US20090219703A1 - Printed circuit board, method for forming frame ground for printed circuit board, and electronic device - Google Patents
Printed circuit board, method for forming frame ground for printed circuit board, and electronic device Download PDFInfo
- Publication number
- US20090219703A1 US20090219703A1 US12/392,789 US39278909A US2009219703A1 US 20090219703 A1 US20090219703 A1 US 20090219703A1 US 39278909 A US39278909 A US 39278909A US 2009219703 A1 US2009219703 A1 US 2009219703A1
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- US
- United States
- Prior art keywords
- solder
- holes
- printed circuit
- circuit board
- board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/115—Via connections; Lands around holes or via connections
- H05K1/116—Lands, clearance holes or other lay-out details concerning the surrounding of a via
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0215—Grounding of printed circuits by connection to external grounding means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09372—Pads and lands
- H05K2201/09481—Via in pad; Pad over filled via
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/0979—Redundant conductors or connections, i.e. more than one current path between two points
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10409—Screws
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/04—Soldering or other types of metallurgic bonding
- H05K2203/043—Reflowing of solder coated conductors, not during connection of components, e.g. reflowing solder paste
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/325—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3485—Applying solder paste, slurry or powder
Abstract
Description
- This application is based upon and claims the benefit of priority from Japanese Patent Application No. 2008-050691, filed Feb. 29, 2008, the entire contents of which are incorporated herein by reference.
- 1. Field
- One embodiment of the invention relates to a printed circuit board having a frame ground portion.
- 2. Description of the Related Art
- In small electronic devices such as portable computers and personal digital assistants, which have electronic circuits incorporated in their housings, a frame ground (FG) for connecting the ground of the electronic circuit to a metal frame is an essential structural element. The ground of the electronic circuit determines reference for operating voltage, and functions as a return path for operating current. A weak frame ground may lead not only to instability of the reference voltage of the electronic circuit and unnecessary radiation but also to erroneous operation due to external noise or electrostatic discharge. In particular, the frame ground in which a copper foil pad is formed around a board-fixation hole requires frame ground technology in order to avoid ground connection failure caused by copper foil oxidation.
- Heat treatment in normal surface mount technology (SMT) does not cause oxidation to such a degree that the copper foil pad of the frame ground is discolored. However, in conditions of high temperature heat as in baking, the copper foil pad of the frame ground tends to oxidize, leading to conduction failure of the frame ground. As a technology for preventing such conduction failure, gold plating of a pad surface is known. However, gold plating is expensive and hence increases manufacturing costs.
- In Jpn. Pat. Appln. KOKAI Publication No. 2001-251029, another technology for preventing conduction failure caused by such oxidation is proposed. In this technology, a plurality of mounds of solder are applied to a copper foil land formed around the board-fixation hole of a frame ground and a screw is inserted in the hole so that the head of the screw is in contact with these mounds of solder, thereby maintaining a satisfactory ground connection in the frame ground.
- However, the conventional frame ground technology in which mounds of solder are applied to a copper foil pad thickens the frame ground and discourages further reduction in size, especially in devices that require a lightweight, thin, and small design.
- A general architecture that implements the various feature of the invention will now be described with reference to the drawings. The drawings and the associated descriptions are provided to illustrate embodiments of the invention and not to limit the scope of the invention.
-
FIG. 1 is an exemplary plan view of the configuration of a main part of a printed circuit board according to a first embodiment of the invention; -
FIG. 2 is an exemplary enlarged plan view of a part of the printed circuit board according to the first embodiment; -
FIG. 3 is an exemplary enlarged sectional side view of a part of the printed circuit board according to the first embodiment; -
FIGS. 4A and 4B show an exemplary manufacturing process of a main part of the printed circuit board according to the first embodiment; -
FIGS. 5A and 5B show an exemplary manufacturing process of the main part of the printed circuit board according to the first embodiment; -
FIGS. 6A and 6B show an exemplary manufacturing process of the main part of the printed circuit board according to the first embodiment; -
FIG. 7 is an exemplary plan view of a modified example of the main part of the printed circuit board according to the first embodiment; -
FIG. 8 is an exemplary side sectional view of another modified example of the main part of the printed circuit board according to the first embodiment; -
FIG. 9 is an exemplary plan view of another modified example of the main part of the printed circuit board according to the first embodiment; -
FIG. 10 is an exemplary plan view of another modified example of the main part of the printed circuit board according to the first embodiment; -
FIG. 11 is an exemplary plan view of the configuration of an electronic device according to a second embodiment of the invention; and -
FIG. 12 is an exemplary plan view of the configuration of a main part of a printed circuit board according to the second embodiment. - Various embodiments according to the invention will be described hereinafter with reference to the accompanying drawings. In general, according to one embodiment of the invention, there is provided a printed circuit board, comprising a frame ground portion in which conductor patterns are formed around a board-fixation hole, and a plurality of through-holes formed around the board-fixation hole in the frame ground portion.
- The embodiments will be described using as an example a multilayer printed circuit board in which components are mounted on one side only.
-
FIGS. 1 to 3 show the configuration of a main part of the printed circuit board according to a first embodiment of the invention.FIG. 1 is a plan view of the configuration of the printedcircuit board 10 according to the first embodiment of the invention.FIG. 2 is a plan view of the configuration of aframe ground portion 11, in an enlarged view of the part A of the printedcircuit board 10.FIG. 3 is a side sectional view of theframe ground portion 11. InFIG. 1 , the area surrounded by the broken line is a component mounting area, where surface components are mounted in a surface mount technology (SMT) process described below. - The printed
circuit board 10 according to the first embodiment of the invention shown inFIGS. 1 to 3 includes theframe ground portions 11 which conductively connects the ground of an electronic circuit constructed using the printedcircuit board 10 to ametal frame 5 disposed in a housing that supports the printedcircuit board 10 fixed in position. The first embodiment shown inFIG. 1 has a layout in which theframe ground portion 11 is disposed in each of the corners (four) of the rectangular printedcircuit board 10. - Each of the
frame ground portions 11 includes a board-fixation hole 12 for use in member fixation,conductor patterns fixation hole 12, and a plurality of through-holes 14 formed around the board-fixation hole 12. - The board-
fixation hole 12 is a large-diameter through-hole conductively connecting theconductor patterns fixation hole 12 is a through-hole for afastening screw 6, for example, which is a fixing member for fixing the printed circuit board (i.e., a printed circuit board with all components mounted) 10 to the metal frame disposed in the housing. Instead of the fastening screw, a metal lock pin, the head of which is elastically deformable, caulking pin, or the like is also applicable as a fixing member fitted into the board-fixation hole 12. - In the first embodiment, each of the
conductor patterns fixation hole 12 is formed of a copper foil pattern as a land specific to theframe ground portion 11, and the copper foil pattern is hereinafter referred to as a copper foil land. In the first embodiment, the copper foil lands 13 a and 13 b are circular patterns of the same diameter, which are formed on oneside 10 a and theother side 10 b, respectively, of the printedcircuit board 10. Thecopper foil land 13 a is formed on the oneface 10 a which is the component mounting face, and thecopper foil land 13 b is formed on theother face 10 b. The copper foil lands 13 a and 13 b on the oneside 10 a and theother side 10 b, respectively, of the printedcircuit board 10 are conductively connected integrally via the large-diameter through-hole serving as the board-fixation hole 12. The through-hole, or the board-fixation hole 12, is conductively connected to a ground pattern in an inner layer (not shown). Formed around thecopper foil lands side 10 a and theother side 10 b of the printedcircuit board 10, respectively, are solder resist films. The solder resist films SR are shown only inFIG. 3 , and omitted inFIGS. 1 and 2 . - In each of the
frame ground portions 11, a plurality of through-holes 14 that are smaller in diameter than the board-fixation hole 12 formed of the large-diameter through-hole are formed in thecopper foil lands fixation hole 12. - In an assembling process performed later, these through-
holes 14 serve as entry channels, through which part of a conductive-film forming member is introduced. The conductive-film forming member is used to form a conductive film, which prevents oxidation of thecopper foil land 13 a, onto thecopper foil land 13 a on the component mounting face side in contact with themetal frame 5. For the conductive-film forming member, cream solder, thermosetting conductive paste (e.g., silver paste), or the like, which can be supplied in a printing process in the SMT process, can be used. - In the first embodiment, cream solder is used as the conductive-film forming member. In a re-flow process described below, the through-
holes 14 act as entry channels, through which some of themolten solder 15 s is introduced. In the first embodiment, the solder supplied to thecopper foil land 13 a is represented byreference number 15 p, the solder melted in the re-flow process (also called molten solder) is represented byreference number 15 s, and solidified solder or solder film is represented byreference number 15. - As described above, forming a plurality of through-
holes 14 serving as entry channels formolten solder 15 s in the copper foil lands 13 a and 13 b of each of the frame ground portions yields the following advantages: the quantity ofsolder 15 covering thecopper foil land 13 a on the component mounting face side joined to themetal frame 5 in the assembling process performed later is regulated by the solder flowing in the through-holes 14 and is reduced to a small value (minimum amount), and extra solder (excess solder) flows into the through-holes 14 and is absorbed by the through-holes 14. - The flow of the excess solder into the through-
holes 14 minimizes the thickness T of the layer ofsolder 15 covering thecopper foil land 13 a, as shown inFIG. 3 . - Thus, while a solder film for preventing oxidation is formed on the
copper foil land 13 a, the volume of solder applied to theframe ground portion 11 can be reduced and the thickness of theframe ground portion 11 can be minimized. - The process of forming the
frame ground portions 11 described above will now be described with reference toFIGS. 4A , 4B, 5A, 5B, 6A and 6B. - In a component mounting process based on the SMT, surface components are mounted in the component mounting area surrounded by the broken line shown in
FIG. 1 . The cream solder printing in the component mounting process by the SMT includes supplyingcream solder 15 p over the through-holes 14 of thecopper foil land 13 a of each of theframe ground portions 11, as shown inFIGS. 4A and 4B . - The cream solder is supplied over the through-
holes 14 of thecopper foil land 13 a and over component mounting positions in the component mounting area. In the solder re-flow process after the surface components are mounted in the component mounting area, the cream solder supplied to the component mounting area melts and consequently the components (i.e., surface components) mounted in the component mounting area are secured in this area by the solder joint. In this re-flow process, thecream solder 15 p printed on the through-holes 14 of thecopper foil land 13 a melts. Thismolten solder 15 s covers the through-holes 14 and the peripheries of the through-holes 14 and also flows into the through-holes 14. - After the re-flow process, the solder solidifies and the surface components are secured in the component mounting area of the printed
circuit board 10 by the solder joint, while, as shown inFIGS. 6A and 6B , thesolder 15 supplied over the through-holes 14 covers thecopper foil land 13 a in the state where some of thesolder 15 is in the through-hole 13. Consequently, asolder film 15 is formed around each of the through-holes 14 on thecopper foil land 13 a. - Thus, by forming a plurality of through-
holes 14 serving as holes into which themolten solder 15 s flows in the copper lands 13 a and 13 b of theframe ground 11, the quantity ofsolder 15 covering thecopper foil land 13 a is regulated and reduced by the solder flowing in the through-holes. Accordingly, since the excess solder flows into the through-holes 14 and is absorbed by them, the thickness T of the layer ofsolder 15 covering thecopper foil land 13 a can be minimized. This results in forming a solder film to prevent oxidation while reducing the volume of the solder applied to theframe ground portion 11, and minimize the thickness of theframe ground portion 11. - The thickness T of the layer of
solder 15 covering thecopper foil land 13 a is determined by various factors, such as the number and the diameter of the through-holes 14, the characteristics and quantity of the solder to be supplied, re-flow heating temperature, and heating time. However, in the case of re-flow process in which the heating temperature, heating time, quantity of solder to be supplied, etc., are constant, the thickness T of thesolder film 15 can be adjusted in accordance with the number and the diameter of the through-holes 14 and the amount of solder to be supplied as parameters. - The foregoing first embodiment exemplifies a configuration where each of the
frame ground portions 11 includes eight through-holes 14 around the board-fixation hole 12. However, the position and the number of the through-holes 14 can be set as necessary. For example, four through-holes 14 may be formed around the board-fixation hole 12, as shown inFIG. 7 . - In addition, the first embodiment exemplifies the case where some of the solder flows into the through-
hole 14 on thecopper foil land 13 a side. However, for example,solder films 15 may be formed on both the copper foil lands 13 a and 13 b by adjusting the amount of solder to be supplied and the diameter of the through-holes 14, thereby filling the through-holes 14 as shown inFIG. 8 . - Further, the first embodiment exemplifies the case where the copper foil lands 13 a and 13 b of each of the
frame ground portions 11 are independent circular copper foil patterns. However, the copper foil lands 13 a and 13 b may be formed integrally with the ground pattern GP formed on thesurface layer 10 a (or 10 b), as shown inFIGS. 9 and 10 . - Referring to
FIGS. 11 and 12 , next will be described a second embodiment of the invention. In the second embodiment, an electronic device is constructed using the printed circuit board that has the frame ground structure of the first embodiment described above. As shown inFIG. 11 , the electronic device in the second embodiment includes a housing 1 having ametal frame 5, acover 2, and a printedcircuit board 7 fixed and supported on themetal frame 5 of the housing 1 with afastening screw 6. - The printed
circuit board 7 is constructed using the printedcircuit board 10 described in the first embodiment described above, and includes a plurality ofelectronic components 17 mounted in the component mounting area of thecomponent mounting face 10 a. As shown inFIG. 12 , which is an enlarged view of a part (part B) of the printedcircuit board 7, thiscircuit board 7 includes aframe ground portion 11 that conductively connects the ground of the printedcircuit board 7 to themetal frame 5 disposed in the housing 1. - The
frame ground portion 11 includes a board-fixation hole 12, copper foil lands 13 a and 13 b formed on both sides (i.e., both surface layers) around the board-fixation hole 12, and a plurality of through-holes 14 arranged around the board-fixation hole 12. - The board-
fixation hole 12 is a large-diameter through-hole that conductively connects the copper foil lands 13 a and 13 b, and serves as a through-hole for thefastening screw 6 used to fix the printedcircuit board 7 to themetal frame 5 of the housing 1. The board-fixation hole 12 is conductively connected to the ground pattern in an inner layer. - The through-
holes 14 are entry channels, into which some of themolten solder 15 supplied to thecopper foil land 13 a flows. Some of thesolder 15 enters the through-holes 14, and thus thesolder film 15 is formed in and on thecopper foil land 13 a around the through-holes 14. - Thus, by forming a plurality of through-
holes 14 serving as holes into which themolten solder 15 s flows are formed in each of theframe ground portions 11, the amount ofsolder 15 covering thecopper foil land 13 a on the component mounting face joined to themetal frame 5 is regulated and reduced by the solder flowing in the through-holes 14. This minimizes the thickness of the layer ofsolder 15 covering thecopper foil land 13 a. Thus, while a solder film that prevents oxidation is formed on thecopper foil land 13 a, the volume of the solder applied to theframe ground portion 11 is reduced and the thickness of theframe ground portion 11 can be minimized. This contributes to reduction in the thickness of the device while maintaining a satisfactory frame ground connection. - The first and second embodiments of the invention described above in detail can accordingly provide a printed circuit board in which the frame ground portions are thinner.
- While certain embodiments of the inventions have been described, these embodiments have been presented by way of example only, and are not intended to limit the scope of the inventions. Indeed, the novel methods and systems described herein may be embodied in a variety of other forms; furthermore, various omissions, substitutions and changes in the form of the methods and systems described herein may be made without departing from the spirit of the inventions. The accompanying claims and their equivalents are intended to cover such forms or modifications as would fall within the scope and spirit of the inventions.
Claims (9)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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JP2008-050691 | 2008-02-29 | ||
JP2008050691A JP2009212124A (en) | 2008-02-29 | 2008-02-29 | Printed-circuit board, method of forming frame ground of printed-circuit board, and electronic apparatus |
Publications (2)
Publication Number | Publication Date |
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US20090219703A1 true US20090219703A1 (en) | 2009-09-03 |
US8159833B2 US8159833B2 (en) | 2012-04-17 |
Family
ID=41013031
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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US12/392,789 Active 2030-08-17 US8159833B2 (en) | 2008-02-29 | 2009-02-25 | Printed circuit board, method for forming frame ground for printed circuit board, and electronic device |
Country Status (3)
Country | Link |
---|---|
US (1) | US8159833B2 (en) |
JP (1) | JP2009212124A (en) |
CN (1) | CN101521987A (en) |
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US20110075384A1 (en) * | 2009-09-29 | 2011-03-31 | Yeates Kyle H | Component mounting structures for electronic devices |
US20120155040A1 (en) * | 2010-12-21 | 2012-06-21 | Nobuhiro Yamamoto | Electronic device |
US20130170144A1 (en) * | 2011-12-30 | 2013-07-04 | Hon Hai Precision Industry Co., Ltd. | Electronic device with heat sink mechansim |
US8666026B1 (en) | 2010-12-07 | 2014-03-04 | Adtran, Inc. | Systems and methods for providing notifications of hazardous ground conditions in telecommunication equipment |
WO2016207704A1 (en) | 2015-06-26 | 2016-12-29 | Bosch Car Multimedia Portugal, S.A. | Spring for fixation and grounding contact of a printed circuit board |
US20170332484A1 (en) * | 2016-01-21 | 2017-11-16 | Boe Technology Group Co., Ltd. | Printed circuit board and electronic apparatus having the same |
US11116089B2 (en) * | 2019-03-06 | 2021-09-07 | Robert Bosch Gmbh | Component assembly including a connection between two components |
US20220248528A1 (en) * | 2021-02-02 | 2022-08-04 | Delta Electronics, Inc. | Electronic device and grounding assembly thereof |
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US8570765B2 (en) * | 2010-08-31 | 2013-10-29 | Asustek Computer Inc. | Circuit board with via hole and electronic device equipped with the same |
JP5585557B2 (en) * | 2011-09-07 | 2014-09-10 | 株式会社デンソー | Electronic device and manufacturing method thereof |
JP6008113B2 (en) * | 2012-10-29 | 2016-10-19 | Tdk株式会社 | Printed wiring board |
WO2015043909A1 (en) * | 2013-09-25 | 2015-04-02 | Continental Automotive Gmbh | Electric component and method for producing same |
EP3188322B1 (en) * | 2015-12-29 | 2018-01-31 | Axis AB | Ground terminal for an electronic device |
DE102016108868A1 (en) * | 2016-05-13 | 2017-11-16 | Kathrein Werke Kg | Adapter plate for HF structures |
TWI637681B (en) * | 2017-08-30 | 2018-10-01 | 和碩聯合科技股份有限公司 | Electronic device |
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US20110075384A1 (en) * | 2009-09-29 | 2011-03-31 | Yeates Kyle H | Component mounting structures for electronic devices |
US8766099B2 (en) * | 2009-09-29 | 2014-07-01 | Apple Inc. | Component mounting structures for electronic devices |
US8666026B1 (en) | 2010-12-07 | 2014-03-04 | Adtran, Inc. | Systems and methods for providing notifications of hazardous ground conditions in telecommunication equipment |
US20120155040A1 (en) * | 2010-12-21 | 2012-06-21 | Nobuhiro Yamamoto | Electronic device |
US8767410B2 (en) * | 2010-12-21 | 2014-07-01 | Kabushiki Kaisha Toshiba | Electronic device |
US20130170144A1 (en) * | 2011-12-30 | 2013-07-04 | Hon Hai Precision Industry Co., Ltd. | Electronic device with heat sink mechansim |
WO2016207704A1 (en) | 2015-06-26 | 2016-12-29 | Bosch Car Multimedia Portugal, S.A. | Spring for fixation and grounding contact of a printed circuit board |
US20170332484A1 (en) * | 2016-01-21 | 2017-11-16 | Boe Technology Group Co., Ltd. | Printed circuit board and electronic apparatus having the same |
US10863617B2 (en) * | 2016-01-21 | 2020-12-08 | Boe Technology Group Co., Ltd. | Printed circuit board and electronic apparatus having the same |
US11116089B2 (en) * | 2019-03-06 | 2021-09-07 | Robert Bosch Gmbh | Component assembly including a connection between two components |
US20220248528A1 (en) * | 2021-02-02 | 2022-08-04 | Delta Electronics, Inc. | Electronic device and grounding assembly thereof |
US11956888B2 (en) * | 2021-02-02 | 2024-04-09 | Delta Electronics, Inc. | Electronic device and grounding assembly thereof |
Also Published As
Publication number | Publication date |
---|---|
CN101521987A (en) | 2009-09-02 |
JP2009212124A (en) | 2009-09-17 |
US8159833B2 (en) | 2012-04-17 |
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