WO2016188235A1 - Pcb拼板子单元的移植方法和pcb拼板 - Google Patents

Pcb拼板子单元的移植方法和pcb拼板 Download PDF

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Publication number
WO2016188235A1
WO2016188235A1 PCT/CN2016/078714 CN2016078714W WO2016188235A1 WO 2016188235 A1 WO2016188235 A1 WO 2016188235A1 CN 2016078714 W CN2016078714 W CN 2016078714W WO 2016188235 A1 WO2016188235 A1 WO 2016188235A1
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Prior art keywords
panel
unit
mating portion
qualified
pcb
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PCT/CN2016/078714
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English (en)
French (fr)
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高峰鸽
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中兴通讯股份有限公司
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Publication of WO2016188235A1 publication Critical patent/WO2016188235A1/zh

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/368—Assembling printed circuits with other printed circuits parallel to each other
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/142—Arrangements of planar printed circuit boards in the same plane, e.g. auxiliary printed circuit insert mounted in a main printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits

Definitions

  • This application relates to, but is not limited to, the field of communication technology.
  • the PCB (Printed Circuit Board) design refers to the designer's assembly of some irregular shape PCBs according to the PCB factory board size to reduce PCB board waste and improve production efficiency.
  • the mobile phone motherboard is usually designed as 4 puzzles (ie, four motherboards are made into one PCB on one plate), but in the actual PCB processing, there will always be 4 puzzles.
  • SMT Surface Mount Technology
  • the production efficiency is reduced.
  • a PCB puzzle migration solution is generated, and the mobile phone motherboard is highly densely interconnected, which requires a very high precision for the assembled puzzle.
  • the design of the panel is not only affected by the size of the unit, but also has a great influence on the size design of the panel due to the limitation of the processing capacity of the PCB factory in each process and the size specification of the upstream sheet supplier.
  • the same design will have different outputs for different PCB factories, and the different utilization rates of the plates will result in different PCB factory costs. For a multi-ply PCB board, customers often concede to receive products containing one or two defective boards in order to reduce costs.
  • the related technology implementation method includes a linear and step-shaped splicing scheme.
  • the sub-board after the migration is prone to shift, and the error is large, which cannot meet the high-density mutuality of the mobile phone.
  • Even the accuracy requirements result in poor surface mount technology SMT reliability and low yield.
  • the PCB board sub-unit transplantation method adopting the linear or step-shaped splicing scheme can barely apply a simple PCB board, and the PCB board material package is large, and the welding precision is not high.
  • mobile phone HDI (High Density Interconnector) board, PCB device layout is dense, small size, high requirements for SMT accuracy, SMT reliability will occur with the relevant technology migration scheme Poor, low yield and other issues.
  • This paper provides a method for transplanting PCB board sub-units and PCB board. After the completion of the transplant, the PCB board can meet the high-precision requirements of SMT, and can be better applied to the mobile phone high-density interconnected HDI board for board sub-unit transplantation.
  • a method for transplanting a PCB puzzle subunit includes:
  • the qualified unit is installed at the vacancy in the first panel, and the first mating portion and the second mating portion are fitted together to qualify the unit at least in the longitudinal direction of the first panel and the upper limit in the width direction.
  • the second panel is also a defective panel, and the shape of the vacancy matches the shape of the qualified unit.
  • the method for transplanting the PCB panel subunit further comprises: collecting the unqualified panel containing both the unqualified unit and the qualified unit, and Qualified units and unqualified units in the unqualified panels are calibrated.
  • the qualified unit is installed at a vacancy in the first panel, and the first mating portion and the second mating portion are cooperatively mounted to at least the length direction of the first panel and the upper limit of the width direction.
  • the step of passing the unit further includes: bonding the qualified unit and the first panel with glue.
  • the qualified unit is installed at the vacancy in the first panel, and the first mating portion and the second mating portion are cooperatively mounted to at least the length direction of the first panel and the upper limit of the width direction.
  • the method for transplanting the PCB panel subunit further comprises: baking, high pressure water washing, precision detection, electrical measurement, final measurement, and vacuum packaging of the first panel mounted with the qualified unit.
  • the method before the rejecting the unqualified unit in the unqualified first panel, the method further includes: Using geber to design the cutting shape of the unqualified unit and the qualified unit;
  • the step of cutting out the qualified unit in the second panel while cutting the second mating portion at the edge of the qualified unit and matching the structure of the first mating portion with the structure of the second mating portion To cut out the qualified unit and the second mating part.
  • the qualified unit is installed at a vacancy in the first panel, and the first mating portion and the second mating portion are cooperatively mounted to at least the length direction of the first panel and the upper limit of the width direction.
  • the step of passing the unit includes: one of the first mating portion and the second mating portion is a T-shaped tongue, and the other is a T-shaped slot, and the T-shaped tongue is inserted into the T-shaped slot to be in the first fight
  • the upper limit of the board in the length direction and the width direction is the qualified unit.
  • the qualified unit is installed at a vacancy in the first panel, and the first mating portion and the second mating portion are cooperatively mounted to at least the length direction of the first panel and the upper limit of the width direction.
  • the step of the qualified unit includes: one of the first mating portion and the second mating portion is a tab, and the other is a slot through which the side wall penetrates, and the insert is inserted into the slot to be at the length of the first panel The upper limit position in the direction, the width direction, and the height direction; wherein the sum of the thickness of the tab and the thickness of the bottom wall of the slot is equal to the thickness of the qualified unit.
  • the first mating portion and the second mating portion are a plurality of one-to-one correspondingly arranged.
  • a PCB panel comprising: a first panel, wherein the unqualified unit has a vacancy cut, a first mating portion is cut around the vacancy; and a qualified unit having a second mating portion at the edge is installed In the vacancy, the first mating portion and the second mating portion are matched and mounted to at least in the longitudinal direction of the first panel and the upper limit in the width direction.
  • the PCB panel further includes: an adhesive layer bonded between the first panel and the qualified unit.
  • one of the first mating portion and the second mating portion is a T-shaped tongue and the other is a T-shaped slot.
  • one of the first mating portion and the second mating portion is a tab and the other is a sidewall
  • the slot is opened, and the sum of the thickness of the tab and the thickness of the bottom wall of the slot is equal to the thickness of the qualified unit.
  • the thickness of the tab is equal to the thickness of the bottom wall of the slot.
  • the first mating portion and the second mating portion are a plurality of one-to-one correspondingly arranged.
  • a computer readable storage medium storing computer executable instructions for performing the method of any of the above.
  • the method for transplanting the PCB panel subunit provided by the embodiment of the present invention, when the qualified unit is installed at the vacancy of the first panel, is installed by the cooperation of the first mating portion and the second mating portion, at least in The upper part of the first panel and the upper limit of the width direction pass the unit, so that the position of the original unit is completely coincident with the position of the original unqualified unit after installation, thereby avoiding the positional deviation on the panel of the first panel due to the swaying misalignment. It satisfies the high precision requirements of SMT, so as to better adapt to the high-density interconnected HDI board of the mobile phone for the sub-unit migration of the board, to ensure the accuracy of the subsequent patch and welding process, and to ensure high yield.
  • FIG. 1 is a flow chart of a method for transplanting a PCB board subunit according to an embodiment of the present invention
  • FIG. 2 is a flowchart of a method for transplanting a PCB board subunit according to another embodiment of the present invention.
  • FIG. 3 is a schematic structural view of a failed first panel according to an embodiment of the present invention.
  • FIG. 4 is a schematic exploded view of the first panel and the qualified unit shown in FIG. 3;
  • FIG. 5 is a schematic structural view of the first panel and the qualified unit shown in FIG. 3 after assembly.
  • the method for transplanting a PCB board subunit provided by the embodiment of the present invention, as shown in FIG. 1 includes:
  • Step 104 the defective unit 11 in the unqualified first panel 1 is cut out, so that the vacancy 13 is formed at the unqualified unit 11 on the first panel 1 while being at the edge of the vacancy 13 on the first panel 1 (such as: transfer process edge 12) cut out the first mating portion 31;
  • Step 106 cutting out the qualified unit 2 in the second panel, while cutting out the second mating portion 32 at the edge of the qualified unit 2, and matching the structure of the first mating portion 31 with the structure of the second mating portion 32;
  • Step 108 the qualified unit 2 (each refers to the qualified unit cut out in the second panel) is installed at the vacancy 13 in the first panel 1, and the first mating portion 31 and the second mating portion 32 are fitted together, The unit 2 is qualified at least in the longitudinal direction of the first panel 1 and the upper limit in the width direction.
  • the method for transplanting the PCB panel subunit provided by the embodiment of the present invention, when the qualified unit 2 is installed at the vacancy 13 of the first panel 1, is installed by the cooperation of the first mating portion 31 and the second mating portion 32, at least in the first The upper end of the panel 1 and the upper limit of the width direction pass unit 2, so that the qualified unit 2 is completely coincident with the position of the original unqualified unit 11 after installation, so as to avoid appearing on the panel of the first panel 1 due to the swaying misalignment.
  • the positional deviation makes it meet the high precision requirements of SMT, so as to better adapt to the high-density interconnected HDI board of the mobile phone for the sub-unit migration, ensuring the accuracy of subsequent patching and soldering processes and ensuring high yield.
  • the subunit includes the qualified unit 2 and the unqualified unit 11.
  • the method for transplanting the PCB panel subunit provided by the above embodiment of the present invention may further have the following additional technical features:
  • the second panel is also a defective panel, and the shape of the vacancy 13 matches the shape of the qualified unit 2.
  • the second panel can also be selected with qualified panels, and the purpose of the application can also be achieved.
  • the method for transplanting the PCB panel subunit may further include: step 102, collecting the unqualified panel containing both the unqualified unit 11 and the qualified unit 2, and calibrating the qualified unit in the unqualified panel 2 And the unqualified unit 11, the purpose of which is to make a qualified jig in a defective jig.
  • step 108 the qualified unit 2 and the first panel 1 are bonded together using glue.
  • the first engaging portion 31 and the second engaging portion 32 pre-position the position of the qualified unit 2 in the first panel 1 to prevent the qualified unit 2 from deviating from the set position due to shaking during the installation process, and the function of the glue
  • the positioning qualified unit 2 is placed on the first panel 1 to fix the two together, and is not displaced during subsequent processes such as patching and welding to ensure the yield.
  • the method for transplanting the PCB panel subunit may further include: step 110, mounting the first panel 1 of the qualified unit 2 for baking, high pressure water washing, precision detection, electrical measurement, final measurement, and Vacuum packed.
  • the purpose of the baking is to solidify and bond the glue, so that the qualified unit 2 and the first panel 1 are completely combined and firmly.
  • high-pressure water washing is to remove defects such as burrs during the cutting process, and to ensure the smoothness and cleanliness of the panel surface.
  • the purpose of precision detection, electrical measurement and final measurement is to ensure the electrical properties of the finished panel.
  • vacuum packaging is to prevent oxidation of the finished panels during subsequent transportation and the like.
  • the cutting shape of the defective unit 11 and the qualified unit 2 is designed by using a geber (PCB processing file), the vacancy 13 is cut out by the output cutting program, the pass unit 2, the first mating portion 31, and the second mating portion 32 are cut. .
  • the vacancy 13 and the first engaging portion 31 can be produced together or sequentially by laser engraving, turning, and the like.
  • one of the first mating portion 31 and the second mating portion 32 is a T-shaped tongue, and the other is a T-shaped slot, and the T-shaped insert
  • the tongue is inserted into the T-shaped slot to qualify the unit 2 in the longitudinal direction of the first panel 1 and the upper limit in the width direction.
  • the implementation manner may be that: the defective unit 11 of the first panel 1 and the qualified unit 2 of the second panel are laser engraved by respective output programs, and the first mating portion 31 and the vacancy 13 are ensured.
  • the shape is identical to the shape of the pass unit 2 and the second mating portion 32, achieving seamless integration.
  • the first mating portion 31 and the second mating portion 32 may be the same number of matching applications, and the plurality of first mating portions 31 may simultaneously include a T-shaped slot and a T-shaped tongue, and the plurality of second mating portions The portion 32 corresponds to both a T-shaped slot and a T-shaped tongue.
  • first fitting portion 31 and the second fitting portion 32 may have other shapes such as a triangle or the like.
  • one of the first mating portion 31 and the second mating portion 32 is a tab, and the other is a slot through which a side wall passes. Inserted in the slot, in the length direction of the first panel 1, in the width direction and in the height direction upper limit level 2; wherein the sum of the thickness of the tab and the thickness of the bottom wall of the slot is equal to the qualified unit 2 thickness of.
  • the thickness of the tab is equal to the thickness of the bottom wall of the slot, which is one-half the thickness of the qualified unit 2.
  • the implementation manner may be: the unqualified unit 11 of the first panel 1 and the qualified unit 2 of the second panel are blindly fished by the respective output programs, and the shape and the first matching portion 31 and the vacancy 13 are ensured and qualified.
  • the shape of the unit 2 and the second mating portion 32 are identical, and the alignment is achieved.
  • the main difference from the above embodiment is that the slot is a slot in the above embodiment, and the slot in this embodiment is a blind slot.
  • the other structures are alternately replaced, and the shape is also replaced by any method. Such as a word type, T shape, etc., will not be described here.
  • the first mating portion 31 and the second mating portion 32 may be the same number of matching applications, and the plurality of first mating portions 31 may include the insert and the slot at the same time, and the plurality of second mating portions 32 correspond to Both the insert and the slot are included, and other equivalents are not described here.
  • the first mating portion 31 and the second mating portion 32 are one-to-one and uniformly arranged, so that the position of the qualified unit 2 on the first panel 1 can be better ensured, and the shifting is prevented. Bit.
  • the position accuracy error of the qualified unit 2 after the transplantation is controlled within 2 mil, which normally satisfies the production conditions of the downstream SMT patch (surface mount).
  • the PCB panel structure After the transplantation, the PCB panel structure has strong bearing capacity and can be destructively tested.
  • the high temperature immersion tin is 288 ° C, three times in 10 seconds, and the height of 1.2 to 1.5 meters falls to the ground in parallel and will not break;
  • the method for transplanting the PCB panel subunit provided by the embodiment of the invention can not only transplant the qualified unit 2 of the unqualified panel, but also can process the edge 12 by using the sheet trimming processing board to maximize the utilization of the panel, including
  • the sub-boards (ie, sub-units) all adopt high-precision transplantation technology, and the transfer process side 12 can be repeatedly used, which is equivalent to the case where all sub-units of the unqualified panel of the present application are the unqualified units 11.
  • the PCB panel provided by the embodiment of the present invention includes: a first panel 1 on which the unqualified unit 11 is cut with a vacancy 13 and the vacancy 13 is cut at the periphery.
  • the mating portion 31; and the qualified unit 2 having the second mating portion 32 at the edge thereof are mounted in the vacancy 13, and the first mating portion 31 is fitted to the second mating portion 32 to be at least at the length of the first panel 1
  • the upper limit in the direction and width direction is the qualified unit 2.
  • the qualified unit 2 when the qualified unit 2 is installed at the vacancy 13 of the first panel 1 , the first mating portion 31 and the second mating portion 32 are fitted together to at least the first panel 1 .
  • the upper limit position in the longitudinal direction and the width direction is the qualified unit 2, so that the position of the qualified unit 2 is completely coincident with the position of the original unqualified unit 11, and the positional deviation on the panel of the first panel 1 due to the swaying misalignment is avoided. It satisfies the high precision requirements of SMT, so as to better adapt to the high-density interconnected HDI board of the mobile phone for the sub-unit migration of the board, to ensure the accuracy of the subsequent patch and welding process, and to ensure high yield.
  • the PCB panel further includes an adhesive layer bonded between the first panel 1 and the qualified unit 2.
  • the adhesive layer is an adhesive layer, which is fixedly bonded together by glue.
  • one of the first mating portion 31 and the second mating portion 32 is a T-shaped tongue and the other is a T-shaped socket.
  • the first mating portion 31 and the second portion One of the mating portions 32 is a tab and the other is a slot through which a side wall passes, and the sum of the thickness of the tab and the thickness of the bottom wall of the slot is equal to the thickness of the pass unit 2.
  • the thickness of the insert is equal to the thickness of the bottom wall of the slot (the unequal manner will not be described again).
  • the first engaging portion 31 and the second engaging portion 32 are a plurality of one-to-one correspondingly arranged.
  • connection may be a fixed connection or a detachable connection, or Connected in one piece; they can be connected directly or indirectly through an intermediate medium.
  • the qualified unit when the qualified unit is installed at the vacancy of the first panel, the first mating portion and the second mating portion are fitted and fitted, at least in the longitudinal direction of the first panel and the upper limit in the width direction.
  • the unit makes the position of the qualified unit completely coincide with the position of the original unqualified unit, and avoids the positional deviation on the panel of the first panel due to the swaying misalignment, so that it satisfies the high precision requirement of the SMT, so as to be better applicable.
  • the high-density interconnected HDI board of the mobile phone is used to transplant the sub-units of the board to ensure the accuracy of subsequent patching and soldering processes and ensure high yield.

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Abstract

一种PCB拼板子单元的移植方法和PCB拼板。PCB拼板子单元的移植方法包括：切除不合格的第一拼板（1）中的不合格单元（11）、使第一拼板上的不合格单元处形成空位（13），同时在第一拼板上空位的边缘处切出第一配合部（31）；切除第二拼板中的合格单元（2），同时在合格单元的边缘处切出第二配合部（32），并使第一配合部的结构与第二配合部的结构匹配；将合格单元安装于第一拼板中的空位处，并使第一配合部和第二配合部配合安装，以至少在第一拼板的长度方向上和宽度方向上限位合格单元。

Description

PCB拼板子单元的移植方法和PCB拼板 技术领域
本申请涉及但不限于通信技术领域。
背景技术
PCB(Printed Circuit Board，印制电路板)拼板设计，是指设计者根据PCB工厂板材尺寸，对一些不规则形状PCB进行拼合，以减少PCB板材浪费，提升生产效率。在与PCB供应商沟通交流中发现，手机主板通常设计为4拼板(即：四个主板制作在一张板材上成为一个PCB拼板)，但是在PCB实际加工中，总会出现4拼板中有1个或者2个板子(相当于本申请中的子单元)加工缺陷，不满足要求，如果直接报废造成PCB加工成本上升，如果勉强贴片，造成SMT(Surface Mount Technology，表面组装技术)生产效率降低，针对此问题，就产生了PCB拼板移植方案，而手机主板高密互连，对移植后的拼板精度要求非常高。
拼板设计不但受单元尺寸影响，同时由于受PCB工厂在每个工序制程设备加工能力的制约、上游板材供应商大料尺寸规格限制等，对拼板尺寸设计有很大的影响。相同的设计对于不同的PCB工厂，会有不同的产出，板材利用率的不同，造成不同的PCB工厂成本有差异。对于一个多拼的PCB板，经常为了降低成本，客户让步接收包含1个或者2个缺陷板的产品。
针对上述问题，业界开始研究PCB拼板子单元移植的方案，相关技术实现方法包含有直线型、阶梯形拼接方案，但是此方案移植后的子板容易发生移位，误差大，无法满足手机高密互连精度要求，造成表面组装技术SMT可靠性差，良率低下。
采用直线型或阶梯形拼接方案的PCB拼板子单元移植方法，勉强可以适用简单的PCB板，该PCB板物料封装大，对焊接精度要求不高。但是手机HDI(High Density Interconnector，高密互连)板，PCB器件布局密集，尺寸细小，对SMT精度要求高，采用相关技术的移植方案将会出现SMT可靠性 差，良率低下等问题。
发明内容
以下是对本文详细描述的主题的概述。本概述并非是为了限制权利要求的保护范围。
本文提供了一种PCB拼板子单元的移植方法和PCB拼板，移植完成后的PCB拼板能够满足SMT的高精度要求，可更好地适用于手机高密互连HDI板进行拼板子单元移植。
一种PCB拼板子单元的移植方法，包括：
切除不合格的第一拼板中的不合格单元，使第一拼板上的不合格单元处形成空位，同时在第一拼板上空位的边缘处切出第一配合部；
切除第二拼板中的合格单元，同时在合格单元的边缘处切出第二配合部，并使第一配合部的结构与第二配合部的结构匹配；
将合格单元安装于第一拼板中的空位处，并使第一配合部和第二配合部配合安装、以至少在第一拼板的长度方向上和宽度方向上限位合格单元。
可选地，所述第二拼板也为不合格的拼板，且空位的形状与合格单元的形状匹配。
可选地，所述切除不合格的第一拼板中的不合格单元之前，所述PCB拼板子单元的移植方法还包括：收集同时含有不合格单元和合格单元的不合格的拼板、并标定不合格的拼板中的合格单元和不合格单元。
可选地，所述将合格单元安装于第一拼板中的空位处，并使第一配合部和第二配合部配合安装、以至少在第一拼板的长度方向上和宽度方向上限位合格单元的步骤中，还包括：使用胶水粘接合格单元和第一拼板。
可选地，将合格单元安装于第一拼板中的空位处，并使第一配合部和第二配合部配合安装、以至少在第一拼板的长度方向上和宽度方向上限位合格单元之后，所述PCB拼板子单元的移植方法还包括：将安装有合格单元的第一拼板进行烘烤、高压水洗、精度检测、电测、终测和真空包装。
可选地，所述切除不合格的第一拼板中的不合格单元之前，还包括：采 用geber设计出不合格单元和合格单元的切割形状；
所述切除不合格的第一拼板中的不合格单元，使第一拼板上的不合格单元处形成空位，同时在第一拼板上空位的边缘处切出第一配合部的步骤中，通过输出切割程式来切出空位和第一配合部；
所述切除第二拼板中的合格单元，同时在合格单元的边缘处切出第二配合部，并使第一配合部的结构与第二配合部的结构匹配的步骤中，通过输出切割程式来切出合格单元和第二配合部。
可选地，所述将合格单元安装于第一拼板中的空位处，并使第一配合部和第二配合部配合安装、以至少在第一拼板的长度方向上和宽度方向上限位合格单元的步骤包括：第一配合部和第二配合部中的一个为T形插舌、另一个为T形插槽，T形插舌插装于T形插槽内、以在第一拼板的长度方向上和宽度方向上限位合格单元。
可选地，所述将合格单元安装于第一拼板中的空位处，并使第一配合部和第二配合部配合安装、以至少在第一拼板的长度方向上和宽度方向上限位合格单元的步骤包括：第一配合部和第二配合部中的一个为插片、另一个为一侧壁贯通的插槽，插片插装于插槽内、以在第一拼板的长度方向上、宽度方向上和高度方向上限位合格单元；其中，插片的厚度和插槽底壁的厚度之和等于合格单元的厚度。
可选地，第一配合部和第二配合部为一一对应均布设置的多个。
一种PCB拼板，包括：第一拼板，其上的不合格单元处切有空位、所述空位周边处切有第一配合部；和边缘处切有第二配合部的合格单元，安装在空位内，且第一配合部与第二配合部匹配安装、以至少在第一拼板的长度方向上和宽度方向上限位合格单元。
可选地，所述PCB拼板还包括：粘结层，粘接于第一拼板和合格单元之间。
可选地，第一配合部和第二配合部中的一个为T形插舌、另一个为T形插槽。
可选地，第一配合部和第二配合部中的一个为插片、另一个为一侧壁贯 通的插槽，且插片的厚度和插槽底壁的厚度之和等于合格单元的厚度。
可选地，插片的厚度和插槽底壁的厚度相等。
可选地，第一配合部和第二配合部为一一对应均布设置的多个。
一种计算机可读存储介质，存储有计算机可执行指令，所述计算机可执行指令用于执行上述任一项的方法。
与相关技术相比，本发明实施例提供的PCB拼板子单元的移植方法，合格单元安装在第一拼板的空位处时，通过第一配合部和第二配合部的配合安装、以至少在第一拼板的长度方向上和宽度方向上限位合格单元，使合格单元安装后与原不合格单元的位置基本完全重合，避免因晃动错位而出现在第一拼板的面板上的位置偏差，使其满足SMT的高精度要求，以更好地适用了手机高密互连HDI板进行拼板子单元移植，保证后续贴片和焊接工序的精准性，确保高良率。
在阅读并理解了附图和详细描述后，可以明白其他方面。
附图概述
图1为本发明一个实施例所述的PCB拼板子单元的移植方法的流程图；
图2为本发明另一个实施例所述的PCB拼板子单元的移植方法的流程图；
图3为本发明一个实施例所述的不合格的第一拼板的结构示意图；
图4为图3所示的第一拼板和合格单元的分解结构示意图；
图5为图3所示的第一拼板和合格单元的组装后的结构示意图。
其中，图3至图5中附图标记与部件名称之间的对应关系为：
1 第一拼板，11 不合格单元，12 传送工艺边，13 空位，2 合格单元，31 第一配合部，32 第二配合部。
本发明的实施方式
下文中将结合附图对本发明的实施方式进行详细说明。需要说明的是，在不冲突的情况下，本申请中的实施例及实施例中的特征可以相互任意组合。
下面结合附图描述本发明一些实施例所述的PCB拼板子单元的移植方法和PCB拼板。
本发明实施例提供的PCB拼板子单元的移植方法，如图1所示，包括：
步骤104，切除不合格的第一拼板1中的不合格单元11，使第一拼板1上的不合格单元11处形成空位13，同时在第一拼板1上空位13的边缘处(如：传送工艺边12上)切出第一配合部31；
步骤106，切除第二拼板中的合格单元2，同时在合格单元2的边缘处切出第二配合部32，并使第一配合部31的结构与第二配合部32的结构匹配；
步骤108，将合格单元2(均指第二拼板中切出的合格单元)安装于第一拼板1中的空位13处，并使第一配合部31和第二配合部32配合安装、以至少在第一拼板1的长度方向上和宽度方向上限位合格单元2。
本发明实施例提供的PCB拼板子单元的移植方法，合格单元2安装在第一拼板1的空位13处时，通过第一配合部31和第二配合部32的配合安装、以至少在第一拼板1的长度方向上和宽度方向上限位合格单元2，使合格单元2安装后与原不合格单元11的位置基本完全重合，避免因晃动错位而出现在第一拼板1的面板上的位置偏差，使其满足SMT的高精度要求，以更好地适用了手机高密互连HDI板进行拼板子单元移植，保证后续贴片和焊接工序的精准性，确保高良率。
其中，子单元包括有合格单元2和不合格单元11。
另外，本发明上述实施例提供的PCB拼板子单元的移植方法还可具有如下附加的技术特征：
可选地，如图2所示，步骤106中，第二拼板也为不合格的拼板，且空位13的形状与合格单元2的形状匹配。
当然，第二拼板也可选用合格的拼板，也可实现本申请的目的。
如图2所示，PCB拼板子单元的移植方法还可包括：步骤102，收集同时含有不合格单元11和合格单元2的不合格的拼板、并标定不合格的拼板中的合格单元2和不合格单元11，其目的是在不合格的拼板中制作合格的拼板。
如图2所示，步骤108中，同时使用胶水粘接合格单元2和第一拼板1。
第一配合部31和第二配合部32来预定位合格单元2在第一拼板1中的位置，防止合格单元2在安装过程中因晃动而发生偏离设定位置的情况发生，胶水的作用是定位合格单元2于第一拼板1上，使二者固定在一起，在后续的贴片和焊接等工序过程中不移位，确保良率。
再者，如图2所示，PCB拼板子单元的移植方法还可包括：步骤110，安装有合格单元2的第一拼板1进行烘烤、高压水洗、精度检测、电测、终测和真空包装。
烘烤的目的是使胶水固化粘接，实现合格单元2与第一拼板1完全结合牢固。
高压水洗的目的是去除切除过程中的毛刺等缺陷，保证拼板板面的光滑度和清洁度。
精度检测、电测和终测的目的均是为了保证制成的拼板的电性能。
真空包装的目的是防止制成的拼板后续运输等过程中被氧化。
可选地，采用geber(PCB加工文件)设计出不合格单元11和合格单元2的切割形状、通过输出切割程式来切出空位13、合格单元2、第一配合部31和第二配合部32。
其中，空位13和第一配合部31(或合格单元2和第二配合部32)可通过激光镂刻、车削加工等方法一起制作出或分先后顺序制作出来。
本发明的第一个实施例中，如图3至图5所示，第一配合部31和第二配合部32中的一个为T形插舌、另一个为T形插槽，T形插舌插装于T形插槽内、以在第一拼板1的长度方向上和宽度方向上限位合格单元2。
实现方式可以是：第一拼板1的不合格单元11处和第二拼板的合格单元2处通过各自的输出程式进行激光镂刻，保证且有第一配合部31和空位13 的形状与合格单元2和第二配合部32的形状一致，实现无缝结合。
其中，第一配合部31和第二配合部32可以为相同数量、匹配应用的多个，且多个第一配合部31可以同时包含T形插槽和T形插舌，多个第二配合部32对应同时包含T形插槽和T形插舌。
另外，第一配合部31和第二配合部32也可以是其他形状，如三角形等。
本发明的第二个实施例中(此方案图中未示出)，第一配合部31和第二配合部32中的一个为插片、另一个为一侧壁贯通的插槽，插片插装于插槽内、来在第一拼板1的长度方向上、宽度方向上和高度方向上限位合格单元2；其中，插片的厚度和插槽底壁的厚度之和等于合格单元2的厚度。
且可选地，插片的厚度和插槽底壁的厚度相等，均为合格单元2厚度的二分之一。
实现方式可以是：第一拼板1的不合格单元11处和第二拼板的合格单元2处通过各自的输出程式进行盲捞，保证且有第一配合部31和空位13的形状与合格单元2和第二配合部32的形状一致，实现对位结合。其与上述实施例的主要区别主要是上述实施例为插槽为通槽，本实施例的插槽为盲槽，其他结构选用等同代换的方式，其形状也采用等同代换的任意方式(如一字型、T形等)，在此不再赘述。
其中，第一配合部31和第二配合部32可以为相同数量、匹配应用的多个，且多个第一配合部31可以同时包含插片和和插槽，多个第二配合部32对应同时包含插片和和插槽，其他等同方式不再赘述。
较好地，第一配合部31和第二配合部32为一一对应且均布设置的多个，这样可更好地保证合格单元2在第一拼板1上的位置，避免其发生移位。
本发明实施例制成的PCB拼板的检验，需要重点检验如下指标、并要求能够满足下列要求：
1、移植后合格单元2的位置精度误差控制在2mil内，正常满足下游SMT贴片(表面贴装)上件生产条件；
2、移植后的PCB拼板耐高温(无铅235℃～266℃)，不会出现掉板(即：合格单元2)及变形的问题；
3、移植后PCB拼板结构牢固承受力大，可做破坏性试验，高温浸锡288℃，10秒三次，1.2～1.5米高处平行跌落到地上，不会破裂；
4、采用符合欧盟ROHS要求专用胶水，移植后板上没胶水颜色，无明显痕迹，保证板面干净，外观良好。
本发明实施例提供的PCB拼板子单元的移植方法，不仅可以移植不合格拼板的合格单元2，也可以是利用板材边角料加工拼板传送工艺边12，最大化提高拼板利用率，所含子板(即：子单元)全部采用高精度移植技术，传送工艺边12可反复循环使用，相当于本申请的不合格拼板的全部子单元为不合格单元11的情况。
本发明实施例提供的PCB拼板，如图3至图5所示，包括：第一拼板1，其上的不合格单元11处切有空位13、所述空位13周边处切有第一配合部31；和边缘处切有第二配合部32的合格单元2，安装在空位13内，且第一配合部31与第二配合部32匹配安装、以至少在第一拼板1的长度方向上和宽度方向上限位合格单元2。
本发明实施例提供的PCB拼板，合格单元2安装在第一拼板1的空位13处时，通过第一配合部31和第二配合部32的配合安装、以至少在第一拼板1的长度方向上和宽度方向上限位合格单元2，使合格单元2安装后与原不合格单元11的位置基本完全重合，避免因晃动错位而出现在第一拼板1的面板上的位置偏差，使其满足SMT的高精度要求，以更好地适用了手机高密互连HDI板进行拼板子单元移植，保证后续贴片和焊接工序的精准性，确保高良率。
PCB拼板还包括：粘结层，粘接于第一拼板1和合格单元2之间。
其中，粘结层为胶粘层，采用胶水固定粘接在一起。
本发明的一个实施例中，如图3至图5所示，第一配合部31和第二配合部32中的一个为T形插舌、另一个为T形插槽。
本发明的另一个实施例中(此方案图中未示出)，第一配合部31和第二 配合部32中的一个为插片、另一个为一侧壁贯通的插槽，且插片的厚度和插槽底壁的厚度之和等于合格单元2的厚度。
其中，插片的厚度和插槽底壁的厚度相等(不等的方式不再赘述)。
第一配合部31和第二配合部32为一一对应均布设置的多个。
在本发明实施例的描述中，术语“安装”、“相连”、“连接”、“固定”等均应做广义理解，例如，“连接”可以是固定连接，也可以是可拆卸连接，或一体地连接；可以是直接相连，也可以通过中间媒介间接相连。
在本说明书的描述中，术语“一个实施例”、“一些实施例”、“实施例”等的描述意指结合该实施例或示例描述的特征、结构、材料或特点包含于本发明的至少一个实施例或示例中。在本说明书中，对上述术语的示意性表述不一定指的是相同的实施例或实例。而且，描述的特征、结构、材料或特点可以在任何的一个或多个实施例或示例中以合适的方式结合。
工业实用性
通过本发明实施例，合格单元安装在第一拼板的空位处时，通过第一配合部和第二配合部的配合安装、以至少在第一拼板的长度方向上和宽度方向上限位合格单元，使合格单元安装后与原不合格单元的位置基本完全重合，避免因晃动错位而出现在第一拼板的面板上的位置偏差，使其满足SMT的高精度要求，以更好地适用了手机高密互连HDI板进行拼板子单元移植，保证后续贴片和焊接工序的精准性，确保高良率。

Claims (16)

  1. 一种PCB拼板子单元的移植方法，包括：
    切除不合格的第一拼板(1)中的不合格单元(11)，使第一拼板(1)上的不合格单元(11)处形成空位(13)，同时在第一拼板(1)上空位(13)的边缘处切出第一配合部(31)；
    切除第二拼板中的合格单元(2)，同时在合格单元(2)的边缘处切出第二配合部(32)，并使第一配合部(31)的结构与第二配合部(32)的结构匹配；
    将合格单元(2)安装于第一拼板(1)中的空位(13)处，并使第一配合部(31)和第二配合部(32)配合安装、以至少在第一拼板(1)的长度方向上和宽度方向上限位合格单元(2)。
  2. 根据权利要求1所述的PCB拼板子单元的移植方法，其中，
    所述第二拼板也为不合格的拼板，且空位(13)的形状与合格单元(2)的形状匹配。
  3. 根据权利要求2所述的PCB拼板子单元的移植方法，其中，所述切除不合格的第一拼板(1)中的不合格单元(11)之前，还包括：
    收集同时含有不合格单元(11)和合格单元(2)的不合格的拼板、并标定不合格的拼板中的合格单元(2)和不合格单元(11)。
  4. 根据权利要求1至3中任一项所述的PCB拼板子单元的移植方法，其中，
    所述将合格单元(2)安装于第一拼板(1)中的空位(13)处，并使第一配合部(31)和第二配合部(32)配合安装、以至少在第一拼板(1)的长度方向上和宽度方向上限位合格单元(2)的步骤中，还包括：使用胶水粘接合格单元(2)和第一拼板(1)。
  5. 根据权利要求4所述的PCB拼板子单元的移植方法，其中，将合格单元(2)安装于第一拼板(1)中的空位(13)处，并使第一配合部(31)和第二配合部(32)配合安装、以至少在第一拼板(1)的长度方向上和宽度 方向上限位合格单元(2)之后，还包括：
    将安装有合格单元(2)的第一拼板(1)进行烘烤、高压水洗、精度检测、电测、终测和真空包装。
  6. 根据权利要求1至3中任一项所述的PCB拼板子单元的移植方法，其中，所述切除不合格的第一拼板(1)中的不合格单元(11)之前，还包括：
    采用geber设计出不合格单元(11)和合格单元(2)的切割形状；
    所述切除不合格的第一拼板(1)中的不合格单元(11)，使第一拼板(1)上的不合格单元(11)处形成空位(13)，同时在第一拼板(1)上空位(13)的边缘处切出第一配合部(31)的步骤中，通过输出切割程式来切出空位(13)和第一配合部(31)；
    所述切除第二拼板中的合格单元(2)，同时在合格单元(2)的边缘处切出第二配合部(32)，并使第一配合部(31)的结构与第二配合部(32)的结构匹配的步骤中，通过输出切割程式来切出合格单元(2)和第二配合部(32)。
  7. 根据权利要求6所述的PCB拼板子单元的移植方法，其中，所述将合格单元(2)安装于第一拼板(1)中的空位(13)处，并使第一配合部(31)和第二配合部(32)配合安装、以至少在第一拼板(1)的长度方向上和宽度方向上限位合格单元(2)的步骤包括：第一配合部(31)和第二配合部(32)中的一个为T形插舌、另一个为T形插槽，T形插舌插装于T形插槽内、以在第一拼板(1)的长度方向上和宽度方向上限位合格单元(2)。
  8. 根据权利要求6所述的PCB拼板子单元的移植方法，其中，所述将合格单元(2)安装于第一拼板(1)中的空位(13)处，并使第一配合部(31)和第二配合部(32)配合安装、以至少在第一拼板(1)的长度方向上和宽度方向上限位合格单元(2)的步骤包括：第一配合部(31)和第二配合部(32)中的一个为插片、另一个为一侧壁贯通的插槽，插片插装于插槽内、以在第一拼板(1)的长度方向上、宽度方向上和高度方向上限位合格单元(2)；
    其中，插片的厚度和插槽底壁的厚度之和等于合格单元(2)的厚度。
  9. 根据权利要求6所述的PCB拼板子单元的移植方法，其中，第一配 合部(31)和第二配合部(32)为一一对应均布设置的多个。
  10. 一种PCB拼板，包括：
    第一拼板(1)，其上的不合格单元(11)处切有空位(13)、所述空位(13)周边处切有第一配合部(31)；和
    边缘处切有第二配合部(32)的合格单元(2)，安装在空位(13)内，且第一配合部(31)与第二配合部(32)匹配安装、以至少在第一拼板(1)的长度方向上和宽度方向上限位合格单元(2)。
  11. 根据权利要求10所述的PCB拼板，还包括：
    粘结层，粘接于第一拼板(1)和合格单元(2)之间。
  12. 根据权利要求10或11所述的PCB拼板，其中，第一配合部(31)和第二配合部(32)中的一个为T形插舌、另一个为T形插槽。
  13. 根据权利要求求10或11所述的PCB拼板，其中，第一配合部(31)和第二配合部(32)中的一个为插片、另一个为一侧壁贯通的插槽，且插片的厚度和插槽底壁的厚度之和等于合格单元(2)的厚度。
  14. 根据权利要求13所述的PCB拼板，其中，插片的厚度和插槽底壁的厚度相等。
  15. 根据权利要求10或11所述的PCB拼板，其中，第一配合部(31)和第二配合部(32)为一一对应均布设置的多个。
  16. 一种计算机可读存储介质，存储有计算机可执行指令，所述计算机可执行指令用于执行权利要求1-9任一项的方法。
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