JPH0290288U - - Google Patents
Info
- Publication number
- JPH0290288U JPH0290288U JP16834788U JP16834788U JPH0290288U JP H0290288 U JPH0290288 U JP H0290288U JP 16834788 U JP16834788 U JP 16834788U JP 16834788 U JP16834788 U JP 16834788U JP H0290288 U JPH0290288 U JP H0290288U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor devices
- container
- inclined surface
- storage container
- integrally molded
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 claims description 8
- 239000011347 resin Substances 0.000 claims 1
- 229920005989 resin Polymers 0.000 claims 1
Landscapes
- Packaging Of Annular Or Rod-Shaped Articles, Wearing Apparel, Cassettes, Or The Like (AREA)
- Packaging Frangible Articles (AREA)
Description
第１図は本考案の実施例に係る識別マークを有
する半導体素子用収容容器の斜視図、第２図は第
１図の部の拡大図、第３図は第２図の−に
おける断面図、第４図は本考案の実施例に係る容
器を多段ち積み重ねた状態を示す斜視図、第５図
は従来の半導体素子用収容容器を多段に積み重ね
た状態を示す斜視図である。
１０……半導体素子用収容容器、１１……半導
体素子の収容部、１２……側面、１３……傾斜部
、１４……識別マーク。
FIG. 1 is a perspective view of a semiconductor device storage container having an identification mark according to an embodiment of the present invention, FIG. 2 is an enlarged view of the part shown in FIG. 1, and FIG. 3 is a cross-sectional view at - in FIG. FIG. 4 is a perspective view showing a state in which containers according to an embodiment of the present invention are stacked in multiple stages, and FIG. 5 is a perspective view showing a state in which conventional storage containers for semiconductor devices are stacked in multiple stages. DESCRIPTION OF SYMBOLS 10...Semiconductor element storage container, 11...Semiconductor element storage part, 12...Side surface, 13...Slope part, 14...Identification mark.
Claims (1)
収容部１１を有しかつ半導体素子を収容した状態
で同じ容器を複数段に積み重ねることのできる、
樹脂で一体成形された半導体素子用収容容器１０
において、容器の側部１２に傾斜面１３を形成し
、該傾斜面上に隆起又は窪みからなる識別マーク
１４を一体成形してなる半導体素子用収容容器。 It has a accommodating part 11 that accommodates a plurality of semiconductor devices arranged in a regular manner, and the same container can be stacked in multiple stages while accommodating the semiconductor devices.
Semiconductor device storage container 10 integrally molded with resin
A storage container for semiconductor devices, in which an inclined surface 13 is formed on a side portion 12 of the container, and an identification mark 14 consisting of a protuberance or a depression is integrally molded on the inclined surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16834788U JPH0644871Y2 (en) | 1988-12-28 | 1988-12-28 | Container for semiconductor device having identification mark |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16834788U JPH0644871Y2 (en) | 1988-12-28 | 1988-12-28 | Container for semiconductor device having identification mark |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0290288U true JPH0290288U (en) | 1990-07-17 |
| JPH0644871Y2 JPH0644871Y2 (en) | 1994-11-16 |
Family
ID=31457447
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16834788U Expired - Fee Related JPH0644871Y2 (en) | 1988-12-28 | 1988-12-28 | Container for semiconductor device having identification mark |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0644871Y2 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008207856A (en) * | 2007-02-28 | 2008-09-11 | Renesas Technology Corp | Tray for semiconductor apparatus |
| WO2017002640A1 (en) * | 2015-07-02 | 2017-01-05 | 株式会社村田製作所 | Electronic component storage tray, multiple electronic component storage element, and method for handling electronic components |
| JP2019147587A (en) * | 2018-02-27 | 2019-09-05 | 三甲株式会社 | Lid body |
-
1988
- 1988-12-28 JP JP16834788U patent/JPH0644871Y2/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008207856A (en) * | 2007-02-28 | 2008-09-11 | Renesas Technology Corp | Tray for semiconductor apparatus |
| WO2017002640A1 (en) * | 2015-07-02 | 2017-01-05 | 株式会社村田製作所 | Electronic component storage tray, multiple electronic component storage element, and method for handling electronic components |
| JPWO2017002640A1 (en) * | 2015-07-02 | 2018-03-29 | 株式会社村田製作所 | Electronic component storage tray, multiple electronic component storage body, and electronic component handling method |
| JP2019147587A (en) * | 2018-02-27 | 2019-09-05 | 三甲株式会社 | Lid body |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0644871Y2 (en) | 1994-11-16 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |