WO2016206141A1 - 一种加热源及有机发光二极管的蒸镀机 - Google Patents

一种加热源及有机发光二极管的蒸镀机 Download PDF

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Publication number
WO2016206141A1
WO2016206141A1 PCT/CN2015/083869 CN2015083869W WO2016206141A1 WO 2016206141 A1 WO2016206141 A1 WO 2016206141A1 CN 2015083869 W CN2015083869 W CN 2015083869W WO 2016206141 A1 WO2016206141 A1 WO 2016206141A1
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Prior art keywords
heating
insulating
heating coil
coil
adjacent
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English (en)
French (fr)
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匡友元
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TCL China Star Optoelectronics Technology Co Ltd
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Shenzhen China Star Optoelectronics Technology Co Ltd
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Priority to US14/891,377 priority Critical patent/US10014493B2/en
Publication of WO2016206141A1 publication Critical patent/WO2016206141A1/zh
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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C23C14/26—Vacuum evaporation by resistance or inductive heating of the source
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/04—Coating on selected surface areas, e.g. using masks
    • C23C14/042—Coating on selected surface areas, e.g. using masks using masks
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C23C14/243—Crucibles for source material
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
    • H10K71/164—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using vacuum deposition
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
    • H10K71/166—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using selective deposition, e.g. using a mask
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/40—Thermal treatment, e.g. annealing in the presence of a solvent vapour

Definitions

  • the present invention relates to the field of electronics, and in particular to a vaporizer for heating sources and organic light emitting diodes.
  • OLED Organic Light-Emitting Diode
  • OLED Organic Light-Emitting Diode
  • the preparation technology and method of the mainstream OLED is an evaporation method, that is, heating an organic small molecule material in a vacuum chamber to sublimate or melt vaporize it into a material vapor, and deposit it on the glass substrate through an opening of the metal mask.
  • the enthalpy used is also getting larger and larger, the heating source heating coil is getting larger and larger, and the coil arrangement is getting denser and denser. Because the thermal expansion and contraction of the heating coil itself, and the crucible of the loaded material undergo thermal expansion and contraction, the deformation of the crucible is partially deformed, so that adjacent coil heating wires are deformed by these external forces, causing mutual contact and bonding, causing short circuit of the entire heat source. The abnormality of the vapor deposition machine is caused, which seriously affects the stability of the vapor deposition machine.
  • the technical problem to be solved by the present invention is to provide a heat source and an organic light emitting diode vapor deposition machine to reduce the probability of short circuit of the heating coil and improve the stability of the heating coil, thereby providing stability of the vapor deposition machine.
  • the invention provides a heating source for use in an evaporation machine of an organic light emitting diode to heat a heating container in the vapor deposition machine, wherein the heating source comprises a heating coil and a guard, the protection An insulating material, the two ends of the heating coil are connected to a power source to receive a voltage to generate heat, and the guard is disposed on the heating coil for limiting a deformation range of the heating coil, thereby Restricting the contact of two adjacent heater wires in the heating coil.
  • the guard comprises an insulating bridge, and at least one insulated bridge is disposed between two adjacent heating wires of the heating coil to limit contact between two adjacent heating wires in the heating coil.
  • the insulating bridge is an insulated rigid joint.
  • the material of the insulating bridge is C/Csi composite material.
  • the angle between the insulating bridge and the adjacent two heating wires is 90 degrees.
  • the guard further comprises an insulating lining disposed between the inner wall of the heating coil and the heating container, and the insulating lining is connected to each heating wire in the heating coil To limit the deformation range of the heating coil, thereby limiting the contact of two adjacent heating wires in the heating coil.
  • the insulating lining is an insulating rigid rib.
  • the heating source comprises a plurality of insulating linings uniformly arranged in an annular space between the inner wall of the heating coil and the heating container.
  • the material of the insulating lining is a C/Csi composite material.
  • the invention also provides an evaporation device for an organic light emitting diode, comprising a heating container and the above-mentioned heating source, the heating source being disposed outside the heating container to heat the heating container.
  • a heating source is applied to an evaporation device of an organic light emitting diode to heat a heating container in the vapor deposition machine, wherein the heating source includes a heating coil and a guard, and the protection member is An insulating material, the two ends of the heating coil are connected to a power source to receive a voltage to generate heat, and the guard is disposed on the heating coil for limiting a deformation range of the heating coil, thereby limiting the heating coil
  • Adjacent two heating wires are in contact to avoid short-circuiting of two adjacent heating wires. Therefore, the present invention reduces the probability of a short circuit of the heating coil and improves the stability of the heating coil, thereby providing stability of the vapor deposition machine to which the heating coil is applied.
  • FIG. 1 is a schematic plan view of a heating source according to a first embodiment of the first aspect of the present invention
  • FIG. 2 is a schematic plan view of a heating source according to a second embodiment of the first aspect of the present invention.
  • FIG. 3 is a block diagram of an evaporation machine for an organic light emitting diode according to a preferred embodiment of the second aspect of the present invention.
  • a first embodiment of the first aspect of the present invention provides a heating source 100.
  • the heat source 100 is applied to an evaporation machine (not shown) of an organic light emitting diode to heat a heating vessel in the vapor deposition machine.
  • the heating source 100 includes a heating coil 10 and a guard 20 .
  • the guard 20 is made of an insulating material. Both ends of the heating coil 10 are connected to a power source (not shown) to receive a voltage to generate heat.
  • the guard 20 is disposed on the heating coil 10 for limiting the deformation range of the heating coil 10, thereby restricting the contact of two adjacent heating wires 11 in the heating coil 10.
  • the heating coil 10 generates heat after receiving the voltage of the power source to heat the heating container.
  • the thermal expansion and contraction of the heating coil 10 causes the heating vessel to undergo thermal expansion and contraction, which may cause deformation.
  • the deformation of the heating vessel transmits a deformation force to the heating coil 10, which causes the heating coil 10 to deform.
  • the heat source 100 includes a guard 20 .
  • the guard 20 limits the deformation range of the heating coil 10, thereby restricting the contact of two adjacent heating wires 11 in the heating coil 10, thereby avoiding the phenomenon that the adjacent two heating wires 11 are short-circuited. Therefore, the present invention reduces the probability of shorting of the heating coil 10, improves the stability of the heating coil 10, and thereby provides stability of the vapor deposition machine to which the heating coil is applied.
  • the heating container is a pot.
  • the guard 20 includes an insulating bridge. At least one insulating bridge is disposed between two adjacent heating wires 11 in the heating coil 10 to restrict contact between two adjacent heating wires 11 in the heating coil 10.
  • the insulating bridge is an insulating rigid joint.
  • the two ends of the rigid ribs are respectively connected to the two connected heating wires 11.
  • the insulating bridge is made of a C/Csi composite material.
  • the angle between the insulating bridge and the adjacent two heating wires 11 is 90 degrees.
  • the insulating bridge supports the heating wires 11 on both sides thereof to be the best, that is, to prevent The heating wires 11 on both sides have the best short-circuit effect.
  • the material of the insulating bridge can be adjusted according to actual needs.
  • the angle between the insulating bridge and the adjacent two heating wires 11 can be adjusted according to actual needs.
  • a second embodiment of the first aspect of the present invention provides a heating source 200.
  • the heating source 200 provided by the second embodiment is similar to the heating source 100 provided by the first embodiment, and the difference is that in the second embodiment, the guard 220 further includes an insulating liner 222.
  • the insulating liner 222 is disposed between the inner wall of the heating coil 10 and the heating container, and the insulating liner 220 is connected to each of the heating coils 10 to limit the heating coil 10 The range of deformation, thereby limiting the contact of two adjacent heating wires 11 in the heating coil 10.
  • the heating coil 10 generates heat after receiving the voltage of the power source to heat the heating container.
  • the thermal expansion and contraction of the heating coil 10 causes the heating vessel to undergo thermal expansion and contraction, which may cause deformation.
  • the deformation of the heating container transmits a deformation force to the heating coil 10. This causes the heating coil 10 to be deformed.
  • the guard 220 further includes the insulating liner 222.
  • the insulating liner 222 is disposed between the inner wall of the heating coil 10 and the heating container, and the insulating liner 220 is connected to each of the heating coils 10 to disperse the deformation force.
  • the deformation range of the heating coil 10 can be limited, thereby restricting the contact of two adjacent heating wires 11 in the heating coil 10 to avoid the occurrence of a short circuit between two adjacent heating wires 11. Therefore, the present invention reduces the probability of shorting of the heating coil 10, improves the stability of the heating coil 10, and thereby provides stability of the vapor deposition machine to which the heating coil is applied.
  • the insulating liner 222 is an insulating rigid joint.
  • the heating source 200 can include a plurality of insulating liners 222.
  • the plurality of insulating linings 222 are evenly arranged in an annular space between the inner wall of the heating coil 10 and the heating container. Therefore, the plurality of insulating linings thus arranged have a better effect of dispersing the deformation force, and the two adjacent heating wires 11 in the heating coil 10 are better limited to contact, thereby better avoiding the occurrence of adjacent two. A phenomenon in which the heating wire 11 is short-circuited.
  • the insulating lining 222 is made of a C/Csi composite material. In other embodiments, the material of the insulating liner 222 can also be adjusted according to actual needs.
  • the heat generating source 222 may include only the insulating bridge 22 or only the insulating liner 222.
  • a second embodiment of the present invention provides a vapor deposition machine 300 for an organic light emitting diode.
  • the vapor deposition machine 300 of the organic light emitting diode includes a heating container 310 and a heating source.
  • the heating source is disposed outside the heating vessel 310 to heat the heating vessel 310.
  • the heating source may be the heating source 200 provided by the second preferred embodiment of the first aspect. The specific structure and function of the heating source have been described in detail in the second preferred embodiment of the first embodiment, and are not described herein again.
  • the heating source may also be another heating source, such as the heating source 100 provided by the first preferred embodiment of the first aspect.
  • the heating coil 10 generates heat to receive the voltage of the power source to heat the heating container.
  • the thermal expansion and contraction of the heating coil 10 causes the heating vessel to undergo thermal expansion and contraction, which may cause deformation.
  • the deformation of the heating vessel transmits a deformation force to the heating coil 10, which causes the heating coil 10 to deform.
  • the heat source 100 includes a guard 20 .
  • the guard 20 limits the deformation range of the heating coil 10, thereby restricting the contact of two adjacent heating wires 11 in the heating coil 10 to avoid the phenomenon that the adjacent two heating wires 11 are short-circuited.
  • the guard 220 also includes the insulating liner 222.
  • the insulating liner 222 is disposed between the inner wall of the heating coil 10 and the heating container, and the insulating liner 220 is connected to each of the heating coils 10 to disperse the deformation force.
  • the deformation range of the heating coil 10 can be limited, thereby restricting the contact of two adjacent heating wires 11 in the heating coil 10 to avoid the occurrence of a short circuit between two adjacent heating wires 11. Therefore, the present invention reduces the probability of the heating coil 10 being short-circuited and improves the stability of the heating coil 10, thereby providing stability of the vapor deposition machine 300 to which the heating coil is applied.

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Electroluminescent Light Sources (AREA)
  • Resistance Heating (AREA)

Abstract

一种加热源（100，200），应用于有机发光二极管的蒸镀机（300）内，以对蒸镀机（300）内的加热容器（310）进行加热，其中，加热源（100，200）包括加热线圈（10）及防护件（20，220），防护件（20，220）为绝缘材质，加热线圈（10）的两端连接至电源，以接受电压来产生热量，防护件（20，220）设置于加热线圈（10）上，用于限制加热线圈（10）的形变范围，从而限制加热线圈（10）中的相邻两个加热丝（11）接触，避免出现相邻两个加热丝（11）短路的现象。

Description

一种加热源及有机发光二极管的蒸镀机
本发明要求2015年6月24日递交的发明名称为“一种加热源及有机发光二极管的蒸镀机”的申请号201510355332.6的在先申请优先权，上述在先申请的内容以引入的方式并入本文本中。
技术领域
本发明涉及电子领域，尤其涉及一种加热源及有机发光二极管的蒸镀机。
背景技术
OLED(Organic Light-Emitting Diode，有机发光二极管)作为新一代的固态自发光显示技术，相较于液晶显示具有超薄、响应度高、对比度高、功耗低等优势，近几年产业化速度突飞猛进。目前OLED主流的制备技术和方法是蒸镀法，即在真空腔体内加热有机小分子材料，使其升华或者熔融气化成材料蒸汽，透过金属光罩的开孔沉积在玻璃基板上。随着越来越高世代的蒸镀机出现，所使用的坩埚也越来越大，加热源加热线圈也越来越大，线圈排布也越来越密集。因为加热线圈本身的热胀冷缩，和装载材料的坩埚经历热胀冷缩导致坩埚部分变形，使得相邻的线圈加热丝因这些外力而变形，导致相互触碰粘结，引起整个发热源短路，造成蒸镀机异常宕机，严重影响蒸镀机的稳定性。
发明内容
本发明所要解决的技术问题在于提供一种加热源及有机发光二极管的蒸镀机，以降低加热线圈短路的几率，提高加热线圈的稳定性，从而提供蒸镀机的稳定性。
为了实现上述目的，本发明实施方式提供如下技术方案：
本发明供了一种加热源，应用于有机发光二极管的蒸镀机内，以对所述蒸镀机内的加热容器进行加热，其中，所述加热源包括加热线圈及防护件，所述防护件为绝缘材质，所述加热线圈的两端连接至电源，以接受电压来产生热量，所述防护件设置于所述加热线圈上，用于限制所述加热线圈的形变范围，从而 限制所述加热线圈中的相邻两个加热丝接触。
其中，所述防护件包括绝缘架桥，所述加热线圈中的相邻两个加热丝之间设置有至少一个绝缘桥架，以限制所述加热线圈中的相邻两个加热丝接触。
其中，所述绝缘桥架为绝缘刚性连筋。
其中，所述绝缘桥架的材质为C/Csi复合材料。
其中，所述绝缘桥架与相邻的两个加热丝之间的夹角为90度。
其中，所述防护件还包括绝缘内衬，所述绝缘内衬设置于所述加热线圈内壁与所述加热容器之间，且所述绝缘内衬连接至所述加热线圈中的每根加热丝，以限制所述加热线圈的形变范围，从而限制所述加热线圈中的相邻两个加热丝接触。
其中，所述绝缘内衬为绝缘刚性连筋。
其中，所述加热源包括多个绝缘内衬，所述多个绝缘内衬均匀地排布于所述加热线圈内壁与所述加热容器之间的环形空间内。
其中，所述绝缘内衬的材质为C/Csi复合材料。
本发明还提供一种有机发光二极管的蒸镀机，包括加热容器及上述的加热源，所述加热源设置于所述加热容器外侧，以对加热容器进行加热。
本发明一种加热源，应用于有机发光二极管的蒸镀机内，以对所述蒸镀机内的加热容器进行加热，其中，所述加热源包括加热线圈及防护件，所述防护件为绝缘材质，所述加热线圈的两端连接至电源，以接受电压来产生热量，所述防护件设置于所述加热线圈上，用于限制所述加热线圈的形变范围，从而限制所述加热线圈中的相邻两个加热丝接触，避免出现相邻两个加热丝短路的现象。因此，本发明降低了加热线圈短路的几率，提高加热线圈的稳定性，从而提供应用所述加热线圈的蒸镀机的稳定性。
附图说明
为了更清楚地说明本发明的技术方案，下面将对实施方式中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本发明的一些实施方式，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以如这些附图获得其他的附图。
图1是本发明第一方案第一实施例提供的一种加热源的平面示意图；
图2是本发明第一方案第二实施例提供的一种加热源的平面示意图；
图3是本发明第二方案较佳实施例提供的一种有机发光二极管的蒸镀机的框图。
具体实施方式
下面将结合本发明实施方式中的附图，对本发明实施方式中的技术方案进行清楚、完整地描述。
请参阅图1，本发明第一方案第一实施例提供一种加热源100。所述加热源100应用于有机发光二极管的蒸镀机(未示出)内，以对所述蒸镀机内的加热容器进行加热。所述加热源100包括加热线圈10及防护件20。所述防护件20为绝缘材质。所述加热线圈10的两端连接至电源(未示出)，以接受电压来产生热量。所述防护件20设置于所述加热线圈10上，用于限制所述加热线圈10的形变范围，从而限制所述加热线圈10中的相邻两个加热丝11接触。
需要说明的是，所述加热线圈10在接收所述电源的电压后产生热量来对所述加热容器进行加热。由于加热线圈10的热胀冷缩使所述加热容器经历热胀冷缩可能导致变形。所述加热容器的变形会将变形力传递至所述加热线圈10，这样会导致所述加热线圈10变形。而所述加热源100包括防护件20。所述防护件20限制所述加热线圈10的形变范围，从而限制所述加热线圈10中的相邻两个加热丝11接触，避免出现相邻两个加热丝11短路的现象。因此，本发明降低了加热线圈10短路的几率，提高加热线圈10的稳定性，从而提供应用所述加热线圈的蒸镀机的稳定性。
在本实施例中，所述加热容器为钳锅。所述防护件20包括绝缘架桥。所述加热线圈10中的相邻两个加热丝11之间设置有至少一个绝缘桥架，以限制所述加热线圈10中的相邻两个加热丝11接触。
具体地，所述绝缘桥架为绝缘刚性连筋。所述刚性连筋的两端分别至相连的两个加热丝11上。
在本实施例中，所述绝缘桥架的材质为C/Csi复合材料。所述绝缘桥架与相邻的两个加热丝11之间的夹角为90度。
需要说明的是，当所述绝缘桥架与相邻的两个加热丝11之间的夹角为90度时，所述绝缘桥架对与其两侧的加热丝11的支撑力度最好，即对防止两侧的加热丝11发生短路效果最好。
在其他实施例中，所述绝缘架桥的材质可以根据实际需要进行调整。所述绝缘桥架与相邻的两个加热丝11之间的夹角可以根据实际需要进行调整。
请参阅图2，本发明第一方案第二实施例提供一种加热源200。所述第二实施例提供的加热源200与所述第一实施例提供的加热源100相似，两者的区别在于：在第二实施例中，所述防护件220还包括绝缘内衬222。所述绝缘内衬222设置于所述加热线圈10内壁与所述加热容器之间，且所述绝缘内衬220连接至所述加热线圈10中的每根加热丝，以限制所述加热线圈10的形变范围，从而限制所述加热线圈10中的相邻两个加热丝11接触。
需要说明的是，所述加热线圈10在接收所述电源的电压后产生热量来对所述加热容器进行加热。由于加热线圈10的热胀冷缩使所述加热容器经历热胀冷缩可能导致变形。所述加热容器的变形会将变形力传递至所述加热线圈10。这样会导致所述加热线圈10变形。而所述防护件220还包括所述绝缘内衬222。所述绝缘内衬222设置于所述加热线圈10内壁与所述加热容器之间，且所述绝缘内衬220连接至所述加热线圈10中的每根加热丝，可以分散所述变形力，可以限制所述加热线圈10的形变范围，从而限制所述加热线圈10中的相邻两个加热丝11接触，避免出现相邻两个加热丝11短路的现象。因此，本发明降低了加热线圈10短路的几率，提高加热线圈10的稳定性，从而提供应用所述加热线圈的蒸镀机的稳定性。
具体地，所述绝缘内衬222为绝缘刚性连筋。
进一步地，所述加热源200可以包括多个绝缘内衬222。所述多个绝缘内衬222均匀地排布于所述加热线圈10内壁与所述加热容器之间的环形空间内。因此，这样排布的多个绝缘内衬分散所述变形力的效果更好，更好地限制了所述加热线圈10中的相邻两个加热丝11接触，更好地避免出现相邻两个加热丝11短路的现象。
在本实施例中，所述绝缘内衬222的材质为C/Csi复合材料。在其他实施例中，所述绝缘内衬222的材质也可以根据实际需要进行调整。
需要说明的是，在其他实施例中所述发热源222可以只包括所述绝缘架桥22或只包括所述绝缘内衬222。
请参阅图3，本发明第二方案较佳实施例提供一种有机发光二极管的蒸镀机300。所述有机发光二极管的蒸镀机300包括加热容器310及加热源。所述加热源设置于所述加热容器310外侧，以对加热容器310进行加热。在本实施例中，所述加热源可以为上述第一方案第二较佳实施例提供的加热源200。所述加热源的具体结构及功能已在上述第一方案第二较佳实施例中进行了详细的描述，在此不再赘述。
在其他实施例中，所述加热源也可以为其他的加热源，如上述第一方案第一较佳实施例提供的加热源100。
在本实施例中，所述加热线圈10在接收所述电源的电压后产生热量来对所述加热容器进行加热。由于加热线圈10的热胀冷缩使所述加热容器经历热胀冷缩可能导致变形。所述加热容器的变形会将变形力传递至所述加热线圈10，这样会导致所述加热线圈10变形。而所述加热源100包括防护件20。所述防护件20限制所述加热线圈10的形变范围，从而限制所述加热线圈10中的相邻两个加热丝11接触，避免出现相邻两个加热丝11短路的现象，另外，所述防护件220还包括所述绝缘内衬222。所述绝缘内衬222设置于所述加热线圈10内壁与所述加热容器之间，且所述绝缘内衬220连接至所述加热线圈10中的每根加热丝，可以分散所述变形力，可以限制所述加热线圈10的形变范围，从而限制所述加热线圈10中的相邻两个加热丝11接触，避免出现相邻两个加热丝11短路的现象。因此，本发明降低了加热线圈10短路的几率，提高加热线圈10的稳定性，从而提供应用所述加热线圈的蒸镀机300的稳定性。
以上所述是本发明的优选实施方式，应当指出，对于本技术领域的普通技术人员来说，在不脱离本发明原理的前提下，还可以做出若干改进和润饰，这些改进和润饰也视为本发明的保护范围。

Claims (18)

  1. 一种加热源，应用于有机发光二极管的蒸镀机内，以对所述蒸镀机内的加热容器进行加热，其特征在于：所述加热源包括加热线圈及防护件，所述防护件为绝缘材质，所述加热线圈的两端连接至电源，以接受电压来产生热量，所述防护件设置于所述加热线圈上，用于限制所述加热线圈的形变范围，从而限制所述加热线圈中的相邻两个加热丝接触。
  2. 如权利要求1所述的加热源，其特征在于，所述防护件包括绝缘架桥，所述加热线圈中的相邻两个加热丝之间设置有至少一个绝缘桥架，以限制所述加热线圈中的相邻两个加热丝接触。
  3. 如权利要求2所述的加热源，其特征在于，所述绝缘桥架为绝缘刚性连筋。
  4. 如权利要求2所述的加热源，其特征在于，所述绝缘桥架的材质为C/Csi复合材料。
  5. 如权利要求2所述的加热源，其特征在于，所述绝缘桥架与相邻的两个加热丝之间的夹角为90度。
  6. 如权利要求1所述的加热源，其特征在于，所述防护件还包括绝缘内衬，所述绝缘内衬设置于所述加热线圈内壁与所述加热容器之间，且所述绝缘内衬连接至所述加热线圈中的每根加热丝，以限制所述加热线圈的形变范围，从而限制所述加热线圈中的相邻两个加热丝接触。
  7. 如权利要求6所述的加热源，其特征在于，所述绝缘内衬为绝缘刚性连筋。
  8. 如权利要求6所述的加热源，其特征在于，所述加热源包括多个绝缘内衬，所述多个绝缘内衬均匀地排布于所述加热线圈内壁与所述加热容器之间的环形空间内。
  9. 如权利要求6所述的加热源，其特征在于，所述绝缘内衬的材质为C/Csi复合材料。
  10. 一种有机发光二极管的蒸镀机，包括加热容器及加热源，所述加热源设置于所述加热容器外侧，以对加热容器进行加热，所述加热源包括加热线 圈及防护件，所述防护件为绝缘材质，所述加热线圈的两端连接至电源，以接受电压来产生热量，所述防护件设置于所述加热线圈上，用于限制所述加热线圈的形变范围，从而限制所述加热线圈中的相邻两个加热丝接触。
  11. 如权利要求10所述的蒸镀机，其特征在于，所述防护件包括绝缘架桥，所述加热线圈中的相邻两个加热丝之间设置有至少一个绝缘桥架，以限制所述加热线圈中的相邻两个加热丝接触。
  12. 如权利要求11所述的蒸镀机，其特征在于，所述绝缘桥架为绝缘刚性连筋。
  13. 如权利要求11所述的蒸镀机，其特征在于，所述绝缘桥架的材质为C/Csi复合材料。
  14. 如权利要求11所述的蒸镀机，其特征在于，所述绝缘桥架与相邻的两个加热丝之间的夹角为90度。
  15. 如权利要求10所述的蒸镀机，其特征在于，所述防护件还包括绝缘内衬，所述绝缘内衬设置于所述加热线圈内壁与所述加热容器之间，且所述绝缘内衬连接至所述加热线圈中的每根加热丝，以限制所述加热线圈的形变范围，从而限制所述加热线圈中的相邻两个加热丝接触。
  16. 如权利要求15所述的蒸镀机，其特征在于，所述绝缘内衬为绝缘刚性连筋。
  17. 如权利要求15所述的蒸镀机，其特征在于，所述加热源包括多个绝缘内衬，所述多个绝缘内衬均匀地排布于所述加热线圈内壁与所述加热容器之间的环形空间内。
  18. 如权利要求15所述的蒸镀机，其特征在于，所述绝缘内衬的材质为C/Csi复合材料。
PCT/CN2015/083869 2015-06-24 2015-07-13 一种加热源及有机发光二极管的蒸镀机 Ceased WO2016206141A1 (zh)

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