WO2016177295A1 - 贴片封装装置及方法 - Google Patents

贴片封装装置及方法 Download PDF

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Publication number
WO2016177295A1
WO2016177295A1 PCT/CN2016/080632 CN2016080632W WO2016177295A1 WO 2016177295 A1 WO2016177295 A1 WO 2016177295A1 CN 2016080632 W CN2016080632 W CN 2016080632W WO 2016177295 A1 WO2016177295 A1 WO 2016177295A1
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WO
WIPO (PCT)
Prior art keywords
cover plate
substrate
cavity
adsorption
air
Prior art date
Application number
PCT/CN2016/080632
Other languages
English (en)
French (fr)
Inventor
井杨坤
刘庆
李良实
杨加开
马光和
Original Assignee
京东方科技集团股份有限公司
合肥京东方光电科技有限公司
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Publication date
Application filed by 京东方科技集团股份有限公司, 合肥京东方光电科技有限公司 filed Critical 京东方科技集团股份有限公司
Priority to US15/511,742 priority Critical patent/US10497897B2/en
Publication of WO2016177295A1 publication Critical patent/WO2016177295A1/zh

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/871—Self-supporting sealing arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/842—Containers
    • H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/841—Self-supporting sealing arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
    • B32B37/1018—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure using only vacuum
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/133308—Support structures for LCD panels, e.g. frames or bezels
    • G02F1/133322—Mechanical guidance or alignment of LCD panel support components
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/133354—Arrangements for aligning or assembling substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/1201—Manufacture or treatment

Definitions

  • the present disclosure relates to the field of display technologies, and in particular, to a chip package device and method.
  • AMOLED Active Matrix Organic Light Emitting Diode
  • the current three-dimensional curved surface AMOLED package patch device draws on the flexible variable idea of multi-point AMOLED package patch technology, and discretely adsorbs the rigid straight substrate of the curved glass substrate AMOLED package patch device into several short substrate adsorptions (substrate adsorption support column ( Suck Bar)), using these substrate adsorption support columns (Suck Bar) to achieve a composite shape of a three-dimensional curved glass substrate.
  • the device can realize high-efficiency and continuous AMOLED package patch of three-dimensional curved glass substrate, and can save a lot of manpower and material resources without designing, manufacturing and debugging the pressure box machine plane compared with the flat AMOLED package patch of the pressure box machine. and time.
  • such a device is difficult to avoid the generation of air bubbles during the patch press process, resulting in a low yield of the produced patch.
  • the main object of the present disclosure is to provide a technical solution that can effectively avoid the generation of air bubbles during the patch press process, thereby improving the yield of the patch.
  • the present disclosure provides a chip package device comprising: an adsorption mechanism for adsorbing a loaded cover plate; and a chip package mechanism provided with a receiving cavity for accommodating loading
  • the substrate of the patch and the cover plate, the cover plate, the substrate and the side wall of the accommodating cavity after the cover plate is placed in the accommodating cavity by the absorbing mechanism Forming a closed cavity, the side wall is provided with a suction hole and an inflation hole; a suction mechanism for extracting air from the closed cavity through the air suction hole; and an inflation mechanism for passing the inflation hole
  • a light gas having a density lower than that of air is flushed into the closed cavity; a pressing mechanism is used for pressing the closed cavity, so that the cover plate is completely pressed after the light gas is discharged On the substrate.
  • the apparatus further includes: a first loading mechanism for loading the cover plate into a predetermined position, wherein the predetermined position is directly above the accommodating cavity; and the second loading mechanism, For loading the substrate and placing the substrate in the receiving cavity.
  • the device further includes: an image collecting mechanism, configured to collect image position information of at least two first identification points preset on the cover plate after the cover plate is sucked by the adsorption mechanism, and And acquiring image position information of at least two second identification points preset on the substrate after the substrate is placed in the accommodating cavity by the second loading mechanism; and determining a module for determining Determining whether the first identification point and the second identification point correspond to each other in a manner of whether the image location information of the first identification point and the image location information of the second identification point match; the alignment mechanism is used to In a case where the positions of the first identification point and the second identification point do not correspond, adjusting a position of the adsorption structure or the accommodating cavity, so that the first identification point and the second identification point Fully corresponding.
  • an image collecting mechanism configured to collect image position information of at least two first identification points preset on the cover plate after the cover plate is sucked by the adsorption mechanism, and And acquiring image position information of at least two second identification points preset on the substrate after the substrate
  • the image acquisition mechanism includes one or two cameras.
  • the camera is disposed above the adsorption mechanism or below the patch package mechanism, and two cameras are used.
  • the two cameras are respectively disposed above the adsorption mechanism or below the patch package mechanism.
  • the number of the first identification point and the second identification point is four, and the four first identification points are respectively disposed at four corners of the cover, four of the second The identification points are respectively disposed at the four corners of the substrate.
  • the adsorption mechanism includes an adsorption body and a plurality of vacuum adsorption assemblies, wherein the adsorption body is provided with a plurality of suction grooves, and the plurality of suction grooves and the plurality of vacuum adsorption assemblies A through hole connection for engaging the cover plate, each of the vacuum adsorption assemblies having an elastic adsorption member for forming close contact with the cover plate.
  • the pressing mechanism is integrally provided with the adsorption mechanism, and the pressing mechanism has a pressing frame, and the pressing frame is concavely formed with a sealing cavity, and the sealing cavity can be pressed during the pressing process. Sealing and abutting with the accommodating cavity.
  • the inflation mechanism and the air suction mechanism are integrally disposed, and the air suction hole and the inflation hole are the same air hole.
  • the light gas comprises: hydrogen, or helium.
  • the present disclosure also provides a patch packaging method, including: an adsorption mechanism sucks up a loaded cover plate; the adsorption mechanism carries the cover plate to move toward a receiving cavity of the packaging mechanism, wherein the capacity A substrate for which a patch is to be placed is placed in the cavity; the adsorption mechanism places the cover plate in the accommodating cavity, and the side walls of the cover plate, the substrate and the accommodating cavity form a Closing the cavity; the air suction mechanism extracts the air in the closed cavity through the air vent provided on the side wall; the inflation mechanism rushes into the closed cavity through the air vent provided on the side wall to lighter than the air a gas; a pressing mechanism presses the closed cavity such that the cover plate is completely pressed against the substrate after the light gas is discharged.
  • the patch package device and method of the present disclosure even if bubbles are generated during the package encapsulation process, since the gas in the bubble is a light gas, the AMOLED package patch is stable and light after being exposed to the atmosphere after the package is packaged. The gas will rise automatically and the bubbles will be eliminated. Therefore, this process can save energy without additional defoaming steps, and can greatly improve the yield of the package of AMOLED package.
  • FIG. 1 is a block diagram showing the structure of a chip package device according to an embodiment of the present disclosure
  • FIG. 2 is a flow chart of a patch packaging method in accordance with an embodiment of the present disclosure
  • FIG. 3 is a schematic diagram of a specific structure of a chip package device according to an embodiment of the present disclosure
  • FIG. 4 is a schematic structural view of an adsorption mechanism of a patch package device according to an embodiment of the present disclosure.
  • the curved surface AMOLED package patch device with wider application range has the advantages of no need to design, manufacture and debug the pressure plate machine plane compared with the flat AMOLED package patch device of the pressure box machine, which can save a lot of manpower, material resources and time cost.
  • the advantage, however, is that it is difficult to avoid the problem that bubbles are easily generated during the lamination of the patch, resulting in a lower yield of the produced patches.
  • the present disclosure provides a patch package device.
  • 1 is a block diagram showing the structure of a patch package device according to an embodiment of the present disclosure.
  • the device mainly includes an adsorption mechanism 10, a patch package mechanism 20, a pumping mechanism 30, an inflator 40, and a press mechanism 60. (As shown in Figure 3).
  • the adsorption mechanism 10 is used to adsorb the loaded cover plate.
  • the chip package mechanism 20 is provided with an accommodating cavity 22 for accommodating the loaded substrate requiring the patch and the cover. After the cover plate is placed in the accommodating cavity 22 by the absorbing mechanism, the cover plate, the substrate, and the side wall of the accommodating cavity 22 form a closed cavity.
  • the side wall is provided with a suction hole and an inflation hole.
  • the pumping mechanism 30 is for extracting air from the enclosed chamber through the air vent (not shown).
  • the inflator 40 is configured to inject a lighter gas having a density lower than that of the air into the closed cavity through the inflation hole (not shown).
  • the pressing mechanism is configured to press the closed cavity such that the cover plate is completely pressed against the substrate after the light gas is discharged.
  • connection structure shown in FIG. 1 is only an optional manner. In practical applications, as long as the above various functional structures are provided, A package for the cover and the substrate (patch) is realized.
  • the air in the closed cavity formed by the cover plate and the substrate and the side wall of the accommodating cavity 22 can be extracted before the cover plate is attached to the substrate.
  • the closed cavity must not completely remove the air, that is, air is more or less present in the closed cavity, so The air is cleaned out, and then the lighter gas with a density lower than that of air is flushed into the closed cavity.
  • the density of the gas in these bubbles is gradually smaller than that of the air. Disappeared.
  • the above apparatus may further include: a first loading mechanism 510 and a second loading mechanism 530.
  • a first loading mechanism 510 configured to load the cover plate 520 into a predetermined position, wherein the predetermined position is directly above the accommodating cavity 22; and the second loading mechanism 530 is configured to load the The substrate 540 is described and the substrate is placed in the accommodating cavity 22.
  • the above apparatus may further include an image collection mechanism 550, a determination module 560, and a registration mechanism 570.
  • the image collecting mechanism 550 is configured to collect an image of at least two first identification points 522 (ie, mark points for identification and alignment) preset on the cover plate after the cover plate is sucked up by the adsorption mechanism. Position information, and collecting at least two second identification points 542 preset on the substrate after the substrate is placed in the accommodating cavity 22 by the second loading mechanism (ie, for identification and pairing) Image position information of the bit mark).
  • first identification points 522 ie, mark points for identification and alignment
  • the image acquisition mechanism does not need to be set to be particularly complicated, and a camera with a higher resolution can be used.
  • the determining module is configured to determine whether the first identification point and the second identification point correspond to each other by determining whether the image location information of the first identification point and the image location information of the second identification point match.
  • the module can be implemented by a combination of software and hardware.
  • the aligning mechanism is configured to adjust a position of the adsorption structure or the accommodating cavity 22 in a case where the positions of the first identification point and the second identification point do not correspond, such that the first identification point Corresponding completely with the second identification point.
  • the above image acquisition mechanism, the judgment module and the alignment mechanism can be set up. Recognizing and adjusting the relative position of the cover plate and the substrate.
  • the first loading mechanism of the above-described chip packaging device loads the cover plate and the second loading mechanism, the positional accuracy of loading the substrate is sufficiently high.
  • These mechanisms and modules for identifying and adjusting the position may not be set.
  • the setting generally improves the positional accuracy, the accuracy of the chip package can be further improved.
  • the image collection mechanism may include one or two cameras, which may be set according to the number of cameras: (1) using a camera. In the case where the camera is disposed above the suction mechanism or below the patch package mechanism; (2) in the case where two cameras are used, the two cameras are respectively disposed above the adsorption mechanism or Below the patch package mechanism.
  • the number of the first identification point and the second identification point is four, and the four first identification points are respectively disposed at four corners of the cover, four The second identification points are respectively disposed at the four corners of the substrate.
  • PCBs printed circuit boards
  • patches if you do not consider the cost, try to set a mark point on the four corners of the printed circuit board (PCB) or patch, which will be very Helping to make overshoots in process production requires alignment and position adjustment.
  • the adsorption mechanism 10 may include an adsorption body 12 and a plurality of vacuum adsorption assemblies 14, wherein the adsorption body is provided with a plurality of suction grooves 16, the plurality of And a suction groove is connected to the through holes in the plurality of vacuum adsorption assemblies for engaging the cover plate, each of the vacuum adsorption assemblies having an elastic adsorption member 18 for forming a tight contact with the cover plate contact.
  • the arrangement mode and the number of the suction grooves and the number of vacuum adsorption components may be determined according to the needs of the production process of the device, as long as the pumping of the suction groove can be realized, and then multiple The vacuum suction assembly can suck the cover plate by the elastic suction member to move the cover plate in position.
  • the pressing mechanism is integrally provided with the adsorption mechanism, and the pressing mechanism has a pressing frame 62, and the pressing frame is concavely formed with a sealing cavity, which is described in the pressing process.
  • the sealing cavity can be sealingly abutted with the receiving cavity 22.
  • the inflation mechanism and the air suction mechanism may be integrally disposed, and the air suction hole and the inflation hole may be the same air hole.
  • the above-described inflation mechanism and the pumping structure may be independently provided, for example, the pumping mechanism and the pumping mechanism may be The air venting hole is disposed at one side of the accommodating cavity 22, and the inflation mechanism and the venting hole are disposed on the other side of the accommodating cavity 22, so that the air venting mechanism passes through After the air vent is used to extract the air inside the closed cavity, the air venting mechanism further injects light gas into the closed cavity through the venting hole.
  • the light gas may include: hydrogen gas or helium gas.
  • hydrogen gas or helium gas.
  • other light gases with stable properties can also be considered.
  • the present disclosure also provides a chip packaging method.
  • 2 is a flow chart of a patch packaging method according to an embodiment of the present disclosure. As shown in FIG. 2, the flow includes the following steps (step S202 - step S212):
  • Step S202 the adsorption mechanism sucks up the loaded cover plate
  • Step S204 the absorbing mechanism carries the cover plate to move toward the accommodating cavity of the packaging mechanism, wherein the accommodating cavity is placed with a substrate on which a patch is to be placed;
  • Step S206 the adsorption mechanism places the cover plate in the accommodating cavity, and the cover plate, the substrate and the sidewall of the accommodating cavity form a closed cavity;
  • Step S208 the air suction mechanism extracts air in the closed cavity through an air vent provided on the side wall;
  • Step S210 the inflation mechanism punches a light gas having a density smaller than air into the closed cavity through the inflation hole provided on the side wall;
  • Step S212 the pressing mechanism presses the closed cavity, so that the cover plate is completely pressed on the substrate after the light gas is discharged.
  • the process of the chip package includes the following steps:
  • the first loading mechanism drives the AMOLED package patch A (ie, the cover plate) to be loaded.
  • the second loading mechanism loads the AMOLED package patch B (ie, the substrate) to be packaged, and places it in the accommodating cavity 22 for collecting the lower position information of the four mark points of the substrate.
  • the image acquisition mechanism is disposed above the accommodating cavity 22, and performs position information collection on four mark points (ie, the second identification point).
  • the adjustment method includes adjusting the horizontal displacement and/or the tilting angle of the adsorption mechanism based on the mark point of the AMOLED package patch B to adjust the AMOLED package patch A. Or the purpose of adjusting the horizontal displacement and/or the tilt angle of the patch package mechanism 20 based on the AMOLED package patch A to achieve the purpose of adjusting the position of the AMOLED package patch B in such two ways.
  • the adsorption mechanism drives the AMOLED package patch A to vertically descend until a preset distance of the threshold height of the platform carrying the AMOLED package patch B (the height of the position conforms to the cover plate, the substrate, and the receiving cavity 22)
  • the sidewalls form a closed cavity), which is equivalent to completing a pre-patch package process, but since the AMOLED package patch A and the AMOLED package patch B are not pressed together, There is no close fit.
  • the pumping structure evacuates the closed chamber through the evacuation hole, and extracts the air inside.
  • the inflatable structure fills the closed cavity with a stable light gas through the inflation hole, and the stable light gas can be a gas such as hydrogen or helium, which is lighter than air, and the lighter the gas, the better the anti-bubble effect.
  • the stable light gas can be a gas such as hydrogen or helium, which is lighter than air, and the lighter the gas, the better the anti-bubble effect.
  • the pressing frame of the pressing mechanism integrally provided with the adsorption mechanism continues to be pressed until the surface of the AMOLED package patch A and the surface of the AMOLED package patch B are attached, and at the same time, the pressing frame and the receiving cavity 22 are The sealing state of the sealing joint is also formed. After the package is completed, the adsorption mechanism drives the pressure frame to separate and complete the chip packaging.
  • the second loading mechanism leaves the packaged AMOLED package patch B away from the chip package.
  • the station returns to the station before step (3) for reclaiming.
  • the patch package device and method provided by the embodiments of the present disclosure have the advantages that: by filling a stable light gas before pressing, an environment of stable light gas is formed between the cover plate and the substrate, and the AMOLED package patch is in the Encapsulation in the environment, even if bubbles are generated during the package encapsulation process, since the gas in the bubble is a light gas, after the AMOLED package is exposed to the atmosphere after the package is packaged, the stable light gas will automatically rise and then the bubble It is eliminated, so this process can save energy without additional defoaming steps, and can greatly improve the patch package yield of AMOLED package.

Abstract

一种贴片封装装置及方法。该贴片封装方法包括：吸附机构（10）将载入的盖板（520）吸起；吸附机构（10）携带盖板（520）向封装机构（20）的容置腔体（22）方向运动，其中，容置腔体（22）内放置有需要进行贴片的基板（540）；吸附机构（10）将盖板（520）放置在容置腔体（22）内，盖板（520）、基板（540）以及容置腔体（22）的侧壁形成一个封闭腔体；抽气机构（30）通过侧壁上设置的抽气孔将封闭腔体内的空气抽出；充气机构（40）通过侧壁上设置的充气孔向封闭腔体内冲入密度比空气小的轻质气体；压合机构（60）对封闭腔体进行压合，使得轻质气体排出后盖板（520）完全压合在基板（540）上。

Description

贴片封装装置及方法
相关申请的交叉引用
本申请主张在2015年5月5日在中国提交的中国专利申请号No.201510224958.3的优先权，其全部内容通过引用包含于此。
技术领域
本公开涉及显示技术领域，尤其是涉及一种贴片封装装置及方法。
背景技术
随着显示技术的发展，曲面电视、曲面手机等曲面的显示器件制造，对AMOLED(有源矩阵有机发光二极体)封装贴片装置的要求就越来越高，既要保证曲面的曲度，又要很好的控制表面的基板吸附力，为对应新兴的AMOLED或其他曲面显示而设计的新型AMOLED封装贴片装置成为当务之急。
目前的三维曲面AMOLED封装贴片装置借鉴了多点AMOLED封装贴片技术的柔性可变思想，将曲面玻璃基板AMOLED封装贴片装置的刚性直基板吸附离散为若干短基板吸附(基板吸附支撑柱(Suck Bar))，使用这些基板吸附支撑柱(Suck Bar)实现三维曲面玻璃基板的压合成形。这种装置可以实现三维曲面玻璃基板的高效、连续AMOLED封装贴片，与压盒机台平面AMOLED封装贴片相比，不用设计、制造和调试压盒机台平面，可以节省大量的人力、物力和时间。但是这种装置在贴片压合过程中难以避免气泡的产生，导致生产的贴片良品率较低。
发明内容
本公开的主要目的在于提供一种可以有效避免在贴片压合过程中产生气泡，从而能够提高贴片良品率的技术方案。
为了达到上述目的，本公开提供了一种贴片封装装置，包括：吸附机构，用于吸附载入后的盖板；贴片封装机构，设置有一容置腔体，用于容置载入 的需要贴片的基板和所述盖板，当所述盖板被所述吸附机构放置在所述容置腔体后，所述盖板、所述基板以及所述容置腔体的侧壁形成一个封闭腔体，所述侧壁上设置有抽气孔和充气孔；抽气机构，用于通过所述抽气孔将所述封闭腔体内的空气抽出；充气机构，用于通过所述充气孔向所述封闭腔体内冲入密度比空气小的轻质气体；压合机构，用于对所述封闭腔体进行压合，使得所述轻质气体排出后所述盖板完全压合在所述基板上。
可选地，该装置还包括：第一载入机构，用于将所述盖板载入预定位置，其中，所述预定位置位于所述容置腔体的正上方；第二载入机构，用于载入所述基板并将所述基板放置在所述容置腔体中。
可选地，该装置还包括：图像采集机构，用于在所述盖板被所述吸附机构吸起后采集所述盖板上预先设置的至少两个第一识别点的图像位置信息，并在所述基板被所述第二载入机构放置在所述容置腔体中后采集所述基板上预先设置的至少两个第二识别点的图像位置信息；判断模块，用于通过判断所述第一识别点的图像位置信息和所述第二识别点的图像位置信息是否相符的方式，确定所述第一识别点和所述第二识别点是否位置对应；对位机构，用于在所述第一识别点和所述第二识别点的位置不对应的情况下，调整所述吸附结构或所述容置腔体的位置，使得所述第一识别点和所述第二识别点完全对应。
可选地，所述图像采集机构包括一个或两个摄像头，在采用一个摄像头的情况下，所述摄像头设置在所述吸附机构的上方或所述贴片封装机构的下方，在采用两个摄像头的情况下，两个摄像头分别设置在所述吸附机构的上方或所述贴片封装机构的下方。
可选地，所述第一识别点和所述第二识别点的个数为四个，四个所述第一识别点分别设置在所述盖板的四个角，四个所述第二识别点分别设置在所述基板的四个角。
可选地，所述吸附机构包括吸附本体和多个真空吸附组件，其中，所述吸附本体中设置有多个抽气槽，所述多个抽气槽与所述多个真空吸附组件中的通孔连接，用于配合吸附所述盖板，每个所述真空吸附组件具有一个弹性吸附部件，用于与所述盖板形成紧密接触。
可选地，所述压合机构与所述吸附机构一体设置，所述压合机构具有一压框，所述压框内凹形成有密封腔体，在压合过程中所述密封腔体能够与所述容置腔体密封吻合对接。
可选地，所述充气机构和所述抽气机构一体设置，所述抽气孔和所述充气孔为同一个气孔。
可选地，所述轻质气体包括：氢气、或氦气。
本公开还提供了一种贴片封装方法，包括：吸附机构将载入的盖板吸起；所述吸附机构携带所述盖板向封装机构的容置腔体方向运动，其中，所述容置腔内放置有需要进行贴片的基板；所述吸附机构将所述盖板放置在所述容置腔体内，所述盖板、所述基板以及所述容置腔体的侧壁形成一个封闭腔体；抽气机构通过侧壁上设置的抽气孔将所述封闭腔体内的空气抽出；充气机构通过侧壁上设置的充气孔向所述封闭腔体内冲入密度比空气小的轻质气体；压合机构对所述封闭腔体进行压合，使得所述轻质气体排出后所述盖板完全压合在所述基板上。
本公开所述的贴片封装装置及方法，即使贴片封装过程产生了气泡，由于气泡中的气体为轻质气体，故在贴片封装后AMOLED封装贴片暴露在大气环境中后，稳定轻质气体会自动上升进而气泡得到消除，因此采用该种工艺就无需额外的除泡步骤，即可节省能源，还能大大提高AMOLED封装贴片的贴片封装良品率。
附图说明
图1是根据本公开实施例的贴片封装装置的结构框图；
图2是根据本公开实施例的贴片封装方法的流程图；
图3是根据本公开实施例的贴片封装装置的具体结构示意图；
图4是根据本公开实施例的贴片封装装置的吸附机构的结构示意图。
具体实施方式
下面将结合本公开实施例中的附图，对本公开实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅仅是本公开的一部分实施例， 而不是全部的实施例。基于本公开中的实施例，本领域的普通技术人员在没有做出创造性劳动的前提下所获得的所有其他实施例，都属于本公开保护的范围。
目前应用范围较广的曲面AMOLED封装贴片装置虽然与压盒机台平面AMOLED封装贴片装置相比，具有无需设计、制造和调试压盒机台平面，可以节省大量的人力、物力和时间成本的优势，但是，这种装置还是难以避免在贴片压合过程中容易产生气泡的问题，导致生产的贴片良品率较低。
为了解决上述技术缺陷，本公开提供了一种贴片封装装置。图1是根据本公开实施例的贴片封装装置的结构框图，如图1所示，该装置主要包括吸附机构10、贴片封装机构20、抽气机构30、充气机构40和压合机构60(如图3所示)。
其中，吸附机构10用于吸附载入后的盖板。
贴片封装机构20设置有一容置腔体22，用于容置载入的需要贴片的基板和所述盖板。当所述盖板被所述吸附机构放置在所述容置腔体22后，所述盖板、所述基板以及所述容置腔体22的侧壁形成一个封闭腔体。所述侧壁上设置有抽气孔和充气孔。
抽气机构30用于通过所述抽气孔(图中未示出)将所述封闭腔体内的空气抽出。
充气机构40用于通过所述充气孔(图中未示出)向所述封闭腔体内冲入密度比空气小的轻质气体。
压合机构用于对所述封闭腔体进行压合，使得所述轻质气体排出后所述盖板完全压合在所述基板上。
当然，上述各个机构在图1所示出的位置和结构关系是可以灵活设置的，图1所示出的连接结构只是可选的方式，在实际应用中，只要具备上述各个功能结构，即可以实现对盖板和基板(贴片)的封装。
通过上述贴片封装装置，可以在将所述盖板贴合在所述基板之前，先对所述盖板和所述基板以及容置腔体22的侧壁形成的封闭腔体内的空气进行抽取，然而由于实现全真空环境的难度比较大，该封闭腔体内必然无法将空气完全排除干净，也就是说，封闭腔体内或多或少地存在空气，因此为了将 空气排除干净，再向封闭腔体内冲入密度比空气小的轻质气体，这样一来在贴片过程中，即使暂时形成一些气泡，但由于这些气泡内的气体的密度比空气小必然会逐渐消失掉。
需要说明的是，由于在图1所示的这一装置立体图中，对于各种机构和部件进行完全标示存在一些困难甚至会加大理解难度，以下将要描述的各个结构和部件均不再在图1中进行标示，同时这也是因为以下部件只要能够实现各自的功能，其位置设置方式并不因此受到限制。
在本公开实施例中，如图3所示，上述装置还可以包括：第一载入机构510和第二载入机构530。
第一载入机构510，用于将所述盖板520载入预定位置，其中，所述预定位置位于所述容置腔体22的正上方；第二载入机构530，用于载入所述基板540并将所述基板放置在所述容置腔体22中。
在本公开实施例中，上述装置还可以进一步包括图像采集机构550、判断模块560和对位机构570。
图像采集机构550用于在所述盖板被所述吸附机构吸起后采集所述盖板上预先设置的至少两个第一识别点522(即用于标识和对位的mark点)的图像位置信息，并在所述基板被所述第二载入机构放置在所述容置腔体22中后采集所述基板上预先设置的至少两个第二识别点542(即用于标识和对位的mark点)的图像位置信息。
例如，在实际应用中，为了降低设备的复杂度，该图像采集机构无需设置特别复杂，采用分辨率较高的摄像头即可。
判断模块用于通过判断所述第一识别点的图像位置信息和所述第二识别点的图像位置信息是否相符的方式，确定所述第一识别点和所述第二识别点是否位置对应。
当然，在实际应用中，该模块可以采用软件和硬件结合的方式来实现。
对位机构用于在所述第一识别点和所述第二识别点的位置不对应的情况下，调整所述吸附结构或所述容置腔体22的位置，使得所述第一识别点和所述第二识别点完全对应。
由此可以看出，上述图像采集机构、判断模块和对位机构的设置能够起 到对盖板和基板的相对位置进行识别和调整，当然，如果上述贴片封装装置的第一载入机构载入所述盖板和第二载入机构载入所述基板的位置精度足够高，这些识别和调整位置的机构和模块也是可以不设置的，当然，如果设置通常会更加提高位置精度，从而后续可以进一步提高贴片封装的精度。
如前述所述，在本实施例提供的一个可选实施方式中，所述图像采集机构可以包括一个或两个摄像头，可以根据摄像头的个数，采用如下方式设置：(1)在采用一个摄像头的情况下，所述摄像头设置在所述吸附机构的上方或所述贴片封装机构的下方；(2)在采用两个摄像头的情况下，两个摄像头分别设置在所述吸附机构的上方或所述贴片封装机构的下方。
显然，如果为了降低设备的复杂度和成本，可以采用方式(1)，如果为了获得精度更高的贴片封装工艺，可以采用方式(2)。
在本公开实施例中，所述第一识别点和所述第二识别点的个数为四个，四个所述第一识别点分别设置在所述盖板的四个角，四个所述第二识别点分别设置在所述基板的四个角。
通常，对于各种印刷电路板(PCB)或贴片的工艺生产中，如果不考虑成本的话，尽量在印刷电路板(PCB)或贴片的四个角均设置一个mark点，这将非常有助于在工艺生产过冲需要进行对位和位置调整。
在本公开实施例中，如图4所示，所述吸附机构10可以包括吸附本体12和多个真空吸附组件14，其中，所述吸附本体中设置有多个抽气槽16，所述多个抽气槽与所述多个真空吸附组件中的通孔连接，用于配合吸附所述盖板，每个所述真空吸附组件具有一个弹性吸附部件18，用于与所述盖板形成紧密接触。
当然，在实际应用中，所述抽气槽的设置方式和个数、真空吸附组件的个数都可以根据设备生产工艺的需要而定，只要能够实现对抽气槽进行抽气，继而多个真空吸附组件就可以通过弹性吸附部件将所述盖板吸住，以便对所述盖板进行位置移动。
在本公开实施例中，所述压合机构与所述吸附机构一体设置，所述压合机构具有一压框62，所述压框内凹形成有密封腔体，在压合过程中所述密封腔体能够与所述容置腔体22密封吻合对接。
采用这样的设置方式，显然能够提高贴片的封闭环境。
作为本公开实施例的一个可选实现方式，所述充气机构和所述抽气机构可以一体设置，所述抽气孔和所述充气孔可以为同一个气孔。
当然，这是为了降低设备的复杂度减小设备体积而做出的选择，如果不考虑这些因素，也可以独立设置上述充气机构和所述抽气结构，例如，可以将所述抽气机构和所述抽气孔设置在所述容置腔体22的一侧，将所述充气机构和所述充气孔设置在所述容置腔体22的另一侧，这样待所述抽气机构通过所述抽气孔将上述封闭腔体内部的空气抽取干净后，所述充气机构再通过所述充气孔向上述封闭腔体内冲入轻质气体。
可选地，在本公开实施例中，所述轻质气体可以包括：氢气、或氦气。当然，在实际应用于中，其他具有性质稳定特点的轻质气体也是可以考虑的。
对应于上述贴片封装装置，本公开还提供了一种贴片封装方法。图2是根据本公开实施例的贴片封装方法流程图，如图2所示，该流程包括以下步骤(步骤S202-步骤S212)：
步骤S202、吸附机构将载入的盖板吸起；
步骤S204、所述吸附机构携带所述盖板向所述封装机构的容置腔体方向运动，其中，所述容置腔内放置有需要进行贴片的基板；
步骤S206、所述吸附机构将所述盖板放置在所述容置腔体内，所述盖板、所述基板以及所述容置腔体的侧壁形成一个封闭腔体；
步骤S208、抽气机构通过侧壁上设置的抽气孔将所述封闭腔体内的空气抽出；
步骤S210、充气机构通过侧壁上设置的充气孔向所述封闭腔体内冲入密度比空气小的轻质气体；
步骤S212、压合机构对所述封闭腔体进行压合，使得所述轻质气体排出后所述盖板完全压合在所述基板上。
具体地，结合上述贴片封装装置，该贴片封装的过程包括以下步骤：
(1)第一载入机构带动AMOLED封装贴片A(即上述盖板)载入。
(2)吸附机构移动至AMOLED封装贴片A后进一步下降，吸附主体中的抽气槽开始抽气将AMOLED封装贴片A吸起，并上升到符合图像采集的 位置高度，该位置方便上部图像采集机构(即设置的用于采集盖板四个mark点位置信息的摄像头)对四个mark点(即上述第一识别点)进行位置信息采集，第一载入机构返回至步骤(1)之前的工位。
(3)第二载入机构载入待贴片封装的AMOLED封装贴片B(即上述基板)，并将其放置在容置腔体22中，用于采集基板四个mark点位置信息的下部图像采集机构设置在容置腔体22上方，并对四个mark点(即上述第二识别点)进行位置信息采集。
(4)对采集到的AMOLED封装贴片A、AMOLED封装贴片B的mark点的位置信息进行比对。
(5)在确定存在位置偏差的情况下，进行位置调整，调整方式包括以AMOLED封装贴片B的mark点为基准，调整吸附机构水平位移和/或倾斜角度，以达到调整AMOLED封装贴片A的位置的目的，或者，以AMOLED封装贴片A为基准，调整贴片封装机构20的水平位移和/或倾斜角度，以达到调整AMOLED封装贴片B的位置的目的，以这样的两种方式之一完成对AMOLED封装贴片A和调整AMOLED封装贴片B的对位过程。
(6)吸附机构带动AMOLED封装贴片A进行竖直下降，直到预先设定的距离承载AMOLED封装贴片B的平台的阈值高度(此位置高度符合上述盖板、上述基板以及容置腔体22的侧壁形成封闭腔体的位置)，这样相当于完成了一个预贴片封装的过程，但由于并未对AMOLED封装贴片A与AMOLED封装贴片B进行压合操作，因此二者之间并未形成紧密的贴合状态。
(7)抽气结构通过抽空孔对封闭腔体进行抽真空操作，将其内部的空气抽取出来。
(8)充气结构通过充气孔向封闭腔体充入稳定轻质气体，稳定轻质气体可为氢、氦等比空气轻的气体，且气体越轻最终的防气泡效果越好。
(9)与吸附机构一体设置的压合机构的压框继续下压，直至AMOLED封装贴片A的表面和AMOLED封装贴片B的表面相贴，与此同时，压框与容置腔体22也形成了密封结合的对接状态，待贴片封装完成后，吸附机构带动压框分离，完成贴片封装。
(10)第二载入机构将封装完成的AMOLED封装贴片B离开贴片封装 工位，返回至步骤(3)之前的工位，以便取料。
本公开实施例提供的贴片封装装置及方法的优点在于：通过在压合前充入稳定轻质气体，盖板和基板之间形成一层稳定轻质气体的环境，AMOLED封装贴片在该环境中进行封装，即使贴片封装过程产生了气泡，由于气泡中的气体为轻质气体，故在贴片封装后AMOLED封装贴片暴露在大气环境中后，稳定轻质气体会自动上升进而气泡得到消除，因此采用该种工艺就无需额外的除泡步骤，即可节省能源，还能大大提高AMOLED封装贴片的贴片封装良品率。
以上所述是本公开的可选实施方式，应当指出，对于本领域的普通技术人员来说，在不脱离本公开所述原理的前提下，还可以做出若干改进和润饰，这些改进和润饰也应视为包含在本公开的保护范围之内。

Claims (11)

  1. 一种贴片封装装置，包括：
    吸附机构，用于吸附载入后的盖板；
    贴片封装机构，设置有一容置腔体，用于容置载入的需要贴片的基板和所述盖板，当所述盖板被所述吸附机构放置在所述容置腔体后，所述盖板、所述基板以及所述容置腔体的侧壁形成一个封闭腔体，所述侧壁上设置有抽气孔和充气孔；
    抽气机构，用于通过所述抽气孔将所述封闭腔体内的空气抽出；
    充气机构，用于通过所述充气孔向所述封闭腔体内冲入密度比空气小的轻质气体；
    压合机构，用于对所述封闭腔体进行压合，使得所述轻质气体排出后所述盖板完全压合在所述基板上。
  2. 根据权利要求1所述的装置，还包括：
    第一载入机构，用于将所述盖板载入预定位置，其中，所述预定位置位于所述容置腔体的正上方；
    第二载入机构，用于载入所述基板并将所述基板放置在所述容置腔体中。
  3. 根据权利要求1所述的装置，还包括：
    图像采集机构，用于在所述盖板被所述吸附机构吸起后采集所述盖板上预先设置的至少两个第一识别点的图像位置信息，并在所述基板被所述第二载入机构放置在所述容置腔体中后采集所述基板上预先设置的至少两个第二识别点的图像位置信息；
    判断模块，用于通过判断所述第一识别点的图像位置信息和所述第二识别点的图像位置信息是否相符的方式，确定所述第一识别点和所述第二识别点是否位置对应；
    对位机构，用于在所述第一识别点和所述第二识别点的位置不对应的情况下，调整所述吸附结构或所述容置腔体的位置，使得所述第一识别点和所述第二识别点完全对应。
  4. 根据权利要求3所述的装置，其中，所述图像采集机构包括一个或两 个摄像头，在采用一个摄像头的情况下，所述摄像头设置在所述吸附机构的上方或所述贴片封装机构的下方，在采用两个摄像头的情况下，两个摄像头分别设置在所述吸附机构的上方或所述贴片封装机构的下方。
  5. 根据权利要求3所述的装置，其中，所述第一识别点和所述第二识别点的个数为四个，四个所述第一识别点分别设置在所述盖板的四个角，四个所述第二识别点分别设置在所述基板的四个角。
  6. 根据权利要求1所述的装置，其中，所述吸附机构包括吸附本体和多个真空吸附组件，其中，所述吸附本体中设置有多个抽气槽，所述多个抽气槽与所述多个真空吸附组件中的通孔连接，用于配合吸附所述盖板，每个所述真空吸附组件具有一个弹性吸附部件，用于与所述盖板形成紧密接触。
  7. 根据权利要求1所述的装置，其中，所述压合机构与所述吸附机构一体设置，所述压合机构具有一压框，所述压框内凹形成有密封腔体，在压合过程中所述密封腔体能够与所述容置腔体密封吻合对接。
  8. 根据权利要求1所述的装置，其中，所述充气机构和所述抽气机构一体设置，所述抽气孔和所述充气孔为同一个气孔。
  9. 根据权利要求1至8中任一项所述的装置，其中，所述轻质气体包括：氢气、或氦气。
  10. 一种贴片封装方法，包括：
    吸附机构将载入的盖板吸起；
    所述吸附机构携带所述盖板向封装机构的容置腔体方向运动，其中，所述容置腔内放置有需要进行贴片的基板；
    所述吸附机构将所述盖板放置在所述容置腔体内，所述盖板、所述基板以及所述容置腔体的侧壁形成一个封闭腔体；
    抽气机构通过侧壁上设置的抽气孔将所述封闭腔体内的空气抽出；
    充气机构通过侧壁上设置的充气孔向所述封闭腔体内冲入密度比空气小的轻质气体；
    压合机构对所述封闭腔体进行压合，使得所述轻质气体排出后所述盖板完全压合在所述基板上。
  11. 根据权利要求10所述的方法，其中，所述轻质气体包括氢气或氦气。
PCT/CN2016/080632 2015-05-05 2016-04-29 贴片封装装置及方法 WO2016177295A1 (zh)

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