WO2016197569A1 - 一种扬声器模组 - Google Patents

一种扬声器模组 Download PDF

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Publication number
WO2016197569A1
WO2016197569A1 PCT/CN2015/096713 CN2015096713W WO2016197569A1 WO 2016197569 A1 WO2016197569 A1 WO 2016197569A1 CN 2015096713 W CN2015096713 W CN 2015096713W WO 2016197569 A1 WO2016197569 A1 WO 2016197569A1
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WIPO (PCT)
Prior art keywords
heat
speaker
cavity
module according
inner cavity
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Ceased
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PCT/CN2015/096713
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English (en)
French (fr)
Inventor
董庆宾
何洁
王武超
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Goertek Inc
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Goertek Inc
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Priority to US15/573,727 priority Critical patent/US10341777B2/en
Publication of WO2016197569A1 publication Critical patent/WO2016197569A1/zh
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R9/00—Transducers of moving-coil, moving-strip, or moving-wire type
    • H04R9/02—Details
    • H04R9/022—Cooling arrangements
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/02—Casings; Cabinets ; Supports therefor; Mountings therein
    • H04R1/021—Casings; Cabinets ; Supports therefor; Mountings therein incorporating only one transducer
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/02—Casings; Cabinets ; Supports therefor; Mountings therein
    • H04R1/028—Casings; Cabinets ; Supports therefor; Mountings therein associated with devices performing functions other than acoustics, e.g. electric candles
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R9/00—Transducers of moving-coil, moving-strip, or moving-wire type
    • H04R9/06—Loudspeakers
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R2499/00—Aspects covered by H04R or H04S not otherwise provided for in their subgroups
    • H04R2499/10—General applications
    • H04R2499/11—Transducers incorporated or for use in hand-held devices, e.g. mobile phones, PDA's, camera's
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating

Definitions

  • the invention belongs to the technical field of acoustic and electrical transduction, and in particular to the technical field of micro-speakers, and relates to a structural design and a feature of a speaker module.
  • Micro-speakers are an indispensable component of modern mobile electronic devices. With the gradual development of mobile electronic devices, people have put forward higher requirements on the sound quality of micro-speakers. On the one hand, in order to make the speaker have higher sensitivity to the sound signal, on the other hand, in order to increase the volume of the speaker, the rated working power of the existing speaker module is higher and higher, and the heat generated by the speaker during the work is also caused. more and more. In particular, when the speaker module is a speaker module driven by an intelligent power amplifier, the speaker generates more heat. However, due to the small structure of the speaker module and the complicated internal structure, there is often a problem of poor heat dissipation.
  • the high temperature generated during the operation of the speaker is likely to affect the components such as the diaphragm and the magnetic circuit system, causing the elastic deformation of the diaphragm and the demagnetization of the magnetic circuit system, which seriously affects the sound performance of the speaker.
  • a speaker module comprising:
  • a module housing having an inner cavity, the inner cavity including a separated front cavity and a rear cavity, the front cavity being in communication with an external space;
  • the speaker assembly mounted in the inner cavity, the speaker assembly including a diaphragm that separates the front cavity from the rear cavity;
  • a heat dissipating member having a heat conducting portion and a heat dissipating portion, the heat conducting portion and the speaker Contacting the component, the heat sink extending into the front cavity;
  • the diaphragm vibrates the air in the front chamber to increase the heat dissipation rate of the heat dissipating portion.
  • the heat dissipation portion has a heat dissipation structure for increasing a heat dissipation area
  • the heat dissipation structure may be a heat dissipation fin and/or a heat dissipation needle.
  • the direction in which the inner cavity leads to the outer space is the sounding direction, and the heat dissipation fins are preferably parallel to the sounding direction.
  • the speaker assembly includes a magnetic circuit system that can be fixedly mounted in the inner cavity, the thermally conductive portion being in contact with the magnetic circuit system.
  • the magnetic circuit system may include a basin frame at the bottom of the speaker assembly, the heat sink may be integral with the basin frame, and the heat conducting portion may be coupled to the basin frame.
  • the heat dissipating member may be integrally formed with the module casing, and the heat conducting portion and the speaker assembly may be coated with silicone grease.
  • the front cavity may be a side sounding front cavity, and a sidewall of the module casing is provided with an sound hole in a direction parallel to the diaphragm.
  • the module housing may include a first housing and a second housing, the first housing and the second housing combination to form the inner cavity.
  • the inventors of the present invention have found that in the prior art, although a technical solution for adding a heat sink to the speaker structure has appeared, there is no technical solution for the air flow generated by the vibration of the diaphragm as an accelerated heat dissipation. means.
  • the heat dissipating portion of the heat dissipating member of the present invention protrudes into the front cavity, and can discharge heat more efficiently through air flow in the front cavity, and when the front cavity is a side sounding front cavity, the heat dissipation
  • the structure of the piece is simple and can save space inside the speaker module. Therefore, the technical solution of the present invention is a new technical solution.
  • FIG. 1 is a schematic structural view of the heat dissipating member in a specific embodiment of the present invention.
  • FIG. 2 is an exploded view of the components of the speaker module in accordance with an embodiment of the present invention.
  • FIG. 3 is a schematic structural view of a speaker module removing the second outer casing and a front cavity cover according to an embodiment of the present invention
  • FIG. 4 is a partial cross-sectional enlarged view of a speaker module in accordance with an embodiment of the present invention.
  • the invention provides a speaker module, which comprises a module shell, a speaker assembly and a heat sink.
  • the module housing has an inner cavity for accommodating the speaker assembly, and the module housing further has an sound hole for sounding.
  • the inner cavity includes spaced apart front and rear chambers that communicate with the outer space through the sounding holes. The sound waves generated when the speaker assembly operates are transmitted from the front cavity to the external space through the sound hole.
  • the speaker assembly includes a diaphragm that is mounted in the inner cavity. Typically, an edge of the diaphragm is fixedly mounted in the inner cavity, and an intermediate portion of the diaphragm can vibrate up and down in the inner cavity. The diaphragm separates the front cavity and the rear cavity.
  • the diaphragm has a front side and a back side, and the back side of the diaphragm is usually connected to the voice coil.
  • the diaphragm vibrates, sound waves are mainly transmitted from the front side of the diaphragm.
  • the front cavity is then transmitted to the outside of the speaker module.
  • the heat dissipating member is fixed on the speaker module, and has a heat conducting portion and a heat dissipating portion.
  • the heat conducting portion is in contact with the speaker assembly for deriving heat generated when the speaker assembly operates.
  • Special The heat dissipating portion extends into the front cavity for conducting heat in the speaker assembly and the heat conducting portion to the front cavity.
  • the generated sound waves are mainly transmitted from the front chamber, and the vibration of the diaphragm and the transmission of the sound waves cause the air in the front chamber to flow, and there is air flow between the front chamber and the outer space.
  • the heat dissipating portion located in the front cavity can increase the heat dissipation rate under the action of air flow, and more efficiently dissipate heat to the external space.
  • the front cavity of the present invention not only represents a part of the cavity for sounding in the module casing, but also represents an internal structure for sounding, such as an acoustic pipe located on the front side of the diaphragm.
  • the heat sink 1 may have a larger surface area to facilitate heat loss.
  • the heat dissipation portion 12 may have a heat dissipation structure for increasing a heat dissipation area.
  • the heat dissipation structure is a heat dissipation fin, and the heat dissipation fins are arranged on the heat conducting portion 11 and protrude toward the front cavity 22 .
  • the heat dissipation fin structure cannot affect the normal sounding of the speaker module, and the sound generated by the diaphragm 31 is transmitted from the front cavity 22 to the external space.
  • the direction from the front cavity 22 to the external space is the speaker mode.
  • the heat dissipation fins may be parallel to the sounding direction to enable sound waves to smoothly escape from the front cavity 22.
  • the present invention does not limit the specific features of the heat dissipation structure. Those skilled in the art can design the characteristics of the heat dissipation structure according to the actual situation of the speaker module, such as the size of the front cavity 22 and the processing difficulty of the heat dissipation structure.
  • the heat dissipation structure may also be a heat sink needle or other structure protruding from the heat conducting portion 11.
  • the heat dissipating portion 12 of the heat dissipating member 1 can be in contact with a component of the speaker assembly 3 that generates heat or has a high thermal conductivity to increase the rate of heat transfer.
  • the speaker assembly 3 includes a magnetic circuit system, which is a component with high heat generation in the speaker, and is usually composed of a metal material and has a strong Thermal conductivity.
  • the heat dissipating member 1 may be fixedly mounted in the inner cavity 21, and the heat conducting portion 11 is in contact with a bottom surface of the magnetic circuit system. In other embodiments of the invention, the thermally conductive portion 11 may also be in contact with other locations of the magnetic circuit system.
  • the magnetic circuit system may include a magnet, a washer, and a basin frame 32.
  • the basin frame 32 is located at the bottom of the magnetic circuit system for carrying the magnet.
  • the basin frame 32 is constructed of a magnetically permeable material, typically an iron based material. So, said The heat sink 1 can be formed by casting or stamping with the basin frame 32 to form a unitary structure, and the heat conducting portion 11 is coupled to the bottom of the basin frame 32.
  • the heat dissipating member 1 of the present invention can also have an assembly connection and a forming relationship with other components in the speaker module.
  • the heat sink 1 can also be integrally molded with the module housing.
  • the module casing is usually made of a plastic material.
  • the heat sink 1 can be fixed in the injection mold. After the module casing is injection molded, the heat sink 1 is fixed. In the module housing. This molding method simplifies the assembly steps of the speaker module.
  • the front cavity 22 and the sound hole are generally located above the front surface of the diaphragm 31, and the sound waves generated by the diaphragm 31 can be directly transmitted to the external space along the normal direction of the diaphragm 31.
  • the front cavity 22 may also be a side sounding front cavity 22. As shown in FIGS. 2-4, the side sounding front cavity 22 is located at a side of the speaker assembly 3, and the side wall of the module housing may form a sound hole in a direction parallel to the diaphragm 31. The sound waves generated by the diaphragm 31 propagate in a direction parallel to the diaphragm 31, and are transmitted from the side sounding front chamber 22 through the side sound holes.
  • the heat conducting portion 11 of the heat sink 1 may directly extend from the bottom surface of the speaker assembly 3, and the heat radiating portion 12 is The heat conducting portion 11 projects out into the front cavity 22 located on the side of the speaker assembly 3.
  • a coating for enhancing thermal conductivity may be applied between the heat conducting portion 11 and the speaker assembly 3, for example, may be a material such as silicone grease.
  • the material used for the heat dissipating member 1 should have a high thermal conductivity.
  • the heat dissipating member 1 can usually be made of a metal material such as aluminum or stainless steel.
  • the module housing may include a first housing 23 and a second housing 24.
  • the second outer casing 24 and the first outer casing 23 are fastened together to form the inner cavity 21, as shown in FIG.
  • the module housing may further include a front chamber cover 25 mounted on the front chamber 22 to seal the heat dissipation portion 12 in the front chamber 22.

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Audible-Bandwidth Dynamoelectric Transducers Other Than Pickups (AREA)
  • Details Of Audible-Bandwidth Transducers (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

一种扬声器模组，包括：模组外壳、扬声器组件（3）以及散热件（1）。所述模组外壳具有内腔（21），内腔（21）包括分隔开的前腔（22）和后腔，前腔（22）与外部空间连通。所述扬声器组件（3）安装在内腔（21）中，扬声器组件（3）包括振膜（31），振膜（31）将所述前腔（22）和后腔分隔。所述散热件（1）具有导热部（11）和散热部（12），导热部（11）与扬声器组件（3）接触，散热部（12）伸入所述前腔（22）中，散热部（12）可以具有用于增大散热面积的散热结构，可以为散热鳍片。所述振膜（31）振动使所述前腔（22）中的空气流动，提高散热部（12）的散热速率，及时将扬声器工作时产生的热量传到模组外部。

Description

一种扬声器模组 技术领域
本发明属于声电换能技术领域，具体地，属于微型扬声器技术领域，涉及一种扬声器模组的结构设计与特征。
背景技术
微型扬声器是现代移动电子设备不可缺少的部件，随着移动电子设备的逐渐发展，人们对微型扬声器的声音质量等性能提出了更高的要求。一方面，为了使扬声器对声音信号具有更高的灵敏度，另一方面，为了增大扬声器的音量，现有扬声器模组的额定工作功率越来越高，造成扬声器在工作过程中产生的热量也越来越多。特别的，当扬声器模组是使用智能功放推动的扬声器模组时，扬声器的发热量更大。但是，由于扬声器模组结构较小，内部结构复杂，所以常常存在散热不畅的问题。扬声器工作时产生的高温容易对振膜、磁路系统等部件产生影响，造成振膜弹性改变、磁路系统退磁等现象，严重影响扬声器的声音性能。
所以，有必要设计一种具有良好散热结构的扬声器模组，或者为微型扬声器、扬声器模组设计一种能够提供良好散热环境的散热装置。
发明内容
本发明的一个目的是提供一种具有良好散热能力的扬声器装置。
根据本发明的第一方面，提供了一种扬声器模组，其中包括：
模组外壳，所述模组外壳具有内腔，所述内腔包括分隔开的前腔和后腔，所述前腔与外部空间连通；
扬声器组件，所述扬声器组件安装在所述内腔中，所述扬声器组件包括振膜，所述振膜将所述前腔和所述后腔分隔；
散热件，所述散热件具有导热部和散热部，所述导热部与所述扬声器 组件接触，所述散热部伸入所述前腔中；
所述振膜振动使所述前腔中的空气流动，提高所述散热部的散热速率。
优选地，所述散热部具有用于增大散热面积的散热结构，所述散热结构可以为散热鳍片和/或散热针。特别的，所述内腔通向外部空间的方向为出声方向，所述散热鳍片优选平行于所述出声方向。
所述扬声器组件包括磁路系统，所述散热件可以固定安装在所内腔中，所述导热部与所述磁路系统接触。特别的，所述磁路系统可以包括位于扬声器组件底部的盆架，所述散热件可以与所述盆架为一体结构，所述导热部连接在所述盆架上。
更优的，所述散热件可以与所述模组外壳一体成型，所述导热部与所述扬声器组件之间可以涂有硅脂。
另外，所述前腔可以为侧出声前腔，所述模组外壳的侧壁沿平行于所述振膜的方向设置有出声孔。所述模组外壳可以包括第一外壳和第二外壳，所述第一外壳和第二外壳组合构成所述内腔。
本发明的发明人发现，在现有技术中，虽然也出现了在所述扬声器结构中增设散热装置的技术方案，但是，并没有一种技术方案将振膜振动产生的空气流动作为加快散热的手段。本发明所述散热件的散热部伸入所述前腔中，能够通过前腔中的空气流动更高效的将热量导出，而且，当所述前腔为侧出声前腔时，所述散热件的结构简洁，能够节省扬声器模组内部的空间。因此，本发明的技术方案是一种新的技术方案。
通过以下参照附图对本发明的示例性实施例的详细描述，本发明的其它特征及其优点将会变得清楚。
附图说明
被结合在说明书中并构成说明书的一部分的附图示出了本发明的实施例，并且连同其说明一起用于解释本发明的原理。
图1是本发明具体实施例中所述散热件的结构示意图；
图2是本发明具体实施例中所述扬声器模组的零件爆炸图；
图3是本发明具体实施例中扬声器模组去除所述第二外壳和前腔盖的结构示意图；
图4是本发明具体实施例中扬声器模组的局部剖视放大图。
具体实施方式
现在将参照附图来详细描述本发明的各种示例性实施例。应注意到：除非另外具体说明，否则在这些实施例中阐述的部件和步骤的相对布置、数字表达式和数值不限制本发明的范围。
以下对至少一个示例性实施例的描述实际上仅仅是说明性的，决不作为对本发明及其应用或使用的任何限制。
对于相关领域普通技术人员已知的技术、方法和设备可能不作详细讨论，但在适当情况下，所述技术、方法和设备应当被视为说明书的一部分。
在这里示出和讨论的所有例子中，任何具体值应被解释为仅仅是示例性的，而不是作为限制。因此，示例性实施例的其它例子可以具有不同的值。
应注意到：相似的标号和字母在下面的附图中表示类似项，因此，一旦某一项在一个附图中被定义，则在随后的附图中不需要对其进行进一步讨论。
本发明提供了一种扬声器模组，其中包括模组外壳、扬声器组件以及散热件。所述模组外壳中具有用于容纳所述扬声器组件的内腔，模组外壳上还具有用于出声的出声孔。特别的，所述内腔包括分隔开的前腔和后腔，所述前腔通过出声孔与外部空间连通。所述扬声器组件工作时产生的声波由前腔经出声孔传到外部空间。所述扬声器组件包括振膜，所述扬声器组件安装在所述内腔中，通常，所述振膜的边缘固定安装在所述内腔中，振膜的中间部分可以在内腔中上下振动。所述振膜将前腔和后腔分隔，特别的，所述振膜具有正面和背面，振膜的背面通常与音圈连接，振膜振动时，声波主要从所述振膜的正面传入前腔，进而传到扬声器模组的外部。所述散热件固定在所述扬声器模组上，其中具有导热部和散热部。所述导热部与所述扬声器组件接触，用于将扬声器组件工作时产生的热量导出。特别 的，所述散热部伸入到所述前腔中，用于将扬声器组件和导热部中的热量传导至前腔。如上所述，扬声器组件工作时，产生的声波主要由前腔传出，振膜的振动以及声波的传递使前腔中的空气产生流动，所述前腔与外部空间之间存在空气流动。位于所述前腔中的散热部在空气流动的作用下，能够提高散热速率，更高效的将热量散失到外部空间。特别的，本发明所述的前腔不仅代表模组外壳中用于出声的部分内腔，也代表位于振膜正面的出声管道等用于出声的内部结构。
在本发明的具体实施例中，为了进一步提高所述扬声器模组的散热能力，所述散热件1可以具有更大的表面积，以利于热量的散失。如图1所示，所述散热部12可以具有用于增大散热面积的散热结构。在图1所示的实施例中，所述散热结构为散热鳍片，散热鳍片排列在所述导热部11上，并向所述前腔22的位置伸出。特别的，所述散热鳍片结构不能影响扬声器模组的正常出声，所述振膜31产生的声音由前腔22传到外部空间，所以，从前腔22通向外部空间的方向为扬声器模组的出声方向。优选的，如图4所示，所述散热鳍片可以平行于所述出声方向，以使声波能够顺畅的从所述前腔22中传出。另外，本发明并不限制所述散热结构的具体特征，本领域技术人员可以根据扬声器模组的实际情况，如前腔22的大小、散热结构的加工难度，对所述散热结构的特征进行设计，所述散热结构还可以是从所述导热部11上伸出的散热针或其它结构。
所述散热件1的散热部12可以与所述扬声器组件3上发热较强或导热能力较强的部件接触，以提高热量传出的速率。在本发明的实施例中，如图2、3所示，所述扬声器组件3包括磁路系统，磁路系统是扬声器中发热量较高的部件，且通常由金属材料构成，具有较强的导热能力。所述散热件1可以固定安装在所述内腔21中，所述导热部11与所述磁路系统的底面接触。在本发明的其它实施例中，所述导热部11还可以与所述磁路系统的其它位置接触。
特别的，在本发明的另一个实施例中，所述磁路系统中可以包括磁铁、华司以及盆架32，所述盆架32位于所述磁路系统的底部，用于承载所述磁铁和华司。所述盆架32由导磁材料构成，通常为铁基材料。所以，所述 散热件1可以与所述盆架32通过铸造或冲压一起成型，构成一体结构，所述导热部11与所述盆架32的底部连接在一起。
除上述实施例中所述散热件1的成型方法之外，本发明所述散热件1还可以与扬声器模组中的其它部件具有装配连接、成型关系。例如，在另一种实施方式中，所述散热件1还可以与所述模组外壳一体注塑成型。所述模组外壳通常由塑料材料制成，在注塑加工所述模组外壳时，可以将散热件1固定在注塑模具中，模组外壳完成注塑成型后，所述散热件1即被固定在所述模组外壳中。这种成型方式可以简化扬声器模组的装配步骤。
另外，所述前腔22和出声孔通常位于所述振膜31正面的上方，振膜31产生的声波可以直接沿振膜31的法线方向传到外部空间。但是，为了减小扬声器模组的厚度，所述前腔22还可以是侧出声前腔22。如图2-4所示，所述侧出声前腔22位于所述扬声器组件3的侧面，所述模组外壳的侧壁可以沿平行于所述振膜31的方向形成出声孔。振膜31产生的声波沿平行于所述振膜31的方向传播，由侧出声前腔22经侧出声孔传出。在所述前腔22为侧出声前腔的实施例中，如图4所示，所述散热件1的导热部11可以直接从扬声器组件3的底面向侧面延伸，所述散热部12从所述导热部11上伸出，进入位于扬声器组件3侧面的前腔22中。
优选的，所述导热部11与所述扬声器组件3之间可以涂覆用于增强导热性能的涂料，例如，可以是硅脂等材料。所述散热件1所采用的材料应具有较高的导热系数，通常可以采用铝、不锈钢等金属材料制成所述散热件1。
另外，在本发明提供的实施例中，如图2所示，所述模组外壳可以包括第一外壳23和第二外壳24。所述第二外壳24与所述第一外壳23扣合在一起，组合构成所述内腔21，如图4所示。所述模组外壳还可以包括前腔盖25，所述前腔盖25安装在所述前腔22上，将所述散热部12封在所述前腔22中。
虽然已经通过一些特定实施例对本发明进行了详细说明，但是本领域的技术人员应该理解，以上例子仅为了进行说明，而不是为了限制本发明的范围。本领域的技术人员应该理解，可在不脱离本发明的范围和精神的 情况下，对以上实施例进行修改。本发明的范围由所附权利要求来限定。

Claims (10)

  1. 一种扬声器模组，其特征在于，包括：
    模组外壳，所述模组外壳具有内腔(21)，所述内腔(21)包括分隔开的前腔(22)和后腔，所述前腔(22)与外部空间连通；
    扬声器组件(3)，所述扬声器组件(3)安装在所述内腔(21)中，所述扬声器组件(3)包括振膜(31)，所述振膜(31)将所述前腔(22)和所述后腔分隔；
    散热件(1)，所述散热件(1)具有导热部(11)和散热部(12)，所述导热部(11)与所述扬声器组件(3)接触，所述散热部(12)伸入所述前腔(22)中；
    所述振膜(31)振动使所述前腔(22)中的空气流动，提高所述散热部(12)的散热速率。
  2. 根据权利要求1所述的扬声器模组，其特征在于，所述散热部(12)具有用于增大散热面积的散热结构。
  3. 根据权利要求2所述的扬声器模组，其特征在于，所述散热结构为散热鳍片和/或散热针。
  4. 根据权利要求3所述的扬声器模组，其特征在于，所述内腔(21)通向外部空间的方向为出声方向，所述散热鳍片平行于所述出声方向。
  5. 根据权利要求1所述的扬声器模组，其特征在于，所述扬声器组件(3)包括磁路系统，所述散热件(1)固定安装在所内腔(21)中，所述导热部(11)与所述磁路系统接触。
  6. 根据权利要求1所述的扬声器模组，其特征在于，所述扬声器组件(3)包括磁路系统，所述磁路系统包括位于扬声器组件(3)底部的盆架(32)，所述散热件(1)与所述盆架(32)为一体结构，所述导热部(11)连接在所述盆架(32)上。
  7. 根据权利要求1所述的扬声器模组，其特征在于，所述散热件(1)与所述模组外壳一体成型。
  8. 根据权利要求1所述的扬声器模组，其特征在于，所述前腔(22) 为侧出声前腔(22)，所述模组外壳的侧壁沿平行于所述振膜(31)的方向设置有出声孔。
  9. 根据权利要求1-5、7、8任意之一所述的扬声器模组，其特征在于，所述导热部(11)与所述扬声器组件(3)之间涂有硅脂。
  10. 根据权利要求1-8任意之一所述的扬声器模组，其特征在于，所述模组外壳包括第一外壳(23)和第二外壳(24)，所述第一外壳(23)和第二外壳(24)组合构成所述内腔(21)。
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