CN117494655A

CN117494655A - Device package detection method, device, electronic equipment and storage medium

Info

Publication number: CN117494655A
Application number: CN202311835785.XA
Authority: CN
Inventors: 何俭文; 湛银波; 陈杰; 萧尚礼; 张海涛; 覃圣
Original assignee: Guangdong Meichuangxi Technology Co ltd
Current assignee: Guangdong Meichuangxi Technology Co ltd
Priority date: 2023-12-28
Filing date: 2023-12-28
Publication date: 2024-02-02

Abstract

The invention relates to the technical field of computers, and provides a device package detection method, a device, electronic equipment and a storage medium, wherein the device package detection method comprises the following steps: responding to the current production process route selected by a user, and acquiring the original PCB packaging name of the component corresponding to the symbol of the to-be-tested device in the electronic design drawing; and determining the packaging detection result of the component corresponding to the device symbol to be detected based on the matching result between the original PCB packaging name and the current production process route. The invention can uniquely determine the characteristic of the PCB packaging when combining the production process route of each component, can realize the aim of batch packaging detection of the components corresponding to each component symbol with the PCB packaging name in the electronic design drawing, greatly improves the detection efficiency and the accuracy of batch detection of whether the PCB packaging of the components accords with the production process, and can ensure more intelligent and automatic detection of the component packaging.

Description

Device package detection method, device, electronic equipment and storage medium

Technical Field

The present invention relates to the field of computer technologies, and in particular, to a device package detection method, a device, an electronic apparatus, and a storage medium.

Background

As is well known, engineers typically determine the respective production process routes of the components before drawing the electronic design drawing, and the production process route of each component is typically unique; for a single component, different production process routes are adopted, different circuit board (Printed Circuit Board, PCB) packages exist for the same component, and the PCB package of each component symbol corresponding to the component in one electronic design drawing is unique; and drawing to obtain the electronic design drawing required in the production process of the electronic product. The existing method for judging whether the PCB packaging of each component symbol of each component in the electronic design drawing accords with the corresponding production process route is generally to manually match the PCB packaging with the existing component packaging library one by one, the situation that the used PCB packaging and the production process route are not in accord easily occurs, the whole manual packaging detection process is time-consuming and labor-consuming, and errors or omission are easy to occur, so that the device packaging detection efficiency and the device packaging accuracy are low.

Disclosure of Invention

The present invention is directed to solving at least one of the technical problems existing in the related art. Therefore, the invention provides a device package detection method, which combines the characteristic that the PCB package can be uniquely determined when the production process route of each component is determined, can realize the aim of carrying out batch package detection on the components corresponding to each device symbol with the PCB package name in the electronic design drawing, avoids the defect of low device package detection efficiency and low accuracy caused by manually detecting whether the PCB package of each device symbol corresponding to the component in the electronic design drawing accords with the production process route, greatly improves the detection efficiency and the accuracy of whether the batch detection device PCB package accords with the production process, and can ensure more intelligent and automatic device package detection.

The invention further provides a device package detection device.

The invention further provides electronic equipment.

The invention also proposes a non-transitory computer readable storage medium.

The device package detection method according to the embodiment of the first aspect of the invention comprises the following steps:

responding to the current production process route selected by a user, and acquiring the original PCB packaging name of the component corresponding to the symbol of the to-be-tested device in the electronic design drawing;

and determining a packaging detection result of the component corresponding to the device symbol to be detected based on a matching result between the original PCB packaging name and the current production process route.

According to the device package detection method provided by the embodiment of the invention, when responding to the current production process route selected by a user, whether the PCB package of the component corresponding to the device symbol to be detected accords with the process or does not accord with the process is determined by judging whether the original PCB package name of the component corresponding to the device symbol to be detected in the electronic design drawing is matched with the current production process route. Therefore, the characteristic of the PCB packaging can be uniquely determined when the production process route of each component is determined, the aim of batch packaging detection of the components corresponding to each component symbol with the PCB packaging name in the electronic design drawing can be fulfilled, the defect that the detection efficiency and the accuracy of the device packaging are very low due to the fact that whether the PCB packaging of each component symbol corresponding to the component in the electronic design drawing accords with the production process route or not is avoided, the detection efficiency and the accuracy of batch detection of the device PCB packaging accord with the production process or not are greatly improved, and meanwhile, the device packaging detection is more intelligent and automatic.

According to one embodiment of the present invention, the determining the package detection result of the component corresponding to the device symbol to be tested based on the matching result between the original PCB package name and the current production process route includes:

judging whether the original PCB package name exists in a pre-configured process package configuration file or not; the process packaging configuration file comprises mapping relations between different target production process routes and respective target PCB packaging names of different types of components, and the different target production process routes comprise the current production process route;

and determining that the original PCB package name does not exist in the process package configuration file, and determining that the package detection result is that the package name is not compliant.

According to one embodiment of the invention, the method further comprises:

determining that the original PCB packaging name exists in the process packaging configuration file, and judging whether the original PCB packaging name accords with the current production process route;

determining that the original PCB package name accords with the current production process route, and determining that the package detection result is that the package is correct;

and determining that the original PCB package name does not accord with the current production process route, and determining that the package detection result is that the package does not accord with the current production process route.

According to one embodiment of the invention, the method further comprises:

based on naming specifications configured for the different types of components in advance, respectively carrying out packaging naming on all the target production process routes covered by producing the different types of components, and determining the respective target PCB packaging names of all the target production process routes;

and constructing a device package library containing all the target production process routes and all the target PCB package names, and determining the process package configuration file corresponding to the device package library.

According to one embodiment of the invention, the method further comprises:

and determining that the package detection result is that the package does not accord with the current production process route, and replacing the original PCB package name with the target PCB package name matched with the current production process route and the components corresponding to the original PCB package name in the process package configuration file.

According to one embodiment of the invention, the method further comprises:

determining that the target PCB package names matched with the components corresponding to the current production process route and the original PCB package names do not exist in the process package configuration file, prompting the user to determine the target PCB package names matched with the components corresponding to the current production process route and the original PCB package names, acquiring the target PCB package names determined by the user, replacing the original PCB package names, and updating the device package library and the process package configuration file respectively based on a successful replacement result.

According to an embodiment of the present invention, the obtaining, in response to a current production process route selected by a user, an original PCB package name of a component corresponding to a device symbol to be tested in an electronic design drawing includes:

responding to the current production process route selected by the user, and acquiring respective bit numbers of all original device symbols and PCB package names of components corresponding to all the original device symbols from the electronic design drawing;

based on each bit number and each PCB packaging name, acquiring the device symbol to be tested corresponding to the target bit number and the original PCB packaging name of the component corresponding to the device symbol to be tested; and each bit number comprises the target bit number, and each PCB package name comprises the original PCB package name.

An embodiment of the device package inspection apparatus according to the second aspect of the present invention includes:

the acquisition unit is used for responding to the current production process route selected by the user and acquiring the original PCB packaging name of the component corresponding to the to-be-tested device symbol in the electronic design drawing;

and the detection unit is used for determining the packaging detection result of the component corresponding to the device symbol to be detected based on the matching result between the original PCB packaging name and the current production process route.

According to the device package detection device provided by the embodiment of the invention, when responding to the current production process route selected by a user, whether the PCB package of the component corresponding to the device symbol to be detected accords with the process or does not accord with the process is determined by judging whether the original PCB package name of the component corresponding to the device symbol to be detected in the electronic design drawing is matched with the current production process route. Therefore, the characteristic of the PCB packaging can be uniquely determined when the production process route of each component is determined, the aim of batch packaging detection of the components corresponding to each component symbol with the PCB packaging name in the electronic design drawing can be fulfilled, the defect that the detection efficiency and the accuracy of the device packaging are very low due to the fact that whether the PCB packaging of each component symbol corresponding to the component in the electronic design drawing accords with the production process route or not is avoided, the detection efficiency and the accuracy of batch detection of the device PCB packaging accord with the production process or not are greatly improved, and meanwhile, the device packaging detection is more intelligent and automatic.

An electronic device according to an embodiment of the third aspect of the present invention includes a memory, a processor, and a computer program stored on the memory and executable on the processor, the processor implementing the device package detection method as described in the foregoing first aspect when executing the program.

A non-transitory computer readable storage medium according to an embodiment of the fourth aspect of the present invention has stored thereon a computer program which, when executed by a processor, implements the device package detection method as described in the foregoing first aspect.

The above technical solutions in the embodiments of the present invention have at least one of the following technical effects: and when responding to the current production process route selected by the user, determining whether the PCB packaging of the component corresponding to the device symbol to be tested accords with the process or does not accord with the process by judging whether the original PCB packaging name of the component corresponding to the device symbol to be tested in the electronic design drawing is matched with the current production process route. Therefore, the characteristic of the PCB packaging can be uniquely determined when the production process route of each component is determined, the aim of batch packaging detection of the components corresponding to each component symbol with the PCB packaging name in the electronic design drawing can be fulfilled, the defect that the detection efficiency and the accuracy of the device packaging are very low due to the fact that whether the PCB packaging of each component symbol corresponding to the component in the electronic design drawing accords with the production process route or not is avoided, the detection efficiency and the accuracy of batch detection of the device PCB packaging accord with the production process or not are greatly improved, and meanwhile, the device packaging detection is more intelligent and automatic.

Furthermore, the package detection result is determined when the original PCB package name does not exist in the process package configuration file based on the process package configuration file containing the mapping relation between different target production process routes and the respective target PCB package names of different types of components, so that the purposes of batch detection and standardized management of all the device symbols in the electronic design image are achieved, and the accuracy and reliability of device package detection are improved.

Further, a device package library is constructed in a manner of performing package naming on various target production process routes through specific naming standards so as to determine a process package configuration file corresponding to the device package library. Therefore, whether the original PCB package names of the components corresponding to the to-be-tested device symbols accord with the current selected production process route can be rapidly judged according to all target PCB package names in the package configuration file, and the easiness and convenience of device package detection can be improved on the premise of ensuring more accurate and intelligent device package detection.

Still further, the original PCB package names which do not accord with the current selected production process route in the electronic design drawing are replaced by the target PCB package names which are matched with the components corresponding to the current selected production process route and the to-be-tested device symbol in the process package configuration file, so that the purposes of managing the PCBs of the components of all the device symbols in the electronic design drawing in batches and in standardization are achieved, reliable guarantee is provided for subsequent rapid and high-quality production of electronic products, manufacturability of the electronic design drawing is improved, and quality of the electronic design drawing is also improved.

Additional aspects and advantages of the invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the related art, the drawings that are required to be used in the embodiments or the related technical descriptions will be briefly described, and it is apparent that the drawings in the following description are only some embodiments of the present invention, and other drawings may be obtained according to the drawings without inventive effort for those skilled in the art.

Fig. 1 is a schematic flow chart of a device package detection method according to an embodiment of the present invention;

FIG. 2 is a schematic block diagram of a device package inspection method provided by an embodiment of the present invention;

fig. 3 is a schematic structural diagram of a device packaging apparatus according to an embodiment of the present invention;

fig. 4 is a schematic structural diagram of an electronic device according to an embodiment of the present invention.

Detailed Description

For the purposes of making the objects, technical solutions and advantages of the present application more apparent, the technical solutions in the present application will be clearly and completely described below with reference to the drawings in the present application, and it is apparent that the described embodiments are some, but not all, embodiments of the present application. All other embodiments, which can be made by one of ordinary skill in the art based on the embodiments herein without making any inventive effort, are intended to be within the scope of the present application.

As is well known, engineers typically determine the respective production process routes of the components before drawing the electronic design drawing, and the production process route of each component is typically unique; for a single component, different production process routes and different PCB packages exist for the same component, and the PCB packages of the components corresponding to each component symbol in one electronic design drawing are unique respectively; and drawing to obtain the electronic design drawing required in the production process of the electronic product.

Considering that the production process route is determined before the engineers draw the PCB packages, in the process of drawing the PCB board, the components and parts possibly contain various PCB packages in a device package library, for example, the chip device generally contains the PCB packages corresponding to two production process routes of a wave-soldering production process route and a solder paste production process route, the wave-soldering production process route requires that the size of a bonding pad is larger relative to the bottom, the solder paste production process route requires that the size of the bonding pad is smaller relative to the bottom, and if the bonding pad corresponding to the solder paste production process route is used on the wave-soldering production process route, poor welding condition can occur, so that the product reject ratio is high. Because the existing method for judging whether the PCB packaging of each component symbol of each component in the electronic design drawing accords with the corresponding production process route is usually to manually match the PCB packaging with the existing component packaging library one by one, the situation that the used PCB packaging does not accord with the production process route is easy to occur, the whole manual packaging detection process is time-consuming and labor-consuming, and errors or omission are easy to occur, so that the device packaging detection efficiency and the device packaging accuracy are low.

In order to solve the above technical problems, the present invention provides a device package detection method, apparatus, electronic device, and storage medium, and the device package detection method, apparatus, electronic device, and storage medium provided by the present invention are described below with reference to fig. 1 to 4, where an execution body of the device package detection method is an electronic device or a server, and the electronic device may be a personal computer (Personal Computer, PC), a portable device, a notebook computer, a smart phone, a tablet computer, a portable wearable device, or other electronic devices; the server may be one server, or may be a server cluster formed by a plurality of servers, a cloud computing center, or the like; the specific form of the electronic device or server is not particularly limited by the present invention. Further, the device package detection method can be applied to a device package detection apparatus provided in an electronic device or a server, and the device package detection apparatus can be implemented by software, hardware or a combination of both. The device package inspection method will be described below taking an execution subject of the device package inspection method as an example of an electronic apparatus.

In order to facilitate understanding of the device package inspection method provided by the embodiment of the present invention, the device package inspection method provided by the embodiment of the present invention will be described in detail by the following several exemplary embodiments. It is to be understood that the following several exemplary embodiments may be combined with each other and that some embodiments may not be repeated for the same or similar concepts or processes.

Referring to fig. 1, a flow chart of a device package detection method according to an embodiment of the present invention is shown in fig. 1, and the device package detection method includes the following steps 110 and 120.

Step 110, responding to the current production process route selected by the user, and acquiring the original PCB packaging name of the component corresponding to the to-be-tested device symbol in the electronic design drawing.

The current production process line can be one of all production process lines covered by producing different types of components, for example, a chip device generally comprises a red-glue wave-soldering production process line and a solder paste reflow production process line, and a plug device generally comprises a single-panel red-glue wave-soldering production process line and a double-sided board red-glue wave-soldering production process line.

The original PCB package name can be a package name obtained according to the PCB package of the component corresponding to the symbol of the device to be tested; namely, the original PCB package name is the package name given by an engineer drawing an electronic design drawing for the PCB package of the component corresponding to the symbol of the device to be tested.

The user may be a device package inspector, administrator, or engineer, and is not particularly limited herein.

The device symbol to be tested can be a device symbol which is required to carry out device packaging detection in the electronic design drawing, the number of the devices corresponding to the device symbol to be tested can be 1, a plurality of or all of all the device symbols contained in the electronic design drawing, and the number of the devices corresponding to the device symbol to be tested is the same as the number of the original PCB packaging names and corresponds to one by one.

For the unit devices, different production process circuits exist for the unit devices, the production process circuits are in one-to-one correspondence with the PCB packages, and the PCB packages refer to the electronic components packaged into assemblies conforming to the standard shape and pin layout, so that the electronic components can be conveniently inserted or welded on a PCB, and therefore, the PCB packages of the components corresponding to each component symbol in one electronic design drawing are unique. That is, how many production process lines are provided for each component, and how many PCB packages are corresponding, one PCB package can be uniquely determined by the production process line for each component, and each PCB package can also be uniquely corresponding to one PCB package name.

In order to quickly distinguish production process routes of components corresponding to each component symbol in the electronic design drawing, engineers often need to provide a PCB package name of the component corresponding to each component symbol when drawing the electronic design drawing, and each PCB package name can be used for definitely determining a PCB package of the corresponding component and definitely determining the production process route of the corresponding component.

Specifically, in step 110, pre-developed package inspection software is installed in the electronic device, and when the package inspection software receives that the user operation is in the package inspection state, all production process routes covered by producing different types of components can be displayed to the user, so that the user can select one production process route from all production process routes as the current production process route, and perform the subsequent package inspection operation of whether the PCB package of the component corresponding to the symbol of the to-be-tested component in the electronic design drawing is matched.

The package detection software in the electronic equipment obtains the original PCB package name of the component corresponding to the to-be-detected device symbol in the electronic design drawing, and can obtain the original PCB package name by inputting the electronic design drawing and the original PCB package name of the component corresponding to the to-be-detected device symbol in the electronic design drawing into the electronic equipment, wherein the input modes comprise but not limited to input on the electronic equipment, equipment application input, photographing input and the like. For example, the electronic design drawing and the original PCB package name of the component corresponding to the symbol of the device to be tested in the electronic design drawing can be manually input on the electronic equipment by a user; or, the method can also be obtained by transmitting and carrying out image recognition on the shot image containing the electronic design drawing and the original PCB package name of the component corresponding to the symbol of the device to be tested in the electronic design drawing. The manner in which the electronic device obtains the original PCB package name of the component corresponding to the device symbol to be tested in the electronic design drawing is not particularly limited herein.

It should be noted that, in the case that the PCB package name of a component corresponding to a certain component symbol in the electronic design drawing is not obtained, the component corresponding to the component symbol may not be used as the component corresponding to the to-be-tested component symbol to perform subsequent package detection.

And 120, determining a packaging detection result of the component corresponding to the device symbol to be tested based on a matching result between the original PCB packaging name and the current production process route.

Specifically, in step 120, because the original PCB package name is a package name given by an engineer drawing the electronic design drawing for the PCB package of the component corresponding to the device symbol to be tested, and the production process route can be uniquely determined when the PCB package of the component corresponding to the device symbol to be tested is determined, the package detection result of the component corresponding to the device symbol to be tested can be determined by determining whether the original PCB package name of the component corresponding to the device symbol to be tested matches the current production process route.

For example, when the original PCB package name of the component corresponding to the device symbol to be tested is matched with the current production process route, it can be determined that the package detection result of the component corresponding to the device symbol to be tested is that the package is correct, and at this time, a prompt message of "the package is correct and accords with the process" can be displayed to the user; when the original PCB packaging name of the component corresponding to the to-be-tested device symbol is not matched with the current production process route, the packaging detection result of the component corresponding to the to-be-tested device symbol can be determined to be the packaging non-conforming process, and prompt information of "the packaging non-conforming process and the to-be-modified" can be displayed to a user at the moment; at the moment, related engineers or testers can be prompted to correct the original PCB package names of components corresponding to the symbols of the to-be-tested devices, which are not in accordance with the process, of the packages.

Based on the above-mentioned device package detection method shown in fig. 1, in an exemplary embodiment, it is considered that all the bit numbers in the electronic design drawing are unique, and the device symbol corresponding to the component at each bit number is also unique, so that the original PCB package name of the component corresponding to the device symbol to be detected can be obtained after the device symbol to be detected is detected by the bit number positioning requirement. Based on this, the specific implementation procedure of step 110 may include:

Firstly, responding to a current production process route selected by a user, and acquiring respective bit numbers of all original device symbols and PCB package names of components corresponding to all original device symbols from an electronic design drawing; further based on each bit number and each PCB packaging name, obtaining a to-be-tested device symbol corresponding to the target bit number and an original PCB packaging name of a component corresponding to the to-be-tested device symbol; each of the bit numbers includes a target bit number and each of the PCB package names includes an original PCB package name.

The target number may be 1, part or all of all the numbers in the electronic design drawing, that is, the number of target numbers may be 1 or more.

Specifically, under the condition that package detection software installed in the electronic equipment displays all production process routes covered by producing different types of components to a user, the user can select one production process route from all production process routes to be recorded as a current production process route, and the current production process route is indicated to be the production process route selected at the current moment.

At this time, the package inspection software installed in the electronic device may obtain the respective bit numbers of all the original device symbols and the PCB package names of the components corresponding to all the original device symbols from the electronic design drawing, and specifically may be obtained by inputting the respective bit numbers of all the original device symbols and the PCB package names of the components corresponding to all the original device symbols in the electronic design drawing into the electronic device, where the input modes include, but are not limited to, input on the electronic device, input by the device application, and input by photographing. The present invention is not particularly limited in terms of the input mode.

For all the bit numbers and all the PCB package names obtained from the electronic design drawing by the package detection software of the electronic equipment, the to-be-detected device symbol corresponding to the target bit number and the original PCB package name of the device corresponding to the to-be-detected device symbol can be further obtained, for example, at least one target bit number can be determined through the selection operation of manual input of a user for at least one bit number in all the bit numbers, and at least one target bit number can be determined through the mode of voice output of at least one bit number for all the bit numbers by the user. The present invention is not particularly limited thereto.

At this time, the electronic device may determine, according to the obtained at least one target bit number, a device symbol to be tested corresponding to each target bit number, and an original PCB package name of the component corresponding to each device symbol to be tested.

It should be noted that, for the to-be-tested device symbol corresponding to each of the plurality of target bit numbers and the original PCB package name of the component corresponding to each of the to-be-tested device symbols, the selected current production process route may be matched with each of the original PCB package names in batches, so as to determine whether the PCB package of the component corresponding to the to-be-tested device symbol at each of the target bit numbers meets or does not meet the current production process route selected by the user.

According to the device package detection method provided by the embodiment of the invention, the original PCB package names of the components corresponding to the to-be-detected device symbols at the target position numbers of the required package detection are positioned through the position numbers in the electronic design drawing, so that the original PCB package names of each required package detection can be accurately and pertinently obtained by combining the uniqueness of the position numbers in the electronic design drawing, and the pertinence and the flexibility of the device package detection are improved.

Based on the device package inspection method shown in fig. 1, in an example embodiment, in a case where pre-developed package inspection software is installed in an electronic device and the package inspection software has at least a process package configuration function, the specific implementation process of step 120 may include:

firstly, judging whether an original PCB packaging name exists in a pre-configured process packaging configuration file; the process packaging configuration file comprises mapping relations between different target production process routes and respective target PCB packaging names of different types of components, and the different target production process routes comprise current production process routes; and further determining that the original PCB package name does not exist in the process package configuration file, and determining that the package detection result is that the package name is not compliant.

The process packaging configuration file is preconfigured by the packaging detection software, and all target production process routes contained in the process packaging configuration file can be specifically all production process routes covered by producing different types of components. In addition, each target PCB package name in the process package configuration file may be a canonical and uniform standard PCB package name that is preconfigured for the PCB package of the corresponding component.

Specifically, package detection software in the electronic equipment firstly judges whether the original PCB package name exists in a process package configuration file for the original PCB package name of the component corresponding to the to-be-detected device symbol, if the original PCB package name is not in the process package configuration file through matching the original PCB package name with the process package configuration file, the package detection result is determined to be that the original PCB package name is not compliant, and prompt information of 'non-process package configuration file device, please confirm' can be displayed to a user at the moment, wherein the case is package detection for an entirely new component or the original PCB package name is not named by engineers according to a package name naming specification of the process package configuration file, but is a custom package name; the PCB package names of the components are normalized by prompting the users to manually confirm whether the components are brand new or custom names, and the PCB package names named with the package name naming standards of the process package configuration file are supplemented or updated into the process package configuration file.

It should be noted that, in the case that the process package configuration file is a configuration file generated by a device package library pre-constructed according to package detection software, and the package device library specifically includes all target production process routes covered by producing different types of components and standard device package libraries of respective standard PCB package names of different types of components, if it is determined that the original PCB package name does not exist in the process package configuration file, a prompt message of "non-standard device package library device and please confirm" may be displayed to a user, so as to prompt the user to manually confirm whether the component is a brand new component or to normalize the PCB package names thereof in a mode of customizing the names.

According to the device package detection method provided by the embodiment of the invention, the package detection result is determined by determining that the original PCB package name does not exist in the process package configuration file based on the process package configuration file containing the mapping relation between different target production process routes and the respective target PCB package names of different types of components, so that the purposes of batch detection and standardized management of all device symbols in an electronic design image are realized, and the accuracy and reliability of device package detection are improved.

Based on the device package inspection method shown in fig. 1, in an exemplary embodiment, in a case of determining that the original PCB package name is a standard PCB package name that is normalized and uniformly configured, it is determined whether the original PCB package name coincides with the current production process route selected by the user, and the package inspection result is determined. Based on this, after the step of determining whether the original PCB package name exists in the pre-configured process package configuration file, the device package detection method provided by the present invention may further include:

firstly, determining that an original PCB packaging name exists in a process packaging configuration file, and judging whether the original PCB packaging name accords with a current production process route; further, determining that the original PCB package name accords with the current production process route, and determining that the package detection result is correct; or determining that the original PCB package name does not accord with the current production process route, and determining that the package detection result is that the package does not accord with the current production process route.

Wherein all target production process routes covered by the process packaging configuration file comprise the current production process route.

Specifically, if the original PCB package name exists in the process package configuration file, it may be determined that the original PCB package name is a standard and unified PCB package name configured based on a naming specification configured for the component configuration corresponding to the device symbol to be tested in advance, at this time, it may be further determined, based on a mapping relationship between different target production process routes included in the process package configuration file and respective target PCB package names of different types of components, whether the target production process route corresponding to the original PCB package name in the process package configuration file is the same as the current production process route selected by the user, if the target production process route corresponding to the original PCB package name in the process package configuration file is the same as the current production process route selected by the user, that is, the original PCB package name accords with the current production process route, at this time, the package detection result may be determined to be the package correct, and the package detection result may be specifically "package correct and accords with the process"; otherwise, if the target production process route corresponding to the original PCB package name in the process package configuration file is different from the current production process route selected by the user, that is, the original PCB package name does not conform to the current production process route, it may be determined that the package detection result specifically may be "the package does not conform to the process and needs to be corrected".

In the device package detection method provided by the embodiment of the invention, under the condition that the original PCB package name exists in the process package configuration file containing the mapping relation between different target production process routes and the respective target PCB package names of different types of components, whether the package accords with the package detection result of the process is detected by determining whether the electrical original PCB package name accords with the current production process route selected by a user or not based on the process package configuration file; thus, the flexibility and the accuracy of batch device package detection can be realized by combining the pre-configured process package configuration file, and the device package detection can be ensured to be more intelligent and standardized.

Based on the above-mentioned device package inspection method shown in fig. 1, in an exemplary embodiment, in order to improve the content richness and the content integrity of the process package configuration file, a device package library may be constructed by combining all existing production process routes to perform a mode of standard unified naming, and then according to the device package library configuration file. Based on this, the device package detection method provided by the embodiment of the invention may further include:

firstly, respectively carrying out packaging naming on all target production process routes covered by producing different types of components based on naming specifications configured for the different types of components in advance, and determining respective target PCB packaging names of all the target production process routes; then, a device package library is constructed containing all target production process routes and all target PCB package names, and a process package configuration file corresponding to the device package library is determined.

Specifically, the package inspection software in the electronic device has a device package library construction function, and when the package inspection software constructs the device package library, all the target production process routes covered by the different types of components can be maintained and put in storage, and each target production process route is packaged and named based on naming specifications configured for the different types of components in advance, so that the standard PCB packages with the respective specifications and unification of the different types of components are obtained, and the PCB packages of the different production process routes are distinguished. That is, the package device library created by the present invention is specifically a standard device package library including all the target production process routes covered by producing different types of components and the respective standard PCB package names of the different types of components.

For example, when the electronic components are classified into two types of the plug-in device and the chip device, the process of performing package naming based on naming specifications configured in advance for the plug-in device and the chip device is as follows:

the target production process route aiming at the chip device can be divided into a red glue wave crest production process route and a solder paste reflow production process route, and the target PCB packaging name suffix strip '-W' -of the chip device corresponding to the red glue wave crest production process route is specified; the target PCB packaging name suffix of the patch device corresponding to the solder paste reflow production process route is not provided with a 'W'.

The target production process route for the plug-in device is usually a red glue wave crest production process route, and the packaging difference is represented by packaging a single panel in a double-sided board, so that: the suffix of the target PCB packaging name of the single-sided board red glue wave crest production process route of the plug-in device is provided with an 'S', and the suffix of the target PCB packaging name of the double-sided board red glue wave crest production process route of the plug-in device is not provided with an 'S'.

And respectively carrying out package naming on all target production process routes covered by the production plug-in device and the patch device according to the naming specifications, and constructing a device package library for detecting whether the PCB package accords with the process or not by subsequent package detection software. In addition, the process packaging configuration is carried out according to a device packaging library constructed for the plug-in device and the patch device, namely, the process packaging configuration is carried out in a mode of writing the target PCB packaging names of the plug-in device and the patch device required by different target production process routes in a file, so that the mapping relation between the different target production process routes and the respective target PCB packaging names of different types of components is obtained.

At this time, the package detection software in the electronic device may perform device package detection based on the mapping relationship, so as to determine whether the package detection of the corresponding type of component is wrong by determining whether the suffix of each target PCB package name of different target production process routes meets the corresponding naming standard, thereby determining whether the package detection result is that the package meets the process. The process of determining whether the package inspection of the corresponding type of component is error-prone may be as shown in table 1.

TABLE 1

As can be seen from table 1, for the original PCB package names of the components corresponding to each to-be-tested device symbol in the electronic design drawing, whether the PCB packages conform to the production process route of the corresponding type of components can be detected in batch by determining whether each original PCB package name conforms to the naming standard of the corresponding type of components, so that the batch device package detection is more flexible and accurate.

According to the device package detection method provided by the embodiment of the invention, the device package library is constructed in a manner of carrying out package naming on various target production process routes through specific naming standards so as to determine the process package configuration file corresponding to the device package library. Therefore, whether the original PCB package names of the components corresponding to the to-be-tested device symbols accord with the current selected production process route can be rapidly detected according to all target PCB package names in the package configuration file, and the easy realization and convenience of device package detection can be improved on the premise of ensuring more accurate and intelligent device package detection.

Based on the device package detection method shown in fig. 1, in an exemplary embodiment, in order to perform batch and standardized management on PCB packages of respective components of all device symbols in an electronic design drawing, when an original PCB package name of a component corresponding to a device symbol to be tested in the electronic design drawing does not match with a currently selected production process route, the original PCB package name may be replaced with a corresponding target PCB package name in a process package configuration file. Based on this, the device package detection method provided by the invention may further include:

And determining that the package detection result is that the package does not accord with the current production process route, and replacing the original PCB package name with a target PCB package name matched with components corresponding to the current production process route and the original PCB package name in the process package configuration file.

When the package detection result is that the package does not accord with the current production process route, prompt information of "the package does not accord with the process and needs to be corrected" can be displayed to a user.

Specifically, when package detection software in the electronic equipment determines that the original PCB package name of the component corresponding to the to-be-detected device symbol does not accord with the current production process route, a target position number of the to-be-detected device symbol in the electronic design drawing is wrongly reported, prompt information of "package does not accord with the process and needs to be corrected" is displayed to a user, meanwhile, the target PCB package name matched with the component corresponding to the current production process route and the original PCB package name can be searched from the process package configuration file, and the original PCB package name of the to-be-detected device symbol at the target position number not accord with the current production process route is replaced by the searched target PCB package name.

According to the device package detection method provided by the embodiment of the invention, the original PCB package names which do not accord with the current selected production process route in the electronic design drawing are replaced by the target PCB package names which are matched with the current selected production process route and the components corresponding to the device symbols to be detected in the process package configuration file, so that the purposes of managing the PCB packages of the components of all the device symbols in the electronic design drawing in batches and standardization are realized, reliable guarantee is provided for subsequent quick and high-quality production of electronic products, the manufacturability of the electronic design drawing is improved, and the quality of the electronic design drawing is also improved.

Based on the device package detection method shown in fig. 1, in an example embodiment, considering that the maintenance or updating of the process package configuration file is not timely, it is unavoidable that the target PCB package name matched with the component corresponding to the current production process route and the original PCB package name cannot be found, at this time, the user may be prompted to manually determine the matched target PCB package name, and the process package configuration file is updated by the electronic device. Based on this, the device package detection method provided by the invention may further include:

determining that the process packaging configuration file does not have the target PCB packaging names matched with the components corresponding to the current production process route and the original PCB packaging names, prompting a user to determine the target PCB packaging names matched with the components corresponding to the current production process route and the original PCB packaging names, acquiring the target PCB packaging names determined by the user, replacing the original PCB packaging names, and updating the device packaging library and the process packaging configuration file respectively based on the successful replacement result.

Specifically, for the case that the original PCB package name of the component corresponding to the to-be-tested device symbol does not accord with the current production process route and the target PCB package name matched with the component corresponding to the current production process route and the original PCB package name is not found in the process package configuration file, the user can be prompted to manually determine the target PCB package name matched with the component corresponding to the current production process route and the original PCB package name, the user-determined target PCB package name is obtained based on the user-determined result, and at the moment, the user can be prompted to replace the original PCB package name of the to-be-tested device symbol at the target position number which does not accord with the current production process route with the user-determined target PCB package name in a positioning correction mode by clicking the target position number; the user can also be prompted to input the artificially determined target PCB package name to the package inspection software, and then the package inspection software performs the replacement operation. Furthermore, the package detection software can update the device package library and the process package configuration file respectively based on the successful replacement result, that is, the artificially determined target PCB package names are respectively recorded and maintained in the device package library and the process package configuration file.

According to the device package detection method provided by the embodiment of the invention, the original PCB package names which do not accord with the current selected production process route in the electronic design drawing are replaced by the target PCB package names which are manually determined and matched with the components corresponding to the current selected production process route and the device symbol to be detected, and the device package library and the process package configuration file are updated in time based on the successful replacement result. Therefore, the purposes of batch and standardized management of the PCB packages of the components of all the device symbols in the electronic design drawing can be achieved by timely updating the device package library and the process package configuration file, so that the manufacturability of the electronic design drawing is improved, and the quality of the electronic design drawing is also improved.

Referring to fig. 2, for an exemplary schematic block diagram of a device package detection method provided by the present invention, as shown in fig. 2, package detection software in an electronic device first determines whether an original PCB package name of a component corresponding to a device symbol to be tested exists in a process package configuration file, if not, a target bit number of the device symbol to be tested in an electronic design drawing is misplaced, and a prompt message of "no device package library device, please confirm" is displayed to a user to prompt the user to manually confirm whether the component corresponding to the device symbol to be tested is an entirely new component or whether the original PCB package name is a package name customized by an engineer drawing the electronic design drawing, and replaces the original PCB package name with a corresponding target PCB package name in the process package configuration file according to a confirmation result; otherwise, if yes, whether the original PCB packaging name accords with the currently selected production process route is further judged, and if yes, a target position number of the device to be tested symbol in the electronic design drawing can display prompt information of 'packaging is correct and accords with the process' to a user; otherwise, if the target PCB package name does not accord with the process, the target position number of the device symbol to be tested in the electronic design drawing is misplaced, and prompt information that the package does not accord with the process and needs to be corrected is displayed to a user, so that the original PCB package name of the package does not accord with the process is replaced by the corresponding target PCB package name in a mode of searching the corresponding target PCB package name from the process package configuration file or manually determining the corresponding target PCB package name. Therefore, package detection software in the electronic equipment can output error reporting prompts to the user through the currently selected production process route, and display package detection results to the user intuitively, so that the user can quickly and accurately locate and correct the wrong original PCB package name in the electronic design drawing through error reporting information, the situation that components are packaged by the PCB through the wrong production process route is avoided, the efficiency and user experience of detecting the PCB package by engineers are improved, and meanwhile, the bad risk of electronic products is reduced. The specific process involved in this process may refer to the foregoing embodiment, and will not be described herein.

The device package inspection apparatus provided by the present invention will be described below, and the device package inspection apparatus described below and the device package inspection method described above may be referred to correspondingly to each other.

Referring to fig. 3, a schematic structural diagram of a device package inspection apparatus according to the present invention, as shown in fig. 3, the device package inspection apparatus 300 may include an acquisition unit 310 and an inspection unit 320.

And the obtaining unit 310 is configured to obtain, in response to the current production process route selected by the user, an original PCB package name of the component corresponding to the device symbol to be tested in the electronic design drawing.

And the detecting unit 320 is configured to determine a package detection result of the component corresponding to the device symbol to be tested based on a matching result between the original PCB package name and the current production process route.

Optionally, the detecting unit 320 is specifically configured to determine whether the original PCB package name exists in a pre-configured process package configuration file; the process packaging configuration file comprises mapping relations between different target production process routes and respective target PCB packaging names of different types of components, and the different target production process routes comprise current production process routes; and determining that the original PCB package name does not exist in the process package configuration file, and determining that the package detection result is that the package name is not compliant.

Optionally, the detecting unit 320 is specifically configured to determine that the original PCB package name exists in the process package configuration file, and determine whether the current original PCB package name meets the current production process route; determining that the original PCB packaging name accords with the current production process route, and determining that the packaging detection result is correct; and determining that the original PCB package name does not accord with the current production process route, and determining that the package detection result is that the package does not accord with the current production process route.

Optionally, the detecting unit 320 is specifically configured to perform package naming on all target production process routes covered by the production of different types of components based on naming specifications configured for the different types of components in advance, and determine respective target PCB package names of all the target production process routes; and constructing a device package library containing all target production process routes and all target PCB package names, and determining a process package configuration file corresponding to the device package library.

Optionally, the detecting unit 320 is specifically configured to determine that the package detection result is that the package does not conform to the current production process route, and replace the original PCB package name with the target PCB package name in the process package configuration file that matches both the current production process route and the component corresponding to the original PCB package name.

Optionally, the detecting unit 320 is specifically configured to determine that there is no target PCB package name matching with the component corresponding to the current production process route and the original PCB package name in the process package configuration file, prompt the user to determine the target PCB package name matching with the component corresponding to the current production process route and the original PCB package name, obtain the target PCB package name determined by the user, replace the original PCB package name, and update the device package library and the process package configuration file respectively based on the successful replacement result.

Optionally, the obtaining unit 310 is specifically configured to obtain, from the electronic design drawing, respective bit numbers of all original device symbols and PCB package names of components corresponding to all original device symbols in response to a current production process route selected by a user;

based on each bit number and each PCB packaging name, acquiring a to-be-tested device symbol corresponding to the target bit number and an original PCB packaging name of a component corresponding to the to-be-tested device symbol; each of the bit numbers includes a target bit number and each of the PCB package names includes an original PCB package name.

The device package detection apparatus 300 provided in the embodiment of the present invention may execute the technical scheme of the device package detection method in any of the embodiments, and the implementation principle and beneficial effects of the device package detection method are similar to those of the device package detection method, and may refer to the implementation principle and beneficial effects of the device package detection method, and will not be described herein.

Fig. 4 illustrates a physical schematic diagram of an electronic device, as shown in fig. 4, which may include: processor 410, communication interface (Communications Interface) 420, memory 430 and communication bus 440, wherein processor 410, communication interface 420 and memory 430 communicate with each other via communication bus 440. The processor 410 may call logic instructions in the memory 430 to perform the following method:

responding to the current production process route selected by a user, and acquiring the original PCB packaging name of the component corresponding to the symbol of the to-be-tested device in the electronic design drawing; and determining the packaging detection result of the component corresponding to the device symbol to be detected based on the matching result between the original PCB packaging name and the current production process route.

Further, the logic instructions in the memory 430 described above may be implemented in the form of software functional units and may be stored in a computer-readable storage medium when sold or used as a stand-alone product. Based on such understanding, the technical solution of the present invention may be embodied essentially or in a part contributing to the related art or in a part of the technical solution, in the form of a software product stored in a storage medium, including several instructions for causing a computer device (which may be a personal computer, a server, or a network device, etc.) to perform all or part of the steps of the method according to the embodiments of the present invention. And the aforementioned storage medium includes: a U-disk, a removable hard disk, a Read-Only Memory (ROM), a random access Memory (RAM, random Access Memory), a magnetic disk, or an optical disk, or other various media capable of storing program codes.

In another aspect, embodiments of the present invention disclose a computer program product comprising a computer program stored on a non-transitory computer readable storage medium, the computer program comprising program instructions which, when executed by a computer, are capable of performing the methods provided by the above-described method embodiments, for example comprising:

In yet another aspect, embodiments of the present invention further provide a non-transitory computer readable storage medium having stored thereon a computer program, which when executed by a processor is implemented to perform the transmission method provided in the above embodiments, for example, including:

The apparatus embodiments described above are merely illustrative, wherein the elements illustrated as separate elements may or may not be physically separate, and the elements shown as elements may or may not be physical elements, may be located in one place, or may be distributed over a plurality of network elements. Some or all of the modules may be selected according to actual needs to achieve the purpose of the solution of this embodiment. Those of ordinary skill in the art will understand and implement the present invention without undue burden.

From the above description of the embodiments, it will be apparent to those skilled in the art that the embodiments may be implemented by means of software plus necessary general hardware platforms, or of course may be implemented by means of hardware. Based on such understanding, the foregoing technical solution may be embodied essentially or in a part contributing to the related art in the form of a software product, which may be stored in a computer readable storage medium, such as ROM/RAM, a magnetic disk, an optical disk, etc., including several instructions for causing a computer device (which may be a personal computer, a server, or a network device, etc.) to perform the method described in the respective embodiments or some parts of the embodiments.

Finally, it should be noted that the above-mentioned embodiments are merely illustrative of the invention, and not limiting. While the invention has been described in detail with reference to the embodiments, those skilled in the art will appreciate that various combinations, modifications, or equivalent substitutions can be made to the technical solutions of the present invention without departing from the spirit and scope of the technical solutions of the present invention, and it is intended to be covered by the scope of the claims of the present invention.

Claims

1. A device package inspection method, comprising:

2. The device package inspection method according to claim 1, wherein the determining the package inspection result of the component corresponding to the device symbol under test based on the matching result between the original PCB package name and the current production process route includes:

3. The device package inspection method of claim 2, further comprising:

4. A device package inspection method according to claim 2 or 3, characterized in that the method further comprises:

5. The device package inspection method of claim 3, further comprising:

6. The device package inspection method of claim 4, further comprising:

7. A device package inspection method according to any one of claims 1 to 3, wherein the obtaining, in response to a current production process route selected by a user, an original PCB package name of a component corresponding to a device symbol to be tested in an electronic design drawing includes:

8. A device package inspection apparatus, comprising:

9. An electronic device comprising a memory, a processor and a computer program stored on the memory and executable on the processor, wherein the processor implements the device package inspection method of any of claims 1 to 7 when the program is executed by the processor.

10. A non-transitory computer readable storage medium having stored thereon a computer program, which when executed by a processor implements the device package inspection method according to any of claims 1 to 7.