JPH0644871Y2 - Container for semiconductor device having identification mark - Google Patents

Description

[Detailed Description of the Invention] [Industrial field of application] The present invention is a container for accommodating semiconductor elements such as integrated circuits (ICs) and large scale integrated circuits (LSIs), in particular, a plurality of semiconductor elements arranged regularly. The present invention relates to a semiconductor element accommodating container integrally molded with a resin, which has an accommodating portion for accommodating and can stack the same containers in a plurality of stages in a state of accommodating semiconductor elements. This kind of container can be conveniently used in the process of manufacturing a semiconductor device or in transporting a finished product.

[Conventional technology]

A container (tray) for accommodating semiconductor elements such as an integrated circuit (IC) and a large-scale integrated circuit (LSI) has an accommodating portion for regularly positioning and accommodating a plurality of semiconductor elements, and generally a semiconductor element. It is possible to stack the same containers in a plurality of stages while accommodating the same. Such a container has a very similar appearance, and is generally difficult to distinguish.

Therefore, conventionally, there is a container in which a character engraving for identification is previously put on the front surface or the back surface of the container, but in a state of being stacked in multiple stages, an identification mark is provided on the front surface or the back surface of the container 20 as shown in FIG. However, it was virtually impossible to see, and some sort of identification mark was required on the side of the container. On the other hand, since the container has a box shape, it is necessary to incorporate a special mechanism called a slide mechanism into the mold in order to engrave characters when this container is to be integrally molded with resin by a mold. there were. That is, at the time of resin molding, the slide mechanism is projected into the cavity of the mold, and the character is engraved by this slide mechanism. Is possible. However, a mold incorporating such a slide mechanism has a problem that the price is high, the productivity is deteriorated, and the container itself which is a molded product is expensive. Further, defective portions such as burrs are likely to occur in the character engraving portion, which is not preferable in terms of container production. Although a method of making a determination by attaching a vertical groove or the like to the side surface is also partially adopted, there is a problem that it is difficult to determine the type of product although it is possible to determine the mixing of other containers.

[Problems to be solved by the device]

Therefore, an object of the present invention is to provide a container for semiconductor elements which has an identification mark which can be manufactured at low cost by integral molding of resin, does not generate burrs and has good productivity.

[Means for Solving the Problems]

In order to solve such a problem, according to the present invention, it is possible to stack a plurality of semiconductor devices in a plurality of stages having a housing part for regularly arranging and housing the semiconductor devices and housing the semiconductor devices. A semiconductor element accommodating container integrally formed of a resin, wherein an inclined surface is formed on a side portion of the container, and an identification mark composed of a ridge or a depression is integrally formed on the inclined surface. Will be provided.

[Action]

According to the present invention, an inclined surface is formed on the side of the container, and only a ridge or a depression is formed on the inclined surface. The required ridges or depressions can be formed. Therefore,
A container having an identification mark can be manufactured inexpensively and with high productivity.

〔Example〕

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.

FIG. 1 is a perspective view of a container 10 according to an embodiment of the present invention,
The container 10 is integrally molded of resin, and has an accommodating portion 11 on the upper surface for accommodating and positioning a plurality of semiconductor elements (not shown) regularly and horizontally arranged in a plane. Moreover, the container 10 can be accommodated by stacking the semiconductor elements inside one on top of the other, with the uppermost container 10 acting as a lid.

On the side surface 12 of the container 10, an inclined surface 13 is formed which is inclined inward from the upper side (the direction in which the molded product after resin molding shown in the arrow A is taken out from the mold). The inclined surface 13 has an inclination of 5 ° to 30 ° inward with respect to the drawing direction (arrow A) so that the inclined surface 13 can be easily pulled out from a mold (not shown) after resin molding. On the inclined surface 13, an identification mark 14 made of a ridge is integrally formed as shown in FIGS. 2 and 3. Similarly, the identification mark 14 can be easily pulled out from the mold without being caught by the mold (not shown) after the resin molding, in the pulling direction (arrow A).
It is necessary to incline at least to the inside.
In order to attach the protrusion of the identification mark 14 as described above, it is only necessary to previously form a groove (not shown) corresponding to the protrusion in the mold by a usual technique, and a special mechanism such as a slide mechanism is used. There is no need to incorporate into the mold.

If a ridge (not shown) is formed in advance, an identification mark composed of a recess (not shown) can be formed on the container 10 side. Note that such an identification mark
Reference numeral 14 can display necessary information such as the type of semiconductor element housed in the container 10, manufacturing conditions, manufacturing location, and the like. Also,
Of course, it is also possible to identify the vertical direction when a large number of containers 10 are stacked.

[Effect of device]

As described above, in the container for semiconductor device having the identification mark of the present invention, a groove or a ridge corresponding to the identification mark is pre-engraved on the mold without incorporating a special slide mechanism in the mold. Since the required identification mark can be attached to the container, which is a molded product, simply by placing it, it is possible to obtain a container having the identification mark at low cost and with good productivity.

[Brief description of drawings]

FIG. 1 is a perspective view of a semiconductor device accommodating container having an identification mark according to an embodiment of the present invention, FIG. 2 is an enlarged view of part II of FIG. 1, and FIG. 3 is III-III of FIG. Sectional view, 4th
FIG. 5 is a perspective view showing a state in which containers according to an embodiment of the present invention are stacked in multiple stages, and FIG. 5 is a perspective view showing a state in which conventional container for semiconductor devices are stacked in multiple stages. 10 …… Semiconductor element container, 11 …… Semiconductor element container, 12 …… Side, 13 …… Inclined part, 14 …… Identification mark.

Claims (1)

[Scope of utility model registration request] 1. A resin integrally molded, having a housing (11) for regularly arranging and housing a plurality of semiconductor elements and capable of stacking the same container in a plurality of stages with the semiconductor elements housed therein. In the container for semiconductor device (10),
A container for a semiconductor element, which is formed by forming an inclined surface (13) on a side portion (12) of the container and integrally forming an identification mark (14) composed of a ridge or a depression on the inclined surface.