WO2016202115A1 - 印制电路板制作信息的确定方法及装置 - Google Patents

印制电路板制作信息的确定方法及装置 Download PDF

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Publication number
WO2016202115A1
WO2016202115A1 PCT/CN2016/081159 CN2016081159W WO2016202115A1 WO 2016202115 A1 WO2016202115 A1 WO 2016202115A1 CN 2016081159 W CN2016081159 W CN 2016081159W WO 2016202115 A1 WO2016202115 A1 WO 2016202115A1
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information
pcb
pins
etching
manufacturer
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PCT/CN2016/081159
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English (en)
French (fr)
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王冲
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中兴通讯股份有限公司
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Publication of WO2016202115A1 publication Critical patent/WO2016202115A1/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/162—Testing a finished product, e.g. heat cycle testing of solder joints

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  • the present application relates to, but is not limited to, the field of communications, and in particular, to a method and apparatus for determining printed circuit board manufacturing information.
  • PCB printed circuit board
  • the backplane design for high-speed data connection of large-capacity data, the board thickness tolerance, impedance control, deep drilling (plating) capability, alignment accuracy, and test capability of the backplane will affect the performance of the backplane, and in severe cases, the backplane will be caused. scrapped.
  • High-end PCBs will be selected by several industry-leading manufacturers, but the processing capabilities of different manufacturers will be different. When there is a problem with the backplane, it is necessary to know which PCB manufacturer the backplane is processed, which is convenient for providing basis and design improvement for the subsequent design.
  • FIG. 1 is a schematic diagram of the manufacturer information of the PCB manufacturer in the related art.
  • the practice in the related art requires the PCB manufacturer to add a logo representing the manufacturer at the blank position of the PCB.
  • the backplanes are installed inside the system. When there is a problem with the PCB, it is not easy to directly observe the logo, and it is impossible to directly judge the manufacturer.
  • a method for determining PCB fabrication information including: presetting a correspondence between a plurality of production information of the PCB and a plurality of coding information, wherein the coding information is Generating a level signal of a plurality of pins of the PCB; etching the plurality of pins according to the corresponding relationship when processing the PCB; and passing the plurality of leads after etching The level signal of the foot determines the fabrication information of the PCB.
  • the etching the plurality of pins according to the corresponding relationship includes: acquiring specified coding information corresponding to the specified production information according to the correspondence relationship; and etching out the specified one of the plurality of pins according to the specified coding information The copper of the pin.
  • the plurality of pins are pins of a programmable chip or an electronic tag of the PCB.
  • the plurality of pins have a value of 4.
  • the production information includes: manufacturer information and address information.
  • a device for determining PCB fabrication information including: a preset module, configured to preset a correspondence between a plurality of production information of the PCB and a plurality of encoded information, The encoding information is generated by a level signal of a plurality of pins of the PCB; and the etching module is configured to etch the plurality of pins according to the corresponding relationship when processing the PCB; The identification module is configured to determine the fabrication information of the PCB by using the level signals of the plurality of pins after the etching.
  • the etch module includes: an obtaining unit configured to acquire specified encoding information corresponding to the specified production information according to the correspondence relationship; and an etching module configured to etch away the specified one of the plurality of pins according to the specified encoding information The copper of the pin.
  • the plurality of pins are pins of a programmable chip or an electronic tag of the PCB.
  • the plurality of pins have a value of 4.
  • the production information includes: manufacturer information and address information.
  • Embodiments of the present invention also provide a computer readable storage medium storing computer executable instructions that are implemented by a processor to implement the above method.
  • a plurality of pins are disposed in the PCB, and the level signals of the plurality of pins are used to represent corresponding coding information, and the plurality of pieces of coding information and the plurality of PCBs are pre-set by the preset information.
  • the PCB level signal can be used to determine the PCB manufacturing information, which solves the problem that it is difficult to directly obtain the manufacturer information in the PCB, thereby improving the user experience.
  • FIG. 1 is a schematic diagram of a manufacturer information of a PCB manufacturer in the related art
  • FIG. 2 is a flow chart of a method of determining PCB fabrication information according to an embodiment of the present invention
  • FIG. 3 is a structural block diagram of a device for determining PCB fabrication information according to an embodiment of the present invention.
  • FIG. 4 is a block diagram showing an optional structure of a device for determining PCB fabrication information according to an embodiment of the present invention
  • FIG. 5 is a schematic diagram of a manufacturer's identification on a PCB according to an embodiment of the invention.
  • FIG. 2 is a flowchart of a method for determining PCB PCB manufacturing information according to an embodiment of the present invention. As shown in FIG. 2, the steps of the method include:
  • Step S202 Presetting a correspondence between a plurality of pieces of manufacturing information of the PCB and a plurality of pieces of coded information, wherein the coded information is generated by a level signal of a plurality of pins of the PCB;
  • Step S204 when processing the PCB, etching the plurality of pins according to the corresponding relationship;
  • Step S206 determining the fabrication information of the PCB by using the level signals of the plurality of pins after the etching.
  • a plurality of pins are disposed in the PCB, and the level signals of the plurality of pins are used to indicate corresponding coding information, by preset the plurality of coding information and
  • the correspondence relationship between the plurality of manufacturing information of the PCB can determine the manufacturing information of the PCB through the level signal of the PCB, and solve the problem that it is difficult to directly obtain the information of the manufacturer in the PCB, thereby improving the user experience.
  • Step S11 Obtain specified coding information corresponding to the specified production information according to the correspondence relationship
  • Step S12 Etching the copper of the designated pins of the plurality of pins according to the specified encoding information.
  • the plurality of pins may be pins of a programmable chip or an electronic tag of the PCB in this embodiment.
  • the value of the multiple pins involved in this embodiment may be 4. Of course, this is an optional implementation of the embodiment, and may be adjusted according to actual conditions, for example, the value may be 5 or the like.
  • the production information involved in this embodiment may include: manufacturer information and address information. Of course, this is merely an example and does not constitute a limitation of the present invention, and other related information is also possible.
  • an application scenario in which the pin value is 4 and the production information is the manufacturer information may be: four pins of the programmable chip or the electronic tag are reserved during design. At the chip, the high level is connected through a resistor, and the remote end is connected to the ground plane through the copper skin, that is, a low level. At this time, the code at the chip is 0000, and this represents the manufacturer 1.
  • the set code is 0001
  • the copper pin a0 is etched away for the manufacturer 2
  • the code at the processed single chip becomes 0001;
  • the PCB When processing by the manufacturer 3, for example, if the code is set to 0002, then in the processing specification, if the copper pin a1 is etched away for the manufacturer 2, the code at the processed single chip becomes 0010.
  • a device for determining the information of the PCB is also provided.
  • the device is configured to implement the above-mentioned embodiments and optional embodiments, and the description thereof has been omitted.
  • the term “module” "unit” may implement a combination of software and/or hardware of a predetermined function.
  • the apparatus described in the following embodiments is preferably implemented in software, hardware, or a combination of software and hardware, is also possible and contemplated.
  • FIG. 3 is a structural block diagram of a device for determining PCB fabrication information according to an embodiment of the present invention.
  • the device includes: a preset module 32 configured to preset a plurality of production information and a plurality of encoded information of the PCB. Corresponding relationship, wherein the coded information is generated by the level signals of the plurality of pins of the PCB; the etch module 34 is configured to be coupled with the preset module 32, and is configured to be configured according to the corresponding relationship when processing the PCB The pins are etched; the identification module 36 is configured to be coupled to the etch module 34 and configured to determine the PCB fabrication information by the level signals of the etched plurality of pins.
  • the etch module 34 includes: an acquisition unit 42 configured to obtain a correspondence according to a corresponding relationship. The specified encoding information corresponding to the specified production information is taken; the etching unit 44 is configured to be coupled to the acquisition unit 42 and configured to etch the copper of the designated one of the plurality of pins according to the specified encoding information.
  • the plurality of pins may be pins of a programmable chip or an electronic tag of the PCB in this embodiment.
  • the value of the multiple pins involved in this embodiment may be 4. Of course, this is an optional implementation of the embodiment, and may be adjusted according to actual conditions, for example, the value may be 5 or the like.
  • the production information involved in this embodiment may include: manufacturer information and address information. Of course, this is merely an example and does not constitute a limitation of the present invention, and other related information is also possible.
  • This embodiment provides a method for identifying a manufacturer of a printed circuit board.
  • a method for setting factory information by encoding an upper pull-down level control 01 is shown.
  • FIG. 5 is a manufacturer on a PCB according to an embodiment of the present invention.
  • the identification diagram, as shown in Figure 5, has only one determined 01 code in the design file.
  • pins of the programmable chip or electronic tag connect the high level through the resistor at the chip, and connect to the ground plane through the copper skin at the far end, that is Low level. At this time, the code at the chip is 0000.
  • the set code is 0001
  • the manufacturer 1 is specified to etch away the copper a0
  • the code at the processed single chip becomes 0001
  • the PCB is manufactured by the manufacturer 3
  • the manufacturer 2 is specified to etch away the copper a1
  • the code at the processed single chip becomes 0010.
  • the manufacturer information is automatically written by the manufacturer.
  • the etching method corresponding to the set encoding method can be specified in one processing description, and the manufacturer processes it according to its own corresponding etching method.
  • the code of the backplane PCB can be obtained by reading the programmable chip or the electronic tag through the host computer, and then the information of the manufacturer can be obtained.
  • the etching method corresponding to the set encoding method can be specified in one processing description, and the manufacturer processes it according to its own corresponding etching method.
  • PCB manufacturer Etching method coding PCB manufacturer Etching method coding PCB manufacturer 01 Not etched 0000 PCB manufacturer 09 Etching a3 1000 PCB manufacturer 02 Etching a0 0001 PCB manufacturer 10 Etching a3, a0 1001 PCB manufacturer 03 Etching a1 0010 PCB manufacturer 11 Etching a3, a1 1010 PCB manufacturer 04 Etching a0, a1 0011 PCB manufacturer 12 Etching a3, a1, a0 1011 PCB manufacturer 05 Etching a2 0100 PCB manufacturer 13 Etching a3, a2 1100 PCB manufacturer 06 Etching a2, a0 0101 PCB manufacturer 14 Etching a3, a2, a0 1101 PCB manufacturer 07 Etching a2, a1 0110 PCB manufacturer 15 Etching a3, a2, a1 1110 PCB manufacturer 08 Etching a2, a1, a0 0111 PCB manufacturer 16 Etching a0, a1, a2, a3 1111
  • the design file does not process the lead copper of the pin, ensuring that only one set of processing files for one design does not add additional design and maintenance costs.
  • a set of processing files is added with different manufacturer information, and it is convenient to use different 01 codes as the codes of the PCB manufacturers.
  • the code of the backplane PCB can be obtained by reading the programmable chip or the electronic tag through the host computer, and then the information of the manufacturer can be obtained.
  • a software is provided that is configured to perform the technical solutions described in the above embodiments and preferred embodiments.
  • an embodiment of the present invention further provides a computer readable storage medium storing computer executable instructions that are implemented by a processor to implement the above method.
  • the storage medium includes any one or more of the following: an optical disk, a floppy disk, a hard disk, and an erasable memory.
  • the embodiment of the present invention provides a method and a device for determining PCB manufacturing information, and presets a correspondence between a plurality of manufacturing information of a PCB and a plurality of encoding information, wherein the encoding information is used by multiple pins of the PCB.
  • Level signal generation when processing the PCB, etching the plurality of pins according to the corresponding relationship; determining the fabrication information of the PCB by using the level signals of the plurality of pins after the etching.
  • a plurality of pins are disposed in the PCB, and the level signals of the plurality of pins are used to indicate corresponding encoding information, and the correspondence between the plurality of encoding information and the plurality of manufacturing information of the PCB is preset.
  • the level signal of the PCB further determines the manufacturing information of the PCB, and solves the problem that it is difficult to directly obtain the manufacturer information in the PCB, thereby improving the user experience.

Abstract

一种印制电路板(PCB)制作信息的确定方法及装置，其中该方法包括：预设PCB的多个制作信息与多个编码信息之间的对应关系(S202)，其中，编码信息由PCB的多个引脚的电平信号生成；在对PCB进行加工时，依据对应关系对多个引脚进行蚀刻(S204)；通过蚀刻后的多个引脚的电平信号确定PCB的制作信息(S206)。解决了难以直接获取到PCB中厂家信息的问题。

Description

印制电路板制作信息的确定方法及装置 技术领域
本申请涉及但不限于通信领域，具体而言，涉及一种印制电路板制作信息的确定方法及装置。
背景技术
随着电子设计、通讯行业的高速发展，网络数据呈现几何倍数巨涨，产品对数据量的要求越来越高，单板和背板设计的速度越来越快，对印制电路板(Printed Circuit Board，PCB)厂家的加工能力不断提出挑战，PCB厂家的加工能力是制约高速设计的一个因素。
目前实现大容量数据高速互联的背板设计，背板制作的板厚公差、阻抗控制、深钻(镀)能力、对位精度、测试能力等都会影响背板的性能，严重时会导致背板报废。高端的PCB都会选择几个业内领先的厂家制作，但是不同厂家的加工能力有所不同。当背板出现问题的时候需要知道背板是哪个PCB厂家加工的，方便对后续的设计提供依据和设计改进。
图1是相关技术中PCB厂家标识厂家信息的示意图，如图1所示，相关技术中的做法是要求PCB厂家在PCB空白位置上添加代表厂家的标识。但是背板都是安装在系统内部，在PCB出现问题的时候，不容易直接观察到这个标识，也就无法直接判断厂家。
针对相关技术中难以直接获取到PCB中厂家信息的问题，目前尚未提出有效的解决方案。
发明内容
以下是对本文详细描述的主题的概述。本概述并非是为了限制权利要求的保围。
根据本发明实施例的一个方面，提供了一种PCB制作信息的确定方法，包括：预设所述PCB的多个制作信息与多个编码信息之间的对应关系，其中，所述编码信息由所述PCB的多个引脚的电平信号生成；在对所述PCB进行加工时，依据所述对应关系对所述多个引脚进行蚀刻；通过蚀刻后的多个引 脚的电平信号确定所述PCB的制作信息。
其中，依据所述对应关系对所述多个引脚进行蚀刻包括：依据所述对应关系获取与指定制作信息对应的指定编码信息；依据所述指定编码信息蚀刻掉所述多个引脚中指定引脚的铜皮。
其中，所述多个引脚为所述PCB的可编程芯片或电子标签的引脚。
其中，所述多个引脚的取值为4。
其中，所述制作信息包括：厂家信息、地址信息。
根据本发明实施例的另一个方面，提供了一种PCB制作信息的确定装置，包括：预设模块，设置为预设所述PCB的多个制作信息与多个编码信息之间的对应关系，其中，所述编码信息由所述PCB的多个引脚的电平信号生成；蚀刻模块，设置为在对所述PCB进行加工时，依据所述对应关系对所述多个引脚进行蚀刻；识别模块，设置为通过蚀刻后的多个引脚的电平信号确定所述PCB的制作信息。
其中，所述蚀刻模块包括：获取单元，设置为依据所述对应关系获取与指定制作信息对应的指定编码信息；蚀刻模块，设置为依据所述指定编码信息蚀刻掉所述多个引脚中指定引脚的铜皮。
其中，所述多个引脚为所述PCB的可编程芯片或电子标签的引脚。
其中，所述多个引脚的取值为4。
其中，所述制作信息包括：厂家信息、地址信息。
本发明实施例还提供了一种计算机可读存储介质，存储有计算机可执行指令，所述计算机可执行指令被处理器执行时实现上述方法。
在本发明实施例中，采用在PCB中设置多个引脚，该多个引脚的电平信号用于表示相应的编码信息，通过预设该多个编码信息与PCB的多个制作信息的对应关系，可以通过该PCB的电平信号进而确定该PCB的制作信息，解决了难以直接获取到PCB中厂家信息的问题，提升了用户体验。
在阅读并理解了附图和详细描述后，可以明白其他方面。
附图概述
设置为在附图中：
图1是相关技术中PCB厂家标识厂家信息的示意图；
图2是根据本发明实施例的PCB制作信息的确定方法的流程图；
图3是根据本发明实施例的PCB制作信息的确定装置的结构框图；
图4是根据本发明实施例的PCB制作信息的确定装置的可选结构框图一；
图5是根据本发明实施例的PCB上厂家的标识示意图。
本发明的实施方式
需要说明的是，在不冲突的情况下，本申请中的实施例及实施例中的特征可以相互组合。下面将参考附图并结合实施例来详细说明本发明实施例。
本实施例提供了一种PCB制作信息的确定方法，图2是根据本发明实施例的印制电路板PCB制作信息的确定方法的流程图，如图2所示，该方法的步骤包括：
步骤S202：预设PCB的多个制作信息与多个编码信息之间的对应关系，其中，编码信息由PCB的多个引脚的电平信号生成；
步骤S204：在对PCB进行加工时，依据对应关系对多个引脚进行蚀刻；
步骤S206：通过蚀刻后的多个引脚的电平信号确定PCB的制作信息。
在本实施例中的上述步骤S202至步骤S204中，采用在PCB中设置多个引脚，该多个引脚的电平信号用于表示相应的编码信息，通过预设该多个编码信息与PCB的多个制作信息的对应关系，可以通过该PCB的电平信号进而确定该PCB的制作信息，解决了难以直接获取到PCB中厂家信息的问题，进而提升用户体验。
对于本实施例步骤S204中涉及到的依据对应关系对多个引脚进行蚀刻的方式，在本实施例的可选实施方式中可以通过如下方式来实现：
步骤S11：依据对应关系获取与指定制作信息对应的指定编码信息；
步骤S12：依据指定编码信息蚀刻掉多个引脚中指定引脚的铜皮。
而对于本实施例中该多个引脚在本实施例中可以为PCB的可编程芯片或电子标签的引脚。
而对于本实施例中涉及到的多个引脚的取值可以为4，当然这只是本实施例可选实施方式，可以根据实际情况进行相应的调整，如取值可以为5等等。此外，本实施例中涉及到的制作信息可以包括：厂家信息、地址信息。当然这仅仅也是举例说明，并不构成对本发明的限定，其他的相关信息也是可以的。
基于上述本实施例的方式，在本实施例中以引脚取值为4以及制作信息为厂家信息为例的一个应用场景可以是：设计时预留可编程芯片或者电子标签的4个引脚，在芯片处通过电阻接高电平，在远端通过铜皮连接到地平面，也就是低电平。此时芯片处的编码为0000，此时代表为厂家1。当PCB由厂家2加工时，比如设定的编码是0001，那么在加工说明中对厂家2指定蚀刻掉铜皮引脚a0，则加工回来的单板芯片处的编码就变为0001；当PCB由厂家3加工时，比如设定的编码是0002，那么在加工说明中对厂家2指定蚀刻掉铜皮引脚a1，则加工回来的单板芯片处的编码就变为0010。
在本实施例中还提供了一种PCB制作信息的确定装置，该装置设置为实现上述实施例及可选实施方式，已经进行过说明的不再赘述。如以下所使用的，术语“模块”“单元”可以实现预定功能的软件和/或硬件的组合。尽管以下实施例所描述的装置较佳地以软件来实现，但是硬件，或者软件和硬件的组合的实现也是可能并被构想的。
图3是根据本发明实施例的PCB制作信息的确定装置的结构框图，如图3所示，该装置包括：预设模块32，设置为预设PCB的多个制作信息与多个编码信息之间的对应关系，其中，编码信息由PCB的多个引脚的电平信号生成；蚀刻模块34，设置为与预设模块32耦合连接，设置为在对PCB进行加工时，依据对应关系对多个引脚进行蚀刻；识别模块36，设置为与蚀刻模块34耦合连接，设置为通过蚀刻后的多个引脚的电平信号确定PCB的制作信息。
图4是根据本发明实施例的PCB制作信息的确定装置的可选结构框图一，如图4所示，蚀刻模块34包括：获取单元42，设置为依据对应关系获 取与指定制作信息对应的指定编码信息；蚀刻单元44，设置为与获取单元42耦合连接，设置为依据指定编码信息蚀刻掉多个引脚中指定引脚的铜皮。
而对于本实施例中该多个引脚在本实施例中可为PCB的可编程芯片或电子标签的引脚。
而对于本实施例中涉及到的多个引脚的取值可以为4，当然这只是本实施例可选实施方式，可以根据实际情况进行相应的调整，如取值可以为5等等。此外，本实施例中涉及到的制作信息可以包括：厂家信息、地址信息。当然这仅仅也是举例说明，并不构成对本发明的限定，其他的相关信息也是可以的。
下面结合具体实施例对本发明实施例进行详细的说明；
本实施例提供了一种识别印制电路板厂家的方式，在本实施例中，通过上下拉电平控制01编码设定厂家信息的方法，图5是根据本发明实施例的PCB上厂家的标识示意图，如图5所示，在设计文件中只有一个确定的01编码。
设计时预留可编程芯片或者电子标签的4个(也可以是其它值，看实际需要)引脚，在芯片处通过电阻接高电平，在远端通过铜皮连接到地平面，也就是低电平。此时芯片处的编码为0000。
当PCB由厂家2加工时，比如设定的编码是0001，那么在加工说明中对厂家1指定蚀刻掉铜皮a0，则加工回来的单板芯片处的编码就变为0001；当PCB由厂家3加工时，比如设定的编码是0002，那么在加工说明中对厂家2指定蚀刻掉铜皮a1，则加工回来的单板芯片处的编码就变为0010。
通过上述相当于由厂家自动写入了厂家信息。设定的编码方式对应的蚀刻方式可以指定在一个加工说明中，由厂家按照自身对应的蚀刻方式加工。
通过指定不同的加工方式使得一套加工文件增加了不同的厂家信息，方便以不同的01编码作为PCB厂家的代码。在系统中，通过上位机读取可编程芯片或电子标签就可以得到背板PCB的编码，进而就可以得到厂家的信息。
设定的编码方式对应的蚀刻方式可以指定在一个加工说明中，由厂家按照自身对应的蚀刻方式加工。
以不同的01编码作为PCB厂家的代码，因为有4位，所以可以识别16个厂家，如表1所示：
PCB厂家 蚀刻方式 编码 PCB厂家 蚀刻方式 编码
PCB厂家01 不蚀刻 0000 PCB厂家09 蚀刻a3 1000
PCB厂家02 蚀刻a0 0001 PCB厂家10 蚀刻a3、a0 1001
PCB厂家03 蚀刻a1 0010 PCB厂家11 蚀刻a3、a1 1010
PCB厂家04 蚀刻a0、a1 0011 PCB厂家12 蚀刻a3、a1、a0 1011
PCB厂家05 蚀刻a2 0100 PCB厂家13 蚀刻a3、a2 1100
PCB厂家06 蚀刻a2、a0 0101 PCB厂家14 蚀刻a3、a2、a0 1101
PCB厂家07 蚀刻a2、a1 0110 PCB厂家15 蚀刻a3、a2、a1 1110
PCB厂家08 蚀刻a2、a1、a0 0111 PCB厂家16 蚀刻a0、a1、a2、a3 1111
表1
在本实施例中，设计文件对引脚的走线铜皮不做处理，保证一个设计只有一套加工文件，不会增加额外的设计和维护成本。通过指定不同的加工方式使得一套加工文件增加了不同的厂家信息，方便以不同的01编码作为PCB厂家的代码。在系统中，通过上位机读取可编程芯片或电子标签就可以得到背板PCB的编码，进而就可以得到厂家的信息。
在另外一个实施例中，还提供了一种软件，该软件设置为执行上述实施例及优选实施方式中描述的技术方案。
在另外一个实施例中，本发明实施例还提供了一种计算机可读存储介质，存储有计算机可执行指令，所述计算机可执行指令被处理器执行时实现上述方法。该存储介质包括如下任一种或几种：光盘、软盘、硬盘、和可擦写存储器等。
本领域普通技术人员可以理解上述方法中的全部或部分步骤可通过程序来指令相关硬件(例如处理器)完成，所述程序可以存储于计算机可读存储介质中，如只读存储器、磁盘或光盘等。可选地，上述实施例的全部或部分步骤也可以使用一个或多个集成电路来实现。相应地，上述实施例中的各模 块/单元可以采用硬件的形式实现，例如通过集成电路来实现其相应功能，也可以采用软件功能模块的形式实现，例如通过处理器执行存储于存储器中的程序/指令来实现其相应功能。本发明实施例不限制于任何特定形式的硬件和软件的结合。
上述仅为本发明的可选实施例而已，并不用于限制本发明实施例，对于本领域的技术人员来说，本发明实施例可以有各种更改和变化。凡在本发明实施例的精神和原则之内，所作的任何修改、等同替换、改进等，均应包含在本发明实施例的保护范围之内。
工业实用性
本发明实施例提供了PCB制作信息的确定方法及装置，预设PCB的多个制作信息与多个编码信息之间的对应关系，其中，所述编码信息由所述PCB的多个引脚的电平信号生成；在对所述PCB进行加工时，依据所述对应关系对所述多个引脚进行蚀刻；通过蚀刻后的多个引脚的电平信号确定所述PCB的制作信息。如此，采用在PCB中设置多个引脚，该多个引脚的电平信号用于表示相应的编码信息，通过预设该多个编码信息与PCB的多个制作信息的对应关系，可以通过该PCB的电平信号进而确定该PCB的制作信息，解决了难以直接获取到PCB中厂家信息的问题，提升了用户体验。

Claims (11)

  1. 一种印制电路板PCB制作信息的确定方法，包括：
    预设PCB的多个制作信息与多个编码信息之间的对应关系，其中，所述编码信息由所述PCB的多个引脚的电平信号生成；
    在对所述PCB进行加工时，依据所述对应关系对所述多个引脚进行蚀刻；
    通过蚀刻后的多个引脚的电平信号确定所述PCB的制作信息。
  2. 根据权利要求1所述的方法，其中，依据所述对应关系对所述多个引脚进行蚀刻包括：
    依据所述对应关系获取与指定制作信息对应的指定编码信息；
    依据所述指定编码信息蚀刻掉所述多个引脚中指定引脚的铜皮。
  3. 根据权利要求2所述的方法，其中，所述多个引脚为所述PCB的可编程芯片或电子标签的引脚。
  4. 根据权利要求1至3任一项所述的方法，其中，所述多个引脚的取值为4。
  5. 根据权利要求1至3任一项所述的方法，其中，所述制作信息包括：厂家信息、地址信息。
  6. 一种印制电路板PCB制作信息的确定装置，包括：
    预设模块，设置为预设PCB的多个制作信息与多个编码信息之间的对应关系，其中，所述编码信息由所述PCB的多个引脚的电平信号生成；
    蚀刻模块，设置为在对所述PCB进行加工时，依据所述对应关系对所述多个引脚进行蚀刻；
    识别模块，设置为通过蚀刻后的多个引脚的电平信号确定所述PCB的制作信息。
  7. 根据权利要求6所述的装置，其中，所述蚀刻模块包括：
    获取单元，设置为依据所述对应关系获取与指定制作信息对应的指定编码信息；
    蚀刻单元，设置为依据所述指定编码信息蚀刻掉所述多个引脚中指定引脚的铜皮。
  8. 根据权利要求7所述的装置，其中，所述多个引脚为所述PCB的可编程芯片或电子标签的引脚。
  9. 根据权利要求6至8任一项所述的装置，其中，所述多个引脚的取值为4。
  10. 根据权利要求6至8任一项所述的装置，其中，所述制作信息包括：厂家信息、地址信息。
  11. 一种计算机可读存储介质，存储有计算机可执行指令，所述计算机可执行指令被处理器执行时实现权利要求1至5任一项所述的方法。
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