WO2016201989A1 - 通信设备 - Google Patents

通信设备 Download PDF

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Publication number
WO2016201989A1
WO2016201989A1 PCT/CN2016/072499 CN2016072499W WO2016201989A1 WO 2016201989 A1 WO2016201989 A1 WO 2016201989A1 CN 2016072499 W CN2016072499 W CN 2016072499W WO 2016201989 A1 WO2016201989 A1 WO 2016201989A1
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WIPO (PCT)
Prior art keywords
magnesium alloy
communication device
less
magnesium
electronic component
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PCT/CN2016/072499
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English (en)
French (fr)
Inventor
富亮
肖春秀
胡邦红
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华为技术有限公司
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Priority to EP16810730.8A priority Critical patent/EP3299484A1/en
Publication of WO2016201989A1 publication Critical patent/WO2016201989A1/zh

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    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C23/00—Alloys based on magnesium
    • C22C23/02—Alloys based on magnesium with aluminium as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C23/00—Alloys based on magnesium
    • C22C23/06—Alloys based on magnesium with a rare earth metal as the next major constituent
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20409—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04B—TRANSMISSION
    • H04B1/00—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
    • H04B1/38—Transceivers, i.e. devices in which transmitter and receiver form a structural unit and in which at least one part is used for functions of transmitting and receiving
    • H04B1/3827—Portable transceivers
    • H04B1/3888—Arrangements for carrying or protecting transceivers

Definitions

  • the present invention relates to the field of communication devices, and more particularly to communication devices.
  • magnesium alloy As the lightest structural material, magnesium alloy has the advantages of light weight, high specific strength, good electromagnetic shielding and shock absorption performance, excellent forming performance, etc. It is widely used in aerospace, automotive and electronic consumer products, and its application field is Rapid expansion. In recent years, with the development of communication equipment in the direction of light weight, the traditional aluminum alloy can not meet the application requirements due to the high density. The magnesium alloy quickly enters the application field of communication equipment by virtue of its light weight and remarkable advantages.
  • the power consumption of the communication device, the working environment and the structural characteristics of the device itself determine that the materials applied to the communication device need to have high thermal conductivity, high corrosion resistance, high structural mechanical properties and processing and forming properties.
  • the thermal conductivity, mechanical properties and forming properties often interact with each other and even contradict each other, which limits the wide application of magnesium alloys in communication equipment. Therefore, it is necessary to propose a communication device using a magnesium alloy material to simultaneously meet the comprehensive requirements of the lightweight communication device for heat dissipation, corrosion resistance, mechanical properties, forming processing performance and the like.
  • Embodiments of the present invention provide a communication device capable of meeting requirements for heat dissipation, corrosion resistance, mechanical properties, and forming processing performance of a lightweight communication device.
  • a communication device comprising an electronic component and a magnesium alloy housing, the electronic component being disposed in a closed inner cavity formed by the magnesium alloy housing, and with the inner cavity
  • the chamber walls are in contact with each other, the magnesium alloy casing is for isolating the electronic component from the outside, and is used for dissipating heat generated by the electronic component, each of the magnesium alloy materials used in the magnesium alloy casing
  • the components are configured as follows by mass percentage:
  • Rare earth element 1% to 10%
  • Zinc less than 1%
  • Zirconium less than 1%
  • the rest is magnesium and unavoidable impurities.
  • the magnesium content is from 75% to 97%.
  • the components of the magnesium alloy material are configured by mass percentage as follows:
  • Zinc less than 0.5%
  • the rest is magnesium and unavoidable impurities.
  • the magnesium content is 86% to 93 %.
  • the magnesium is provided with heat dissipating fins.
  • the magnesium The alloy casing is die cast.
  • the communication The device is a radio frequency module
  • the electronic component includes: a printed circuit board PCB for processing the received signal, and a power module for supplying power to the device disposed on the PCB .
  • the radio frequency module is fixed on an antenna enclosure for performing a signal received from the antenna enclosure deal with.
  • the communication device of the embodiment of the invention adopts a magnesium alloy shell prepared by using a magnesium alloy material with a specific component content, and the magnesium alloy material has high heat dissipation, high corrosion resistance, high structural mechanical properties and high forming.
  • the processing performance is such that the communication device of the embodiment of the present invention can satisfy the requirements of the lightweight communication device for heat dissipation, corrosion resistance, mechanical properties, and forming processability.
  • FIG. 1 is a schematic cross-sectional view of a communication device in accordance with an embodiment of the present invention.
  • FIG. 2 is a schematic diagram of a housing of a communication device in accordance with an embodiment of the present invention.
  • the embodiment of the invention provides a communication device 100.
  • the communication device 100 includes an electronic component 101 and a magnesium alloy casing 102.
  • the electronic component 101 is disposed in a closed cavity formed by the magnesium alloy casing 102 and is in contact with the cavity wall of the inner cavity, and the magnesium alloy casing
  • the body 102 serves to isolate the electronic component 101 from the outside and is used to dissipate heat generated by the electronic component 101.
  • the electronic component 101 can be in direct contact with the cavity wall of the inner cavity, or can be in indirect contact with the cavity wall of the inner cavity, which is not limited in this embodiment of the present invention.
  • the electronic component 101 shown in FIG. 1 includes two portions 101a and 101b, but the present invention is not limited thereto, and the electronic component 101 may be an integral body, and may also include an electronic component composed of a plurality of partial electronic components.
  • the components of the magnesium alloy material used in the magnesium alloy casing 102 are arranged in mass percentage as follows:
  • Rare earth element 1% to 10%
  • Zinc less than 1%
  • Zirconium less than 1%
  • the rest is magnesium and unavoidable impurities.
  • the unavoidable impurities in the magnesium alloy material may be one or a mixture of silicon, iron, copper, nickel, and the like.
  • the rare earth element refers to one of lanthanum, cerium, lanthanum, cerium or a mixture of several rare earth elements.
  • the components may be adjusted as needed within the above range, and the embodiment of the invention is not limited thereto.
  • the content of aluminum may be 2% to 3%, or 3% to 4%, or 4% to 5%, or 5% to 6%, and the like.
  • the content of the rare earth element may be 2% to 3%, or 3% to 4%, or 4% to 5%, 7% to 8%, or the like.
  • magnesium alloy materials After testing and research, lightweight communication equipment requires magnesium alloy materials to have the following characteristics: thermal conductivity ⁇ 75W/MK, Brinell hardness ⁇ 40, tensile strength ⁇ 120Mpa, yield strength ⁇ 90Mpa, elongation ⁇ 0.5 %, in the same state, the neutral salt spray corrosion rate of the magnesium alloy material is less than or equal to the corrosion rate of the neutral salt spray of the magnesium alloy AZ91D, and the spiral or zigzag flow length of the magnesium alloy material under the same process state It is greater than 50% of the flow length of the spiral or the word of the magnesium alloy AZ91D.
  • the magnesium alloy material used in the magnesium alloy casing in the embodiment of the present invention can meet the comprehensive requirements for thermal conductivity, corrosion resistance, structural mechanical properties and high forming processing performance of the lightweight communication device.
  • the magnesium alloy casing 102 can timely transfer the heat generated by the electronic component 101 to the contact surface of the magnesium alloy casing 102 with the external environment and dissipate it. It is also possible to fill a gap between the electronic component 101 and the inner cavity of the magnesium alloy casing 102 with a heat conductive medium such as thermal grease to increase the contact area of the electronic component 101 with the inner cavity of the magnesium alloy casing 102, so that the electrons The heat generated by the component 101 can be quickly conducted to the magnesium alloy casing 102.
  • a heat conductive medium such as thermal grease
  • the magnesium alloy casing 102 of the embodiment of the present invention also has excellent corrosion resistance, and is isolated from the electronic component 101 inside the casing by the environment, thereby avoiding corrosion failure of the electronic component 101 in direct contact with the environment, and being resistant to the environment. Erosion, better protection of the electronic component 101.
  • the magnesium alloy casing 102 of the embodiment of the present invention has high connection reliability and high structural reliability, and can Other communication devices or components are reliably connected and provide high reliability protection for the internal electronic component 101.
  • the magnesium alloy casing 102 made of the magnesium alloy material can have high heat dissipation and high corrosion resistance. Sexuality and high structural strength enable fast cooling and outdoor applications of lightweight communication equipment.
  • the communication device of the embodiment of the invention adopts a magnesium alloy shell prepared by using a magnesium alloy material with a specific component content, and the magnesium alloy material has high heat dissipation, high corrosion resistance, high structural mechanical properties and high forming processing performance,
  • the communication device of the embodiment of the invention can satisfy the requirements of the lightweight communication device for heat dissipation, corrosion resistance, mechanical properties, and forming processability.
  • the magnesium content is from 75% to 97%.
  • the components of the magnesium alloy material are configured by mass percentage as follows:
  • Zinc less than 0.5%
  • the rest is magnesium and unavoidable impurities.
  • the magnesium content is from 86% to 93%.
  • Table 1 shows typical values and performance of several magnesium alloy materials commonly used in existing communication equipment. As can be seen from Table 1, the magnesium alloy materials currently used cannot simultaneously meet the comprehensive requirements of lightweight communication equipment for high thermal conductivity, high corrosion resistance, high structural mechanical properties, and high forming and processing properties.
  • the magnesium alloy material of the communication device of the embodiment of the invention can simultaneously meet the comprehensive requirements of the lightweight communication device for high thermal conductivity, high corrosion resistance, high structural mechanical properties and high forming processing performance.
  • the corrosion resistance and the forming ability ranged from 1 to 5, and the larger the value, the worse the corrosion resistance and the forming ability, respectively.
  • the magnesium alloy casing of the embodiment of the invention has high thermal conductivity, can meet the requirements of high heat dissipation of the communication device, and has high connection reliability such as thread reliability, high structural reliability, and Excellent corrosion resistance, so the communication device of the embodiment of the present invention can be directly exposed to an outdoor environment.
  • the outer surface of the magnesium alloy casing 102 is provided with heat dissipating fins as shown in FIG. This can increase the heat dissipation area and improve the heat dissipation efficiency.
  • the height of the heat dissipating fins is ⁇ 30 mm, and the thickness of the heat dissipating fins is ⁇ 1.8 mm.
  • the height of the heat dissipating fins is ⁇ 50 mm, and the thickness of the heat dissipating fins is ⁇ 1.2 mm.
  • the magnesium alloy material of the embodiment of the present invention has excellent forming ability, it is possible to form a complicated thin-walled structure, that is, a heat-dissipating fin having a high tooth height and a thin shape, which greatly increases the heat-dissipating area and further improves the heat-dissipating efficiency.
  • the magnesium alloy casing 102 is formed by die casting.
  • the magnesium alloy casing 102 can also be formed by other processes, which is not limited in the embodiment of the present invention.
  • the communication device can be a radio frequency module.
  • 101a is a Printed Circuit Board (PCB) 101a
  • 101b is a power module
  • PCB 101a is used for processing signals
  • power module 101b is used for providing devices provided on PCB 101a. power supply.
  • the radio frequency module described in the foregoing embodiment is fixed on the antenna enclosure for the antenna.
  • the signals collected by the enclosure are processed.
  • the communication device according to the embodiment of the present invention may also be other devices, which is not limited by the present invention.
  • the communication device of the embodiment of the invention has high heat dissipation capability and high corrosion resistance, and is suitable for outdoor application scenarios.
  • the magnesium alloy casing 102 of the embodiment of the present invention may constitute a complete closed cavity, or may constitute a half cavity, by fixing the magnesium alloy casing 102 to other equipment or components to form a complete enclosure. Cavity.
  • a closed cavity is formed by screwing or the like.
  • a groove may be provided at the joint of the two parts of the inner cavity, and a sealed inner cavity having a waterproof effect is finally formed by embedding an organic sealing ring having a sealing effect in the groove.
  • the magnesium alloy shell assumes the function of deriving and dissipating the heat generated by the electronic components in the closed inner cavity to the external environment, and the magnesium alloy casing protects the functional components such as the PCB and the power module located therein. .

Abstract

一种通信设备，包括电子部件和镁合金壳体。镁合金壳体使用的镁合金材料的组成按质量百分比为：铝：小于10％，稀土元素：1％～10％，锰：小于1％，锌：小于1％，锆：小于1％，钙：小于3％，其余为镁和不可避免的杂质。

Description

通信设备
本申请要求于2015年06月18日提交中国专利局、申请号为201510340994.6、发明名称为“通信设备”的中国专利申请的优先权，其全部内容通过引用结合在本申请中。
技术领域
本发明涉及通信设备领域，尤其涉及通信设备。
背景技术
镁合金作为最轻的结构材料，具有质量轻、比强度高、电磁屏蔽及减震性能好、成形性能优良等优点，在航空航天、汽车、电子消费产品中得到广泛应用，并且其应用领域正在迅速拓展。近年来，随着通信设备朝轻量化的方向发展，传统铝合金由于密度较大逐渐不能满足应用要求，镁合金凭借其质轻的显著优点迅速进入通信设备的应用领域。
然而，通信设备的功耗、工作环境及设备自身的结构特点决定了应用于通信设备上的材料需综合具备高热导率、高耐蚀、高结构力学性能及加工成形性能。而热导率、力学性能及成形性能之间往往相互影响，甚至是相互矛盾，限制了镁合金在通信设备上的广泛应用。因此，需要提出一种采用镁合金材料的通信设备，以同时满足轻量化通信设备对散热性、耐蚀性、力学性能、成形加工性能等各方面的综合要求。
发明内容
本发明实施例提供了一种通信设备，能够满足轻量化通信设备在散热性、耐蚀性、力学性能和成形加工性能上的要求。
第一方面，提供了一种通信设备，所述通信设备包括电子部件和镁合金壳体，所述电子部件设置在所述镁合金壳体形成的封闭内腔中，且与所述内腔的腔壁相接触，所述镁合金壳体用于将所述电子部件与外界相隔离，且用于将所述电子部件产生的热量散发出去，所述镁合金壳体使用的镁合金材料中各组分按质量百分数配置如下：
铝：小于10％；
稀土元素：1％～10％；
锰：小于1％；
锌：小于1％；
锆：小于1％；
钙：小于3％；
其余为镁和不可避免的杂质。
结合第一方面，在第一方面的第一种可能实现方式中，所述镁的含量为75％～97％。
结合第一方面，在第一方面的第二种可能实现方式中，所述镁合金材料中各组分按质量百分数配置如下：
铝：3％～6％；
稀土元素：3％～6％；
锰：0.1％～0.5％；
锌：小于0.5％；
锆：小于0.5％；
钙：小于0.5％；
其余为镁和不可避免的杂质。
结合第一方面、第一方面的第一种可能实现方式或第一方面的第二种可能实现方式，在第一方面的第三种可能实现方式中，所述镁的含量为86％～93％。
结合第一方面或第一方面的第一种可能实现方式至第一方面的第三种可能实现方式中任一种可能实现方式，在第一方面的第四种可能实现方式中，所述镁合金壳体的外侧表面设置散热翅片。
结合第一方面或第一方面的第一种可能实现方式至第一方面的第四种可能实现方式中任一种可能实现方式，在第一方面的第五种可能实现方式中，所述镁合金外壳采用压铸成形。
结合第一方面或第一方面的第一种可能实现方式至第一方面的第五种可能实现方式中任一种可能实现方式，在第一方面的第六种可能实现方式中，所述通信设备为射频模块，所述电子部件包括：印制电路板PCB和电源模块，所述PCB用于对接收到的信号进行处理，所述电源模块用于为设置在所述PCB上的器件提供电源。
结合第一方面的第六种可能实现方式，在第一方面的第七种可能实现方式中，所述射频模块固定在天线围框上，用于对从所述天线围框接收到的信号进行处理。
基于上述技术方案，本发明实施例的通信设备采用特定组分含量的镁合金材料制备的镁合金壳体，由于该镁合金材料具备高散热性、高耐蚀性、高结构力学性能和高成形加工性能，因此本发明实施例的通信设备能够满足轻量化通信设备对散热性、耐蚀性、力学性能和成形加工性能的要求。
附图说明
为了更清楚地说明本发明实施例的技术方案，下面将对本发明实施例中所需要使用的附图作简单地介绍，显而易见地，下面所描述的附图仅仅是本发明的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1是根据本发明实施例的通信设备的剖面示意图。
图2是根据本发明实施例的通信设备的外壳的示意图。
具体实施方式
下面将结合本发明实施例中的附图，对本发明实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例是本发明的一部分实施例，而不是全部实施例。基于本发明中的实施例，本领域普通技术人员在没有做出创造性劳动的前提下所获得的所有其他实施例，都应属于本发明保护的范围。
本发明实施例提供了一种通信设备100。如图1所示，通信设备100包括电子部件101和镁合金壳体102，电子部件101设置在镁合金壳体102形成的封闭内腔中，且与内腔的腔壁相接触，镁合金壳体102用于将电子部件101与外界相隔离，且用于将电子部件101产生的热量散发出去。
电子部件101可以与内腔的腔壁直接接触，也可以与内腔的腔壁间接接触，本发明实施例对此并不限定。
应理解，图1所示电子部件101包括101a和101b两部分，但本发明并不限于此，电子部件101可以为一个整体，也可以包括由多个部分的电子元件组成的电子部件。
镁合金壳体102使用的镁合金材料中各组分按质量百分数配置如下：
铝：小于10％；
稀土元素：1％～10％；
锰：小于1％；
锌：小于1％；
锆：小于1％；
钙：小于3％；
其余为镁和不可避免的杂质。
例如，该镁合金材料中不可避免的杂质可以为硅、铁、铜、镍等中的一种或几种的混合物。
其中，稀土元素指镧、铈、镨、钕中的一种或者几种稀土元素的混合物。
各组分可以在上述范围内根据需要进行调整，本发明实施例对此并不限定。例如，铝的含量可以为2％～3％，或3％～4％，或4％～5％，或5％～6％等。稀土元素的含量可以为2％～3％，或3％～4％，或4％～5％，7％～8％等。
经测试研究，轻量化通信设备要求镁合金外壳采用的镁合金材料具备如下特性：热导率≥75W/MK，布氏硬度≥40，抗拉强度≥120Mpa，屈服强度≥90Mpa，延伸率≥0.5％，在同等状态下该镁合金材料的中性盐雾腐蚀速率小于或等于镁合金AZ91D的中性盐雾的腐蚀速率，在同等工艺状态下，该镁合金材料的螺旋或之字的流动长度大于镁合金AZ91D的螺旋或之字的流动长度的50％。
经测试，本发明实施例中的镁合金壳体使用的镁合金材料能满足轻量化通信设备以上对热导率、耐蚀性、结构力学性能、高成形加工性能的综合要求。
由于本发明实施例的镁合金材料具有高热导率，因此镁合金壳体102能够及时将电子部件101产生的热量传导到镁合金壳体102与外界环境的接触面并散发出去。还可以在电子部件101与镁合金壳体102的内腔之间的缝隙内填充导热介质(如导热硅脂)，以增加电子部件101与镁合金壳体102的内腔的接触面积，使得电子部件101产生的热量能够快速的传导到镁合金壳体102上。
而且，本发明实施例的镁合金壳体102还具有优异的耐蚀性能，通过将环境与壳体内部的电子部件101相隔离，避免电子部件101与环境直接接触而腐蚀失效，能够抵抗环境的侵蚀，更好地对电子部件101进行保护。
另外，由于本发明实施例的镁合金材料具有高抗拉强度、高屈服强度和延伸率，因此本发明实施例的镁合金壳体102具备高的连接可靠性以及高的结构可靠性，能够与其他通信设备或部件可靠地连接，并对内部的电子元件101起到高可靠性的保护作用。
由于本发明实施例的镁合金材料具有高散热性、高耐蚀性、高结构力学性能和高成形加工性能，因此该镁合金材料制作的镁合金壳体102能够具备高效散热性、高耐蚀性、高结构强度，可以实现轻量化通信设备的快速散热及户外应用。
本发明实施例的通信设备采用特定组分含量的镁合金材料制备的镁合金壳体，由于该镁合金材料具备高散热性、高耐蚀性、高结构力学性能和高成形加工性能，因此本发明实施例的通信设备能够满足轻量化通信设备对散热性、耐蚀性、力学性能和成形加工性能的要求。
可选地，镁的含量为75％～97％。
可选地，该镁合金材料中各组分按质量百分数配置如下：
铝：3％～6％；
稀土：3％～6％；
锰：0.1％～0.5％；
锌：小于0.5％；
锆：小于0.5％；
钙：小于0.5％；
其余为镁和不可避免的杂质。
可选地，镁的含量为86％～93％。
表1所示为现有通信设备中通常采用的几种镁合金材料性能的典型数值和表现。结合表1可以看出，现在采用的镁合金材料无法同时满足轻量化通信设备对高热导率、高耐蚀、高结构力学性能、高成形加工性能的综合要求。而本发明实施例的通信设备的镁合金材料能够同时满足轻量化通信设备对高热导率、高耐蚀、高结构力学性能、高成形加工性能的综合要求。
表1中，耐蚀性和成形能力的取值范围为1～5，取值越大，分别表示耐蚀性和成形能力越差。
本发明实施例的镁合金壳体具有高热导率，能够满足通信设备对高散热性的要求，且具备高的连接可靠性如螺纹可靠性、高的结构可靠性，还具备 优秀的耐蚀性，因此本发明实施例的通信设备能够直接暴露在户外环境中。
表1
Figure PCTCN2016072499-appb-000001
可选地，镁合金壳体102的外侧表面设置散热翅片，如图2所示。这样能够增大散热面积，提高散热效率。
可选地，散热翅片的高度≥30mm，散热翅片的厚度≤1.8mm。
可选地，散热翅片的高度≥50mm，散热翅片的厚度≤1.2mm。
由于本发明实施例的镁合金材料具有优秀的成形能力，因此能够成形复杂的薄壁结构，即能够制作齿高且薄的散热翅片，这将大大增大散热面积，进一步提高散热效率。
可选地，镁合金壳体102采用压铸成形。
镁合金壳体102也可以采用其他工艺成形，本发明实施例对此并不限定。
可选地，该通信设备可以为射频模块。相应地，如图1所示101a为印制电路板(Printed Circuit Board，简称PCB)101a，101b为电源模块，PCB101a用于对信号进行处理，电源模块101b用于为设置在PCB101a上的器件提供电源。
可选地，上述实施例所述的射频模块，固定在天线围框上，用于对天线 围框收集的信号进行处理。
应理解，根据本发明实施例的通信设备还可以为其他设备，本发明对此并不限定。
本发明实施例通信设备在具有高效散热能力的同时，兼具高防腐蚀性能，适用于户外应用场景。
应理解，本发明实施例的镁合金壳体102可以构成一个完整的封闭内腔，也可以构成一个半腔，通过将该镁合金壳体102固定在其他设备或部件上形成一个完整的封闭内腔。
当镁合金壳体与固定在其内腔的电子部件(如PCB、电源模块等)作为一个整体，与另外一个壳体或者另外一个非壳体部件，通过螺钉等连接方式形成一个具有封闭内腔的通信设备时，可以在内腔的两部分结合处设置凹槽，通过在凹槽中嵌入具有密封效果的有机物密封圈，最终形成一个具有防水效果的封闭内腔。镁合金壳体承担将电子部件在封闭内腔中因工作而产生的热量导出并散发到外界环境中的功能，同时镁合金壳体对位于其内部的PCB、电源模块等功能元器件起保护作用。
以上所述，仅为本发明的具体实施方式，但本发明的保护范围并不局限于此，任何熟悉本技术领域的技术人员在本发明揭露的技术范围内，可轻易想到变化或替换，都应涵盖在本发明的保护范围之内。因此，本发明的保护范围应以所述权利要求的保护范围为准。

Claims (8)

  1. 一种通信设备，其特征在于，所述通信设备包括电子部件和镁合金壳体，所述电子部件设置在所述镁合金壳体形成的封闭内腔中，且与所述内腔的腔壁相接触，所述镁合金壳体用于将所述电子部件与外界相隔离，且用于将所述电子部件产生的热量散发出去，所述镁合金壳体使用的镁合金材料中各组分按质量百分数配置如下：
    铝：小于10％；
    稀土元素：1％～10％；
    锰：小于1％；
    锌：小于1％；
    锆：小于1％；
    钙：小于3％；
    其余为镁和不可避免的杂质。
  2. 根据权利要求1所述的通信设备，其特征在于，所述镁的含量为75％～97％。
  3. 根据权利要求1所述的通信设备，其特征在于，所述镁合金材料中各组分按质量百分数配置如下：
    铝：3％～6％；
    稀土元素：3％～6％；
    锰：0.1％～0.5％；
    锌：小于0.5％；
    锆：小于0.5％；
    钙：小于0.5％；
    其余为镁和不可避免的杂质。
  4. 根据权利要求1至3中任一项所述的通信设备，其特征在于，所述镁的含量为86％～93％。
  5. 根据权利要求1至4中任一项所述的通信设备，其特征在于，所述镁合金壳体的外侧表面设置散热翅片。
  6. 根据权利要求1至5中任一项所述的通信设备，其特征在于，所述镁合金壳体采用压铸成形。
  7. 根据权利要求1至6中任一项所述的通信设备，其特征在于，所述 通信设备为射频模块，所述电子部件包括：印制电路板PCB和电源模块，所述PCB用于对接收到的信号进行处理，所述电源模块用于为设置在所述PCB上的器件提供电源。
  8. 根据权利要求7所述的通信设备，其特征在于，所述射频模块固定在天线围框上，用于对从所述天线围框接收到的信号进行处理。
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