CN117473947A - Drawing package detection method and device, electronic equipment and medium - Google Patents
Drawing package detection method and device, electronic equipment and medium Download PDFInfo
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- CN117473947A CN117473947A CN202311835962.4A CN202311835962A CN117473947A CN 117473947 A CN117473947 A CN 117473947A CN 202311835962 A CN202311835962 A CN 202311835962A CN 117473947 A CN117473947 A CN 117473947A
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- 238000001514 detection method Methods 0.000 title claims abstract description 32
- 238000004519 manufacturing process Methods 0.000 claims abstract description 209
- 238000004806 packaging method and process Methods 0.000 claims abstract description 148
- 238000000034 method Methods 0.000 claims abstract description 38
- 238000012986 modification Methods 0.000 claims description 21
- 230000004048 modification Effects 0.000 claims description 21
- 238000007689 inspection Methods 0.000 claims description 11
- 230000002159 abnormal effect Effects 0.000 claims description 7
- 238000004590 computer program Methods 0.000 claims description 5
- 238000013461 design Methods 0.000 abstract description 22
- 238000012545 processing Methods 0.000 abstract description 2
- 230000008569 process Effects 0.000 description 14
- 238000013507 mapping Methods 0.000 description 8
- 238000004891 communication Methods 0.000 description 5
- 238000010586 diagram Methods 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- 238000005538 encapsulation Methods 0.000 description 3
- 239000003292 glue Substances 0.000 description 3
- 230000003287 optical effect Effects 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000012938 design process Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
Classifications
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F30/00—Computer-aided design [CAD]
- G06F30/30—Circuit design
- G06F30/39—Circuit design at the physical level
- G06F30/398—Design verification or optimisation, e.g. using design rule check [DRC], layout versus schematics [LVS] or finite element methods [FEM]
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F30/00—Computer-aided design [CAD]
- G06F30/30—Circuit design
- G06F30/39—Circuit design at the physical level
- G06F30/392—Floor-planning or layout, e.g. partitioning or placement
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
- Y02P90/30—Computing systems specially adapted for manufacturing
Abstract
The application relates to the field of design drawing processing, and provides a drawing packaging detection method, a device, electronic equipment and a medium, wherein the method comprises the following steps: obtaining the package name of a device in a drawing to be tested and the production process of the drawing to be tested; comparing the package name of the device with the package names in the device package library; if the target packaging name consistent with the packaging name of the device exists in the device packaging library, comparing the production process of the drawing to be tested with the production process related to the target packaging name; if the production process of the drawing to be tested is inconsistent with the production process related to the target package name and the package name related to the production process of the drawing to be tested exists in the device package library, determining that the device is the packaged device to be modified. The method and the device can quickly find out the wrong and modifiable device packages in the drawing to be tested, are convenient for modifying the packages in batches, further reduce the situation that the electronic drawing is wrong in packaging, and improve the design efficiency of the electronic drawing.
Description
Technical Field
The application relates to the field of design drawing processing, in particular to a drawing packaging detection method, a drawing packaging detection device, electronic equipment and a drawing packaging detection medium.
Background
Before drawing the electronic design drawings, engineers will set up the process routes, and each process route for the electronic design drawings is unique. For devices, different process routes are needed to select different packages, and the process routes are in one-to-one correspondence with the packages. However, during the design process, the engineer pulls the device from the device library for use, and the system defaults to selecting the first package, which is not necessarily suitable for the process route of the drawing. Because the devices in the electronic design drawing are many, the electronic design drawing is troublesome to change from package to package, and therefore, the electronic design drawing is easy to have package errors due to missing inspection or wrong inspection, and the design efficiency of the electronic design drawing is low.
Disclosure of Invention
The present application aims to solve at least one of the technical problems existing in the related art. Therefore, the drawing packaging detection method can avoid the problem of packaging errors in the designed electronic drawing caused by missing detection or false detection, and improves the design efficiency of the electronic drawing.
The application also provides a drawing packaging detection device, electronic equipment and a medium.
The drawing package detection method according to the embodiment of the first aspect of the application comprises the following steps:
obtaining the package name of a device in a drawing to be tested and the production process of the drawing to be tested;
comparing the package name of the device with the package names in a device package library; the device package library is used for storing the package name of the device and the association relation between the package name and the production process;
if the target packaging name consistent with the packaging name of the device exists in the device packaging library, comparing the production process of the drawing to be tested with the production process associated with the target packaging name;
and if the production process of the drawing to be tested is inconsistent with the production process related to the target package name and the package name related to the production process of the drawing to be tested exists in the device package library, determining that the device is a packaged device to be modified.
According to the drawing packaging detection method, through the association relation between the packaging names and the production process in the device packaging library, whether the packaging names of devices in the drawing to be detected are contained in the device packaging library can be determined, if yes, whether the packaging of the devices corresponds to the production process is determined, and if not, the devices are determined to be packaged to be modified, so that the wrong and modifiable device packaging in the drawing to be detected can be rapidly found, batch modification of the packaging is facilitated, the situation that packaging errors exist in the designed electronic drawing is reduced, and the design efficiency of the electronic drawing is improved.
According to one embodiment of the present application, after comparing the package name of the device with the package names in the device package library, the method further includes:
and if the package names in the device package library are different from the package names of the devices, determining that the devices are non-package library devices.
According to one embodiment of the present application, after comparing the production process of the drawing to be tested with the production process associated with the target package name, the method further includes:
and if the production process of the drawing to be tested is consistent with the production process related to the target package name, determining that the device package is correct.
According to one embodiment of the present application, after comparing the production process of the drawing to be tested with the production process associated with the target package name, the method further includes:
if the production process of the drawing to be tested is inconsistent with the production process related to the target package name and the package name related to the production process of the drawing to be tested does not exist in the device package library, determining that the device is an abnormal package device.
According to one embodiment of the present application, after determining that the device is a packaged device to be modified, the method further includes:
receiving a modification instruction based on at least one to-be-modified packaging device, and determining a target packaging name of the to-be-modified packaging device according to a production process of a drawing where the to-be-modified packaging device is located and a device type of the to-be-modified packaging device;
and modifying the current package name of the to-be-modified package device into the target package name.
According to one embodiment of the application, the device package library is further used for storing the association relation among the production process, the device type and the package name; the determining the target package name of the to-be-modified packaged device according to the production process of the drawing of the to-be-modified packaged device and the device type of the to-be-modified packaged device comprises the following steps:
inquiring the packaging names corresponding to the production process of the drawing of the packaging device to be modified and the device type of the packaging device to be modified based on the association relation among the production process, the device type and the packaging names, and determining the packaging names corresponding to the production process of the drawing of the packaging device to be modified and the device type of the packaging device to be modified as target packaging names.
According to one embodiment of the present application, the device types include at least one of a interposer device and a patch device.
According to one embodiment of the present application, after obtaining the package name of the device in the drawing to be tested and the production process of the drawing to be tested, the method further includes:
comparing the production process of the drawing to be tested with the production process in a device packaging library;
if the target production process consistent with the production process of the drawing to be tested exists in the device packaging library, comparing the packaging name of the device with the packaging name associated with the target production process;
and if the package name of the device is inconsistent with the package name associated with the target production process, determining that the device is a packaged device to be modified.
According to an embodiment of the second aspect of the present application, a drawing package detection device includes:
the device comprises an acquisition module, a display module and a display module, wherein the acquisition module is used for acquiring the package name of a device in a drawing to be tested and the production process of the drawing to be tested;
the first comparison module is used for comparing the package name of the device with the package names in the device package library; the device package library is used for storing the package name of the device and the association relation between the package name and the production process;
the second comparison module is used for comparing the production process of the drawing to be tested with the production process associated with the target package name if the target package name consistent with the package name of the device exists in the device package library;
the determining module is used for determining the device as a packaged device to be modified if the production process of the drawing to be tested is inconsistent with the production process related to the target package name and the package name related to the production process of the drawing to be tested exists in the device package library.
An electronic device according to an embodiment of the third aspect of the present application includes a memory, a processor, and a computer program stored on the memory and executable on the processor, where the processor implements any one of the drawing package detection methods described above when executing the program.
According to an embodiment of the fourth aspect of the present application, the medium is a non-transitory computer readable storage medium, on which a computer program is stored, which when executed by a processor implements a drawing package detection method as described in any of the above.
The above technical solutions in the embodiments of the present application have at least one of the following technical effects:
the device package which is wrong and can be modified in the drawing to be tested can be quickly found, batch modification is conveniently carried out on the package, the situation that package errors exist in the designed electronic drawing is further reduced, and the design efficiency of the electronic drawing is improved.
Additional aspects and advantages of the application will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the application.
Drawings
In order to more clearly illustrate the embodiments of the present application or the technical solutions in the related art, the drawings that are required to be used in the embodiments or the related technical descriptions will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and other drawings may be obtained according to the drawings without inventive effort for a person having ordinary skill in the art.
Fig. 1 is a schematic flow chart of a method for detecting a package of a drawing according to an embodiment of the present application;
FIG. 2 is a second flowchart of a method for inspecting a package of a drawing according to an embodiment of the present disclosure;
fig. 3 is a schematic structural diagram of a package inspection apparatus according to an embodiment of the present disclosure;
fig. 4 is a schematic structural diagram of an electronic device provided in the present application.
Detailed Description
Embodiments of the present application are described in further detail below with reference to the accompanying drawings and examples. The following examples are illustrative of the present application but are not intended to limit the scope of the present application.
In the description of the embodiments of the present application, it should be noted that, directions or positional relationships indicated by terms such as "center", "longitudinal", "lateral", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., are based on those shown in the drawings, are merely for convenience in describing the embodiments of the present application and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the embodiments of the present application. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the embodiments of the present application, it should be noted that, unless explicitly specified and limited otherwise, the terms "connected," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium. The specific meaning of the terms in the embodiments of the present application will be understood by those of ordinary skill in the art in a specific context.
In the examples herein, a first feature "on" or "under" a second feature may be either the first and second features in direct contact, or the first and second features in indirect contact via an intermediary, unless expressly stated and defined otherwise. Moreover, a first feature being "above," "over" and "on" a second feature may be a first feature being directly above or obliquely above the second feature, or simply indicating that the first feature is level higher than the second feature. The first feature being "under", "below" and "beneath" the second feature may be the first feature being directly under or obliquely below the second feature, or simply indicating that the first feature is less level than the second feature.
In the description of the present specification, a description referring to terms "one embodiment," "some embodiments," "examples," "specific examples," or "some examples," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the embodiments of the present application. In this specification, schematic representations of the above terms are not necessarily directed to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, the different embodiments or examples described in this specification and the features of the different embodiments or examples may be combined and combined by those skilled in the art without contradiction.
Fig. 1 is one of flow diagrams of a drawing package detection method provided in an embodiment of the present application, as shown in fig. 1, where the drawing package detection method includes:
step 110, obtaining the package name of the device in the drawing to be tested and the production process of the drawing to be tested.
It should be noted that, the execution body of the drawing package detection method provided in the embodiments of the present application may be a server, a computer device, for example, a mobile phone, a tablet computer, a notebook computer, a palm computer, a vehicle-mounted electronic device, a wearable device, an Ultra-mobile personal computer (Ultra-Mobile Personal Computer, UMPC), a netbook, a personal digital assistant (Personal Digital Assistant, PDA), or the like.
It should be noted that, before designing the electronic drawings, engineers will set the production process of the drawings, and the production process of each electronic drawing is unique. Meanwhile, each device in the electronic drawing is required to be provided with a packaging mode, wherein different packaging modes respectively correspond to a unique packaging name.
In the application, the to-be-tested drawing, namely the electronic drawing designed by the engineer, can be used as the to-be-tested drawing, one or more devices can be included in the to-be-tested drawing, and each device can have a unit number and a packaging name.
Therefore, after the drawing to be measured is obtained, the position number of each device in the drawing to be measured can be obtained, the packaging name corresponding to each position number can be extracted, and the production process of the drawing to be measured can be obtained, wherein the production process is determined by an engineer before the drawing design is performed.
Step 120, the package name of the device is compared with the package names in the device package library.
In the application, a device package library can be pre-constructed, and the device package library is used for storing package names of devices and association relations between the package names and production processes.
In the device package library, each package name corresponds to a production process, so that an association relationship between the package name and the production process is formed.
It should be noted that each package name is associated with one device type in addition to one production process. Thereby forming an association between the memory production process, the device type and the package name.
It should be noted that the device types in the present application may include, but are not limited to, a plug-in device and a patch device.
Because only one production process can be selected during the production of the electronic product, each device can only correspond to one package under each production process, when a device package library is created, all the related packages need to be maintained in the prior art so as to ensure that enough production process scenes are covered.
In one embodiment, for the plug-in device, the red glue wave crest process is selected for the production process, but the packaging difference is embodied in a single-panel package and a double-panel package. It is therefore specified that: the package name suffix of the single-sided board package of the plug-in device is "S"; the package name suffix of the dual-sided board package of the package device is not provided with an "S".
Aiming at the chip device, the production process is divided into a red glue crest process and a solder paste reflow process. It is therefore specified that: the encapsulation name of the red glue crest process of the patch device is provided with a suffix W; the package name suffix of the solder paste reflow process of the chip device is not provided with a "W".
When the device package library is created, when each patch device and plug-in device are subjected to package naming, the package is conveniently grasped later according to the rules.
The method and the device can maintain a configuration file in the device packaging library, and package names of the mapping plug-in devices and the patch devices required by different production processes are written into the configuration file. The mapping is shown in table 1 below:
TABLE 1
As shown in the above table, the above is related to the production process commonly used for electronic products, and this mapping relationship is maintained to the inside of the configuration table.
Besides the mapping relation, all package names in the device package library are recorded in the configuration file so as to judge whether the device is a brand new material or not, and the package names of the brand new material are not recorded in the device package library and are generally different from those in the device package library.
Therefore, after the package names of the devices are obtained, the package names of the devices can be compared with the package names in the device package library for each device, so that whether the package names of the devices are the package names in the device package library or not can be determined.
And 130, if the target package name consistent with the package name of the device exists in the device package library, comparing the production process of the drawing to be tested with the production process associated with the target package name.
If the comparison determines that the package name consistent with the package name of the device exists in the device package library for each device, the package name in the device package library is determined to be the target package name.
Further, the production process associated with the target package name is found out through the association relation between the package name and the production process.
And comparing the production process related to the target package name with the production process of the drawing to be tested, thereby determining whether the package name of the device is matched with the corresponding production process or not with a group of package names in the device package library.
And 140, if the production process of the drawing to be tested is inconsistent with the production process associated with the target package name and the package name associated with the production process of the drawing to be tested exists in the device package library, determining that the device is the packaged device to be modified.
If the comparison determines that the production process of the drawing to be tested is inconsistent with the production process related to the target package name, the package name of the device is not matched with the corresponding production process, and the package name is wrong, namely the package mode is wrong.
Further, whether the package name associated with the production process of the drawing to be tested exists in the device package library can be searched, if so, the package name of the device can be modified to correct the package mode, and package errors are avoided.
Thus, the device may be determined to be a packaged device to be modified.
It should be noted that if there are a plurality of package names of devices in the device package library, but the production process of the drawing is inconsistent with the production process of the corresponding package names and the production process of the drawing has an associated package name in the device package library, determining the plurality of devices as the packaged devices to be modified.
According to the drawing packaging detection method, through the association relation between the packaging names and the production process in the device packaging library, whether the packaging names of devices in the drawing to be detected are contained in the device packaging library can be determined, if yes, whether the packaging of the devices corresponds to the production process is determined, and if not, the devices are determined to be packaged to be modified, so that the wrong and modifiable device packaging in the drawing to be detected can be rapidly found, batch modification of the packaging is facilitated, the situation that packaging errors exist in the designed electronic drawing is reduced, and the design efficiency of the electronic drawing is improved.
The method and the device aim at solving the problem that a user cannot modify the package in batches so as to meet the requirement that the user can quickly and accurately search and modify the package in batches, thereby improving the drawing efficiency and reducing the design error probability.
Based on the above embodiment, the step 120 may include, after that:
and 150, if the package names in the device package library are different from the package names of the devices, determining that the devices are non-package library devices.
After comparing the package name of the device with the package names in the device package library, if the package names in the device package library are different from the package names of the current device, the package names of the current device are not in the device package library, and the device can be considered to be a new device or a device adopting a new package mode, so that the device can be determined to be a non-package library device, and further, prompt information of 'non-package library device and no modification' can be output according to the position number of the device.
When the package names in the device package library are different from the package names of the devices, the device is determined to be a non-package library device for further checking by engineers, so that the design accuracy of the electronic drawing can be improved.
Based on the above embodiment, the step 130 may include:
step 160, if the production process of the drawing to be tested is consistent with the production process associated with the target package name, determining that the device package is correct.
After the production process of the drawing to be tested is compared with the production process related to the target package name, if the production process of the drawing to be tested is consistent with the production process related to the target package name, the package name of the current device is consistent with the production process, so that the package of the current device can be determined to be correct, and prompt information of ' the process is consistent with ' can be output according to the position number of the device without modification '.
When the production process of the drawing to be tested is consistent with the production process related to the target package name, the device package is determined to be correct, so that the package names of all devices in the drawing can be automatically detected, the condition of missing detection and false detection during manual inspection is avoided, and the design accuracy of the electronic drawing can be improved.
Based on the above embodiment, the step 130 may further include:
step 170, if the production process of the drawing to be tested is inconsistent with the production process associated with the target package name, and the package name associated with the production process of the drawing to be tested does not exist in the device package library, determining that the device is an abnormal package device.
After comparing the production process of the drawing to be tested with the production process related to the target package name, if the production process of the drawing to be tested is inconsistent with the production process related to the target package name, whether the package name related to the production process of the drawing to be tested exists in the device package library can be further determined.
If the package name associated with the production process of the drawing to be tested does not exist in the device package library, the fact that the package name of the current device cannot be modified to be the correct package name can be determined, and therefore the device can be determined to be an abnormal package device. Meanwhile, the prompt message of 'no package matched with the process is found and not modified' can be output for the position number of the device, so that an engineer can check and modify.
In the embodiment, when the production process of the drawing to be tested is inconsistent with the production process related to the target package name, and the package name related to the production process of the drawing to be tested does not exist in the device package library, the device can be determined to be an abnormal package device, so that engineers can further check and correct the abnormal package device, and the design accuracy of the electronic drawing can be improved.
Based on the above embodiment, the step 140 may include:
step 180, receiving a modification instruction based on at least one to-be-modified packaging device, and determining a target packaging name of the to-be-modified packaging device according to a production process of a drawing where the to-be-modified packaging device is located and a device type of the to-be-modified packaging device;
according to the method and the device, engineers can select the packaged devices to be modified singly or in batches according to detection results of the devices, and can initiate modification instructions for carrying out package modification on the packaged devices to be modified aiming at the selected devices.
When receiving a modification instruction of an engineer for at least one to-be-modified packaging device, the method can find the packaging name associated with the production process and the device type of the drawing of the to-be-modified packaging device according to the association relationship among the production process, the device type and the packaging name, and determine the packaging name as the target packaging name of the to-be-modified packaging device.
Step 190, modifying the current package name of the package device to be modified into the target package name.
After the target package name of the current package device to be modified is determined, the current package name of the current package device to be modified can be obtained, and the package name is modified into the target package name, so that the package name modification of the package device to be modified is completed, and further, the package modification of the package device to be modified can be realized.
Based on the above embodiment, the step 180 may include:
step 181, inquiring the packaging names corresponding to the production process of the drawing of the packaging device to be modified and the device type of the packaging device to be modified based on the association relation among the production process, the device type and the packaging names, and determining the packaging names corresponding to the production process of the drawing of the packaging device to be modified and the device type of the packaging device to be modified as target packaging names.
After receiving the modification instruction, the method and the device can acquire the association relationship among the production process, the device type and the package name from the device package library.
Further, for each to-be-modified packaging device, whether a packaging name corresponding to both the production process of the drawing of the current to-be-modified packaging device and the device type of the current to-be-modified packaging device exists in a packaging library of the device can be queried according to the association relation, and if the packaging name corresponding to both the production process of the drawing of the current to-be-modified packaging device and the device type of the current to-be-modified packaging device exists, the packaging name is determined to be a target packaging name.
According to the embodiment, the batch device package names can be modified according to the modification instruction, so that engineers are prevented from checking each device one by one and carrying out package modification one by one, the situation that package errors exist in the designed electronic drawing can be reduced, and the design efficiency of the electronic drawing is improved.
Fig. 2 is a second flowchart of the drawing package detection method provided in the embodiment of the present application, as shown in fig. 2, in some embodiments, after an engineer selects an existing drawing as a drawing to be tested, the drawing package detection method of the present application may include the following steps:
(1) Firstly, capturing the position numbers of all devices in a drawing to be tested and the current package, and judging each device as follows:
(2) And judging whether the current package names of the devices are all in the configuration file of the device package library. If the current encapsulation name with the bit number is not in the configuration file, the corresponding bit number is reported out and marked as a non-encapsulation library device and is not modified, which is generally a brand new material. If the current package name with the bit number is determined to exist in the configuration file, continuing the next step of judgment:
(3) Judging whether the current package name accords with the selected production process, if so, marking the bit number as 'accord with the process' without modification. If the current package name is determined not to accord with the selected production process, continuing the next step of judgment:
(4) Judging whether the corresponding package name package can be found according to the mapping relation of the configuration files. If the corresponding package name is not found according to the mapping relation of the configuration file, the corresponding bit number is reported out and recorded as 'no package matched with the process is found and not modified', and the situation is that the package name of the package is not maintained in a device package library. If the package of the corresponding package name is found according to the mapping relation of the configuration file, the corresponding bit number is marked as 'needing to be modified'.
In one embodiment, after the engineer examines the judgment result of the software, click the "apply" button to make the software execute the operation of replacing the packaging action on the device with the "to be modified" bit number according to the mapping relation in the configuration file. The software does not deal with devices that would otherwise conform to the manufacturing process or have a bit number of the error term.
Based on the above embodiment, the step 110 may further include:
step 210, comparing the production process of the drawing to be tested with the production process in the device packaging library;
in one embodiment, after the package name of the device in the drawing to be tested and the production process of the drawing to be tested are obtained, the production process of the drawing to be tested and the production process in the device package library can be compared, so that whether the device package library has the same production process or not can be determined.
If the consistent production process does not exist, the production process error of the drawing to be tested can be determined, and prompt information can be output so that an engineer can check and correct the drawing.
Step 220, if there is a target production process consistent with the production process of the drawing to be tested in the device packaging library, comparing the packaging name of the device with the packaging name associated with the target production process;
if the target production process consistent with the production process of the drawing to be tested exists in the device packaging library, obtaining the packaging name corresponding to the target production process from the device packaging library.
It should be noted that, each production process in the device package library may correspond to one or more package names according to the device type.
And comparing the packaging names of the target production process with the packaging names of the devices of the drawing to be tested, thereby determining whether the packaging name and the production process of each device in the drawing to be tested are matched with a group of packaging names and production processes in a device packaging library.
And if the package name of the device is consistent with the package name associated with the target production process, determining that the package of the device is normal.
In step 230, if the package name of the device is inconsistent with the package name associated with the target production process, the device is determined to be the packaged device to be modified.
If the package name of the device is not consistent with the package name associated with the target production process, the package of the device is incorrect, but the modifiable package name exists in the device package library, so that the device is determined to be the packaged device to be modified.
The embodiment can quickly find out the wrong and modifiable device packages in the drawing to be tested, is convenient for modifying the packages in batches, further reduces the situation that the electronic drawing is wrong in package, and improves the design efficiency of the electronic drawing.
Fig. 3 is a schematic structural diagram of a drawing package detection device provided in an embodiment of the present application, as shown in fig. 3, where the drawing package detection device includes:
an obtaining module 310, configured to obtain a package name of a device in a drawing to be tested and a production process of the drawing to be tested;
a first comparing module 320, configured to compare the package name of the device with the package names in the device package library; the device package library is used for storing the package name of the device and the association relation between the package name and the production process;
a second comparison module 330, configured to compare, if a target package name consistent with the package name of the device exists in the device package library, a production process of the drawing to be tested with a production process associated with the target package name;
a determining module 340, configured to determine that the device is a packaged device to be modified if the production process of the drawing to be tested is inconsistent with the production process associated with the target package name, and the package name associated with the production process of the drawing to be tested exists in the device package library.
According to the drawing package detection device disclosed by the embodiment of the application, through the association relation between the package names and the production process in the device package library, whether the package names of devices in the drawing to be detected are contained in the device package library can be determined, if yes, whether the packages of the devices correspond to the production process is determined, and if not, the packages of the devices are determined to be the devices to be modified, so that the device packages which are wrong and can be modified in the drawing to be detected can be rapidly found, batch modification of the packages is facilitated, the situation that package errors exist in the designed electronic drawing is reduced, and the design efficiency of the electronic drawing is improved.
Based on any of the above embodiments, the first comparison module 320 is further configured to:
and if the package names in the device package library are different from the package names of the devices, determining that the devices are non-package library devices.
Based on any of the above embodiments, the second comparison module 330 is further configured to:
and if the production process of the drawing to be tested is consistent with the production process related to the target package name, determining that the device package is correct.
Based on any of the above embodiments, the second comparison module 330 is further configured to:
if the production process of the drawing to be tested is inconsistent with the production process related to the target package name and the package name related to the production process of the drawing to be tested does not exist in the device package library, determining that the device is an abnormal package device.
Based on any of the above embodiments, the determining module 340 is further configured to:
receiving a modification instruction based on at least one to-be-modified packaging device, and determining a target packaging name of the to-be-modified packaging device according to a production process of a drawing where the to-be-modified packaging device is located and a device type of the to-be-modified packaging device;
and modifying the current package name of the to-be-modified package device into the target package name.
Based on any of the above embodiments, the determining module 340 further includes a determining unit, where the determining unit is configured to:
inquiring the packaging names corresponding to the production process of the drawing of the packaging device to be modified and the device type of the packaging device to be modified based on the association relation among the production process, the device type and the packaging names, and determining the packaging names corresponding to the production process of the drawing of the packaging device to be modified and the device type of the packaging device to be modified as target packaging names.
Based on any one of the above embodiments, the drawing package detection device further includes:
the third comparison module is used for comparing the production process of the drawing to be tested with the production process in the device packaging library;
a fourth comparison module, configured to compare, if a target production process consistent with a production process of a drawing to be tested exists in the device package library, a package name of the device with a package name associated with the target production process;
and the determining module is further configured to determine that the device is a packaged device to be modified if the package name of the device is inconsistent with the package name associated with the target production process.
Fig. 4 illustrates a physical schematic diagram of an electronic device, as shown in fig. 4, which may include: processor 410, communication interface (Communications Interface) 420, memory 430 and communication bus 440, wherein processor 410, communication interface 420 and memory 430 communicate with each other via communication bus 440. The processor 410 may call logic instructions in the memory 430 to perform the following method: obtaining the package name of a device in a drawing to be tested and the production process of the drawing to be tested;
comparing the package name of the device with the package names in a device package library; the device package library is used for storing the package name of the device and the association relation between the package name and the production process;
if the target packaging name consistent with the packaging name of the device exists in the device packaging library, comparing the production process of the drawing to be tested with the production process associated with the target packaging name;
and if the production process of the drawing to be tested is inconsistent with the production process related to the target package name and the package name related to the production process of the drawing to be tested exists in the device package library, determining that the device is a packaged device to be modified.
Further, the logic instructions in the memory 430 described above may be implemented in the form of software functional units and may be stored in a computer-readable storage medium when sold or used as a stand-alone product. Based on such understanding, the technical solution of the present application may be embodied essentially or in a part contributing to the related art or in a part of the technical solution, in the form of a software product stored in a storage medium, including several instructions for causing a computer device (which may be a personal computer, a server, or a network device, etc.) to perform all or part of the steps of the methods described in the embodiments of the present application. And the aforementioned storage medium includes: a U-disk, a removable hard disk, a Read-Only Memory (ROM), a random access Memory (RAM, random Access Memory), a magnetic disk, or an optical disk, or other various media capable of storing program codes.
In yet another aspect, embodiments of the present application further provide a non-transitory computer readable storage medium having stored thereon a computer program that, when executed by a processor, is implemented to perform the method provided by the above embodiments, for example, comprising: obtaining the package name of a device in a drawing to be tested and the production process of the drawing to be tested;
comparing the package name of the device with the package names in a device package library; the device package library is used for storing the package name of the device and the association relation between the package name and the production process;
if the target packaging name consistent with the packaging name of the device exists in the device packaging library, comparing the production process of the drawing to be tested with the production process associated with the target packaging name;
and if the production process of the drawing to be tested is inconsistent with the production process related to the target package name and the package name related to the production process of the drawing to be tested exists in the device package library, determining that the device is a packaged device to be modified.
The apparatus embodiments described above are merely illustrative, wherein the elements illustrated as separate elements may or may not be physically separate, and the elements shown as elements may or may not be physical elements, may be located in one place, or may be distributed over a plurality of network elements. Some or all of the modules may be selected according to actual needs to achieve the purpose of the solution of this embodiment. Those of ordinary skill in the art will understand and implement the present invention without undue burden.
From the above description of the embodiments, it will be apparent to those skilled in the art that the embodiments may be implemented by means of software plus necessary general hardware platforms, or of course may be implemented by means of hardware. Based on such understanding, the foregoing technical solution may be embodied essentially or in a part contributing to the related art in the form of a software product, which may be stored in a computer readable storage medium, such as ROM/RAM, a magnetic disk, an optical disk, etc., including several instructions for causing a computer device (which may be a personal computer, a server, or a network device, etc.) to perform the method described in the respective embodiments or some parts of the embodiments.
Finally, it should be noted that the above embodiments are only for illustrating the present application, and are not limiting of the present application. While the present application has been described in detail with reference to the embodiments, those skilled in the art will understand that various combinations, modifications, or equivalents of the technical solutions of the present application may be made without departing from the spirit and scope of the technical solutions of the present application, and all such modifications are intended to be covered by the claims of the present application.
Claims (11)
1. The drawing packaging detection method is characterized by comprising the following steps of:
obtaining the package name of a device in a drawing to be tested and the production process of the drawing to be tested;
comparing the package name of the device with the package names in a device package library; the device package library is used for storing the package name of the device and the association relation between the package name and the production process;
if the target packaging name consistent with the packaging name of the device exists in the device packaging library, comparing the production process of the drawing to be tested with the production process associated with the target packaging name;
and if the production process of the drawing to be tested is inconsistent with the production process related to the target package name and the package name related to the production process of the drawing to be tested exists in the device package library, determining that the device is a packaged device to be modified.
2. The drawing package inspection method according to claim 1, further comprising, after comparing the package name of the device with package names in a device package library:
and if the package names in the device package library are different from the package names of the devices, determining that the devices are non-package library devices.
3. The drawing package inspection method according to claim 1, further comprising, after comparing the production process of the drawing to be inspected with the production process associated with the target package name:
and if the production process of the drawing to be tested is consistent with the production process related to the target package name, determining that the device package is correct.
4. The drawing package inspection method according to claim 1, further comprising, after comparing the production process of the drawing to be inspected with the production process associated with the target package name:
if the production process of the drawing to be tested is inconsistent with the production process related to the target package name and the package name related to the production process of the drawing to be tested does not exist in the device package library, determining that the device is an abnormal package device.
5. The drawing package inspection method according to claim 1, further comprising, after determining that the device is a packaged device to be modified:
receiving a modification instruction based on at least one to-be-modified packaging device, and determining a target packaging name of the to-be-modified packaging device according to a production process of a drawing where the to-be-modified packaging device is located and a device type of the to-be-modified packaging device;
and modifying the current package name of the to-be-modified package device into the target package name.
6. The drawing package inspection method according to claim 5, wherein the device package library is further used for storing association relations among a production process, a device type and a package name; the determining the target package name of the to-be-modified packaged device according to the production process of the drawing of the to-be-modified packaged device and the device type of the to-be-modified packaged device comprises the following steps:
inquiring the packaging names corresponding to the production process of the drawing of the packaging device to be modified and the device type of the packaging device to be modified based on the association relation among the production process, the device type and the packaging names, and determining the packaging names corresponding to the production process of the drawing of the packaging device to be modified and the device type of the packaging device to be modified as target packaging names.
7. The method of drawing packaging inspection as in claim 5, wherein the device types include at least one of a interposer device and a chip device.
8. The drawing packaging detection method according to any one of claims 1 to 7, further comprising, after obtaining a packaging name of a device in a drawing to be detected and a production process of the drawing to be detected:
comparing the production process of the drawing to be tested with the production process in a device packaging library;
if the target production process consistent with the production process of the drawing to be tested exists in the device packaging library, comparing the packaging name of the device with the packaging name associated with the target production process;
and if the package name of the device is inconsistent with the package name associated with the target production process, determining that the device is a packaged device to be modified.
9. A drawing package inspection device, comprising:
the device comprises an acquisition module, a display module and a display module, wherein the acquisition module is used for acquiring the package name of a device in a drawing to be tested and the production process of the drawing to be tested;
the first comparison module is used for comparing the package name of the device with the package names in the device package library; the device package library is used for storing the package name of the device and the association relation between the package name and the production process;
the second comparison module is used for comparing the production process of the drawing to be tested with the production process associated with the target package name if the target package name consistent with the package name of the device exists in the device package library;
the determining module is used for determining the device as a packaged device to be modified if the production process of the drawing to be tested is inconsistent with the production process related to the target package name and the package name related to the production process of the drawing to be tested exists in the device package library.
10. An electronic device comprising a memory, a processor and a computer program stored on the memory and executable on the processor, wherein the processor implements the drawing package detection method of any one of claims 1 to 8 when the program is executed by the processor.
11. A medium, which is a non-transitory computer readable storage medium, having stored thereon a computer program, which when executed by a processor implements the drawing package detection method according to any of claims 1 to 8.
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