JPH08204360A - Conductive pattern mechanism of printed wiring board - Google Patents

Conductive pattern mechanism of printed wiring board

Info

Publication number
JPH08204360A
JPH08204360A JP7027438A JP2743895A JPH08204360A JP H08204360 A JPH08204360 A JP H08204360A JP 7027438 A JP7027438 A JP 7027438A JP 2743895 A JP2743895 A JP 2743895A JP H08204360 A JPH08204360 A JP H08204360A
Authority
JP
Japan
Prior art keywords
wiring board
printed wiring
solder
land
holes
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP7027438A
Other languages
Japanese (ja)
Inventor
Hiroaki Amano
裕章 天野
Tomotsuru Arai
知鶴 荒井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Advantest Corp
Original Assignee
Advantest Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advantest Corp filed Critical Advantest Corp
Priority to JP7027438A priority Critical patent/JPH08204360A/en
Publication of JPH08204360A publication Critical patent/JPH08204360A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/325—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3468—Applying molten solder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections

Landscapes

  • Multi-Conductor Connections (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Mounting Of Printed Circuit Boards And The Like (AREA)

Abstract

PURPOSE: To make an attachment hole not choked with any solder in the case of soldering by the use of a soldering bath and make no washer necessary, by boring a plurality of through holes in the positions of a land which are covered with the head section of a small screw attached to the land. CONSTITUTION: When on both the surfaces of a printed wiring board 10 lands 11 are provided and they are clamped together with a small screw, in the sections of the land 11 which are covered with the head section of the small screw, a plurality of through holes 15 are bored. Thereby, when parts on the printed wiring board 10 are soldered by the use of a soldering bath, since an attachment hole 16 is not a through hole, it is not choked with any solder even when not masked. Also, since the solder sticks on the land 11 of a soldering surface and the through holes 15 are choked with the solder, when the small screw is driven, no washer is required because of the crushed solder playing such a role as a washer.

Description

【発明の詳細な説明】Detailed Description of the Invention

【０００１】[0001]

【産業上の利用分野】本発明は、スルーホールを使用す
る２層以上のプリント配線板において、プリント配線板
に設けられたグランドパターンを製品本体のフレームに
ビスで固定して導通させる為の導電パターンの機構に関
する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a printed wiring board having two or more layers using through-holes. The ground pattern provided on the printed wiring board is fixed to the frame of the product body with a screw so as to be electrically conductive. Regarding the mechanism of the pattern.

【０００２】[0002]

【従来の技術】従来技術のスルーホールを使用するプリ
ント配線板の導電パターンについて、図８から図１４を
参照して説明する。スルーホールを使用するプリント配
線板には導体層数により２層の両面プリント配線板と３
層以上の多層プリント配線板がある。ここでスルーホー
ルとは、プリント板の穴の壁面に金属が付着して、内層
または外層導体パターンあるいはその両方の間に電気的
接続のある穴をいう。図８から図１２は、内層にグラン
ドパターンを有する３層の多層プリント配線板を示し、
図１３と図１４は表面にグランドパターンを有する２層
の両面プリント配線板を示している。説明を簡単にする
ため、内層にグランドパターンを有する３層の多層プリ
ント配線板による図を主体にして説明する。本導電パタ
ーンの構成は、図８に示すように、プリント配線板１０
と、表面にある２つのランド２４と内層のグランドパタ
ーン１４と導通しているスルーホール２５とで構成して
いる。図９は本導電パターンの斜視図を示している。図
１０に示すように、導電パターンを有するプリント配線
板１０はグランドパターン１４とフレーム２１を導通さ
せるために、フレーム２１に固定された取付け座面２０
にビス２３とワッシャ２２とでランド２４を締めつけて
組み立てる。プリント配線板１０のグランドパターン１
４は取付け穴を兼ねているスルーホール２５を介してラ
ンド２４と導通しているので、ビス２３とワッシャ２２
で取付け座面２０にランド２４を締めつけて組み立てる
とグランドパターン１４はフレーム２１と導通する。ワ
ッシャ２２はビス２３のゆるみ防止及びビス２３とラン
ド２４間の導電性を良くするために使用される。図１３
と図１４に示すように、プリント配線板１０が２層の両
面プリント配線板の場合は、表面にグランドパターン１
４を有し、そのグランドパターン１４がランド２４と接
続され、プリント配線板１０の両面にあるランド２４が
導電性を良くするためにスルーホール２５で導通してい
るので、多層プリント配線板と同様にビス２３とワッシ
ャ２２で取付け座面２０にランド２４を締めつけて組み
立てるとグランドパターン１４はフレーム２１と導通す
る。2. Description of the Related Art A conventional conductive pattern of a printed wiring board using through holes will be described with reference to FIGS. A printed wiring board that uses through holes has two layers of double-sided printed wiring board and three depending on the number of conductor layers.
There are multilayer printed wiring boards with more than one layer. Here, the through-hole means a hole in which metal is attached to the wall surface of the hole of the printed board and an electrical connection is provided between the inner layer and / or the outer layer conductor pattern. 8 to 12 show a three-layer multilayer printed wiring board having a ground pattern in the inner layer,
13 and 14 show a two-layer double-sided printed wiring board having a ground pattern on the surface. In order to simplify the description, a description will be given mainly with reference to a drawing of a three-layered multilayer printed wiring board having a ground pattern in the inner layer. As shown in FIG. 8, the structure of the conductive pattern is the printed wiring board 10
And two lands 24 on the surface and a through hole 25 that is electrically connected to the ground pattern 14 in the inner layer. FIG. 9 shows a perspective view of the conductive pattern. As shown in FIG. 10, a printed wiring board 10 having a conductive pattern has a mounting seat surface 20 fixed to the frame 21 in order to electrically connect the ground pattern 14 and the frame 21.
Assemble by tightening the land 24 with the screw 23 and the washer 22. Ground pattern 1 of printed wiring board 10
Since 4 is electrically connected to the land 24 through the through hole 25 which also serves as a mounting hole, the screw 23 and the washer 22 are provided.
When the land 24 is tightened on the mounting seat surface 20 to assemble, the ground pattern 14 is electrically connected to the frame 21. The washer 22 is used for preventing loosening of the screw 23 and improving conductivity between the screw 23 and the land 24. FIG.
As shown in FIG. 14 and FIG. 14, when the printed wiring board 10 is a two-layer double-sided printed wiring board, the ground pattern 1 is formed on the surface.
4, the ground pattern 14 is connected to the lands 24, and the lands 24 on both sides of the printed wiring board 10 are electrically connected by the through holes 25 to improve conductivity. When the land 24 is fastened to the mounting seat surface 20 with the screw 23 and the washer 22, the ground pattern 14 is electrically connected to the frame 21.

【０００３】[0003]

【発明が解決しようとする課題】上記説明のように、プ
リント配線板１０における導電パターンのランド２４は
スルーホール２５となっているので、図１１に示すよう
に、プリント配線板１０上の部品を半田槽を用いて半田
付けする際に、このまま半田槽を通すと取付け穴を兼ね
ているスルーホール２５は半田１２でふさがれてしま
う。そのために、図１１に示すように前もってランド２
４の半田槽で半田付けする側をマスク２６で塞ぐ必要が
ある。したがってプリント配線板１０をフレーム２１に
固定された取付け座面２０にビス２３で取り付けるため
の導電パターンのランド２４が多いとマスキングする為
の工数が増加してプリント配線板１０の組立のコストが
大きくなるという問題があった。そこで、本発明が解決
しようとする課題は、プリント配線板１０の導電パター
ンのランド２４をマスキングしなくても、半田槽による
半田付けの際に取付け穴が半田１２でふさがれない構造
にし、かつワッシャ２２が不要となる構造にして導電パ
ターンを有するプリント配線板１０の組立工数を削減す
ることを目的とする。As described above, the land 24 of the conductive pattern on the printed wiring board 10 is a through hole 25. Therefore, as shown in FIG. When the solder bath is used for soldering, if the solder bath is passed through as it is, the through holes 25 that also serve as mounting holes are blocked by the solder 12. Therefore, as shown in FIG. 11, the land 2 is previously prepared.
It is necessary to close the soldering side of the solder bath No. 4 with the mask 26. Therefore, if there are many conductive pattern lands 24 for attaching the printed wiring board 10 to the mounting seat surface 20 fixed to the frame 21 with the screws 23, the number of steps for masking increases and the cost for assembling the printed wiring board 10 increases. There was a problem of becoming. Therefore, the problem to be solved by the present invention is to provide a structure in which the mounting holes are not blocked by the solder 12 when soldering in a solder bath without masking the lands 24 of the conductive pattern of the printed wiring board 10. An object of the present invention is to reduce the number of assembly steps of the printed wiring board 10 having a conductive pattern by making the washer 22 unnecessary.

【０００４】[0004]

【課題を解決する為の手段】図１から図７に本発明によ
る解決手段を示している。上記課題を解決するために、
本発明の構成では、プリント配線板１０の両面にランド
１１を設けて、ビス２３でフレーム２１の取付け座面２
０にランド１１を締めつけてプリント配線板１０を組み
立てるときにビス２３の頭の下となる部分に複数のスル
ーホール１５を設け、プリント配線板１０の部品を半田
槽を用いて半田付けする際にランド１１とスルーホール
１５に半田１２が付着し、ビス２３で取付け座面２０に
プリント配線板１０のランド１１を締めつけて組み立て
るとき半田１２がワッシャの働きをする構成手段にす
る。1 to 7 show a solution according to the present invention. In order to solve the above problems,
In the configuration of the present invention, the lands 11 are provided on both sides of the printed wiring board 10, and the mounting seat surface 2 of the frame 21 is fixed by the screw 23.
When the land 11 is fastened to 0 to assemble the printed wiring board 10, a plurality of through holes 15 are provided below the head of the screw 23, and when the components of the printed wiring board 10 are soldered using the solder bath. The solder 12 adheres to the land 11 and the through hole 15 and the land 12 of the printed wiring board 10 is fastened to the mounting seating surface 20 with the screw 23 so that the solder 12 serves as a washer when assembled.

【０００５】[0005]

【作用】本発明によるプリント配線板１０の導電パター
ンはつぎのように使用する。すなわち、プリント配線板
１０上の部品を半田槽を用いて半田付けするときにラン
ド１１をマスクしないでおこなう。これはランド１１の
取付け穴１６はスルーホールとなっていないため半田で
ふさがれないが、ランド１１の半田面とスルーホール１
５とは半田１２が付着されるようにするためである。ラ
ンド１１をフレーム２１に固定された取付け座面２０に
ビス２３で締めつけると、ビス２３の頭の下にあるスル
ーホール１５の半田１２の盛り上がり部分及び半田面側
のランド１１の表面に付着した半田１２と取付け座面２
０とがワッシャの働きをしてビス２３のゆるみ防止と密
着性がよくなる効果を実現できる。The conductive pattern of the printed wiring board 10 according to the present invention is used as follows. That is, when the components on the printed wiring board 10 are soldered using the solder bath, the lands 11 are not masked. This is because the mounting hole 16 of the land 11 is not a through hole and is not blocked by solder, but the solder surface of the land 11 and the through hole 1
5 is for the solder 12 to be attached. When the land 11 is fastened to the mounting seat surface 20 fixed to the frame 21 with the screw 23, the solder adhered to the raised portion of the solder 12 in the through hole 15 below the head of the screw 23 and the surface of the land 11 on the solder surface side. 12 and mounting seat surface 2
0 acts as a washer to prevent the screw 23 from loosening and to improve the adhesiveness.

【０００６】[0006]

【実施例】【Example】

（実施例１）本発明の実施例１については、図１から図
４を参照して説明する。本発明の構成は、図１と図２に
示すようにプリント配線板１０とランド１１とグランド
パターン１４と複数のスルーホール１５で構成される。
プリント配線板１０を下方から半田槽により半田付けを
したあとの状態は、図３に示すようにランド１１の取付
け穴１６は半田１２でふさがれないが、半田面のランド
１１は半田１２が付着し、スルーホール１５は半田１２
でふさがれて半田１２が上部へ盛り上がった状態とな
る。 図４に示すように、プリント配線板１０は、フレ
ーム２１に固定された取付け座面２０にビス２３で取付
け穴１６を通してランド１１を締めつけることにより、
半田１２はつぶれてワッシャの役目をするので緩みが無
く確実に組み立てられる。(Embodiment 1) Embodiment 1 of the present invention will be described with reference to FIGS. As shown in FIGS. 1 and 2, the structure of the present invention comprises a printed wiring board 10, a land 11, a ground pattern 14, and a plurality of through holes 15.
After the printed wiring board 10 is soldered from below with a solder bath, the mounting holes 16 of the lands 11 are not blocked by the solder 12 as shown in FIG. 3, but the solder 12 is attached to the lands 11 on the solder surface. Through hole 15 is solder 12
The solder 12 is blocked by and the solder 12 is raised to the upper part. As shown in FIG. 4, in the printed wiring board 10, the land 11 is fastened to the mounting seat surface 20 fixed to the frame 21 with the screw 23 through the mounting hole 16.
Since the solder 12 is crushed and acts as a washer, it is securely assembled without looseness.

【０００７】（実施例２）本発明の実施例２を図５に基
づいて説明する。図５は実施例２を示す斜視図で、ラン
ド１１の内径側にレジスト１３を設けている。ビス２３
が通る取付け穴１６とランド間にレジスト１３を設ける
ことで、半田付けする際に、半田１２で取付け穴１６が
ふさがれないようにする効果をより高めることができ
る。(Second Embodiment) A second embodiment of the present invention will be described with reference to FIG. FIG. 5 is a perspective view showing the second embodiment, in which a resist 13 is provided on the inner diameter side of the land 11. Screw 23
By providing the resist 13 between the mounting hole 16 through which the holes pass and the land, it is possible to further enhance the effect of preventing the mounting hole 16 from being blocked by the solder 12 during soldering.

【０００８】（実施例３）実施例１と実施例２ではビス
２３の通るランド１１の取付け穴１６を円形としている
が、取付け穴１６は円形以外の種々の形状でも構成でき
る。図６に示すように、ランド１１の取付け穴１６が長
円の場合を示す。またランド１１の形状も円形以外の種
々の形状でも構成できる。図６にランド１１が四角の場
合の図を示す。(Embodiment 3) In Embodiment 1 and Embodiment 2, the mounting hole 16 of the land 11 through which the screw 23 passes is circular, but the mounting hole 16 can be formed in various shapes other than circular. As shown in FIG. 6, the case where the mounting hole 16 of the land 11 is an ellipse is shown. Further, the land 11 may be formed in various shapes other than a circle. FIG. 6 shows a case where the land 11 is square.

【０００９】（実施例４）実施例１と実施例２と実施例
３ではプリント配線板１０のグランドパターン１４が内
層にある３層の多層プリント配線板で示したが、４層以
上の多層プリント配線板でも同様に構成でき、また図７
に示すようにプリント配線板１０のグランドパターン１
４が表面にある２層の両面プリント配線板でも同様に構
成できる。(Embodiment 4) In Embodiment 1, Embodiment 2 and Embodiment 3, the multi-layer printed wiring board having three layers in which the ground pattern 14 of the printed wiring board 10 is the inner layer is shown. A wiring board can be constructed in the same way, and FIG.
As shown in, the ground pattern 1 of the printed wiring board 10
A double-sided double-sided printed wiring board having 4 on its surface can be similarly configured.

【００１０】[0010]

【発明の効果】本発明は、以上説明したように構成され
ているので、下記に記載されるような効果を奏する。ラ
ンド１１のビス２３が通る取付け穴１６はスルーホール
になっていないので、マスクをしないでも、半田槽を用
いて半田付けする場合に取付け穴１６が半田でふさがれ
ることが無い。また半田槽を用いて半田付けする場合
に、半田面のランド１１は半田１２が付着し、スルーホ
ール１５は半田１２でふさがれて半田１２が上部へ盛り
上がった状態となる為にネジ２３を締めつけたときに半
田１２がつぶれてワッシャの働きをするのでワッシャ２
２が不要となる。したがって、プリント配線板１０をフ
レーム２１に取り付けて組み立てる場合にマスキングす
る工数とワッシャを挿入する工数が不要となるので組立
の工数削減ができる。Since the present invention is configured as described above, it has the following effects. Since the mounting hole 16 through which the screw 23 of the land 11 passes is not a through hole, the mounting hole 16 is not blocked with solder when soldering is performed using a solder bath without using a mask. Also, when soldering is performed using a solder bath, the solder 12 is attached to the land 11 on the solder surface, the through hole 15 is blocked by the solder 12, and the solder 12 is raised to the upper part, so the screw 23 is tightened. When the solder 12 is crushed, it acts as a washer.
2 is unnecessary. Therefore, when the printed wiring board 10 is mounted on the frame 21 and assembled, the man-hours for masking and the man-hours for inserting the washers are unnecessary, and the man-hours for assembly can be reduced.

【図面の簡単な説明】[Brief description of drawings]

【図１】本発明の実施例１の斜視図である。FIG. 1 is a perspective view of a first embodiment of the present invention.

【図２】本発明の実施例１の部分斜視図である。FIG. 2 is a partial perspective view of the first embodiment of the present invention.

【図３】本発明の実施例１を半田付けしたあとの断面図
である。FIG. 3 is a cross-sectional view after soldering the first embodiment of the present invention.

【図４】本発明の実施例１を組立した断面図である。FIG. 4 is a cross-sectional view of the assembled first embodiment of the present invention.

【図５】本発明の実施例２の斜視図である。FIG. 5 is a perspective view of a second embodiment of the present invention.

【図６】本発明の実施例３の斜視図である。FIG. 6 is a perspective view of a third embodiment of the present invention.

【図７】本発明の実施例４の斜視図である。FIG. 7 is a perspective view of a fourth embodiment of the present invention.

【図８】従来技術の導電パターンの断面図である。FIG. 8 is a cross-sectional view of a conventional conductive pattern.

【図９】従来技術の導電パターンの斜視図である。FIG. 9 is a perspective view of a conventional conductive pattern.

【図１０】従来技術のプリント配線板をフレームに取り
付ける関係を示す爆発図である。FIG. 10 is an explosive view showing a relationship in which a conventional printed wiring board is attached to a frame.

【図１１】従来技術のランドをマスクした斜視図であ
る。FIG. 11 is a perspective view in which a conventional land is masked.

【図１２】従来技術のランドをマスクしないで半田付け
した断面図である。FIG. 12 is a cross-sectional view in which a conventional land is soldered without masking.

【図１３】従来技術の導電パターンの斜視図である。FIG. 13 is a perspective view of a conventional conductive pattern.

【図１４】従来技術の導電パターンの断面図である。FIG. 14 is a cross-sectional view of a conventional conductive pattern.

【符号の説明】[Explanation of symbols]

１０ プリント配線板 １１、２４ ランド １２ 半田 １３ レジスト １４ グランドパターン １５、２５ スルーホール １６ 取付け穴 ２０ 取付け座面 ２１ フレーム ２２ ワッシャ ２３ ビス ２６ マスク 10 Printed Wiring Board 11, 24 Land 12 Solder 13 Resist 14 Ground Pattern 15, 25 Through Hole 16 Mounting Hole 20 Mounting Seat Surface 21 Frame 22 Washer 23 Screw 26 Mask

Claims (2)

【特許請求の範囲】[Claims] 【請求項１】 グランドパターン（１４）を有するプリ
ント配線板（１０）において、 フレーム（２１）の取付け座面（２０）にビス（２３）
で固定する為の取付け穴１６を有するランド（１１）を
プリント配線板（１０）の両面に設け、 当該ランド（１１）に複数のスルーホール（１５）を取
り付けるビス（２３）の頭部の下となる位置に設けたこ
とを特徴としたプリント配線板（１０）の導電パターン
機構。1. In a printed wiring board (10) having a ground pattern (14), a screw (23) is attached to a mounting seat surface (20) of a frame (21).
Under the head of the screw (23), which is provided with lands (11) having mounting holes 16 for fixing with, on both sides of the printed wiring board (10) and a plurality of through holes (15) are attached to the lands (11). A conductive pattern mechanism for a printed wiring board (10), which is provided at a position where 【請求項２】 ランド（１１）の内径側にレジスト（１
３）を設けたことを特徴とした請求項１記載のプリント
配線板（１０）の導電パターン機構。2. A resist (1) is provided on the inner diameter side of the land (11).
The conductive pattern mechanism for a printed wiring board (10) according to claim 1, characterized in that 3) is provided.
JP7027438A 1995-01-24 1995-01-24 Conductive pattern mechanism of printed wiring board Pending JPH08204360A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7027438A JPH08204360A (en) 1995-01-24 1995-01-24 Conductive pattern mechanism of printed wiring board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7027438A JPH08204360A (en) 1995-01-24 1995-01-24 Conductive pattern mechanism of printed wiring board

Publications (1)

Publication Number Publication Date
JPH08204360A true JPH08204360A (en) 1996-08-09

Family

ID=12221124

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7027438A Pending JPH08204360A (en) 1995-01-24 1995-01-24 Conductive pattern mechanism of printed wiring board

Country Status (1)

Country Link
JP (1) JPH08204360A (en)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000124644A (en) * 1998-10-12 2000-04-28 Pfu Ltd Card-type circuit module device and mounting board used therein
NL1015101C2 (en) * 2000-05-03 2001-11-06 Ericsson Telefon Ab L M Printed circuit board has blind holes for conducting passages between middle and upper conducting layers to prevent solder protrusions from interfering with head of screw fastener
JP2005142405A (en) * 2003-11-07 2005-06-02 Orion Denki Kk Electronic equipment equipped with printed board to improve luminance of led
JP2009212124A (en) * 2008-02-29 2009-09-17 Toshiba Corp Printed-circuit board, method of forming frame ground of printed-circuit board, and electronic apparatus
CN103369812A (en) * 2012-04-02 2013-10-23 鸿富锦精密工业（深圳）有限公司 Printed circuit board
JP2014090018A (en) * 2012-10-29 2014-05-15 Tdk Corp Print circuit board
WO2016170826A1 (en) * 2015-04-20 2016-10-27 三菱重工オートモーティブサーマルシステムズ株式会社 Power conversion circuit board and electric compressor

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000124644A (en) * 1998-10-12 2000-04-28 Pfu Ltd Card-type circuit module device and mounting board used therein
NL1015101C2 (en) * 2000-05-03 2001-11-06 Ericsson Telefon Ab L M Printed circuit board has blind holes for conducting passages between middle and upper conducting layers to prevent solder protrusions from interfering with head of screw fastener
JP2005142405A (en) * 2003-11-07 2005-06-02 Orion Denki Kk Electronic equipment equipped with printed board to improve luminance of led
JP2009212124A (en) * 2008-02-29 2009-09-17 Toshiba Corp Printed-circuit board, method of forming frame ground of printed-circuit board, and electronic apparatus
US8159833B2 (en) 2008-02-29 2012-04-17 Kabushiki Kaisha Toshiba Printed circuit board, method for forming frame ground for printed circuit board, and electronic device
CN103369812A (en) * 2012-04-02 2013-10-23 鸿富锦精密工业（深圳）有限公司 Printed circuit board
JP2014090018A (en) * 2012-10-29 2014-05-15 Tdk Corp Print circuit board
WO2016170826A1 (en) * 2015-04-20 2016-10-27 三菱重工オートモーティブサーマルシステムズ株式会社 Power conversion circuit board and electric compressor
JP2016208626A (en) * 2015-04-20 2016-12-08 三菱重工オートモーティブサーマルシステムズ株式会社 Circuit board for power conversion, and electric compressor
US11418111B2 (en) 2015-04-20 2022-08-16 Mitsubishi Heavy Industries Thermal Systems, Ltd. Power conversion circuit board and electric compressor

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