WO2016207704A1 - Ressort de fixation et contact de mise à la terre d'une carte de circuit imprimé - Google Patents

Ressort de fixation et contact de mise à la terre d'une carte de circuit imprimé Download PDF

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Publication number
WO2016207704A1
WO2016207704A1 PCT/IB2015/054876 IB2015054876W WO2016207704A1 WO 2016207704 A1 WO2016207704 A1 WO 2016207704A1 IB 2015054876 W IB2015054876 W IB 2015054876W WO 2016207704 A1 WO2016207704 A1 WO 2016207704A1
Authority
WO
WIPO (PCT)
Prior art keywords
metal sheet
die
spring
pcb
previous
Prior art date
Application number
PCT/IB2015/054876
Other languages
English (en)
Inventor
João Manuel BARROS DA CRUZ MOTA FARIA
Diogo GONÇALVES LEMOS
Joel Filipe VIEIRA DA SILVA
Nélson NATANAEL FERREIRA LIMA
José Luis DE CARVALHO MARTINS ALVES
Pedro Miguel SOUSA BERNARDO
Original Assignee
Bosch Car Multimedia Portugal, S.A.
Universidade Do Minho
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Bosch Car Multimedia Portugal, S.A., Universidade Do Minho filed Critical Bosch Car Multimedia Portugal, S.A.
Priority to CN201580081226.1A priority Critical patent/CN107996033A/zh
Publication of WO2016207704A1 publication Critical patent/WO2016207704A1/fr

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0215—Grounding of printed circuits by connection to external grounding means
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16F—SPRINGS; SHOCK-ABSORBERS; MEANS FOR DAMPING VIBRATION
    • F16F15/00—Suppression of vibrations in systems; Means or arrangements for avoiding or reducing out-of-balance forces, e.g. due to motion
    • F16F15/02—Suppression of vibrations of non-rotating, e.g. reciprocating systems; Suppression of vibrations of rotating systems by use of members not moving with the rotating systems
    • F16F15/04—Suppression of vibrations of non-rotating, e.g. reciprocating systems; Suppression of vibrations of rotating systems by use of members not moving with the rotating systems using elastic means
    • F16F15/06—Suppression of vibrations of non-rotating, e.g. reciprocating systems; Suppression of vibrations of rotating systems by use of members not moving with the rotating systems using elastic means with metal springs
    • F16F15/073—Suppression of vibrations of non-rotating, e.g. reciprocating systems; Suppression of vibrations of rotating systems by use of members not moving with the rotating systems using elastic means with metal springs using only leaf springs
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/71—Coupling devices for rigid printing circuits or like structures
    • H01R12/712—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit
    • H01R12/714—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit with contacts abutting directly the printed circuit; Button contacts therefore provided on the printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0302—Properties and characteristics in general
    • H05K2201/0311—Metallic part with specific elastic properties, e.g. bent piece of metal as electrical contact
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2045—Protection against vibrations

Definitions

  • the present disclosure relates to a spring for fixation and grounding contact of a printed circuit board (PCB) in a chassis (housing) for electronic components.
  • PCB printed circuit board
  • the present disclosure relates to a spring for fixation and grounding contact of a printed circuit board (PCB) in a chassis (housing) for electronic components without any additional components.
  • PCB printed circuit board
  • This spring is made by a progressive die on the same sheet metal where the chassis parts are made.
  • This geometry is capable of putting the circuit board under a compressive load to, not only fixate the PCB as well insure the grounding contact using the material spring-back elasticity.
  • the compressive load prevents it from vibrating and bending over the limits, managing to keep all the components intact during a normal use of the chassis, for example as the chassis of an electronic device like the radio of a vehicle.
  • This spring is embossed with a recess in particular in the format of a "castle" where the contact between the PCB and chassis occurs.
  • the geometry of the recess or embossment has in particular the overall shape of a conical revolution, which is used in automotive sheet metal parts with other purposes, such as for components spacing, as well in auto radios manufacturing to compensate tolerances.
  • the present disclosure is also focused in the geometry around the embossed part, or alternatively referred as built-in or recess.
  • This geometry around the built-in consists of material removal in the shape of rips, e.g. cut-outs or die-cuts, and it can be configurable depending on the variables to input on the PCB, such as axial force and PCB thickness (or set of tolerances) and the characteristic curve (force vs displacement) of the spring.
  • the die-cut arms are deformed such as to displace the central embossed part further in the direction of the embossment of said central embossed part.
  • the metal sheet spring is obtainable by die stamping of a single metal sheet.
  • the string contains four rips (9) containing one inside and outside strip each, however it can contain a large variety of rips always depending on the goal to achieve with the spring, for instance, a smaller number of rips will result in bigger amount of material to deform (areas 3 and 4 will increase) which in turn will result in a higher load imposed on the PCB.
  • the minimum number of rips to have a correct functioning of the spring is two, because it must be a symmetric geometry around the built-in to result in a constant load applied to the PCB.
  • the next step corresponds to the PCB/chassis placing.
  • Admitting the PCB is fixated using material from the top chassis, it can begin the chassis positioning.
  • the surface (21) will enter in contact with the PCB (50), after these two components touch each other, it should be input a displacement on the bottom chassis equal to the displacement input in the embossment deformation (which is said in the previous paragraph to be around 1mm), so the spring deformation does not breaches the embossment package.

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Aviation & Aerospace Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Casings For Electric Apparatus (AREA)
  • Springs (AREA)

Abstract

L'invention concerne un ressort en feuille métallique pour la fixation d'une carte de circuit imprimé comprenant une partie centrale estampée reliée par une pluralité de bras découpés à l'emporte-pièce à une partie périphérique entourant la partie centrale estampée ; la partie centrale estampée, les bras découpés à l'emporte-pièce et la partie périphérique étant faits de la même feuille métallique ; chacun des bras découpés à l'emporte-pièce comprenant trois sections, une première section radiale reliée à la partie centrale estampée et reliée à une deuxième section en forme d'arc qui est reliée à une troisième section radiale qui est reliée à la partie périphérique. Les bras découpés à l'emporte-pièce peuvent être déformés de manière à déplacer la partie centrale estampée plus loin dans la direction de l'estampage de ladite partie centrale estampée, en particulier de manière à obtenir un ressort ayant une force élastique contre le déplacement de la partie estampée. Le ressort en feuille métallique peut également être un contact électrique de la carte de circuit imprimé avec la feuille métallique.
PCT/IB2015/054876 2015-06-26 2015-06-29 Ressort de fixation et contact de mise à la terre d'une carte de circuit imprimé WO2016207704A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201580081226.1A CN107996033A (zh) 2015-06-26 2015-06-29 用于印刷电路板的固定和接地触头的弹簧

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
PT10858615 2015-06-26
PT108586 2015-06-26

Publications (1)

Publication Number Publication Date
WO2016207704A1 true WO2016207704A1 (fr) 2016-12-29

Family

ID=57584751

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/IB2015/054876 WO2016207704A1 (fr) 2015-06-26 2015-06-29 Ressort de fixation et contact de mise à la terre d'une carte de circuit imprimé

Country Status (2)

Country Link
CN (1) CN107996033A (fr)
WO (1) WO2016207704A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20200347907A1 (en) * 2019-05-02 2020-11-05 Braun Gmbh Motor with spring-mounted movable motor part and personal care device comprising such a motor

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111288118A (zh) * 2020-03-23 2020-06-16 广东博智林机器人有限公司 弹性件、墙面缓冲机构以及吊篮

Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4573265A (en) * 1984-03-19 1986-03-04 Checon Corporation Method of making electrical contacts
US4633973A (en) * 1984-10-25 1987-01-06 Mitsubishi Denki Kabushiki Kaisha Acoustic apparatus
US4841633A (en) * 1985-03-06 1989-06-27 Sharp Kabushiki Kaisha Method of mounting electronic parts onto single-sided printed wiring board
US6158594A (en) 1998-04-17 2000-12-12 Micron Electronics, Inc. Printed circuit board mounting bracket
US6402219B1 (en) * 1998-05-30 2002-06-11 Koninklijke Philips Electronics N.V. Electronic apparatus having a vibration-sensitive constructional unit
US7034223B2 (en) 2004-03-11 2006-04-25 Hon Hai Precision Industry Co., Ltd. Mounting apparatus for PCB
US20090219703A1 (en) 2008-02-29 2009-09-03 Kabushiki Kaisha Toshiba Printed circuit board, method for forming frame ground for printed circuit board, and electronic device
US20100001150A1 (en) * 2008-07-03 2010-01-07 Gemtek Technology Co., Ltd. Seat structure for supporting an assembly from underneath
US20100213649A1 (en) * 2009-02-23 2010-08-26 Compal Electronics, Inc. Shock Absorber and Assembling Method of Electronic Device Using the Same
US20110193426A1 (en) * 2010-02-08 2011-08-11 Samsung Electro-Mechanics Co., Ltd. Vertical vibrator
US20120276791A1 (en) * 2010-01-14 2012-11-01 Laird Technologies, Inc. Electrical contacts with laser defined geometries

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE202005012756U1 (de) * 2005-08-12 2005-10-27 Anton Hummel Verwaltungs-Gmbh Stecker mit Haltefeder für einen Erdungskontakt
DE102011080645A1 (de) * 2011-08-09 2013-02-14 Tyco Electronics Amp Gmbh Elektrische kontaktfeder, elektrische federkontakteinrichtung sowie elektrische kontaktzone

Patent Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4573265A (en) * 1984-03-19 1986-03-04 Checon Corporation Method of making electrical contacts
US4633973A (en) * 1984-10-25 1987-01-06 Mitsubishi Denki Kabushiki Kaisha Acoustic apparatus
US4841633A (en) * 1985-03-06 1989-06-27 Sharp Kabushiki Kaisha Method of mounting electronic parts onto single-sided printed wiring board
US6158594A (en) 1998-04-17 2000-12-12 Micron Electronics, Inc. Printed circuit board mounting bracket
US6402219B1 (en) * 1998-05-30 2002-06-11 Koninklijke Philips Electronics N.V. Electronic apparatus having a vibration-sensitive constructional unit
US7034223B2 (en) 2004-03-11 2006-04-25 Hon Hai Precision Industry Co., Ltd. Mounting apparatus for PCB
US20090219703A1 (en) 2008-02-29 2009-09-03 Kabushiki Kaisha Toshiba Printed circuit board, method for forming frame ground for printed circuit board, and electronic device
US20100001150A1 (en) * 2008-07-03 2010-01-07 Gemtek Technology Co., Ltd. Seat structure for supporting an assembly from underneath
US20100213649A1 (en) * 2009-02-23 2010-08-26 Compal Electronics, Inc. Shock Absorber and Assembling Method of Electronic Device Using the Same
US20120276791A1 (en) * 2010-01-14 2012-11-01 Laird Technologies, Inc. Electrical contacts with laser defined geometries
US20110193426A1 (en) * 2010-02-08 2011-08-11 Samsung Electro-Mechanics Co., Ltd. Vertical vibrator

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20200347907A1 (en) * 2019-05-02 2020-11-05 Braun Gmbh Motor with spring-mounted movable motor part and personal care device comprising such a motor
US11859687B2 (en) * 2019-05-02 2024-01-02 Braun Gmbh Motor with spring-mounted movable motor part and personal care device comprising such a motor

Also Published As

Publication number Publication date
CN107996033A (zh) 2018-05-04

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