WO2016201879A1 - 电路板、电路板组件和液晶显示装置 - Google Patents

电路板、电路板组件和液晶显示装置 Download PDF

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Publication number
WO2016201879A1
WO2016201879A1 PCT/CN2015/094970 CN2015094970W WO2016201879A1 WO 2016201879 A1 WO2016201879 A1 WO 2016201879A1 CN 2015094970 W CN2015094970 W CN 2015094970W WO 2016201879 A1 WO2016201879 A1 WO 2016201879A1
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WIPO (PCT)
Prior art keywords
circuit board
board
circuit
matching
pattern
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PCT/CN2015/094970
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English (en)
French (fr)
Inventor
徐健
程鸿飞
马永达
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京东方科技集团股份有限公司
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Application filed by 京东方科技集团股份有限公司 filed Critical 京东方科技集团股份有限公司
Priority to US15/300,397 priority Critical patent/US10634964B2/en
Publication of WO2016201879A1 publication Critical patent/WO2016201879A1/zh

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    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements

Definitions

  • Embodiments of the present invention relate to a circuit board including a circuit board assembly of the circuit board and a liquid crystal display device.
  • circuit boards and matching boards that are attached to each other.
  • the above-described mutually bonded circuit boards and matching boards are included.
  • a circuit board for fitting to a matching board to be attached including a first circuit pattern and a fit a state inspection area, wherein the fit state inspection area further includes a third circuit pattern.
  • the matching board includes a second circuit pattern that matches the circuit board.
  • the first circuit pattern and the third circuit pattern are the same height and the same material.
  • the third circuit pattern includes a plurality of sub-portions distributed in the conforming state inspection region, and each sub-portion does not overlap each other in the length direction of the conforming state inspection region.
  • the third circuit pattern includes a plurality of sub-portions distributed in the conforming state inspection region, wherein one of the sub-portions overlaps with the other sub-portions in the length direction of the conforming state inspection region.
  • the circuit board is provided with two of the bonding state inspection areas, and the two of the bonding state inspection areas are respectively located at two sides of the first circuit pattern.
  • the circuit board further includes at least one board alignment mark, each of the board alignment marks including at least two sub-alignment marks disposed at intervals.
  • the position of the board in the horizontal direction of the alignment mark is entirely in the middle of the fitting state inspection area.
  • the middle portion of the inspection state in the fitting state refers to the area of 1/2 in the middle of the inspection state inspection area, that is, from 1/4 of the inspection state inspection area to 3/4 of the inspection state inspection area. Between the two.
  • the height of the board alignment mark is the same as the height of the first circuit pattern and the material is the same.
  • the circuit board is part of a display panel.
  • a liquid crystal display device including a matching board and a circuit board bonded to the matching board, wherein the circuit board is the above-described circuit provided by an embodiment of the present invention board.
  • the mating board is a flexible printed circuit board.
  • Conductive particles are present in a region where the third circuit pattern is not disposed in the bonding state inspection region of the board.
  • the conductive particles are present in the area occupied by the third circuit pattern (i.e., the vacant area) in the bonding state inspection area of the board.
  • the pressure of the conductive particles in different regions of the length of the circuit board is approximated by the first circuit pattern and the second circuit.
  • the conductive particles are subjected to pressure. Therefore, by detecting the deformation state of the conductive particles in the vacant area at different positions, the fitting state between the circuit board and the matching board can be accurately determined.
  • Figure 1 is a schematic illustration of a matching plate.
  • FIG. 2 is a schematic diagram of a circuit board.
  • FIG. 3 is a schematic diagram of an embodiment of a circuit board provided by an embodiment of the present invention.
  • FIG. 4 is a schematic illustration of a matching board that mates with the circuit board shown in FIG.
  • Figure 5 is a diagram showing the electrical circuit formed after the circuit board shown in Figure 3 and the matching board shown in Figure 4 are correctly aligned. Schematic diagram of the board assembly.
  • Figure 6 is a schematic illustration of a misalignment of the circuit board shown in Figure 3 and the matching board shown in Figure 4.
  • Figure 7 is a schematic illustration of a misalignment of the circuit board shown in Figure 3 and the matching board shown in Figure 4.
  • FIG. 8 is a schematic diagram of an embodiment of a circuit board provided by an embodiment of the present invention.
  • FIG. 9 is a schematic diagram of an embodiment of a circuit board provided by an embodiment of the present invention.
  • Fig. 10 is a view showing a state before the mating plate of Fig. 1 and the circuit board of Fig. 2 are attached.
  • Fig. 11 is an enlarged view showing a detection area in the case of a fitting of the matching board and the circuit board shown in Fig. 10.
  • Fig. 12 is an enlarged view showing the detection area in the case of the fitting shown in Fig. 5.
  • Matching board 11 Second circuit pattern
  • circuit board 2 shows a circuit board 2 which is an external lead terminal area (PAD) of the edge of the array substrate in the liquid crystal display panel, and the matching board 1 shown in FIG. 1 is the circuit board shown in FIG.
  • a 2-phase bonded flexible printed circuit board (FPC) the matching board 1 and the circuit board 2 are bonded together by conductive particles and electrically connected.
  • the circuit board 2 includes a first circuit pattern 21 and a bonding state inspection area 23, and the bonding state Conductive particles are disposed in the inspection region 23, and accordingly, the matching plate 1 includes a second circuit pattern 11 corresponding to the circuit board 2.
  • the second circuit pattern 11 has the same shape as the first circuit pattern 21, that is, has the same circuit configuration.
  • the pressure applied to the matching board 1 and the circuit board 2 by the device indenter for bonding the matching board 1 to the circuit board 2 is a predetermined pressure, which ensures the circuit between the first circuit pattern 21 and the second circuit pattern 11. All of the conductive particles in the length direction of the circuit reach a pressed state. Since there is a height difference between the bonding state inspection area 23 and the side circuit pattern in the longitudinal direction of the circuit board, the fitting state inspection area 23 has a large receiving space for accommodating the conductive particles, thereby failing to ensure the bonding state inspection area.
  • the conductive particles of 23 are in a state of being pressed open throughout the length of the circuit, so that the pressed state of a certain position in the longitudinal direction of the board is deviated from the true state.
  • FIG. 10 shows the matching board and the circuit board before bonding, wherein the circuit board is covered with an anisotropic conductive layer.
  • a glue in which conductive particles are present in the conductive paste For the sake of simplicity, the conductive paste and conductive particles are not shown in Figures 1-9. It should be noted that the conductive particles lose the conductive effect in the case of fracturing, but have conductive properties in the case of normal pressing.
  • Fig. 11 is an enlarged view showing the right side detection area in a fitting state of the matching board and the circuit board shown in Fig. 10.
  • the space in the longitudinal direction of the detecting area is large, there is no blocking, and the particles move in the direction of small pressure.
  • a conductive particle increasing region is formed on the upper side. At this time, particles are normally opened on the lower side of the detecting region, but the particles in the circuit of the non-detecting region are unable to move due to the pressure of the upper and lower circuits, resulting in a force-receiving ratio particle.
  • Fig. 12 is an enlarged view of the right detection area of the attached state of Fig. 5;
  • the third circuit pattern disposed in the circuit board makes the detection area space small, and when the particles are under pressure, each area has The barrier allows the particles to be in only the corresponding zone, so that the device pressure is brought closer to the pressure of the conductive particles in the circuit area. For example, in FIG.
  • the conductive particles in the upper and lower portions of the detection region are blocked by the third circuit existing in the middle, and the conductive particles in the middle portion of the detection region are blocked by the third circuit existing in the upper and lower portions, which makes the A region and the B
  • the conductive particles in the region and the C region respectively reflect the bonding states of the upper, middle, and lower portions of the matching board and the circuit board in the longitudinal direction of the circuit in the first circuit pattern and the second circuit pattern, respectively.
  • an embodiment of the present invention provides a circuit board 2 for attaching to a matching board 1 to be attached (as shown in FIG. 4).
  • the circuit board 2 includes a first circuit pattern 21 and a bonding state inspection area 23, and the matching board 1 includes a second circuit pattern 11 matched with the circuit board 2, wherein the bonding state inspection area 23 further includes a third circuit pattern 23a. .
  • the second circuit pattern 11 on the matching board 1 since the second circuit pattern 11 on the matching board 1 is matched with the circuit board 2, the second circuit pattern 11 includes a portion matching the first circuit pattern 21 and the same as in the bonding state inspection area.
  • the matching portion of the three-circuit pattern 23a For convenience of description, a portion of the second circuit pattern 11 that matches the first circuit pattern is referred to as a matching pattern, and the shape of the matching pattern is the same as that of the first circuit pattern 21 disposed on the circuit board 2, that is, The matching pattern has the same circuit structure as the first circuit pattern.
  • the portion of the second circuit pattern that matches the bonding state inspection region is referred to as a detection pattern (in FIG. 4, the portion of the dotted line frame filled with the oblique line is the detection pattern).
  • the region in which the third circuit pattern 23a is not provided in the bonding state inspection region 23 of the circuit board 2 i.e., the vacant region 23b
  • the conductive particles function to electrically connect the first circuit pattern 21 of the bonded circuit board 2 and the circuit in the second circuit pattern of the matching board 1. Since the third circuit pattern 23a has a plurality of sub-portions, when the circuit board 2 and the matching board 1 are attached, a part of the detection pattern is attached to the third circuit pattern 23a, and the other portions on the detection pattern and the vacant area 23b are detected. The conductive particles are in contact.
  • the segmented structure of the third circuit pattern 23a over the length of the circuit causes the pressure of the conductive particles to be received in different regions of the length of the board, similar to the first circuit pattern 21 and the second circuit pattern 11
  • the bonding state between the circuit board 2 and the matching board 1 can be accurately determined by detecting the deformation state of the conductive particles in the vacant area 23b at different positions.
  • the specific structure of the third circuit pattern 23a is not particularly limited, and the structure of the third circuit pattern 23a can be determined according to the structure of the matching pattern.
  • the third circuit pattern includes a plurality of sub-portions distributed in the inspection state inspection region, and each sub-portion does not overlap each other in the longitudinal direction of the conforming state inspection region.
  • the shape of the third circuit pattern 23a may be as shown in FIG. 3, including three sub-portions. One sub-portion is formed as an upper portion of the strip electrode, one sub-portion is formed as an intermediate portion of the strip-shaped electrode, and a sub-portion is formed as an intermediate portion of the strip-shaped electrode. These three sub-portions have no overlapping areas with each other in the length direction.
  • the third circuit pattern 23a includes two sub-portions.
  • One of the sub-portions is the lower half of the strip electrode, and the other sub-portion is the upper half of the strip electrode, and the two sub-portions have no overlapping regions with each other in the longitudinal direction. It should be explained that "there is no overlap with each other in the longitudinal direction" means that the sub-portions are projected onto the strip electrodes, and the projections of the respective sub-portions on the strip electrodes do not overlap.
  • the third circuit pattern includes a plurality of sub-portions distributed in the inspection state inspection area, wherein one of the sub-portions overlaps with the other sub-portions in the longitudinal direction of the conforming state inspection zone.
  • the shape of the third circuit pattern 23a may be as shown in FIG. 9, including four sub-portions, wherein one sub-portion is an upper portion of the strip electrode, and the other The sub-portion is the lower portion of the strip electrode, and the shape of one sub-portion is the same as that of the strip electrode, and the shape of the other sub-portion is the middle of the strip electrode.
  • the sub-portion having the same shape as the strip electrode is located in the middle of the conforming state inspection region 23, and the remaining sub-portions are respectively located on both sides of the sub-portion having the same shape as the strip electrode.
  • the sub-portions on both sides may form a projection on the sub-portion located in the middle, and therefore, one sub-portion in the middle and three sub-portions on both sides thereof have overlapping regions in the longitudinal direction of the conforming state inspection region.
  • the "longitudinal direction of the bonding state inspection region” means the vertical direction in the drawing.
  • the manner of setting the third circuit pattern 23a is not particularly limited, and the third circuit pattern 23a may be formed after the first circuit pattern 21 is formed. In order to simplify the manufacturing process, in some embodiments.
  • the first circuit pattern 21 and the third circuit pattern 23a may be formed in the same step patterning process such that the height of the third circuit pattern 23a is the same as the height of the first circuit pattern 21 and the materials are the same.
  • a bonding state inspection region 23 may be provided on the circuit board 2, or two bonding state inspection regions 23 may be provided on the circuit board 2.
  • a detection pattern should also be provided on the matching board 1; when two bonding state inspection areas 23 are provided on the circuit board 2, correspondingly, two detection patterns should be provided on the matching board 1.
  • two bonding state inspection regions 23 are provided on the circuit board 2 to more accurately judge the bonding state of the circuit board 2 and the matching board 1. In order not to hinder the normal operation of the circuit pattern in the first circuit pattern 21, in some embodiments, the two bonding state inspection regions 23 may be disposed on both sides of the first circuit pattern 21, respectively.
  • the board alignment mark and the matching alignment mark can be respectively set on the board 2 and the matching board 1. Before the board 2 and the mating board 1 are attached, the board 2 and the matching board 1 are first aligned by the board alignment mark on the board 2 and the matching alignment mark on the matching board 1.
  • the board alignment mark provided on the circuit board provided by the embodiment of the present invention may be the same as the board alignment mark 22 provided on the circuit board in FIG. 2, and correspondingly, the alignment mark on the matching board 1 It may be the same as the matching board registration mark 12 shown in FIG.
  • the circuit board 2 may further include at least one circuit board alignment mark 22, each of the circuit board alignment marks 22 including at least two sub-alignment marks disposed at intervals, in the figure 3.
  • the two sub-alignment marks are the sub-alignment mark 22a and the sub-alignment mark 22b, respectively.
  • the matching board alignment mark 12 on the matching board 1 is matched with the board alignment mark 22 on the board 2.
  • the matching plate registration mark 12 is formed with a horizontal portion matching the interval between the sub-alignment mark 22a and the sub-alignment mark 22b.
  • the width of the horizontal portion is the same as the width between the sub-alignment mark 22a and the sub-alignment mark 22b.
  • the sub-alignment mark 22a is a "T" shape
  • the sub-alignment mark 22b is an "inverted T” shape, or, in one In the board registration mark 22, the sub-alignment mark 22a and the sub-alignment mark 22b are both "ten” shaped.
  • the matching board alignment mark 12 on the matching board 1 may be a "ten" shape.
  • FIG. 5 Shown in Figure 5 is the case where the circuit board 2 of Figure 3 is properly aligned with the matching board 1 of Figure 4, in which case the horizontal portion of the matching board alignment mark 12 is located exactly at the sub-alignment mark. In the interval between 22a and the sub-alignment mark 22b.
  • the regions A, B, C, D, E, and F in FIG. 5 are the regions corresponding to the vacant regions 23b on the circuit board 2, and the states of the conductive particles in the regions A, B, C, D, E, and F can be observed. It is judged whether the circuit board 2 and the matching board 1 are properly attached.
  • Shown in Fig. 6 is a case where the circuit board 2 is misaligned with the matching board 1.
  • the state of the interval in the board registration mark 22 it can be known that the position of the board 2 is too high.
  • the state of the bonded state can still be determined by observing the state of the conductive particles in the upper portion of the fitting state inspection region.
  • FIG. 7 What is shown in Fig. 7 is another case where the circuit board 2 is misaligned with the matching board 1.
  • the state of the interval in the alignment mark it can be known that the position of the circuit board 2 is too low.
  • the state of the bonded state can still be determined by observing the state of the conductive particles in the lower portion of the fitting state inspection region.
  • the third circuit pattern is set to have a plurality of sub-portions, even if the circuit board and the matching board are not accurately aligned in the longitudinal direction of the circuit board 2 (ie, the left-right direction in FIGS. 6 and 7) , the inspection of the fit state can still be completed through its sub-parts.
  • the board alignment mark 22 includes two sub-alignment marks, it is only necessary to observe whether the interval between the sub-alignment marks is filled by the horizontal portion of the matching board registration mark on the matching board 1, or is it other parts. When filled, it can be judged whether the circuit board and the matching board are fitted in the correct position, no complicated measurement is needed, the fitting process is simplified, and the time cost is saved.
  • the board alignment mark can also play a role in assisting the flattening, further ensuring that the detected pattern is in a non-floating state.
  • the position of the board in the horizontal direction of the alignment mark is entirely in the middle of the fitting state inspection area.
  • the board alignment mark may be formed after the first circuit pattern is formed, or the board alignment mark may be formed while forming the first circuit pattern. In order to simplify the manufacturing process, in some embodiments, the board alignment mark is formed while forming the first circuit pattern such that the height of the board alignment mark is the same as the height of the first circuit pattern And the materials are the same.
  • the circuit board 2 provided by an embodiment of the present invention may be part of a display panel.
  • the circuit board 2 may be an external lead terminal area of the edge of the array substrate of the display panel.
  • Embodiments of the present invention provide a display panel including the circuit board 2 described above.
  • a liquid crystal display device including a circuit board 2 and a matching board 1 attached to the circuit board 2, wherein the circuit board 2 is an implementation of the present invention
  • the above circuit board is provided by the example.
  • the conductive in the vacant area 23b at different positions is detected.
  • the deformation state of the particles makes it possible to more accurately judge the bonding state between the circuit board 2 and the matching board 1, so that it is possible to accurately judge whether or not the liquid crystal display device is a good product.
  • the circuit board 2 may be a rigid circuit board, and accordingly, the matching board 1 may be a flexible printed circuit board.
  • the circuit board 2 may be an external circuit terminal area of the edge of the array substrate of the display panel, and the matching board 1 is a flexible printed circuit board that is in contact with the circuit board 2.

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  • Physics & Mathematics (AREA)
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  • Mathematical Physics (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
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Abstract

一种电路板(2)，所述电路板(2)用于与匹配板(1)相贴合，所述电路板(2)包括第一电路图形(21)和贴合状态检查区(23)，其中，所述贴合状态检查区(23)还包括第三电路图形(23a)。一种液晶显示装置，其包括所述电路板(2)和所述匹配板(1)，所述匹配板(1)上包括与电路板(2)相匹配的第二电路图形(11)。当电路板(2)和匹配板(1)贴合后，通过检测不同位置的空置区中的导电颗粒的变形状态，即可较为准确的判断电路板(2)和匹配板(1)之间的贴合状态。

Description

电路板、电路板组件和液晶显示装置 技术领域
本发明的实施例涉及一种电路板，包括该电路板的电路板组件和液晶显示装置。
背景技术
在电子电路领域中，存在互相贴合的电路板和匹配板。例如，在液晶显示装置中就包括上述互相贴合的电路板和匹配板。
如何准确地判断电路板与匹配板之间的贴合状态是本领域亟待解决的技术问题。
发明内容
本发明的实施例的目的在于提供一种电路板和一种包括该电路板的电路板组件，将所述电路板和相应的匹配板贴合时，可以准确地判断该电路板与匹配板的贴合状态。
为了实现上述目的，作为本发明的实施例的一个方面，提供一种电路板，所述电路板用于与待贴合的匹配板相贴合，所述电路板包括第一电路图形和贴合状态检查区，其中，所述贴合状态检查区还包括第三电路图形。在一些实施例中，所述匹配板上包括与电路板相匹配的第二电路图形。
在一些实施例中，所述第一电路图形和第三电路图形高度相同且材料相同。
在一些实施例中，所述第三电路图形包括分布在贴合状态检查区的多个子部分，且各子部分在贴合状态检查区的长度方向上互相间没有重叠的区域。
在一些实施例中，所述第三电路图形包括分布在贴合状态检查区的多个子部分，其中一个子部分与其它子部分在贴合状态检查区的长度方向上均有重叠区域。
在一些实施例中，所述电路板上设置有两个所述贴合状态检查区，该两个所述贴合状态检查区分别位于所述第一电路图形的两侧。
在一些实施例中，所述电路板还包括至少一个电路板对位标记，每个所述电路板对位标记均包括间隔设置的至少两个子对位标记。
在一些实施例中，所述电路板对位标记的水平方向的位置整体处于所述贴合状态检查区的中部。此处的处于贴合状态检查区的中部是指在贴合状态检查区的中间1/2的区域内，即从贴合状态检查区的1/4处至贴合状态检查区的3/4处之间。
在一些实施例中，所述电路板对位标记的高度与所述第一电路图形高度相同且材料相同。
在一些实施例中，所述电路板为显示面板的一部分。
作为本发明的实施例的另一个方面，提供一种液晶显示装置，包括匹配板和与所述匹配板贴合的电路板，其中，所述电路板为本发明的实施例所提供的上述电路板。
在一些实施例中，所述匹配板为柔性印刷电路板。
在电路板的贴合状态检查区中未设置第三电路图形的区域中具有导电颗粒。换句话说，在电路板的贴合状态检查区中被第三电路图形占据的区域(即空置区)中具有导电颗粒。当电路板和匹配板贴合后，由于第三电路图形在电路长度上的分段结构，使导电颗粒在电路板长度方向上的不同区域受到的压力，近似于第一电路图形与第二电路图形贴合时导电颗粒受到的压力，所以，通过检测不同位置的空置区中的导电颗粒的变形状态，即可较为准确的判断电路板和匹配板之间的贴合状态。
附图说明
为了更清楚地说明本发明实施例的技术方案，下面将对实施例的附图作简单地介绍，显而易见地，下面描述中的附图仅仅涉及本发明的一些实施例，而非对本发明的限制。
图1是一种匹配板的示意图。
图2是一种电路板的示意图。
图3是本发明的实施例所提供的电路板的一种实施方式的示意图。
图4是与图3中所示的电路板匹配的匹配板的示意图。
图5是图3中所示的电路板和图4中所示的匹配板正确对位后形成的电 路板组件的示意图。
图6是图3中所示的电路板和图4中所示的匹配板一种错位情况的示意图。
图7是图3中所示的电路板和图4中所示的匹配板的一种错位情况的示意图。
图8是本发明的实施例所提供的电路板的一种实施方式的示意图。
图9是本发明的实施例所提供的电路板的一种实施方式的示意图。
图10是图1的匹配板和图2的电路板在贴合之前的状态的示意图。
图11示出了图10所示的匹配板和电路板的一种贴合情况下检测区的放大图。
图12示出了图5所示的贴合情况下检测区的放大图。
附图标记具有如下含义：
1：匹配板                 11：第二电路图形
12：匹配对位标记          2：电路板
21：第一电路图形          22：电路板对位标记
23：贴合状态检查区        22a：子对位标记
22b：子对位标记           23a：第三电路图形
23b：空置区
具体实施方式
为使本发明实施例的目的、技术方案和优点更加清楚，下面将结合本发明实施例的附图，对本发明实施例的技术方案进行清楚、完整地描述。显然，所描述的实施例是本发明的一部分实施例，而不是全部的实施例。基于所描述的本发明的实施例，本领域普通技术人员在无需创造性劳动的前提下所获得的所有其他实施例，都属于本发明保护的范围。
图2示出了电路板2，其为液晶显示面板中的阵列基板边缘的外引电路端子区(PAD)，而图1中所示的匹配板1则为与图2中所示的电路板2相贴合的柔性印刷电路板(FPC)，匹配板1和电路板2通过导电颗粒胶相贴合并导电连接。
通常，电路板2包括第一电路图形21和贴合状态检查区23，贴合状态 检查区23中设置有导电颗粒，相应地，匹配板1包括对应于电路板2的第二电路图形11。第二电路图形11与第一电路图形21的形状相同，即，具有相同的电路结构。通过匹配对位标记12和电路板对位标记22将电路板2和匹配板1贴合时，匹配板1上的所述第二电路图形与导电颗粒相接触，通过在贴合状态检查区23观察导电颗粒的变形情况来判断匹配板1与电路板2之间的贴合状态。
用于将匹配板1与电路板2贴合的设备压头对匹配板1和电路板2施加的压力为预定压力，该预定压力可保证第一电路图形21与第二电路图形11的电路间在电路长度方向上的所有导电颗粒都达到压开状态。由于贴合状态检查区23与旁边电路图形之间在电路板长度方向上均存在高度落差，贴合状态检查区23内有较大的容纳空间来容纳导电颗粒，从而无法保证贴合状态检查区23的导电颗粒在整个电路长度方向上都处于压开状态，所以，会使检查到的电路板长度方向上某一位置的压合状态偏离真实状态较多。
为了解释图1的匹配板和图2的电路板在贴合状态下导电颗粒的情况，图10示出了贴合前的匹配板和电路板，其中电路板上覆盖了一层各向异性导电胶，其中该导电胶中存在导电颗粒。为了简单起见，该导电胶和导电颗粒在图1-9中并没有示出。需要说明的是，该导电颗粒在压裂的情况下会丧失导电效果，但是在正常压开的情况下具有导电特性。
图11示出了在图10所示的匹配板和电路板的一种贴合情况中，右侧检测区的放大图。在图10的匹配板和电路板相互压合的过程中，当设备压力施加在下侧的压力较大时，在检测区电路长度方向上空间较大、无阻挡，粒子向压力小的方向移动，在上侧形成导电颗粒增多区，此时，在检测区下侧有粒子被正常压开，但因非检测区的电路中粒子因上下电路压力使其无法移动，导致其受力比检测区粒子大，会有压裂的粒子出现，丧失导电效果，若果这样的粒子增多，就使电路不能正常工作。在这种情况下，如图11中所示，检查到的电路板长度方向上某一位置的压合状态偏离真实状态较多，比如检测区中处于下侧的正常压开的粒子不能反映电路板的第一电路图形(或者匹配板的第二电路图形)的相应下侧位置处的压裂。
图12是图5的贴合状态的右侧检测区的放大图。如图12中所示，电路板中设置的第三电路图形使检测区空间变小，粒子在受到压力时，各区均有 阻挡部，使粒子只能在对应区中，这样受到的设备压力更接近于电路区的导电粒子受到的压力。比如，在图12中，检测区的上下部分的导电颗粒有存在于中间的第三电路阻挡，检测区的中间部分的导电颗粒有存在于上下部分的第三电路阻挡，这使得A区、B区和C区中的导电颗粒分别真实地反映了匹配板和电路板在第一电路图形和第二电路图形中在电路长度方向上的上部、中部和下部的贴合状态。
如图3、图8和图9中所示，本发明的实施例提供一种电路板2，该电路板2用于与待贴合的匹配板1(如图4所示)相贴合，电路板2包括第一电路图形21和贴合状态检查区23，匹配板1上包括与电路板2相匹配的第二电路图形11，其中，贴合状态检查区23还包括第三电路图形23a。
如上文中所述，由于匹配板1上的第二电路图形11与电路板2相匹配，因此第二电路图形11包括与第一电路图形21相匹配的部分以及与贴合状态检查区中的第三电路图形23a相匹配的部分。为了便于描述，将第二电路图形11中与第一电路图形相匹配的部分称之为匹配图形，所述匹配图形的形状与设置在电路板2上的第一电路图形21的形状相同，即，匹配图形与第一电路图形具有相同的电路结构。相应地，将第二电路图形中与贴合状态检查区相匹配的部分称之为检测图形(图4中，虚线框内填充有斜线的部分即为检测图形)。将电路板2和匹配板1贴合时，匹配板1上的所述匹配图形与电路板2上的第一电路图形21相贴合，匹配板1上的检测图形的一部分与电路板2上的第三电路图形相贴合。
在电路板2的贴合状态检查区23中未设置第三电路图形23a的区域(即，空置区23b)中具有导电颗粒。本领域技术人员应当理解的是，导电颗粒的作用是用于将贴合后的电路板2的第一电路图形21和匹配板1的第二电路图形中的电路导电连接。由于第三电路图形23a具有多个子部分，可以使电路板2和匹配板1贴合时，检测图形的一部分与第三电路图形23a相贴合，而检测图形上的其他部分与空置区23b中的导电颗粒相接触。在这种情况中，第三电路图形23a在电路长度上的分段结构，使导电颗粒在电路板长度方向上的不同区域受到的压力，近似于第一电路图形21与第二电路图形11贴合时导电颗粒受到的压力，所以，通过检测不同位置的空置区23b中的导电颗粒的变形状态，即可较为准确的判断电路板2和匹配板1之间的贴合状态。
在本发明的实施例中，对第三电路图形23a的具体结构并没有特殊的限制，可以根据所述匹配图形的结构来确定第三电路图形23a的结构。
所述第三电路图形包括分布在贴合状态检查区的多个子部分，且各子部分在贴合状态检查区的长度方向上互相间没有重叠的区域。例如，当所述匹配图形为两个平行的条状电极时，第三电路图形23a的形状可以如图3中所示，包括三个子部分。一个子部分形成为条状电极的上部分、一个子部分形成为条状电极的中间部分，还一个子部分形成为条状电极的中间部分。这三个子部分在长度方向上互相间没有重叠区域。或者，如图8中所示，第三电路图形23a包括两个子部分。其中一个子部分为条状电极的下半段，另一个子部分为条状电极的上半段，这两个子部分在长度方向上互相间也没有重叠区域。需要解释的是，此处的“在长度方向上互相间没有重叠”是指，将子部分向条状电极做投影，各个子部分的在条状电极上的投影并没有重叠。
所述第三电路图形包括分布在贴合状态检查区的多个子部分，其中一个子部分与其它子部分在贴合状态检查区的长度方向上均有重叠区域。例如，当所述匹配图形为三条平行的条状电极时，第三电路图形23a的形状可以如图9中所示，包括四个子部分，其中，一个子部分为条状电极的上部，另一个子部分为条状电极的下部，还一个子部分的形状与条状电极相同，再一个子部分的形状为条状电极的中部。形状与条状电极相同的子部分位于贴合状态检查区23的中间，其余的子部分分别位于形状与条状电极相同的子部分两侧。位于两侧的子部分可以在位于中间的子部分上形成投影，因此，位于中间的一个子部分与位于其两侧的三个子部分在贴合状态检查区的长度方向上均有重叠区域。
此处，所谓的“贴合状态检查区的长度方向”是指附图中的上下方向。
在本发明的实施例中，对第三电路图形23a的设置方式并没有特殊的限定，可以在形成了第一电路图形21之后再形成第三电路图形23a，为了简化制造工艺，在一些实施例中，可以在同一步构图工艺中形成第一电路图形21和第三电路图形23a，从而使得第三电路图形23a的高度与第一电路图形21高度相同且材料相同。
可以在电路板2上设置一个贴合状态检查区23，也可以在电路板2上设置两个贴合状态检查区23。当电路板2上设置有一个贴合状态检查区23时， 相应地，匹配板1上也应设置一个检测图形；当电路板2上设置有两个贴合状态检查区23时，相应地，匹配板1上也应设置两个检测图形。
在一些实施例中，在电路板2上设置两个贴合状态检查区23，从而更加准确地判断电路板2和匹配板1的贴合状态。为了不妨碍第一电路图形21中的电路图形的正常工作，在一些实施例中，可以将两个贴合状态检查区23分别设置在第一电路图形21的两侧。
为了确保电路板2和匹配板1可以准确地对位，可以在电路板2和匹配板1上分别设置电路板对位标记和匹配对位标记。在将电路板2和匹配板1贴合之前，首先通过电路板2上的电路板对位标记和匹配板1上的匹配对位标记将电路板2和匹配板1进行对位。
在本发明的实施例中，对电路板对位标记的具体形状并没有特殊的要求。例如，本发明的实施例所提供的电路板上设置的电路板对位标记可以与图2中的电路板上设置的电路板对位标记22相同，相应地，匹配板1上的对位标记可以与图1中所示的匹配板对位标记12相同。
作为本发明的实施例的一种优选实施方式，电路板2还可以包括至少一个电路板对位标记22，每个电路板对位标记22均包括间隔设置的至少两个子对位标记，在图3、图8以及图9中，两个子对位标记分别为子对位标记22a和子对位标记22b。匹配板1上的匹配板对位标记12与电路板2上的电路板对位标记22是匹配的。匹配板对位标记12上形成有与子对位标记22a和子对位标记22b之间的间隔相匹配的水平部。该水平部的宽度与子对位标记22a和子对位标记22b之间的间隔宽度相同。
作为本发明的实施例的一种具体实施方式，在一个电路板对位标记22中，子对位标记22a为“T”字形，子对位标记22b为“倒T”字形，或者，在一个电路板对位标记22中，子对位标记22a和子对位标记22b均为“十”字形。相匹配地，匹配板1上的匹配板对位标记12可以为“十”字形。
图5中所示的是图3中的电路板2与图4中的匹配板1正确对位的情况，在这种情况中，匹配板对位标记12上的水平部正好位于子对位标记22a和子对位标记22b之间的间隔中。图5中的区域A、B、C、D、E、F均为电路板2上的空置区23b对应的区域，通过观察区域A、B、C、D、E、F中导电颗粒的状态可以判断电路板2和匹配板1是否贴合正常。
图6中所示的是电路板2与匹配板1错位的一种情况，通过观察电路板对位标记22中的间隔的状态可以得知，电路板2的位置过于靠上。此时仍可通过观察贴合状态检查区的较靠上部分中的导电粒子状态，来确定贴合的状态的优劣。
图7中所示的是电路板2与匹配板1错位的另一种情况，通过观察对位标记中的间隔的状态可以得知，电路板2的位置过于靠下。此时仍可通过观察贴合状态检查区的较靠下部分的中的导电粒子状态，来确定贴合的状态的优劣。
由此可知，第三电路图形被设置为具有多个子部分时，即使在电路板与匹配板未在电路板2长度方向(即，图6和图7中的左右方向)上精确对位情况下，仍能通过其子部分完成对贴合状态的检查。同时，当电路板对位标记22包括两个子对位标记时，只需要观察子对位标记之间的间隔是否被匹配板1上的匹配板对位标记的水平部填满，还是被其他部分填满，即可判断电路板与匹配板是否按照正确位置贴合，无需复杂的测量，简化了贴合工艺，节约了时间成本。
除了对位作用之外，电路板对位标记还可以起到辅助平坦的作用，进一步确保检测图形处于非悬空的状态。
作为本发明的实施例的一种具体实施方式，在一些实施例中，所述电路板对位标记的水平方向的位置整体处于贴合状态检查区的中部。
可以在形成了第一电路图形之后形成所述电路板对位标记，也可以在形成第一电路图形的同时形成所述电路板对位标记。为了简化制造工艺，在一些实施例中，在形成所述第一电路图形的同时形成所述电路板对位标记，以使得所述电路板对位标记的高度与所述第一电路图形高度相同且材料相同。
在一些实施例中，本发明的实施例所提供的电路板2可以为显示面板的一部分。例如，电路板2可以是显示面板的阵列基板边缘的外引电路端子区。本发明的实施例提供一种显示面板，包括以上所述的电路板2。
作为本发明的实施例的另一个方面，提供一种液晶显示装置，所述液晶显示装置包括电路板2和与该电路板2贴合的匹配板1，其中，电路板2为本发明的实施例所提供的上述电路板。
匹配板1和电路板2贴合后，通过检测不同位置的空置区23b中的导电 颗粒的变形状态，即可较为准确的判断电路板2和匹配板1之间的贴合状态，从而可以准确地判断液晶显示装置是否为良品。
电路板2可以为刚性电路板，相应地，匹配板1可以为柔性印刷电路板。具体地，电路板2可以是显示面板的阵列基板边缘的外引电路端子区，匹配板1为与电路板2相贴合的柔性印刷电路板。
以上所述仅是本发明的示范性实施方式，而非用于限制本发明的保护范围，本发明的保护范围由所附的权利要求确定。
本申请要求于2015年6月15日递交的中国专利申请第201520411746.1号的优先权，在此全文引用上述中国专利申请公开的内容以作为本申请的一部分。

Claims (18)

  1. 一种电路板，所述电路板包括第一电路图形和贴合状态检查区，其中，所述贴合状态检查区还包括第三电路图形。
  2. 根据权利要求1所述的电路板，其中，所述第一电路图形和第三电路图形高度相同且材料相同。
  3. 根据权利要求2所述的电路板，其中，所述第三电路图形包括分布在贴合状态检查区的多个子部分，且各子部分在贴合状态检查区的长度方向上互相间没有重叠的区域。
  4. 根据权利要求2所述的电路板，其中，所述第三电路图形包括分布在贴合状态检查区的多个子部分，其中一个子部分与其它子部分在贴合状态检查区的长度方向上均有重叠区域。
  5. 根据权利要求1至4中任意一项所述的电路板，其中，所述电路板上设置有两个所述贴合状态检查区，该两个所述贴合状态检查区分别位于所述第一电路图形的两侧。
  6. 根据权利要求1至4中任意一项所述的电路板，其中，所述电路板还包括至少一个电路板对位标记，每个所述电路板对位标记均包括间隔设置的至少两个子对位标记。
  7. 根据权利要求6所述的电路板，其中，所述电路板对位标记的水平方向的位置整体处于所述贴合状态检查区的中部。
  8. 根据权利要求7所述的电路板，其中，所述电路板对位标记的高度与所述第一电路图形高度相同且材料相同。
  9. 根据权利要求1-8中任一项的电路板，其中，在电路板的贴合状态检查区中未设置第三电路图形的区域中具有导电颗粒。
  10. 根据权利要求1-9中任一项的电路板，其中，所述电路板用于与匹配板相贴合。
  11. 一种电路板组件，其包括根据权利要求1-10中任一项的电路板和匹配板，所述匹配板上包括与电路板相匹配的第二电路图形。
  12. 根据权利要求11的电路板组件，其中所述第二电路图形包括：
    与第一电路图形相匹配的部分，称为匹配图形；和
    与贴合状态检查区的第三电路图形相匹配的部分，称为检测图形。
  13. 根据权利要求11或12的电路板组件，其中所述电路板和匹配板处于相互贴合和对位的状态。
  14. 根据权利要求11-13中任一项的电路板组件，其中电路板的第一电路图形和匹配板的第二电路图形中的电路通过导电颗粒而导电连接。
  15. 一种液晶显示装置，包括匹配板和与所述匹配板贴合的电路板，其中，所述电路板为权利要求1至10中任意一项所述的电路板。
  16. 根据权利要求15所述的液晶显示装置，其中，所述匹配板为柔性印刷电路板。
  17. 根据权利要求15或16所述的液晶显示装置，其中，所述匹配板上包括与电路板相匹配的第二电路图形。
  18. 根据权利要求15至17中任一项所述的液晶显示装置，其中所述第二电路图形包括：
    与第一电路图形相匹配的部分，称为匹配图形，和
    与贴合状态检查区相匹配的部分，称为检测图形。
PCT/CN2015/094970 2015-06-15 2015-11-19 电路板、电路板组件和液晶显示装置 WO2016201879A1 (zh)

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