packaged examination：
If the COM code in BOM data table can be found in the COM code of material standard packaging tables of data, but thing
Expect not specified standard packaging name in standard packaging tables of data, examination result is that standard packaging is unknown；
If the COM code in BOM data table can be found in the COM code of material standard packaging tables of data, and thing
Expect the name of specified value encapsulation in standard packaging tables of data, and device welding manner is Reflow Soldering, and in PCB encapsulation of data tables
Encapsulation name is Reflow Soldering encapsulation, if the encapsulation name in PCB encapsulation of data tables is consistent with the standard packaging name specified, examines knot
Fruit calls correct for encapsulation；
If the COM code in BOM data table can be found in the COM code of material standard packaging tables of data, and thing
Expect the name of specified value encapsulation in standard packaging tables of data, and device welding manner is Reflow Soldering, and in PCB encapsulation of data tables
Encapsulation name is Reflow Soldering encapsulation, if the encapsulation name in PCB encapsulation of data tables is not consistent with the standard packaging name specified, is examined
As a result it is incorrect for encapsulation calling, and prompt the encapsulation name in PCB encapsulation of data tables should be changed into material standard packaging tables of data
In the standard packaging name specified；
If the COM code in BOM data table can be found in the COM code of material standard packaging tables of data, and thing
Expect the name of specified value encapsulation in standard packaging tables of data, and device welding manner is Reflow Soldering, but in PCB encapsulation of data tables
Encapsulation name is red glue wave-soldering encapsulation, and examination result is that the encapsulation in PCB should be changed to Reflow Soldering encapsulation；
If the COM code in BOM data table can be found in the COM code of material standard packaging tables of data, and thing
Expect the name of specified value encapsulation in standard packaging tables of data, and device welding manner is red glue wave-soldering, and PCB encapsulation of data tables
In encapsulation name be the encapsulation of red glue wave-soldering, if encapsulation name and the standard packaging famous prime minister specified in PCB encapsulation of data tables
Symbol, examination result call correct for encapsulation；
If the COM code in BOM data table can be found in the COM code of material standard packaging tables of data, and thing
Expect the name of specified value encapsulation in standard packaging tables of data, and device welding manner is red glue wave-soldering, and PCB encapsulation of data tables
In encapsulation name be the encapsulation of red glue wave-soldering, if encapsulation name and the standard packaging name specified in PCB encapsulation of data tables are not
It is consistent, examination result is incorrect for encapsulation calling, and prompts that the encapsulation name in PCB encapsulation of data tables should be changed to material standard envelope
The standard packaging name specified in dress tables of data；
If the COM code in BOM data table can be found in the COM code of material standard packaging tables of data, and thing
Expect the name of specified value encapsulation in standard packaging tables of data, and device welding manner is red glue wave-soldering, but PCB encapsulation of data tables
In encapsulation name be Reflow Soldering encapsulation, examination result is that the encapsulation in PCB should be changed to the encapsulation of red glue wave-soldering；
If the COM code in BOM data table can be found in the COM code of material standard packaging tables of data, and thing
Expect the name of specified value encapsulation in standard packaging tables of data, and device welding manner is wave-soldering or manual welding, if PCB encapsulates number
It is consistent according to the encapsulation name in table with the standard packaging name specified, examination result calls correct for encapsulation；
If the COM code in BOM data table can be found in the COM code of material standard packaging tables of data, and thing
Expect the name of specified value encapsulation in standard packaging tables of data, and device welding manner is wave-soldering or manual welding, if PCB encapsulates number
It is not consistent with the standard packaging name specified according to the encapsulation name in table, examination result is incorrect for encapsulation calling, and prompts to answer
The standard packaging name that encapsulation name in PCB encapsulation of data tables is changed to specify in material standard packaging tables of data；
If the COM code in BOM data table can not be found in the COM code of material standard packaging tables of data, examine
The fruit that comes to an end is without this material in material standard packaging tables of data.
Further, in the BOM data table also include EBOM in COM code information and device be via devices also
It is surface mounting component information, layer information residing for the device in PCB is also included in the PCB encapsulation of data table；
Comprise the following steps：
A. specify Wave crest Welding face and set PCBA processing technologys and element height to limit；
B. device welding manner is judged：
If device is surface mounting component, and on non-Wave crest Welding face, then device welding manner is Reflow Soldering；
If device is surface mounting component, on Wave crest Welding face, and PCBA processing technologys are pallet solder wave process, then
Device welding manner is Reflow Soldering；
If device is surface mounting component, on Wave crest Welding face, and PCBA processing technologys are red glue solder wave process, then
Device welding manner is red glue wave-soldering；
If device is via devices, and on non-Wave crest Welding face, then device welding manner is wave-soldering；
If device is via devices, and on Wave crest Welding face, then device welding manner is manual welding；
C. using the COM code in computer reading material standard packaging tables of data, element height information, height is carried out
Examine：
If the COM code in BOM data table can be found in the COM code of material standard packaging tables of data, and device
Layer residing for part is non-Wave crest Welding face, and examination result is device in non-Wave crest Welding face；
If the COM code in BOM data table can be found in the COM code of material standard packaging tables of data, device
Welding manner is Reflow Soldering, and in wave-soldering junction, then judges the height of device；If element height exceedes pallet crest welder
The upper limit that skill is limited element height, examination result are height beyond limitation；If element height exceedes warning value, examination result
To suggest the lower device of selection height；If element height is less than higher limit, examination result is highly qualified；Otherwise, examine
As a result it is unknown for element height；
If the COM code in BOM data table can be found in the COM code of material standard packaging tables of data, and device
Part welding manner is red glue wave-soldering, then judges the height of device；If element height exceedes red glue solder wave process to device
The upper limit of height limitation, examination result are height beyond limitation；If element height is less than higher limit, examination result closes for height
Lattice；Otherwise, examination result is that element height is unknown；
If the COM code in BOM data table can be found in the COM code of material standard packaging tables of data, and device
Part welding manner is manual welding, and examination result is that device is moved to non-Wave crest Welding face；
If the COM code in BOM data table can not be found in the COM code of material standard packaging tables of data, and
Layer residing for device is non-Wave crest Welding face, and examination result is device in non-Wave crest Welding face；If layer residing for device is ripple
Peak welds solder side, and type of device is via devices, and examination result is that device is moved to non-Wave crest Welding face；Otherwise, knot is examined
Fruit is that element height is unknown.
As a kind of preferred embodiment, the repeats bits number in PCB encapsulation of data tables, and PCB encapsulation of data table and BOM data
The position number that table is not correspond to does not judge device welding manner.
The present invention can be sufficiently examined PCBA manufacturabilitys, can examine out the repetition of PCB positions, PCB with
EBOM middle positions number are inconsistent, PCB never calls standard packaging, standard packaging call error, height of materials is beyond the mistake such as technological requirement
By mistake, the artificial examination blind area for browsing formula examination and difficult point are solved, efficiency high is examined, reduces PCBA manufacturing cost.
Embodiment
One embodiment of the present invention generates PCB encapsulation of data tables using computer, in the PCB encapsulation of data table
Comprising the position information in PCB, check whether the position number in PCB encapsulation of data tables is unique；If not unique, repeats bits number are exported.
BOM data table is generated using computer, the position information in EBOM is included in the BOM data table, checks PCB envelopes
Whether the position number in dress tables of data corresponds with the position number in BOM data table；If not corresponding, the position being not correspond to is exported
Number.
In the BOM data table also include EBOM in COM code information and device be via devices or surface mounting component
Information, the encapsulation name information in layer information and PCB residing for the device in PCB is also included in the PCB encapsulation of data table；
Comprise the following steps：
A. specify Wave crest Welding face and PCBA processing technologys are set；
B. device welding manner is judged：
If device is surface mounting component, and on non-Wave crest Welding face, then device welding manner is Reflow Soldering；
If device is surface mounting component, on Wave crest Welding face, and PCBA processing technologys are pallet solder wave process, then
Device welding manner is Reflow Soldering；
If device is surface mounting component, on Wave crest Welding face, and PCBA processing technologys are red glue solder wave process, then
Device welding manner is red glue wave-soldering；
If device is via devices, and on non-Wave crest Welding face, then device welding manner is wave-soldering；
If device is via devices, and on Wave crest Welding face, then device welding manner is manual welding；
C. the COM code in material standard packaging tables of data is read using computer, encapsulates name, is packaged examination：
If the COM code in BOM data table can be found in the COM code of material standard packaging tables of data, but thing
Expect not specified standard packaging name in standard packaging tables of data, examination result is that standard packaging is unknown；
If the COM code in BOM data table can be found in the COM code of material standard packaging tables of data, and thing
Expect the name of specified value encapsulation in standard packaging tables of data, and device welding manner is Reflow Soldering, and in PCB encapsulation of data tables
Encapsulation name is Reflow Soldering encapsulation, if the encapsulation name in PCB encapsulation of data tables is consistent with the standard packaging name specified, examines knot
Fruit calls correct for encapsulation；
If the COM code in BOM data table can be found in the COM code of material standard packaging tables of data, and thing
Expect the name of specified value encapsulation in standard packaging tables of data, and device welding manner is Reflow Soldering, and in PCB encapsulation of data tables
Encapsulation name is Reflow Soldering encapsulation, if the encapsulation name in PCB encapsulation of data tables is not consistent with the standard packaging name specified, is examined
As a result it is incorrect for encapsulation calling, and prompt the encapsulation name in PCB encapsulation of data tables should be changed into material standard packaging tables of data
In the standard packaging name specified；
If the COM code in BOM data table can be found in the COM code of material standard packaging tables of data, and thing
Expect the name of specified value encapsulation in standard packaging tables of data, and device welding manner is Reflow Soldering, but in PCB encapsulation of data tables
Encapsulation name is red glue wave-soldering encapsulation, and examination result is that the encapsulation in PCB should be changed to Reflow Soldering encapsulation；
If the COM code in BOM data table can be found in the COM code of material standard packaging tables of data, and thing
Expect the name of specified value encapsulation in standard packaging tables of data, and device welding manner is red glue wave-soldering, and PCB encapsulation of data tables
In encapsulation name be the encapsulation of red glue wave-soldering, if encapsulation name and the standard packaging famous prime minister specified in PCB encapsulation of data tables
Symbol, examination result call correct for encapsulation；
If the COM code in BOM data table can be found in the COM code of material standard packaging tables of data, and thing
Expect the name of specified value encapsulation in standard packaging tables of data, and device welding manner is red glue wave-soldering, and PCB encapsulation of data tables
In encapsulation name be the encapsulation of red glue wave-soldering, if encapsulation name and the standard packaging name specified in PCB encapsulation of data tables are not
It is consistent, examination result is incorrect for encapsulation calling, and prompts that the encapsulation name in PCB encapsulation of data tables should be changed to material standard envelope
The standard packaging name specified in dress tables of data；
If the COM code in BOM data table can be found in the COM code of material standard packaging tables of data, and thing
Expect the name of specified value encapsulation in standard packaging tables of data, and device welding manner is red glue wave-soldering, but PCB encapsulation of data tables
In encapsulation name be Reflow Soldering encapsulation, examination result is that the encapsulation in PCB should be changed to the encapsulation of red glue wave-soldering；
If the COM code in BOM data table can be found in the COM code of material standard packaging tables of data, and thing
Expect the name of specified value encapsulation in standard packaging tables of data, and device welding manner is wave-soldering or manual welding, if PCB encapsulates number
It is consistent according to the encapsulation name in table with the standard packaging name specified, examination result calls correct for encapsulation；
If the COM code in BOM data table can be found in the COM code of material standard packaging tables of data, and thing
Expect the name of specified value encapsulation in standard packaging tables of data, and device welding manner is wave-soldering or manual welding, if PCB encapsulates number
It is not consistent with the standard packaging name specified according to the encapsulation name in table, examination result is incorrect for encapsulation calling, and prompts to answer
The standard packaging name that encapsulation name in PCB encapsulation of data tables is changed to specify in material standard packaging tables of data；
If the COM code in BOM data table can not be found in the COM code of material standard packaging tables of data, examine
The fruit that comes to an end is without this material in material standard packaging tables of data.
In the BOM data table also include EBOM in COM code information and device be via devices or surface mounting component
Information, layer information residing for the device in PCB is also included in the PCB encapsulation of data table；
Comprise the following steps：
A. specify Wave crest Welding face and set PCBA processing technologys and element height to limit；
B. device welding manner is judged：
If device is surface mounting component, and on non-Wave crest Welding face, then device welding manner is Reflow Soldering；
If device is surface mounting component, on Wave crest Welding face, and PCBA processing technologys are pallet solder wave process, then
Device welding manner is Reflow Soldering；
If device is surface mounting component, on Wave crest Welding face, and PCBA processing technologys are red glue solder wave process, then
Device welding manner is red glue wave-soldering；
If device is via devices, and on non-Wave crest Welding face, then device welding manner is wave-soldering；
If device is via devices, and on Wave crest Welding face, then device welding manner is manual welding；
C. using the COM code in computer reading material standard packaging tables of data, element height information, height is carried out
Examine：
If the COM code in BOM data table can be found in the COM code of material standard packaging tables of data, and device
Layer residing for part is non-Wave crest Welding face, and examination result is device in non-Wave crest Welding face；
If the COM code in BOM data table can be found in the COM code of material standard packaging tables of data, device
Welding manner is Reflow Soldering, and in wave-soldering junction, then judges the height of device；If element height exceedes pallet crest welder
The upper limit that skill is limited element height, examination result are height beyond limitation；If element height exceedes warning value, examination result
To suggest the lower device of selection height；If element height is less than higher limit, examination result is highly qualified；Otherwise, examine
As a result it is unknown for element height；
If the COM code in BOM data table can be found in the COM code of material standard packaging tables of data, and device
Part welding manner is red glue wave-soldering, then judges the height of device；If element height exceedes red glue solder wave process to device
The upper limit of height limitation, examination result are height beyond limitation；If element height is less than higher limit, examination result closes for height
Lattice；Otherwise, examination result is that element height is unknown；
If the COM code in BOM data table can be found in the COM code of material standard packaging tables of data, and device
Part welding manner is manual welding, and examination result is that device is moved to non-Wave crest Welding face；
If the COM code in BOM data table can not be found in the COM code of material standard packaging tables of data, and
Layer residing for device is non-Wave crest Welding face, and examination result is device in non-Wave crest Welding face；If layer residing for device is ripple
Peak welds solder side, and type of device is via devices, and examination result is that device is moved to non-Wave crest Welding face；Otherwise, knot is examined
Fruit is that element height is unknown.
Repeats bits number in PCB encapsulation of data tables, and the position number that PCB encapsulation of data table is not correspond to BOM data table
Device welding manner is not judged.
Claims (3)
1. a kind of PCBA manufacturabilitys checking method, it is characterised in that generate PCB encapsulation of data tables, the PCB using computer
The position information in PCB is included in encapsulation of data table, checks whether the position number in PCB encapsulation of data tables is unique；It is defeated if not unique
Go out repeats bits number；
BOM data table is generated using computer, the position information in EBOM is included in the BOM data table, checks PCB encapsulation numbers
Whether corresponded according to the position number in table and the position number in BOM data table；If not corresponding, the position number being not correspond to is exported；
It is via devices or surface mounting component letter that the COM code information in EBOM and device are also included in the BOM data table
Cease, the encapsulation name information in layer information and PCB residing for the device in PCB is also included in the PCB encapsulation of data table；
Comprise the following steps：
A. specify Wave crest Welding face and PCBA processing technologys are set；
B. device welding manner is judged：
If device is surface mounting component, and on non-Wave crest Welding face, then device welding manner is Reflow Soldering；
If device is surface mounting component, on Wave crest Welding face, and PCBA processing technologys are pallet solder wave process, then device
Welding manner is Reflow Soldering；
If device is surface mounting component, on Wave crest Welding face, and PCBA processing technologys are red glue solder wave process, then device
Welding manner is red glue wave-soldering；
If device is via devices, and on non-Wave crest Welding face, then device welding manner is wave-soldering；
If device is via devices, and on Wave crest Welding face, then device welding manner is manual welding；
C. the COM code in material standard packaging tables of data is read using computer, encapsulates name, is packaged examination：
If the COM code in BOM data table can be found in the COM code of material standard packaging tables of data, but material mark
Not specified standard packaging name in quasi- encapsulation of data table, examination result are that standard packaging is unknown；
If the COM code in BOM data table can be found in the COM code of material standard packaging tables of data, and material mark
The name of specified value encapsulation in quasi- encapsulation of data table, and device welding manner is Reflow Soldering, and the encapsulation in PCB encapsulation of data tables
Name is Reflow Soldering encapsulation, if the encapsulation name in PCB encapsulation of data tables is consistent with the standard packaging name specified, examination result is
Encapsulation is called correct；
If the COM code in BOM data table can be found in the COM code of material standard packaging tables of data, and material mark
The name of specified value encapsulation in quasi- encapsulation of data table, and device welding manner is Reflow Soldering, and the encapsulation in PCB encapsulation of data tables
Name is Reflow Soldering encapsulation, if the encapsulation name in PCB encapsulation of data tables is not consistent with the standard packaging name specified, examination result
It is incorrect for encapsulation calling, and prompt the encapsulation name in PCB encapsulation of data tables should be changed in material standard packaging tables of data
The standard packaging name specified；
If the COM code in BOM data table can be found in the COM code of material standard packaging tables of data, and material mark
The name of specified value encapsulation in quasi- encapsulation of data table, and device welding manner is Reflow Soldering, but the encapsulation in PCB encapsulation of data tables
Name is red glue wave-soldering encapsulation, and examination result is that the encapsulation in PCB should be changed to Reflow Soldering encapsulation；
If the COM code in BOM data table can be found in the COM code of material standard packaging tables of data, and material mark
The name of specified value encapsulation in quasi- encapsulation of data table, and device welding manner is red glue wave-soldering, and in PCB encapsulation of data tables
Encapsulation name is red glue wave-soldering encapsulation, if the encapsulation name in PCB encapsulation of data tables is consistent with the standard packaging name specified, is examined
The fruit that comes to an end calls correct for encapsulation；
If the COM code in BOM data table can be found in the COM code of material standard packaging tables of data, and material mark
The name of specified value encapsulation in quasi- encapsulation of data table, and device welding manner is red glue wave-soldering, and in PCB encapsulation of data tables
Encapsulation name is red glue wave-soldering encapsulation, if the encapsulation name in PCB encapsulation of data tables is not consistent with the standard packaging name specified,
Examination result is incorrect for encapsulation calling, and prompts the encapsulation name in PCB encapsulation of data tables should be changed into material standard packaging number
According to the standard packaging name specified in table；
If the COM code in BOM data table can be found in the COM code of material standard packaging tables of data, and material mark
The name of specified value encapsulation in quasi- encapsulation of data table, and device welding manner is red glue wave-soldering, but in PCB encapsulation of data tables
Encapsulation name is Reflow Soldering encapsulation, and examination result is that the encapsulation in PCB should be changed to red glue wave-soldering encapsulation；
If the COM code in BOM data table can be found in the COM code of material standard packaging tables of data, and material mark
The name of specified value encapsulation in quasi- encapsulation of data table, and device welding manner is wave-soldering or manual welding, if PCB encapsulation of data tables
In encapsulation name be consistent with the standard packaging name specified, examination result calls correct for encapsulation；
If the COM code in BOM data table can be found in the COM code of material standard packaging tables of data, and material mark
The name of specified value encapsulation in quasi- encapsulation of data table, and device welding manner is wave-soldering or manual welding, if PCB encapsulation of data tables
In encapsulation name be not consistent with the standard packaging name specified, examination result for encapsulation call it is incorrect, and prompt should be by PCB
Encapsulation name in encapsulation of data table is changed to the standard packaging name specified in material standard packaging tables of data；
If the COM code in BOM data table can not be found in the COM code of material standard packaging tables of data, knot is examined
Fruit is without this material in material standard packaging tables of data.
2. PCBA manufacturabilitys checking method as claimed in claim 1, it is characterised in that also included in the BOM data table
COM code information and device in EBOM are via devices or surface mounting component information, are also wrapped in the PCB encapsulation of data table
Containing layer information residing for the device in PCB；
Comprise the following steps：
A. specify Wave crest Welding face and set PCBA processing technologys and element height to limit；
B. device welding manner is judged：
If device is surface mounting component, and on non-Wave crest Welding face, then device welding manner is Reflow Soldering；
If device is surface mounting component, on Wave crest Welding face, and PCBA processing technologys are pallet solder wave process, then device
Welding manner is Reflow Soldering；
If device is surface mounting component, on Wave crest Welding face, and PCBA processing technologys are red glue solder wave process, then device
Welding manner is red glue wave-soldering；
If device is via devices, and on non-Wave crest Welding face, then device welding manner is wave-soldering；
If device is via devices, and on Wave crest Welding face, then device welding manner is manual welding；
C. using the COM code in computer reading material standard packaging tables of data, element height information, height examination is carried out：
If the COM code in BOM data table can be found in the COM code of material standard packaging tables of data, and device institute
Place's layer is non-Wave crest Welding face, and examination result is device in non-Wave crest Welding face；
If the COM code in BOM data table can be found in the COM code of material standard packaging tables of data, device welding
Mode is Reflow Soldering, and in wave-soldering junction, then judges the height of device；If element height exceedes pallet solder wave process pair
The upper limit of element height limitation, examination result are height beyond limitation；If element height exceedes warning value, examination result is to build
The lower device of view selection height；If element height is less than higher limit, examination result is highly qualified；Otherwise, examination result
It is unknown for element height；
If the COM code in BOM data table can be found in the COM code of material standard packaging tables of data, and device welds
The mode of connecing is red glue wave-soldering, then judges the height of device；If element height exceedes red glue solder wave process to element height
The upper limit of limitation, examination result are height beyond limitation；If element height is less than higher limit, examination result is highly qualified；
Otherwise, examination result is that element height is unknown；
If the COM code in BOM data table can be found in the COM code of material standard packaging tables of data, and device welds
The mode of connecing is manual welding, and examination result is that device is moved to non-Wave crest Welding face；
If the COM code in BOM data table can not be found in the COM code of material standard packaging tables of data, and device
Residing layer is non-Wave crest Welding face, and examination result is device in non-Wave crest Welding face；If layer residing for device is wave-soldering
Solder side, and type of device is via devices, examination result is that device is moved to non-Wave crest Welding face；Otherwise, examination result is
Element height is unknown.
3. PCBA manufacturabilitys checking method as claimed in claim 1 or 2, it is characterised in that the weight in PCB encapsulation of data tables
Reset number, and the position number that PCB encapsulation of data table is not correspond to BOM data table do not judge device welding manner.
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| CN112307707B (en) * | 2020-09-22 | 2022-09-27 | 中国电子科技集团公司第二十九研究所 | Manufacturability examination method and system for multi-chip assembly |
| CN117494655A (en) * | 2023-12-28 | 2024-02-02 | 广东美创希科技有限公司 | Device package detection method, device, electronic equipment and storage medium |
| CN117473947A (en) * | 2023-12-28 | 2024-01-30 | 广东美创希科技有限公司 | Drawing package detection method and device, electronic equipment and medium |
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| CN1549670A (en) * | 2003-05-21 | 2004-11-24 | 华为技术有限公司 | Method and apparatus for examining uniformity |
| CN1960624A (en) * | 2006-08-23 | 2007-05-09 | 上海广联电子有限公司 | Programmable control method for pasting chips for machine of pasting chips |
| CN101408416A (en) * | 2008-11-24 | 2009-04-15 | 沈建华 | Method and system for checking SMT paster formula correctness |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN1549670A (en) * | 2003-05-21 | 2004-11-24 | 华为技术有限公司 | Method and apparatus for examining uniformity |
| CN1960624A (en) * | 2006-08-23 | 2007-05-09 | 上海广联电子有限公司 | Programmable control method for pasting chips for machine of pasting chips |
| CN101408416A (en) * | 2008-11-24 | 2009-04-15 | 沈建华 | Method and system for checking SMT paster formula correctness |
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