WO2016197699A1 - 封装件及其封装方法、oled装置 - Google Patents
封装件及其封装方法、oled装置 Download PDFInfo
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- WO2016197699A1 WO2016197699A1 PCT/CN2016/079270 CN2016079270W WO2016197699A1 WO 2016197699 A1 WO2016197699 A1 WO 2016197699A1 CN 2016079270 W CN2016079270 W CN 2016079270W WO 2016197699 A1 WO2016197699 A1 WO 2016197699A1
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- Prior art keywords
- substrate
- sealing structure
- cavity
- sealing
- package
- Prior art date
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- 238000000034 method Methods 0.000 title claims abstract description 30
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 18
- 239000000758 substrate Substances 0.000 claims abstract description 141
- 238000007789 sealing Methods 0.000 claims abstract description 139
- 239000011521 glass Substances 0.000 claims description 32
- 239000003292 glue Substances 0.000 claims description 25
- 239000004088 foaming agent Substances 0.000 claims description 18
- 239000000463 material Substances 0.000 claims description 10
- 238000005538 encapsulation Methods 0.000 claims description 6
- 238000005245 sintering Methods 0.000 claims description 6
- 239000011248 coating agent Substances 0.000 claims description 4
- 238000000576 coating method Methods 0.000 claims description 4
- 239000002274 desiccant Substances 0.000 claims description 3
- 239000000203 mixture Substances 0.000 claims description 3
- 230000001678 irradiating effect Effects 0.000 claims description 2
- 230000006835 compression Effects 0.000 abstract description 3
- 238000007906 compression Methods 0.000 abstract description 3
- 239000010410 layer Substances 0.000 description 19
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 10
- 229910052760 oxygen Inorganic materials 0.000 description 10
- 239000001301 oxygen Substances 0.000 description 10
- 238000012858 packaging process Methods 0.000 description 8
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 8
- 239000000853 adhesive Substances 0.000 description 4
- 230000001070 adhesive effect Effects 0.000 description 4
- OSGAYBCDTDRGGQ-UHFFFAOYSA-L calcium sulfate Chemical compound [Ca+2].[O-]S([O-])(=O)=O OSGAYBCDTDRGGQ-UHFFFAOYSA-L 0.000 description 4
- 230000003139 buffering effect Effects 0.000 description 3
- 230000005525 hole transport Effects 0.000 description 3
- 230000002427 irreversible effect Effects 0.000 description 3
- 239000002346 layers by function Substances 0.000 description 3
- 238000007539 photo-oxidation reaction Methods 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 2
- 239000011241 protective layer Substances 0.000 description 2
- 238000007650 screen-printing Methods 0.000 description 2
- 239000002002 slurry Substances 0.000 description 2
- 229910018540 Si C Inorganic materials 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical group [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 239000011149 active material Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000006260 foam Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 125000000962 organic group Chemical group 0.000 description 1
- 239000005022 packaging material Substances 0.000 description 1
- 238000012536 packaging technology Methods 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 238000004078 waterproofing Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/842—Containers
- H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/841—Self-supporting sealing arrangements
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/842—Containers
- H10K50/8428—Vertical spacers, e.g. arranged between the sealing arrangement and the OLED
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/40—Thermal treatment, e.g. annealing in the presence of a solvent vapour
- H10K71/421—Thermal treatment, e.g. annealing in the presence of a solvent vapour using coherent electromagnetic radiation, e.g. laser annealing
Definitions
- the present disclosure relates to a package and a method of packaging the same, an OLED device.
- OLED Organic Light-Emitting Diode
- An OLED device packaging technology uses a glass paste (slurry frit) packaging process.
- a glass paste slurry frit
- FIG. 1 in an OLED device, an OLED structure 03 is disposed between a glass cover plate 01 and a glass back plate 02, and the OLED body is provided.
- the structure specifically includes an organic light-emitting functional layer, etc., since the organic light-emitting functional layer may undergo an irreversible photo-oxidation reaction in the presence of moisture and oxygen, therefore, in order to ensure the sealing property of the OLED device, the glass cover 01 and the glass back After the plate 02 is aligned, the glass paste is melted by a laser to form a frit sealing layer 04 to complete the packaging of the OLED device.
- the glass paste used in the frit packaging process is mostly a hard material, and thus, the OLED device has poor drop resistance and compression resistance, and affects the mechanical properties of the entire OLED device.
- a package includes: a first substrate and a second substrate disposed opposite to each other; a first sealing structure disposed between the first substrate and the second substrate, the first a sealing structure, the first substrate and the second substrate enclosing a first cavity; a second sealing structure disposed between the first substrate and the second substrate, the second sealing structure is located The outer side of the first sealing structure encloses a second cavity with the first sealing structure, the first substrate and the second substrate.
- an OLED device comprising: a package as described above, and an OLED structure disposed within the first cavity of the package.
- a packaging method comprising: coating a UV paste on a first substrate having a sintered glass paste; the glass paste being located in a first sealing region of the first substrate, The UV glue is located in a second sealing area of the second substrate, the second sealing area Located on an outer side of the first sealing region; aligning the first substrate with a second substrate provided with an OLED structure; the first between the first substrate and the second substrate The sealing region forms a first sealing structure, and forms a second sealing structure in the second sealing region, wherein the first sealing structure, the first substrate and the second substrate enclose a first cavity; The second sealing structure is located outside the first sealing structure and encloses a second cavity with the first sealing structure, the first substrate and the second substrate.
- 1 is a schematic structural view of a packaged OLED device
- FIG. 2a is a cross-sectional view 1 of a package according to an embodiment of the present disclosure
- 2b is a top view of a package provided by an embodiment of the present disclosure.
- FIG. 3 is a cross-sectional view 2 of a package according to an embodiment of the present disclosure.
- FIG. 4 is a cross-sectional view 3 of a package according to an embodiment of the present disclosure.
- FIG. 5 is a flowchart 1 of a packaging method according to an embodiment of the present disclosure.
- FIG. 6 is a second flowchart of a packaging method according to an embodiment of the present disclosure.
- first and second are used for descriptive purposes only, and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, features defining “first” and “second” may include one or more of the features either explicitly or implicitly. In the description of the present invention, "a plurality” means two or more unless otherwise stated.
- an embodiment of the present disclosure provides a package 100 (wherein Figure 2a is a cross-sectional view of the package 100 and Figure 2b is a top view of the package 100).
- the package 100 includes a first substrate 101 and a second substrate 102 disposed opposite to each other; and a first sealing structure 103 disposed between the first substrate 101 and the second substrate 102.
- the first sealing structure 103, the first substrate 101 and the second substrate 102 enclose a first cavity 200, which can be used to place an OLED structure.
- the OLED structure herein may be an integral structure of an OLED or a part of an OLED, such as an organic light-emitting functional layer, a hole transport layer, an electron transport layer, etc., and these layers may also be referred to as a main structure of an OLED.
- a second sealing structure 104 is further disposed between the first substrate 101 and the second substrate 102, and the second sealing structure 104 is located outside the first sealing structure 103, and is opposite to the first sealing structure 103, the first substrate 101, and the second The substrate 102 encloses a second cavity 300.
- the second cavity can mitigate the impact force experienced by the first sealing structure 103.
- first sealing structure 103 there may be a plurality of second cavities 300 disposed between the first substrate 101 and the second substrate 102, which are not limited in the present invention.
- the second cavity 300 serves to slow the impact force received by the first sealing structure 103.
- the second cavity 300 can serve as a buffer layer between the first sealing structure 103 and the second sealing structure 104, so that the packaging material in the first cavity 200 is subjected to the impact force exerted by the outside as little as possible.
- the anti-drop and anti-pressure performance of the entire package 100 is improved.
- the cross-sections of the first sealing structure 103 and the second sealing structure 104 parallel to the first substrate are both annular shapes, such that the first sealing structure 103 and the second sealing structure 104 can cooperate with the first A substrate and a second substrate form a first cavity and a second cavity.
- An OLED main structure such as a hole transport layer, an organic light emitting layer or an electron transport layer, of the OLED device may be disposed in the first cavity 200, and an irreversible photooxidation reaction may occur due to the presence of water vapor and oxygen in the OLED main body structure. Therefore, the multiple sealing structure in the package 100 The water-proofing of the OLED main body structure can be prevented, and the anti-drop and anti-pressure performance of the package 100 can be improved by the buffer layer between the first sealing structure 103 and the second sealing structure 104.
- the second cavity 300 is filled with a foaming agent and/or an organic glue.
- the foaming agent is a kind of surface active material, which mainly reduces the interfacial tension at the gas-water interface, promotes the formation of small bubbles in the slurry, expands the sorting interface, and ensures that the bubbles rise to form a foam layer.
- the organic gum refers to a compound containing a Si-C bond and at least one organic group is directly bonded to a silicon atom. Both the organic glue and the foaming agent having a low modulus of elasticity can be used as an effective cushioning material. Therefore, by filling the second cavity 300 with a foaming agent and/or an organic glue, the first sealing structure 103 and the second can be added. The buffering effect of the buffer layer between the sealing structures 104 further improves the anti-drop and pressure resistance properties of the package 100.
- a desiccant such as calcium sulfate or the like which reacts with water and oxygen may be added to the above-mentioned foaming agent and/or organic rubber, so that an effective environment around the encapsulating material in the first cavity 200 can be formed.
- a protective layer that prevents water oxygen from entering the encapsulating material.
- the first substrate 101 is further provided with a connection with the second cavity 300.
- the connection hole 105 is such that the above-mentioned foaming agent and/or organic glue can be injected into the second cavity 300 through the connection hole 105.
- connection hole 105 may further be provided with a filling melt (meltable) 106, which is fusible.
- the body 106 is a glass mixture that absorbs microwaves or lasers, and the melt 106 can be used to seal the connection holes 105, so that after the above-mentioned foaming agent and/or organic glue is injected into the second cavity 300, laser or microwave heating can be used.
- the meltable 106 on the connection hole 105 is such that the meltable 106 is heated and melted and then the connection hole 105 is packaged.
- the heat affected zone of the packaging process is small, and excessive residual stress is not generated to cause the first substrate 101 to be warped. song.
- the first sealing structure 103 in the package 100 may be a sealing structure formed by sintering and laser scanning after the glass paste is cured by a frit packaging process; and the second sealing structure 104 in the package 100 may be Specifically, the sealing structure formed by curing the UV adhesive by the UV encapsulation process, that is, the cured UV adhesive.
- the sealed structure formed by the frit packaging process has a strong ability to resist water and oxygen, but the mechanical properties are poor, and the UV packaging process is relatively simple. Therefore, the package 100 having the multiple sealing structure formed by the above process can simplify the manufacturing process and Improvement The ability of the package 100 to resist oxygen.
- An embodiment of the present disclosure provides a package including a first substrate and a second substrate disposed opposite to each other, wherein a first sealing structure is disposed between the first substrate and the second substrate, The first sealing structure, the first substrate and the second substrate enclose a first cavity, the first cavity is for placing an OLED main body structure; and the first substrate and the second substrate are further disposed
- the second sealing structure is located outside the first sealing structure, and encloses a second cavity with the first sealing structure, the first substrate and the second substrate, and the second cavity is available
- the second cavity can serve as a buffer layer between the first sealing structure and the second sealing structure, so that the OLED main structure in the first cavity is as The impact force exerted by the outside is less, thereby improving the anti-drop and anti-pressure performance of the entire package.
- FIG. 5 is a packaging method according to an embodiment of the present invention.
- the packaging method provided by the embodiment of the present disclosure is used to fabricate the package 100 shown in FIG. 1 to FIG. 4 .
- FIG. 5 For the convenience of description, only the implementation of the present invention is shown. For the relevant parts of the examples, the specific technical details are not disclosed, please refer to the embodiments of the present invention shown in FIGS.
- the above packaging method includes:
- the OLED device includes, for example, a first substrate, and a second substrate formed with an OLED body structure.
- the first substrate and the second substrate need to be aligned and packaged to form an OLED main body structure in the OLED device. It is enclosed in a waterproof and oxygen-proof enclosure.
- the glass paste is located in a first sealing area of the first substrate, the UV glue is located in a second sealing area of the second substrate, and the second sealing area is located outside the first sealing area.
- the glass paste may be coated on the first sealing area of the first substrate to be packaged by screen printing, and then the first substrate coated with the glass paste is placed in a sintering furnace for sintering, and finally the first after sintering.
- the second sealing area of the substrate is coated with UV glue, wherein the UV glue can be cured and used as an adhesive under ultraviolet light irradiation.
- the first sealing structure, the first substrate and the second substrate enclose a first cavity; the second sealing structure is located outside the first sealing structure, and is surrounded by the first sealing structure, the first substrate and the second substrate Cavity.
- the first substrate and the second substrate may be first packaged to form the second sealing structure by using a UV encapsulation process to irradiate the position of the UV coating on the first substrate (ie, the second sealing region) with ultraviolet rays. Further, using the frit packaging process, the position where the glass paste is sintered on the first substrate (ie, the first sealing region) is subjected to the second encapsulation to form the first sealing structure.
- the first sealing structure, the first substrate and the second substrate enclose a first cavity; the first sealing structure, the second sealing structure, the first substrate and the second substrate enclose a second space Cavity.
- the second cavity can serve as a buffer layer between the first sealing structure and the second sealing structure, so that the OLED main body structure in the first cavity is subjected to an impact force applied by the outside as little as possible, thereby improving the protection of the entire package. Drop, compression performance.
- the first substrate may further be provided with a connection hole communicating with the second cavity, and the connection hole is further provided with a meltable portion, wherein the meltable material is a glass mixture for absorbing microwave or laser light.
- the embodiment of the present invention provides a packaging method, as shown in FIG. 6, which includes:
- a screen printing process may be used to apply a glass paste to a first sealing region of the first substrate according to a pre-designed pattern on the screen, and then the first substrate coated with the glass paste is placed in the sintering furnace. The medium is sintered, and finally, the second sealing region on the sintered first substrate is coated with UV glue.
- the UV sealing process can be used to irradiate the UV-coated position on the first substrate with ultraviolet rays, and the first sealing structure is formed separately from the first The substrate and the second substrate are pasted.
- Form a first sealing structure by using a glass paste encapsulation process to sinter the glass paste on the first substrate.
- the second sealing structure is respectively adhered to the second sealing structure, the first substrate and the second substrate to form a second cavity.
- the connecting hole can be Injecting a foaming agent and/or an organic glue into the second cavity, since both the organic glue and the foaming agent can be used as an effective buffering material, the foaming agent and/or the organic glue is filled in the second cavity, and The buffering effect of the buffer layer between the first sealing structure and the second sealing structure is increased to further improve the anti-drop and anti-pressure performance of the package.
- a desiccant such as calcium sulfate or the like, which is reactive with water and oxygen, may be added to the above-mentioned foaming agent and/or organic rubber, so that an effective protective layer can be formed around the OLED main structure in the first cavity. To prevent water oxygen from invading the OLED main structure.
- the filling melt on the connecting hole may be heated by using a laser or a microwave, so that the filling melt is heated and melted, and the connecting hole is packaged.
- the heat affected zone is small and does not generate excessive residual stress causing warpage of the first substrate.
- Embodiments of the present disclosure provide a packaging method in which a first sealing structure is disposed between a first substrate and a second substrate disposed opposite to each other, and the first sealing structure, the first substrate and the second substrate are enclosed a first cavity for placing the OLED body structure; a second sealing structure disposed between the first substrate and the second substrate, the second sealing structure being located outside the first sealing structure, and the first cavity a sealing structure, the first substrate and the second substrate enclose a second cavity, the second cavity can be used to slow the impact force of the first sealing structure, so that the second cavity can As a buffer layer between the first sealing structure and the second sealing structure, the OLED main body structure in the first cavity is subjected to an impact force applied by the outside as little as possible, thereby improving the anti-drop and anti-pressure performance of the entire package.
- an embodiment of the present disclosure further provides an OLED device, which specifically includes the package 100 described in the above embodiment, and an OLED main body structure disposed in the first cavity 200 of the package 100.
- the OLED body structure may specifically include a hole transport layer, an organic light emitting layer or an electron transport layer of the OLED device. Since the OLED main structure has an irreversible photooxidation reaction in the presence of moisture and oxygen, the multiple sealing structure in the package 100 can prevent water oxygen from intruding into the OLED main structure while passing through the first sealing structure 103.
- the buffer layer between the second sealing structures 104 improves the drop resistance and pressure resistance of the package 100.
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Abstract
Description
Claims (16)
- 一种封装件,包括:相对设置的第一基板和第二基板;设置于所述第一基板和所述第二基板之间的第一密封结构,所述第一密封结构、所述第一基板与所述第二基板围成第一空腔;设置于所述第一基板和所述第二基板之间的第二密封结构,所述第二密封结构位于所述第一密封结构的外侧,且与所述第一密封结构、所述第一基板以及所述第二基板围成第二空腔。
- 根据权利要求1所述的封装件,其中,所述第二空腔内填充有起泡剂和有机胶的至少一种。
- 根据权利要求2所述的封装件,其中,所述起泡剂和有机胶的至少一种中含有干燥剂。
- 根据权利要求2或3所述的封装件,其中,所述第一基板上还设有与所述第二空腔连通的连接孔,所述连接孔用于注入所述起泡剂和所述有机胶的至少一种。
- 根据权利要求4所述的封装件,其中,所述连接孔中还设置有可熔体,所述可熔体用于密封所述连接孔。
- 根据权利要求5所述的封装件,其中,所述可熔体为吸收微波或者激光的玻璃混合物。
- 根据权利要求1-7中任一项所述的封装件,其中,所述第一密封结构为玻璃浆料经过烧结和激光扫描后固化形成的。
- 根据权利要求1-8中任一项所述的封装件,其中,所述第二密封结构为固化的UV胶。
- 根据权利要求1-8中任一项的封装件,其中,所述第一密封结构和第二密封结构的平行于所述第一基板截取的截面均为环形形状。
- 一种OLED装置,包括:如权利要求1-9中任一项所述的封装件,以及设置在所述封装件的第一空腔内的OLED结构。
- 一种封装方法,包括:在具有烧结的玻璃浆料的第一基板上涂覆UV胶;所述玻璃浆料位于所 述第一基板的第一密封区域,所述UV胶位于所述第二基板的第二密封区域,所述第二密封区域位于所述第一密封区域的外侧;将所述第一基板与设置有OLED结构的第二基板进行对位贴合;在所述第一基板和所述第二基板之间的所述第一密封区域形成第一密封结构,并在所述第二密封区域形成第二密封结构,其中,所述第一密封结构、所述第一基板与所述第二基板围成第一空腔;所述第二密封结构位于所述第一密封结构外侧,且与所述第一密封结构、所述第一基板以及所述第二基板围成第二空腔。
- 根据权利要求11所述的方法,其中,在对位贴合中,所述第一基板的设置有所述玻璃浆料和所述UV胶的一侧和所述第二基板的设置有所述OLED结构的一侧彼此面对。
- 根据权利要求11或12所述的方法,其中,所述第一密封区域和所述第二密封区域均具有环形形状。
- 根据权利要求11-13中任一项所述的方法,其中,在所述第一基板和所述第二基板之间形成第一密封结构和第二密封结构,包括:使用紫外线照射所述第一基板上涂覆UV胶的位置,使所述UV胶固化形成所述第二密封结构;使用玻璃浆料封装工艺使所述第一基板上的烧结的玻璃浆料形成所述第一密封结构。
- 根据权利要求14所述的方法,其中,所述第一基板中设有与所述第二空腔连通的连接孔,在使用玻璃浆料封装工艺使所述第一基板上的烧结的玻璃浆料形成所述第一密封结构之后,还包括:从所述连接孔向所述第二空腔内注入起泡剂和/或有机胶。
- 根据权利要求15所述的方法,其中,在从所述连接孔向所述第二空腔内注入起泡剂和/或有机胶之后,还包括:在所述连接孔上设置可熔体,并使用微波或者激光加热所述可熔体,使所述可熔体熔化后密封所述连接孔。
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US15/321,856 US20170133625A1 (en) | 2015-06-08 | 2016-04-14 | Packaging Assembly and Packaging Method Thereof, and OLED Apparatus |
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CN201510312061.6A CN104882556B (zh) | 2015-06-08 | 2015-06-08 | 一种封装件及其封装方法、oled装置 |
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CN104882556B (zh) * | 2015-06-08 | 2017-06-27 | 京东方科技集团股份有限公司 | 一种封装件及其封装方法、oled装置 |
CN106848099B (zh) * | 2017-02-21 | 2019-01-22 | 深圳市华星光电技术有限公司 | Oled封装方法与oled封装结构 |
CN107403871A (zh) | 2017-07-21 | 2017-11-28 | 京东方科技集团股份有限公司 | 封装结构及封装方法、显示装置 |
CN110993819B (zh) * | 2019-12-04 | 2021-07-23 | 深圳市华星光电半导体显示技术有限公司 | 显示面板及其制作方法 |
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- 2015-06-08 CN CN201510312061.6A patent/CN104882556B/zh active Active
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