WO2016165360A1 - 一种集成传感器的封装结构 - Google Patents

一种集成传感器的封装结构 Download PDF

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Publication number
WO2016165360A1
WO2016165360A1 PCT/CN2015/096910 CN2015096910W WO2016165360A1 WO 2016165360 A1 WO2016165360 A1 WO 2016165360A1 CN 2015096910 W CN2015096910 W CN 2015096910W WO 2016165360 A1 WO2016165360 A1 WO 2016165360A1
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sensor
substrate
sensors
package
integrated
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English (en)
French (fr)
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端木鲁玉
张俊德
宋青林
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Goertek Inc
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Goertek Inc
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/60—Seals
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/753—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between laterally-adjacent chips

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  • the invention relates to a package structure of an integrated sensor.
  • the integrated sensor is a sensor chip that integrates multiple sensor units (such as an integrated sensor integrated by a pressure sensor unit and a temperature sensor unit) and is used as a stand-alone chip capable of simultaneously implementing multiple sensing functions.
  • the package of the integrated sensor is generally mounted on the substrate with the MEMS sensor chip and the ASIC chip of each sensor unit, and finally packaged in a cavity for integration, for example, as shown in FIG. 1 and FIG. 2: the outer cover 2 covers the first substrate 1 is surrounded by a large cavity, and two sensor units mounted on the first substrate 1 are disposed in the cavity.
  • One of the sensor units includes a MEMS sensor chip 3 and an ASIC chip 5, which are electrically connected by a lead 4, and the AISC chip 5 is connected to the first substrate 1 by wires.
  • the other sensor unit includes a MEMS sensor chip 8 and an ASIC chip 7, which are also electrically connected by wires, and the AISC chip 7 is connected to the first substrate 1 by wires.
  • the outer casing 2 is provided with an opening 6 required for sensor unit sensing, and the back surface of the first substrate 1 is provided with a pad 9, and the sensor unit is electrically connected to an external circuit through the pad 9.
  • the existing integrated sensor is packaged in a cavity in which all sensor units of the integrated sensor are packaged. In this case, electrical, magnetic, thermal, and optical interferences between the different sensor units are easily caused, which seriously affects the integrated sensor. Overall performance.
  • the present invention proposes a new technical solution for the integrated sensor package.
  • the present invention provides a package structure of an integrated sensor, comprising: a first substrate; a plurality of sensors disposed on the first substrate, each of the sensors including a MEMS sensor chip And an ASIC chip electrically connected to the MEMS sensor chip; and at least one first package cavity surrounded by the first housing and the first substrate, the first package cavity being internally provided with at least one And a second encapsulation cavity surrounded by the first substrate; wherein each of the second package cavities is provided with at least one of the sensors.
  • At least one of the sensors is disposed inside the first package cavity while being external to the second package cavity.
  • the plurality of sensors comprise sensitive sensors and non-sensitive sensors, each of which is isolated from other sensors.
  • the plurality of sensors comprise a pressure sensor, a microphone, and a humidity sensor, the microphone and the humidity sensor being sensitive sensors, the pressure sensor being a non-sensitive sensor.
  • the microphone is separately disposed inside one of the second package cavities, and the humidity sensor is separately disposed inside the other of the second package cavities.
  • the pressure sensor is disposed inside the first package cavity while being located outside each of the second package cavities.
  • the first outer casing is a substrate outer casing or a metal outer casing
  • the second outer casing is a substrate outer casing or a metal outer casing
  • the senor is directly disposed on the first substrate or the sensor is disposed on the first substrate through a second substrate.
  • At least one of the sensor's MEMS sensor chip and ASIC chip are integrated.
  • the ASIC chips of the mutually non-interfering sensors are integrated or the MEMS sensor chips are integrated.
  • the invention separates and encapsulates each sensor unit of the integrated sensor through the cavity separation, or isolates the sensitive sensor unit which is susceptible to interference, so as to shield the mutual interference between the various sensor units of the integrated sensor and effectively improve Product performance with integrated sensors.
  • 1 and 2 are schematic structural views of a conventional integrated sensor package structure.
  • 3 and 4 are schematic views showing the structure of the first embodiment of the integrated sensor package structure of the present invention.
  • FIG. 5 is a schematic structural view of a second embodiment of the integrated sensor package structure of the present invention.
  • FIG. 6 is a schematic structural view of a third embodiment of the integrated sensor package structure of the present invention.
  • FIG. 7 is a schematic structural view of a fourth embodiment of the integrated sensor package structure of the present invention.
  • FIG. 8 is a schematic structural view of a fifth embodiment of the integrated sensor package structure of the present invention.
  • FIG. 9 is a schematic structural view of a sixth embodiment of an integrated sensor package structure of the present invention.
  • FIG. 10 is a schematic structural view of a seventh embodiment of the integrated sensor package structure of the present invention.
  • a first embodiment of an integrated sensor package structure includes two sensor units, one of which includes a MEMS sensor chip 3 and an ASIC chip 5, and a lead 4 is passed between the two. Electrical connection, ASIC chip 5 through a lead The wire is electrically connected to the first substrate 1.
  • the other sensor unit includes a MEMS sensor chip 8 and an ASIC chip 7, which are also electrically connected by a lead, and the ASIC chip 7 is electrically connected to the first substrate 1 through a lead. Both sensor units are mounted on the first substrate 1, and are electrically connected to an external circuit through the pads 9 on the back surface of the first substrate 1.
  • the first embodiment encloses a first package cavity through the outer casing 2-1 and the first substrate 1, and a first envelope body 2-2 and a first substrate 1 are disposed inside the first package cavity. a second package cavity.
  • a sensor unit is disposed in the second package cavity, and an opening 6-2 required for sensor unit sensing is disposed at a top of the second package cavity.
  • Another sensor unit is disposed in a space between the first package cavity and the second package cavity, and an opening 6-1 required for sensor unit sensing is disposed at a top of the first package cavity.
  • a second embodiment of the integrated sensor package structure is different from the first embodiment shown in FIG. 3 in that the second embodiment includes three sensor units, through the housing 2-1 and the first
  • the substrate 1 encloses a first package cavity, and two second package cavities are disposed inside the first package cavity.
  • the outer casing 2-2 and the first substrate 1 enclose a second package cavity, and a first sensor unit is disposed therein.
  • the first sensor unit includes a MEMS sensor chip 8 and an ASIC chip 7 in the second package cavity.
  • the top of the opening is provided with an opening 6-2.
  • the outer casing 2-3 and the first substrate 1 enclose another second package cavity, and a second sensor unit is disposed therein, and the second sensor unit includes a MEMS sensor chip 11 and an ASIC chip 10, and the second package cavity
  • the top of the body is provided with an opening 6-3.
  • the third sensor unit is disposed in a space between the first package cavity and the second package cavity, the first sensor unit includes a MEMS sensor chip 3 and an ASIC chip 5, and is disposed at a top of the first package cavity Opening 6-1.
  • the integrated sensor includes a plurality of sensor units, some of which are relatively more sensitive, ie, more susceptible to interference from other sensor units in the integrated sensor, where the sensor unit that is susceptible to interference from other sensor units is referred to as a "sensitive sensor. Sensor units outside the sensitive sensor are called “non-sensitive sensors.”
  • a third embodiment of an integrated sensor package structure includes three sensor units including one sensitive sensor and two non-sensitive sensors.
  • the sensitive sensor unit includes a MEMS sensor chip 3 and an ASIC chip 5, one non-sensitive
  • the sensor unit includes a MEMS sensor chip 8 and an ASIC chip 7, and the other non-sensitive sensor unit includes a MEMS sensor chip 11 and an ASIC chip 10.
  • the two non-sensitive sensors are disposed together in the second package cavity, and the sensitive sensor is disposed in the space between the first package cavity and the second package cavity, thereby achieving isolation of the sensitive sensor and other sensors.
  • the sensitive sensor can be separately disposed in the second package cavity, and isolation from other sensors can also be realized.
  • the invention separates each sensitive sensor from other sensors.
  • the pressure sensor releases electromagnetic signals and heat energy as a source of interference, and the microphone is easily released by the pressure sensor.
  • the electromagnetic signal is disturbed, the humidity sensor is easily interfered by the thermal energy released by the pressure sensor, so the pressure sensor is a non-sensitive sensor, the microphone and the humidity sensor are sensitive sensors, so the present invention separately sets the microphone in a second package cavity Internally, the humidity sensor is separately disposed inside the other second package cavity, and the pressure sensor is disposed inside the first package cavity while being located outside the second package cavity, thereby preventing the microphone and the humidity sensor from being stressed. Sensor interference.
  • those skilled in the art can determine sensitive sensors and non-sensitive sensors according to actual application products and environments, and these should also fall within the protection scope of the present invention.
  • a fourth embodiment of the integrated sensor package structure is different from the first embodiment shown in FIG. 3 in that the sensor unit on the right side is not directly disposed on the first substrate 1 but through the second
  • the substrate 15 is indirectly disposed on the first substrate 1.
  • the sensor unit is mounted on the second substrate 15 and electrically connected to the external circuit through the pads 9 on the back surface of the first substrate 1.
  • external stress is transmitted to the first substrate 1 and then buffered by the second substrate 15, which protects the sensor unit and makes the sensor unit more stable.
  • the second substrate 15 is designed as a buffer portion, which avoids the influence of external stress on the pressure sensor and causes pressure sensor data error, thereby improving the sensitivity of the pressure sensor unit.
  • each chip needs to be separately mounted and electrically connected, the process is low in efficiency, the hidden dangers are sharply increased, and the assembled safety space needs to be left between the chips, thereby wasting the overall space of the product.
  • the invention can also integrate the sensor unit to reduce space waste, optimize the processing procedure, and improve the packaging efficiency and product yield.
  • the present invention provides the following three integration methods:
  • a fifth embodiment of the integrated sensor package structure includes three sensor units as in the second embodiment shown in FIG. 5, except that the MEMS sensor chip and ASIC of the sensor unit 21 located in the middle are provided. The chips are integrated.
  • a sixth embodiment of the integrated sensor package structure is different from the third embodiment shown in FIG. 6 in that two sensor units that do not interfere with each other share an ASIC chip, specifically a MEMS sensor.
  • the chip 8 and the MEMS sensor chip 11 share one ASIC chip 10.
  • a seventh embodiment of the integrated sensor package structure is different from the third embodiment shown in FIG. 6 in that two mutually non-interfering sensor units share one MEMS sensor chip, specifically an ASIC.
  • the chip 7 and the ASIC chip 10 share a MEMS sensor chip 8.
  • the outer casing is made of a metal casing, and of course, a substrate casing composed of a substrate may be used, which is all within the scope of the present invention.
  • the present invention separates each sensor unit of the integrated sensor by cavity separation, or isolates the sensitive sensor unit that is susceptible to interference, The mutual interference between the various sensor units of the integrated sensor is shielded, which effectively improves the product performance of the integrated sensor.

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Abstract

一种集成传感器的封装结构，包括：第一基板(1)；设置在第一基板(1)上的多个传感器，每个传感器均包括MEMS传感器芯片(8)和与MEMS传感器芯片(8)电连接的ASIC芯片(7)；以及，至少一个由第一外壳(2-1)和第一基板(1)围成的第一封装腔体，第一封装腔体内部设置有至少一个由第二外壳(2-2)和第一基板(1)围成的第二封装腔体；其中，每个第二封装腔体内设置有至少一个传感器。通过腔体分立，将集成传感器的每个传感器单元都进行隔离封装，或者将容易受到干扰的敏感传感器单元进行隔离封装，以屏蔽掉集成传感器的各个传感器单元之间的彼此干扰，有效提升了集成传感器的产品性能。

Description

一种集成传感器的封装结构 技术领域
本发明涉及一种集成传感器的封装结构。
背景技术
集成传感器是一种内部集成了多个传感器单元的传感器芯片(例如由压力传感器单元和温度传感器单元集成的集成传感器)，并且作为一个能够同时实现多种传感功能的独立的芯片进行使用。目前集成传感器的封装一般是将其各个传感器单元的MEMS传感器芯片和ASIC芯片贴装于基板上，最终封装在一个腔体内进行集成，例如图1和图2所示：外壳2覆盖在第一基板1上围成一个大的腔体，腔体内设置有贴装在第一基板1上的两个传感器单元。其中一个传感器单元包括MEMS传感器芯片3和ASIC芯片5，两者之间通过引线4电连接，AISC芯片5通过引线连接至第一基板1。另一个传感器单元包括MEMS传感器芯片8和ASIC芯片7，两者之间同样通过引线电连接，AISC芯片7通过引线连接至第一基板1。外壳2设有传感器单元传感所需的开口6，第一基板1的背面设有焊盘9，传感器单元通过焊盘9与外部电路电连接。
现有集成传感器的这种封装方式是将集成传感器的全部传感器单元封装在一个腔体内，这种情况下不同传感器单元之间容易造成电、磁、热、光等相互干扰，严重影响集成传感器的整体性能。
发明内容
为了解决上述技术问题，尽量减少集成传感器的各个传感器单元之间的互相干扰，本发明提出了关于集成传感器封装的新的技术方案。
本发明提供了一种集成传感器的封装结构，包括：第一基板；设置在所述第一基板上的多个传感器，每个所述传感器均包括MEMS传感器芯片 和与所述MEMS传感器芯片电连接的ASIC芯片；以及，至少一个由第一外壳和所述第一基板围成的第一封装腔体，所述第一封装腔体内部设置有至少一个由第二外壳和所述第一基板围成的第二封装腔体；其中，每个所述第二封装腔体内设置有至少一个所述传感器。
优选的，至少一个所述传感器设置于所述第一封装腔体的内部同时位于所述第二封装腔体的外部。
优选的，多个所述传感器包括敏感传感器和非敏感传感器，每个所述敏感传感器均与其它传感器隔离。
优选的，多个所述传感器包括压力传感器、麦克风、以及湿度传感器，所述麦克风和所述湿度传感为敏感传感器，所述压力传感器为非敏感传感器。
优选的，所述麦克风单独设置于一个所述第二封装腔体内部，所述湿度传感器单独设置于另一个所述第二封装腔体内部。
优选的，所述压力传感器设置于所述第一封装腔体的内部同时位于各个所述第二封装腔体的外部。
优选的，所述第一外壳为基板外壳或者金属外壳，所述第二外壳为基板外壳或者金属外壳。
优选的，所述传感器直接设置于所述第一基板上或者所述传感器通过第二基板设置于所述第一基板上。
优选的，至少一个所述传感器的MEMS传感器芯片和ASIC芯片集成在一起。
优选的，互不干扰的传感器的ASIC芯片集成在一起或者MEMS传感器芯片集成在一起。
本发明通过腔体分立，将集成传感器的每个传感器单元都进行隔离封装，或者将容易受到干扰的敏感传感器单元进行隔离封装，以屏蔽掉集成传感器的各个传感器单元之间的彼此干扰，有效提升了集成传感器的产品性能。
附图说明
构成说明书的一部分的附图描述了本发明的实施例，并且连同说明书一起用于解释本发明的原理。
图1、2是现有集成传感器封装结构的结构示意图。
图3、4是本发明集成传感器封装结构第一实施例的结构示意图。
图5是本发明集成传感器封装结构第二实施例的结构示意图。
图6是本发明集成传感器封装结构第三实施例的结构示意图。
图7是本发明集成传感器封装结构第四实施例的结构示意图。
图8是本发明集成传感器封装结构第五实施例的结构示意图。
图9是本发明集成传感器封装结构第六实施例的结构示意图。
图10是本发明集成传感器封装结构第七实施例的结构示意图。
具体实施方式
现在将参照附图来详细描述本发明的各种示例性实施例。应注意到：除非另外具体说明，否则在这些实施例中阐述的部件和步骤的相对布置、数字表达式和数值不限制本发明的范围。
以下对至少一个示例性实施例的描述实际上仅仅是说明性的，决不作为对本发明及其应用或使用的任何限制。
对于相关领域普通技术人员已知的技术和设备可能不作详细讨论，但在适当情况下，所述技术和设备应当被视为说明书的一部分。
在这里示出和讨论的所有例子中，任何具体值应被解释为仅仅是示例性的，而不是作为限制。因此，示例性实施例的其它例子可以具有不同的值。
应注意到：相似的标号和字母在下面的附图中表示类似项，因此，一旦某一项在一个附图中被定义，则在随后的附图中不需要对其进行进一步讨论。
参考图3和图4所示为集成传感器封装结构的第一实施例，集成传感器一共包含两个传感器单元，其中一个传感器单元包括MEMS传感器芯片3和ASIC芯片5，两者之间通过一引线4电连接，ASIC芯片5通过一引 线与第一基板1电连接。另一个传感器单元包括MEMS传感器芯片8和ASIC芯片7，两者之间同样通过一引线电连接，ASIC芯片7通过一引线与第一基板1电连接。两个传感器单元均贴装于第一基板1上，通过第一基板1背面的焊盘9与外部电路电连接。
可以看出，第一实施例是通过外壳2-1和第一基板1围成第一封装腔体，在第一封装腔体内部设置有一个由外壳2-2和第一基板1围成的第二封装腔体。一个传感器单元设置于第二封装腔体内，在该第二封装腔体的顶部开设有传感器单元传感所需的开口6-2。另一个传感器单元设置于第一封装腔体和第二封装腔体之间的空间内，在第一封装腔体的顶部开设有传感器单元传感所需的开口6-1。
参考图5所示为集成传感器封装结构的第二实施例，和图3所示的第一实施例的不同之处在于，第二实施例包括三个传感器单元，通过外壳2-1和第一基板1围成第一封装腔体，在第一封装腔体内部设置有两个第二封装腔体。外壳2-2和第一基板1围成一个第二封装腔体，内部设置有第一个传感器单元，该第一个传感器单元包括MEMS传感器芯片8和ASIC芯片7，在该第二封装腔体的顶部开设有开口6-2。外壳2-3和第一基板1围成另一个第二封装腔体，内部设置有第二个传感器单元，该第二个传感器单元包括MEMS传感器芯片11和ASIC芯片10，在该第二封装腔体的顶部开设有开口6-3。第三个传感器单元设置于第一封装腔体和第二封装腔体之间的空间内，该第一个传感器单元包括MEMS传感器芯片3和ASIC芯片5，在第一封装腔体的顶部开设有开口6-1。
集成传感器中包括多个传感器单元，其中某些传感器单元相对更为敏感，即更容易受到集成传感器中的其它传感器单元的干扰，这里将容易受到其它传感器单元干扰的传感器单元称之为“敏感传感器”，敏感传感器之外的传感器单元称之为“非敏感传感器”。参考图6所示为集成传感器封装结构的第三实施例，包括三个传感器单元，其中包括一个敏感传感器和两个非敏感传感器，敏感传感器单元包括MEMS传感器芯片3和ASIC芯片5，一个非敏感传感器单元包括MEMS传感器芯片8和ASIC芯片7，另一个非敏感传感器单元包括MEMS传感器芯片11和ASIC芯片10。将 两个非敏感传感器共同设置于第二封装腔体内，将敏感传感器设置于第一封装腔体和第二封装腔体之间的空间内，这样就实现了敏感传感器和其它传感器的隔离。当然也可以像图5那样，将敏感传感器单独的设置在第二封装腔体内，也能够实现与其它传感器的隔离。
本发明令每个敏感传感器均与其它传感器隔离，例如在一个包括压力传感器、麦克风、以及湿度传感器的集成传感器中，压力传感器会释放电磁信号和热能成为干扰源，麦克风很容易被压力传感器释放出的电磁信号所干扰，湿度传感器很容易被压力传感器释放出的热能所干扰，所以压力传感器为非敏感传感器，麦克风和湿度传感器为敏感传感器，所以本发明将麦克风单独设置在一个第二封装腔体内部，将湿度传感器单独设置在另一个第二封装腔体内部，将压力传感器设置于第一封装腔体的内部同时位于各个第二封装腔体的外部，这样就可以避免麦克风和湿度传感器受到压力传感器的干扰。在本发明公开的基础上，本领域技术人员可以根据实际应用产品和环境确定敏感传感器和非敏感传感器，这些也应当属于本发明的保护范围内。
参考图7所示为集成传感器封装结构的第四实施例，和图3所示的第一实施例的不同之处在于，右边的传感器单元不是直接设置于第一基板1上而是通过第二基板15间接设置于第一基板1上，该传感器单元贴装于第二基板15上，通过第一基板1背面的焊盘9与外部电路电连接。在该传感器单元的装配、工作过程中，外部应力传递至第一基板1然后由第二基板15缓冲卸掉，保护了该传感器单元，使该传感器单元性能更稳定。特别对于压力传感器单元，第二基板15作为缓冲部的结构设计，避免了外部应力对压力传感器产生影响而导致压力传感器数据误差，提高了压力传感器单元的灵敏度。
上述实施例中，各个芯片需要单独贴装和电连接，工序多效率低，不良隐患剧增，并且各个芯片之间需要留出组装安全空间，浪费产品总体空间。为了能够更好的实现腔体的分立，本发明还可以将传感器单元进行集成设计，以减少空间浪费，优省加工工序，提升封装效率和产品良率。本发明提供了以下三种集成方式：
参考图8所示为集成传感器封装结构的第五实施例，和图5所示的第二实施例一样包括三个传感器单元，不同之处在于，位于中间的传感器单元21的MEMS传感器芯片和ASIC芯片集成在一起。
参考图9所示为集成传感器封装结构的第六实施例，和图6所示的第三实施例的不同之处在于，两个互不干扰的传感器单元共用一个ASIC芯片，具体来说MEMS传感器芯片8和MEMS传感器芯片11共用一个ASIC芯片10。
参考图10所示为集成传感器封装结构的第七实施例，和图6所示的第三实施例的不同之处在于，两个互不干扰的传感器单元共用一个MEMS传感器芯片，具体来说ASIC芯片7和ASIC芯片10共用一个MEMS传感器芯片8。
上述实施例中，外壳采用金属外壳，当然也可以采用由基板组成的基板外壳，这些都应当属于本发明的保护范围内。
相对于现有的集成传感器共用一个大腔体的封装方式，本发明通过腔体分立，将集成传感器的每个传感器单元都进行隔离封装，或者将容易受到干扰的敏感传感器单元进行隔离封装，以屏蔽掉集成传感器的各个传感器单元之间的彼此干扰，有效提升了集成传感器的产品性能。
虽然已经通过示例对本发明的一些特定实施例进行了详细说明，但是本领域的技术人员应该理解，以上示例仅是为了进行说明，而不是为了限制本发明的范围。本领域的技术人员应该理解，可在不脱离本发明的范围和精神的情况下，对以上实施例进行修改。本发明的范围由所附权利要求来限定。

Claims (10)

  1. 一种集成传感器的封装结构，其特征在于，包括：
    第一基板；
    设置在所述第一基板上的多个传感器，每个所述传感器均包括MEMS传感器芯片和与所述MEMS传感器芯片电连接的ASIC芯片；以及，
    至少一个由第一外壳和所述第一基板围成的第一封装腔体，所述第一封装腔体内部设置有至少一个由第二外壳和所述第一基板围成的第二封装腔体；其中，每个所述第二封装腔体内设置有至少一个所述传感器。
  2. 根据权利要求1所述的结构，其特征在于，至少一个所述传感器设置于所述第一封装腔体的内部同时位于所述第二封装腔体的外部。
  3. 根据权利要求1所述的结构，其特征在于，多个所述传感器包括敏感传感器和非敏感传感器，每个所述敏感传感器均与其它传感器隔离。
  4. 根据权利要求3所述的结构，其特征在于，多个所述传感器包括压力传感器、麦克风、以及湿度传感器，所述麦克风和所述湿度传感为敏感传感器，所述压力传感器为非敏感传感器。
  5. 根据权利要求4所述的结构，其特征在于，所述麦克风单独设置于一个所述第二封装腔体内部，所述湿度传感器单独设置于另一个所述第二封装腔体内部。
  6. 根据权利要求5所述的结构，其特征在于，所述压力传感器设置于所述第一封装腔体的内部同时位于各个所述第二封装腔体的外部。
  7. 根据权利要求1-6任一项所述的结构，其特征在于，所述第一外壳为基板外壳或者金属外壳，所述第二外壳为基板外壳或者金属外壳。
  8. 根据权利要求1-6任一项所述的结构，其特征在于，所述传感器直接设置于所述第一基板上或者所述传感器通过第二基板设置于所述第一基板上。
  9. 根据权利要求1-6任一项所述的结构，其特征在于，至少一个所述传感器的MEMS传感器芯片和ASIC芯片集成在一起。
  10. 根据权利要求1-6任一项所述的结构，其特征在于，互不干扰的传 感器的ASIC芯片集成在一起或者MEMS传感器芯片集成在一起。
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