WO2016163830A1 - Composition de revêtement de dissipation de chaleur et unité de dissipation de chaleur formée par son utilisation - Google Patents

Composition de revêtement de dissipation de chaleur et unité de dissipation de chaleur formée par son utilisation Download PDF

Info

Publication number
WO2016163830A1
WO2016163830A1 PCT/KR2016/003745 KR2016003745W WO2016163830A1 WO 2016163830 A1 WO2016163830 A1 WO 2016163830A1 KR 2016003745 W KR2016003745 W KR 2016003745W WO 2016163830 A1 WO2016163830 A1 WO 2016163830A1
Authority
WO
WIPO (PCT)
Prior art keywords
heat dissipation
coating layer
coating composition
heat
carbon
Prior art date
Application number
PCT/KR2016/003745
Other languages
English (en)
Korean (ko)
Inventor
황승재
김문회
황문영
Original Assignee
주식회사 아모그린텍
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 주식회사 아모그린텍 filed Critical 주식회사 아모그린텍
Priority to CN201680019942.1A priority Critical patent/CN107429107B/zh
Priority to JP2017552955A priority patent/JP6625659B2/ja
Priority to US15/564,698 priority patent/US11104108B2/en
Priority claimed from KR1020160043710A external-priority patent/KR101837512B1/ko
Publication of WO2016163830A1 publication Critical patent/WO2016163830A1/fr

Links

Images

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D163/00—Coating compositions based on epoxy resins; Coating compositions based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
    • C09D7/40—Additives

Definitions

  • the present invention relates to a heat dissipation coating composition, and more particularly, after forming a heat dissipation coating layer, the heat dissipation coating composition exhibits excellent heat dissipation performance and at the same time excellent durability of the coating layer, adhesion to the coated surface, and surface quality of the coating layer. It relates to a heat dissipation unit coated with this
  • a heat radiating member is mounted to the component having heat.
  • Heat dissipation members such as heat sinks or heat sinks, are typically made of metals with high thermal conductivity so that heat within the device or components can be quickly released to the outside.
  • the heat sink is a plurality of heat dissipation fins that are uniformly protruded on the front surface by heating and melting aluminum, copper and its alloy material at a high temperature state, and then extrusion molding using a mold having a predetermined shape. Structure has been generally employed.
  • the heat sink of the metal material may have a high thermal conductivity, but the thermal radiation efficiency of radiating conducted heat into the air is very low.
  • the electronic device having the heat dissipation member made of metal is difficult to lighten due to the weight of the heat dissipation member, and there is a problem in that the mobile electronic device has a limitation in use.
  • the structure of the heat dissipation member such as reducing the number of heat dissipation fins is solved.
  • To simplify and to reduce the thickness of the heat radiation member has a problem that is difficult to achieve the desired level of heat radiation performance.
  • an object of the present invention is to provide a heat dissipation coating composition that can implement a heat dissipation coating layer that exhibits excellent heat dissipation performance as well as thermal conductivity.
  • the present invention is very excellent in adhesion to the surface to be coated, the peeling of the heat-dissipating coating layer is remarkably prevented during use, and after forming as a heat-dissipating coating layer to the physical and chemical stimuli such as external heat, organic solvent, moisture, impact
  • Another object is to provide a heat dissipation coating composition that can be maintained in durability.
  • the present invention has a further object to provide a heat dissipation coating composition formed surface is very smooth, excellent in smoothness and can implement a heat dissipation coating layer excellent in surface quality.
  • the coating layer forming component comprising a main resin; Carbon-based filler contained in 8 to 72 parts by weight based on 100 parts by weight of the main resin; It provides a heat dissipation coating composition comprising; and a physical property enhancing component for improving heat dissipation and adhesion.
  • the main resin is a glycidyl ether type epoxy resin, a glycidyl amine type epoxy resin, a glycidyl ester type epoxy resin, a linear aliphatic type epoxy resin, a rubber-modified epoxy resin and their It may include any one or more epoxy resin selected from the group consisting of derivatives. At this time, it may preferably include a glycidyl ether type epoxy resin containing a bisphenol A epoxy resin, more preferably the epoxy equivalent may be 350 ⁇ 600 g / eq.
  • the coating layer forming component may further include a curing agent including any one or more components of an acid anhydride, amine, imidazole, polyamide and polycaptan.
  • the curing agent may include a polyamide-based component.
  • the polyamide-based component may be a polyamide-based component having an amine number of 180 to 300 mgKOH / g.
  • the curing agent including the polyamide-based component may be provided with 45 to 75 parts by weight based on 100 parts by weight of the bisphenol A epoxy resin.
  • the carbon-based filler may include any one or more of graphite and carbon black.
  • the carbon-based filler may be included in 17 to 42 parts by weight based on 100 parts by weight of the epoxy resin.
  • the carbon-based filler is carbon black, the average particle diameter may be 250nm or less, more preferably 50 to 250nm. In addition, the carbon-based filler may have a D90 of 260 nm or less.
  • the physical property enhancing component is 3- (N-aniyl-N-glycidyl) aminopropyltrimethoxysilane, 3-glycidoxypropylmethylethoxysilane, ⁇ -glycidoxycitrimethyldimethoxysilane, 3- Any one or more selected from the group consisting of glycidoxypropyltrimethoxysilane, 3-glycidoxypropyltriethoxysilane, 3-glycidoxypropylmethylmethoxysilane, and 3-glycidoxypropylmethyldimethoxysilane It may include.
  • the physical property enhancing component may be included in 2 to 5 parts by weight based on 100 parts by weight of the main resin.
  • the coating layer-forming component may include a curing agent including a main resin and a polyamide-based component including a bisphenol A-type epoxy resin, and the carbon-based filler may include carbon black.
  • the present invention On the other hand, the present invention; And a heat dissipation coating composition coated on at least a portion of the outer surface of the substrate and cured heat dissipation coating layer according to the present invention.
  • the thickness of the heat dissipation coating layer may be 10 ⁇ 100 ⁇ m.
  • the heat dissipation coating layer may include a carbon-based filler 5 to 30% by weight based on the total weight of the heat dissipation coating layer.
  • the substrate may be molded of any one or more of a metal, a nonmetal, and a high molecular organic compound.
  • the heat dissipation coating composition of the present invention can realize a heat dissipation coating layer exhibiting excellent heat dissipation performance as well as thermal conductivity.
  • the heat dissipation coating layer implemented through this has excellent adhesion to the surface to be coated to prevent peeling of the heat dissipation coating layer during use, and after being formed as a heat dissipation coating layer, external heat, organic solvent, moisture, impact, etc.
  • the durability of the coating layer can be maintained even with chemical stimuli.
  • the surface of the formed heat dissipation coating layer is very smooth, the smoothness is excellent and the surface quality is excellent, the heat dissipation coating layer can be widely applied in the industry that requires heat dissipation.
  • 1 to 3 is a view showing a perspective view and a partial cross-sectional view of the heat dissipation unit according to an embodiment of the present invention.
  • FIGS. 4 to 5 are perspective views of a substrate according to an embodiment of the present invention.
  • the heat dissipation coating composition according to an embodiment of the present invention includes a coating layer-forming component including a main resin, a carbon-based filler and a physical property enhancing component for improving heat dissipation and adhesion, and a carbon-based filler based on 100 parts by weight of the main resin 8 to 72 parts by weight.
  • the coating layer forming component may include a main resin, and may further include a curing agent when the main resin is a curable resin, and may further include other curing accelerators and curing catalysts.
  • the main resin may be used without limitation in the case of components known in the art to form a coating layer.
  • the main resin is glycidyl ether type in order to simultaneously achieve the improvement of heat dissipation performance by improving the adhesiveness to the substrate to be coated, heat resistance which is not embrittled by heat of the heat generating substrate, mechanical strength and compatibility with the carbon-based filler.
  • Epoxy resin, glycidylamine type epoxy resin, glycidyl ester type epoxy resin, linear aliphatic type epoxy resin, rubber-modified epoxy resin, and any one or more epoxy resin selected from the group consisting of derivatives thereof may be included.
  • the glycidyl ether type epoxy resin includes glycidyl ethers of phenols and glycidyl ethers of alcohols.
  • glycidyl ethers of the phenols bisphenol A type, bisphenol B type, bisphenol AD type, and bisphenol Bisphenol-based epoxys such as S-type, bisphenol-F and resorcinol, phenol novolac epoxy, aralkylphenol novolac, phenolic novolacs and terpene-phenol novolacs and o-cresolnovolac
  • cresol novolak-type epoxy resins such as epoxy, and these can be used individually or in combination of 2 or more types.
  • the glycidyl ester type epoxy resin may be an epoxy resin such as hydroxycarboxylic acid such as p-hydroxybenzoic acid or ⁇ -hydroxy naphthoic acid, and polycarboxylic acid such as phthalic acid or terephthalic acid. can do.
  • linear aliphatic epoxy resins examples include 1,4-butanediol, 1,6-hexanediol, neopentyl glycol, cyclohexanedimethanol, glycerin, trimethylolethane, thirimethylolpropane, pentaerythritol, and dodecahydro bisphenol A.
  • glycidyl ethers based on dodecahydro bisphenol F ethylene glycol, propylene glycol, polyethylene glycol, polypropylene glycol, and the like, and may be used alone or in combination of two or more thereof.
  • the rubber-modified epoxy resin is not particularly limited as long as it is an epoxy resin having rubber and / or polyether in its skeleton.
  • an epoxy resin CBN-modified compound
  • CBR-modified epoxy resins acrylonitrile-butadiene rubber-modified epoxy resins
  • silicone-modified epoxy resins such as silicone-modified epoxy resins, and may be used alone or in combination of two or more.
  • the main resin includes bisphenol-A epoxy resin in terms of heat dissipation characteristics, durability improvement of the coating layer, and surface quality improvement of the heat dissipation coating layer due to its excellent compatibility with carbon-based fillers, in particular, carbon black. It may be a glycidyl ether type epoxy resin.
  • the bisphenol A epoxy resin may have an epoxy equivalent of 350 to 600 g / eq. If the epoxy equivalent is less than 350g / eq there is a problem that the hardness of the coating layer is increased to be easily cracked or cracks, it can be easily peeled off particularly in the curved coating surface. In addition, if the epoxy equivalent exceeds 600g / eq there is a problem that the chemical resistance, adhesion and durability due to the occurrence of the uncured portion may be lowered.
  • the bisphenol A epoxy resin may have a viscosity of 10 to 200 cps. If the viscosity of the bisphenol A epoxy resin is less than 10 cps it may be difficult to produce a coating layer, there is a problem that the adhesive strength with the surface to be coated may be reduced even after the production, if it exceeds 200 cps is made of a thin coating layer The coating process may be difficult, and the coating process may not be easy. In particular, the coating process may be more difficult in the case of spraying coating. In addition, there is a problem that the dispersibility of the carbon black in the coating layer may be reduced.
  • the curing agent included in the coating layer forming component together with the epoxy resin of the above-mentioned main resin may be changed according to the specific type of the selected epoxy resin, the specific type may use a curing agent known in the art, Preferably, any one or more of an acid anhydride type, an amine type, an imidazole type, a polyamide type, and a polymercaptan type may be included.
  • the acid anhydride may be phthalic anhydride, trimellitic anhydride, pyromellitic anhydride, benzophenonetetracarboxylic acid, ethylene glycol bistrimellitate, glycerol tristrimellitate, maleic anhydride, tetrahydrophthalic anhydride, methyl Tetrahydrophthalic anhydride, endo methylene tetrahydro phthalic anhydride, methyl endo methylene tetrahydro phthalic anhydride, methyl butenyl tetrahydro phthalic anhydride, dodecenyl anhydrous succinic acid, hexahydro phthalic anhydride, methyl hexahydro phthalic anhydride, succinic anhydride, methylcyclohexene Dicarboxylic acid
  • the amine system may be aromatic amines, aliphatic amines, or modified substances thereof.
  • aromatic amines for example, metaphenylenediamine, diaminodiphenylmethane, diaminodiphenylsulfone, azomethylphenol and the like may be used alone or in combination of two or more.
  • the aliphatic amines can be used alone or in combination of two or more diethylenetriamine, triethylenetetramine, for example.
  • the polyamides may be, for example, a reactant produced by condensation of a dimer acid and a polyamine having a fatty acid dimer, and may be a polyamideamine having a plurality of amino groups in a molecule and having at least one amide group.
  • the imidazole type is, for example, 2-methylimidazole, 2-ethyl-4-methylimidazole, 1-cyanoethyl-2-undecyl imidazolium trimellitate and epoxyimidazole adduct. (adduct) and the like.
  • the polymercaptan-based may be, for example, a mercaptan group is present at the end of the polypropylene glycol chain, or a mercaptan group is present at the end of the polyethylene glycol chain.
  • a known curing agent such as a phenol resin, an amino resin, a polysulfide resin or the like may be included depending on the purpose instead of or in combination with the curing agent described above.
  • the coating layer forming component may further include a polyamide-based component as a curing agent, through which the carbon-based filler, Among them, it is very advantageous for improving compatibility with carbon black, and it is advantageous in all physical properties such as adhesion, durability, and surface quality of the coating layer.
  • the surface to which the heat-dissipating coating composition is applied is not flat but curved or stepped. In this case, there is an advantage of further preventing cracks from occurring or peeling off the heat-dissipating coating layer formed on the corresponding part.
  • the polyamide-based component may preferably have an amine number of 180 to 300 mgKOH / g, and more preferably 50,000 to 70,000 cps at 40 ° C.
  • the amine value of the polyamide-based curing agent is less than 180 mgKOH / g curing quality is lowered, all of the surface quality, durability, adhesion can be reduced, and the heat dissipation performance may also be reduced at the same time.
  • the amine value exceeds 300 mgKOH / g curing may proceed rapidly to cause agglomeration in the coating.
  • the viscosity of the polyamide-based curing agent is less than 50,000 cps, there is a problem of flowing down after coating, if it exceeds 70,000 cps, uniform coating is not applied during spray coating, the nozzle may be clogged and agglomeration may occur.
  • the coating layer forming component may include 45 to 75 parts by weight of the polyamide-based curing agent based on 100 parts by weight of the main resin provided, for example, the main resin is a bisphenol A-type epoxy resin. If the polyamide-based curing agent is provided in less than 45 parts by weight there is a problem of uncured, durability degradation. In addition, when the polyamide-based curing agent exceeds 75 parts by weight, there may be problems such as cracking due to excessive curing.
  • the above-described coating layer forming component may further include a curing accelerator in addition to the above-mentioned curing agent when the main resin and the main resin is a curable resin.
  • the curing accelerator plays a role for adjusting the curing rate, the properties of the cured product, etc., and may be used by selecting a known curing accelerator according to the type of curing agent selected, and as a non-limiting example, amines, imidazoles , Organic phosphines, Lewis acid curing accelerators.
  • the curing accelerator when using a polyamide-based curing agent may be used in combination with a curing accelerator of phenols and amines, for example, the addition amount may be appropriately changed in consideration of the equivalent of the epoxy resin.
  • the curing catalyst may be selected from the known curing catalyst in consideration of the type of the main resin, the type of curing agent, and the like, and the addition amount may be appropriately changed in consideration of the content of the main resin and the curing agent, epoxy equivalent, and curing temperature. Therefore, this invention does not specifically limit about this.
  • the carbon filler may be used without limitation in the case of including carbon in the material thereof, and a carbon material known in the art may be used.
  • the shape and size of the carbon-based fillers are not limited, and may also be porous or non-porous in structure, and may be differently selected according to the purpose.
  • carbon nanotubes such as single-walled carbon nanotubes, double-walled carbon nanotubes, multi-walled carbon nanotubes, graphene, graphene oxide, graphite, carbon black and carbon-metal composites include at least one can do.
  • it may preferably include any one or more of graphite and carbon black in terms of facilitating the achievement of the desired physical properties, such as excellent heat dissipation performance, ease of forming the coating layer, the surface quality of the coating layer, and improves the surface quality of the coating layer More preferably carbon black.
  • the carbon black may be used without limitation by selecting one or more kinds of known carbon blacks such as furnace black, lamp black and channel black.
  • the carbon black preferably has an average particle diameter of 250 nm or less, more preferably 50 to 250 nm. If the average particle diameter exceeds 250nm, there may be a problem of the uniformity of the surface, and if the average particle diameter is less than 50nm, there is a fear that the cost of the product increases, and the amount of carbon black buried on the surface after being implemented as a coating layer This increases and there is a problem that the heat dissipation performance can be reduced.
  • the carbon black provided for the surface quality may have a D90 of 260 nm or less in a volume accumulation particle size distribution.
  • the D90 refers to the particle diameter of the carbon black particles when the cumulative degree is 90% in the volume accumulation particle size distribution. Specifically, in the graph (volume-based particle size distribution) from the side with the smallest particle diameter on the horizontal axis and the smallest particle diameter on the vertical axis, the volume% from the smallest particle size is obtained from the smallest particle size with respect to the volume accumulation value (100%) of all particles.
  • the particle size of the particle with a cumulative value of 90% corresponds to D90.
  • the volume cumulative particle size distribution of the carbon black can be measured using a laser diffraction scattering particle size distribution device.
  • the carbon-based filler a carbon-based filler whose surface is modified with a functional group such as a silane group, an amino group, an amine group, a hydroxy group, or a carboxyl group may be used, wherein the functional group may be directly bonded to the surface of the carbon-based filler. Or may be indirectly bonded to the carbon-based filler via a substituted or unsubstituted aliphatic hydrocarbon having 1 to 20 carbon atoms or a substituted or unsubstituted aromatic hydrocarbon having 6 to 14 carbon atoms.
  • the carbon-based material may be a core or a shell, and the heterogeneous material may be a core-shell filler comprising the shell or the core.
  • the carbon-based filler may be included in an amount of 8 to 72 parts by weight based on 100 parts by weight of the above-described main resin, and may be included in an amount of 17 to 42 parts by weight for further improved physical properties.
  • the carbon-based filler is included in less than 8 parts by weight based on 100 parts by weight of the main resin, there is a problem that may not express the desired level of heat dissipation performance.
  • the carbon-based filler exceeds 72 parts by weight, the adhesion of the implemented coating layer is weakened, so that peeling occurs easily, and the hardness of the coating layer increases, so that it may be easily broken or crushed by physical impact.
  • the surface roughness may increase, thereby decreasing the surface quality of the coating layer.
  • the degree of improvement in heat dissipation performance may be insignificant.
  • the carbon-based filler may be provided in 42 parts by weight or less, if provided in excess of 42 parts by weight in the process of applying a heat-dissipating coating composition to the surface to be coated to achieve a thin coating layer
  • coating for example, by spraying
  • the physical property enhancing component is responsible for improving the durability by expressing improved heat dissipation and at the same time excellent adhesiveness when the heat dissipation coating composition according to the present invention is coated on the surface to be coated.
  • the physical property enhancing component may be a silane-based compound, and may be used without limitation in the case of known silane-based compounds employed in the art, but when used together with carbon black among the main resin and carbon-based filler of the above-described coating layer forming component,
  • the silane-based compound was added to 3- (N-anyl-N-glycidyl) aminopropyltrimethoxysilane, 3-glycidoxypropylmethyl to cause synergistic properties of one physical property and to express remarkable durability and heat dissipation.
  • the physical property enhancing component may preferably be included in 2 to 5 parts by weight based on 100 parts by weight of the main resin. If the physical property enhancing component is provided in less than 2 parts by weight, there may be a problem in that the desired physical properties such as heat dissipation and adhesion improvement through the physical property enhancing component are not simultaneously achieved to the desired level. In addition, when provided in excess of 5 parts by weight may have a problem of weakening the adhesion with the surface to be coated.
  • the above-mentioned heat-dissipating coating composition may further include a dispersant and a solvent for improving the dispersibility of the carbon-based filler.
  • the dispersant may be a known component employed in the art as a dispersant of the carbon-based filler.
  • polyester-based dispersant polyphenylene ether-based dispersant
  • Polyolefin dispersant acrylonitrile-butadiene-styrene copolymer dispersant, polyarylate dispersant, polyamide dispersant, polyamideimide dispersant, polyarylsulfone dispersant, polyetherimide dispersant, polyethersulfone dispersant, poly Phenylene sulfide dispersants, polyimide dispersants
  • Polyetherketone Dispersant Polybenzoxazole Dispersant, Polyoxadiazole Dispersant, Polybenzothiazole Dispersant, Polybenzimidazole Dispersant, Polypyridine Dispersant, Polytriazole Dispersant, Polypyrrolidine Dispersant, Polydibenzofuran
  • a system dispersing agent a polysulfone dispersing agent, a polyure
  • a reactant in which a urea component and an aldehyde component such as isobutylaldehyde can be used as a dispersant.
  • the solvent may be selected according to the selected main resin, the curing agent and the like, and the present invention is not particularly limited thereto, and the solvent may be used any solvent that enables the proper dissolution of each component,
  • an aqueous solvent such as water, an alcohol solvent, a ketone solvent, an amine solvent, an amine solvent, an ester solvent, an amide solvent, a halogenated hydrocarbon solvent, an ether solvent, and a furan solvent
  • an aqueous solvent such as water, an alcohol solvent, a ketone solvent, an amine solvent, an amine solvent, an ester solvent, an amide solvent, a halogenated hydrocarbon solvent, an ether solvent, and a furan solvent
  • an aqueous solvent such as water, an alcohol solvent, a ketone solvent, an amine solvent, an amine solvent, an ester solvent, an amide solvent, a halogenated hydrocarbon solvent, an ether solvent, and a furan solvent
  • One or more selected species may be used.
  • the above-mentioned heat-dissipating coating composition may be a leveling agent, a pH adjusting agent, an ion trapping agent, a viscosity adjusting agent, a thixotropic agent, an antioxidant, a heat stabilizer, a light stabilizer, an ultraviolet absorber, a colorant, a dehydrating agent, a flame retardant, an antistatic agent.
  • the heat dissipation coating composition according to the embodiment of the present invention described above may have a viscosity of 50 to 250 cps at 25 °C. If the viscosity of the heat-dissipating coating composition is less than 50 cps, it may be difficult to produce a coating layer due to the flow of the composition, and even after the production, the adhesive strength with the coated surface may be weakened. It is difficult to prepare a coating layer of the, even if the surface may not be uniform, the coating process may not be easy, especially in the case of spraying coating may be more difficult coating process. In addition, there is a problem that the dispersibility of the carbon black in the coating layer may be reduced.
  • the present invention is a heat dissipation unit including a heat dissipation coating layer (10b) is applied to the substrate 10a and the heat dissipation coating composition according to the invention on at least a portion of the outer surface of the substrate 10a as shown in FIG. 100.
  • the substrate 10a may be employed without limitation if the substrate 10a has a mechanical strength enough to form a coating layer after the heat-dissipating coating composition according to the present invention is applied regardless of whether there is a heat dissipation characteristic.
  • the substrate 10a may be at least one of a metal, a nonmetal, and a polymer organic compound.
  • the metal may be molded of any one metal material selected from the group consisting of aluminum, copper, zinc, silver, gold, iron, oxides thereof, and alloys of the metals.
  • the base metal may be a component commonly referred to as aluminum oxide, commonly ceramic.
  • the polymer organic compound is polyethylene, polypropylene, polystyrene, polyvinyl chloride, acrylonitrile-butadiene-styrene resin (ABS), acrylonitrile-styrene resin (AN), methacryl resin (PMMA), polyamide, Polyacetal, polycarbonate, polyethylene terephthalate (PET), polybutylene terephthalate (PBT).
  • the shape of the substrate 10a is not limited.
  • the substrate 10a may have a structure having a plurality of peaked heat dissipation fins 10a 1 as shown in FIG. 1 to widen a surface area for radiating heat to the outside.
  • the substrate 10a may have a structure having a plate-shaped heat dissipation fin 10a 2 .
  • both side ends of the bottom plate may be bent upward to face each other, and thus may be a substrate 12a having a function of performing a heat radiation fin.
  • the heat dissipation coating layers 10b, 11b, and 12b formed of the heat dissipation coating composition according to the embodiment of the present invention exhibit improved heat dissipation performance, so that the heat dissipation unit 100 ′′ as shown in FIG. 3 is the number of heat dissipation fins of the substrate 12a. 1 is less than Figs. 1 and 2, the heat dissipation performance of the heat dissipation coating layer is not superior to that of the heat dissipation substrate having only the shape as shown in Figs. As shown in FIG. 1 and FIG. 2, even if the substrates 10a and 11a of the structure which are difficult to be molded structurally and the manufacturing time and the manufacturing cost are increased, there is an advantage of achieving a desired level of heat dissipation performance.
  • the outer surface is bent or stepped due to excellent adhesiveness of the heat dissipation coating layer. Even the heat dissipation coating layer may be peeled off or cracks do not occur.
  • the thickness, length, width, etc. of the substrates 10a, 11a, 12a may be variously changed according to the size and location of the application where the heat dissipation units 100, 100 ', 100 "are provided. It is not limited.
  • the substrate 12a may further include a functional layer 12c between the outer surface and the heat dissipation coating layer 12b, and the functional layer may be used to improve adhesion of the heat dissipation coating layer 12b. It may be a separate primer layer or an oxide film formed by surface modification such as anodizing the outer surface of the substrate 12a to improve heat dissipation performance.
  • the heat dissipation coating composition according to the present invention is coated on at least one region of the above-described substrate (10a, 11a, 12a) to form a heat dissipation coating layer, and unlike the Figures 1 to 3, the heat dissipation coating layer only on a portion of the substrate (10a, 11a, 12a) This can be formed. This is because the area covered in some coating may vary depending on the desired level of heat dissipation performance, so the present invention is not particularly limited thereto.
  • the heat dissipation coating layer (10b, 11b, 12b) is formed by curing the heat dissipation coating composition according to the present invention on the outer surface of the substrate.
  • Specific methods for forming the heat dissipation coating layer (10b, 11b, 12b) can be used by selecting a known method for coating the heat dissipation coating composition on the substrate, non-limiting examples of spray, dip coating, silk screen, roll It may be prepared by coating on various substrates by a method such as coating, dip coating or spin coating.
  • the coating resin may be implemented as a coating layer by treating heat and / or light according to the type of the main resin of the coating layer forming component used for curing after the coating, and the type of the curing agent provided with the curable main resin.
  • the temperature of heat applied and / or the light intensity and treatment time may vary depending on the type of main resin used, the type of curing agent, their content, coating thickness, and the like.
  • the bisphenol-A epoxy resin described above is included as the main resin, and the polyamide curing agent is provided, the bisphenol A epoxy resin may be treated for 10 to 120 minutes at a temperature of 60 ° C to 300 ° C, which is below the strain point of the substrate.
  • the treatment temperature is less than 60 °C, it is difficult to coat the heat dissipation coating composition on the substrate, if the treatment temperature exceeds 300 °C there is a problem that the deformation of the substrate or the manufacturing cost is increased.
  • the heat treatment time is less than 10 minutes, it is difficult to coat the heat dissipation coating composition on the substrate, and when the heat treatment time exceeds 120 minutes, the heat dissipation device is unnecessary because the manufacturing time of the heat dissipation device is unnecessarily increased. It is preferable that the surface treatment process is performed for 10 to 120 minutes.
  • the heat-dissipating coating composition used in the present invention is exposed to air after contact with a solid substrate, in particular a metal substrate to form a film that quickly cures without stickiness in moisture at room temperature or below 50 ° C. It is less likely to be contaminated by and the like, and the final curing can be performed at a relatively low temperature, so that the workability is excellent and the deformation of the metal substrate can be prevented during the curing.
  • the formed heat dissipation coating layers 10b, 11b, and 12b may have a thickness of 10 to 100 ⁇ m, and more preferably 15 to 50 ⁇ m. If the thickness exceeds 100 ⁇ m may have a problem such as boiling phenomenon occurs on the coating surface, if the thickness is less than 10 ⁇ m may have a problem of deterioration of heat radiation characteristics.
  • the heat dissipation coating layer (10b, 11b, 12b) may include a carbon-based filler 5 to 30% by weight based on the total weight of the heat dissipation coating layer. If the carbon-based filler is provided in less than 5% by weight in the implemented heat dissipation coating layer there is a problem that can not express the desired level of heat dissipation performance. In addition, if the carbon-based filler exceeds 30% by weight, the adhesion of the coating layer is weakened and peeling easily occurs, and the hardness of the coating layer is increased so that it may be easily broken or crushed by physical impact.
  • the surface roughness may increase, thereby decreasing the surface quality of the coating layer.
  • the degree of improvement in heat dissipation performance may be insignificant.
  • the heat dissipation coating composition forming the heat dissipation coating layer of the present invention can substantially increase the bending strength of the coating layer, excellent adhesion between the coating layer and the substrate, improved moisture resistance and weather resistance, and wettability of the carbon-based filler, and lower the viscosity during compounding. And increasing the surface ductility of the substrate on which the heat dissipation coating layer is formed.
  • excellent heat dissipation, excellent solvent resistance to the organic solvent, there is no discoloration during curing, and the heat dissipation unit including the heat dissipation coating layer implemented as it is easy to control the heat conduction can continuously express improved physical properties.
  • lighting devices such as LED lamps, energy charging devices, heater devices, display devices, power devices such as engines and motors, energy storage devices such as batteries, electrical and electronic devices such as heat exchangers, condensers and evaporators, automobiles, energy, and aviation Widely applicable to heat dissipation units or housings throughout the aerospace industry.
  • the coating layer forming component is a main resin and 65 parts by weight of a polyamide curing agent (Kukdo Chemical, G-5022) based on 100 parts by weight of a bisphenol A epoxy resin (Kukdo Chemical, YD-011) having an epoxy equivalent of 550 g / eq. 22 parts by weight of carbon black having an average particle diameter of 150 nm and D90 of 190 nm, 3 parts by weight of a physical property enhancing component (Shanghai Tech Polymer Technology, Tech-7130), which is an epoxy silane compound, and a dispersant (isobutylaldehyde and urea).
  • the heat-dissipating coating composition prepared in Example and Comparative Example is made of aluminum material (Al 1050) of which both ends are bent upwards as shown in FIG. 4, and the thickness is 1.5 mm, the width x the length x the height 35 mm x 34 mm x After spraying and coating the entire surface of the substrate with a final thickness of 25 ⁇ m at a thickness of 8.12 g of 12 mm, a heat dissipation unit having a heat dissipation coating layer was formed at a temperature of 150 ° C. for 10 minutes, and then evaluated by the following physical properties. Shown in
  • a test specimen was prepared by attaching a heat source (copper block combined with a ceramic heater) to the heat dissipation unit by using a TIM (thermally conductive tape: 1W / mk). Heat was generated by applying a constant current to the heat source of the prepared specimen, and maintained for 1 hour to evaluate the thermal emissivity by measuring the temperature of the heat radiation unit. Specifically, the thermal emissivity was calculated according to the following equation on the basis of the temperature measured under the same conditions for the substrate having no heat-dissipating coating layer.
  • Thermal emissivity (%) ⁇ 1- (temperature of test specimen (°C) / temperature of uncoated substrate (°C)) ⁇ ⁇ 100
  • Example 13 and Comparative Example 2 it was determined that the durability and adhesion evaluation results in poor, and radioactive evaluation was omitted.
  • the height of the chamber and the temperature of the heat dissipation unit were adjusted to 25 ⁇ 0.2 ° C.
  • a heat source having a diameter of 15 mm, a thickness of 1.5 mm, and a temperature of 115 ° C. is directly contacted with the center of the bottom surface of the bottom plate of the heat dissipation unit.
  • the standard deviation for the time required for the four points was calculated. The smaller the standard deviation, the more uniform the heat dissipation performance, and it can be interpreted that the carbon-based filler dispersibility of the heat dissipation coating layer is high.
  • the surface state of the heat dissipation unit was visually evaluated after 480 hours.
  • cracks and peeling (floating) of the heat-dissipating coating layer were checked for no abnormality, and the abnormality was indicated by ⁇ .
  • Example 1 Example 2 Example 3 Example 4 Example 5 Example 6 Example 7 Coating Layer Forming Ingredients Main resin (type / epoxy equivalent (g / eq) / content (part by weight)) BPA (YD-011) / 550/100 BPA (YD-011) / 550/100 BPA (YD-011) / 550/100 BPA (YD-011) / 550/100 BPA (YD-011) / 550/100 BPA (YD-011) / 550/100 BPA (YD-011) / 550/100 BPA (YD-011) / 550/100 Curing agent (type / amine value (mgKOH / g) / content (part by weight)) PA (G-5022) / 220/65 PA (G-5022) / 220/65 PA (G-5022) / 220/65 PA (G-5022) / 220/65 PA (G-5022) / 220/65 PA (G-5022) / 220/65 PA (G
  • Example 8 Example 9 Example 10 Example 11 Example 12 Example 13 Example 14 Coating Layer Forming Ingredients Main resin (type / epoxy equivalent (g / eq) / content (part by weight)) BPA (YD-011) / 550/100 BPA (YD-011) / 550/100 BPA (YD-011) / 550/100 BPA (YD-011) / 550/100 BPA (YD-011) / 550/100 BPA (YD-136) / 310/100 BPA (YD-012H) / 650/100 Curing agent (type / amine value (mgKOH / g) / content (part by weight)) PA (G-5022) / 220/65 PA (G-5022) / 220/65 PA (G-5022) / 220/65 PA (G-5022) / 220/65 PA (G-5022) / 220/65 PA (G-5022) / 220/65 PA (G-5022) / 220/65 PA (
  • Example 15 Example 16
  • Example 17 Example 18
  • Example 20 Coating Layer Forming Ingredients Main resin (type / epoxy equivalent (g / eq) / content (part by weight)) BPF (YDF-2001) / 480/100 Rubber modified epoxy (KR-202C) / 380/100 DCPD (KDCP-150) / 280/100 BPA (YD-011) / 550/100 BPA (YD-011) / 550/100 BPA (YD-011) / 550/100 Curing agent (type / amine value (mgKOH / g) / content (part by weight)) PA (G-5022) / 220/65 PA (G-5022) / 220/65 PA (G-5022) / 220/65 Amidoamine (G-A0533) / 330/65 Alicyclic amine (KH-825) / 275/65 Phenalcarmine (KMH-121X80) / 200/65 Carbon filler Type / content
  • Comparative Example 1 Comparative Example 2 Comparative Example 3 Comparative Example 4 Coating Layer Forming Ingredients Main resin (type / epoxy equivalent (g / eq) / content (part by weight)) BPA (YD-011) / 550/100 BPA (YD-011) / 550/100 BPA (YD-011) / 550/100 BPA (YD-011) / 550/100 Curing agent (type / amine value (mgKOH / g) / content (part by weight)) PA (G-5022) / 220/65 PA (G-5022) / 220/65 PA (G-5022) / 220/65 PA (G-5022) / 220/65 filler Type / content (part by weight) Carbon black / 5 Carbon black / 75 Titanium Dioxide / 22 Carbon black / 22 Average particle diameter (nm) / D90 (nm) 150/192 150/192 208/255 150/190 Properties Enhancement Ingredients 3 3 3 Not included Heat dissip
  • Examples 1, 4 and 5 in which the content of the carbon-based fillers are within the preferred range of the present invention can be confirmed that thermal radiation and adhesiveness are simultaneously achieved as compared with Examples 2, 3, 6 and 7.
  • thermal radiation and adhesiveness are simultaneously achieved as compared with Examples 2, 3, 6 and 7.
  • the degree of improvement in thermal radiation properties is insignificant, rather it can be seen that the adhesiveness is lowered.
  • the uniformity of the radioactivity is also reduced.
  • Example 1 In Example 1, Examples 8 to 12, in which carbon black is provided in the same amount, in Example 11 having an average particle diameter of more than 250 nm, it can be seen that surface quality is lowered and radiation performance uniformity is lowered.
  • Example 12 in which D90 of the carbon black exceeds 260 nm, the surface quality was markedly lowered, and the adhesiveness was also decreased simultaneously.
  • Example 13 where the epoxy equivalent of the epoxy resin of the main resin is less than the preferred range, it can be seen that the adhesion and durability is not very good.
  • Example 14 in which the epoxy equivalent of the epoxy resin which is the main resin exceeds the preferable range, it can be seen that the adhesiveness is significantly lowered, and the uniformity of the radioactivity is also lowered.
  • Comparative Example 1 in which the content of the carbon-based filler is out of the range according to the present invention, it can be confirmed that the thermal radiation property is not significantly better than that in the embodiment.
  • Comparative Example 2 it can be seen that the durability and adhesion, the surface properties are very poor.
  • Comparative Example 3 equipped with a type of filler titanium dioxide, the adhesiveness and durability was excellent, but the degree of thermal radiation is Example 2 level, the filler content of Example 2 is less than 1/2 of Comparative Example 3 Considering that the carbon black can be expected to have a much better heat dissipation performance than titanium dioxide.
  • Example 4 which does not include a physical property enhancing component, it can be seen that the radioactivity, radioactivity uniformity, adhesiveness and durability all decrease.
  • the height of the chamber and the temperature of the heat dissipation unit were adjusted to be 25 ⁇ 0.2 ° C. Thereafter, a ceramic heating element having a diameter of 15 mm and a thickness of 1.5 mm was directly contacted with the bottom center of the bottom surface of the heat dissipation unit, and then a power of 620 kV and 5.2 V was applied, and the temperature of the heat source was measured after 2 hours.
  • the height of the chamber and the temperature of the heat dissipation unit were adjusted to be 25 ⁇ 0.2 ° C. Thereafter, a ceramic heating element having a diameter of 15 mm and a thickness of 1.5 mm was directly contacted with the bottom center of the bottom surface of the heat dissipation unit, and then a power of 620 kV and 5.2 V was applied, and after 2 hours, the temperature inside the chamber was measured.

Landscapes

  • Chemical & Material Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Organic Chemistry (AREA)
  • Paints Or Removers (AREA)

Abstract

L'invention concerne une composition de revêtement de dissipation de chaleur. Une composition de revêtement de dissipation de chaleur selon un mode de réalisation de la présente invention comprend : un constituant de formation d'une couche de revêtement comprenant une résine principale ; une charge à base de carbone comprenant 8 à 72 parties en poids par rapport à 100 parties en poids de la résine principale ; et un constituant d'amélioration des propriétés physiques destiné à améliorer les propriétés de dissipation de chaleur et d'adhérence. Par conséquent, une couche de revêtement de dissipation de chaleur présentant une excellente performance de dissipation de chaleur peut être réalisée par le fait qu'elle présente non seulement une bonne conductivité thermique, mais également une bonne radiation de chaleur. En outre, une couche de revêtement de dissipation de chaleur formée comme indiqué ci-dessus présente une très bonne adhérence à la surface à revêtir de manière à empêcher de manière significative le pelage de la couche de revêtement de dissipation de chaleur pendant l'utilisation et après la formation de la couche de revêtement de dissipation de chaleur, la durabilité de la couche de revêtement peut être maintenue, malgré des stimuli physiques et chimiques externes, tels que la chaleur, les solvants organiques, l'humidité et des chocs. En outre, étant donné que la surface de la couche de revêtement de dissipation de chaleur formée est très lisse et présente une bonne régularité, la qualité de surface est excellente, ce qui permet une large utilisation de la composition dans toutes les industries nécessitant une dissipation de chaleur.
PCT/KR2016/003745 2015-04-08 2016-04-08 Composition de revêtement de dissipation de chaleur et unité de dissipation de chaleur formée par son utilisation WO2016163830A1 (fr)

Priority Applications (3)

Application Number Priority Date Filing Date Title
CN201680019942.1A CN107429107B (zh) 2015-04-08 2016-04-08 散热涂敷组合物及通过其形成的散热单元
JP2017552955A JP6625659B2 (ja) 2015-04-08 2016-04-08 放熱コーティング組成物およびこれを使用して形成された放熱ユニット
US15/564,698 US11104108B2 (en) 2015-04-08 2016-04-08 Heat dissipating coating composition and heat dissipating unit formed using same

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
KR10-2015-0049915 2015-04-08
KR20150049915 2015-04-08
KR10-2015-0063316 2015-05-06
KR20150063316 2015-05-06
KR10-2016-0043710 2016-04-08
KR1020160043710A KR101837512B1 (ko) 2015-04-08 2016-04-08 방열 코팅조성물 및 이를 통해 형성된 방열유닛

Publications (1)

Publication Number Publication Date
WO2016163830A1 true WO2016163830A1 (fr) 2016-10-13

Family

ID=57072252

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2016/003745 WO2016163830A1 (fr) 2015-04-08 2016-04-08 Composition de revêtement de dissipation de chaleur et unité de dissipation de chaleur formée par son utilisation

Country Status (1)

Country Link
WO (1) WO2016163830A1 (fr)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109266008A (zh) * 2018-09-28 2019-01-25 桐城市双港森科塑料厂 一种导热新材料
JP2020507910A (ja) * 2017-09-18 2020-03-12 エルジー・ケム・リミテッド バッテリパック製造方法
CN115725104A (zh) * 2022-12-09 2023-03-03 合肥乐凯科技产业有限公司 一种防静电膜

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20100079046A (ko) * 2008-12-30 2010-07-08 남동진 실록산계 방열 수지 조성물
KR20120076881A (ko) * 2010-12-30 2012-07-10 박영수 방열 도료 조성물 및 이를 이용한 방열시트
KR20130008855A (ko) * 2011-07-13 2013-01-23 주식회사 포스코 표면 처리용 수지 조성물 및 이에 의해 코팅된 강판
KR20140043031A (ko) * 2012-09-28 2014-04-08 한화케미칼 주식회사 방열 도료 조성물 및 방열 구조체
JP2015007214A (ja) * 2013-05-27 2015-01-15 Dic株式会社 硬化性樹脂組成物、その硬化物および熱伝導性接着剤

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20100079046A (ko) * 2008-12-30 2010-07-08 남동진 실록산계 방열 수지 조성물
KR20120076881A (ko) * 2010-12-30 2012-07-10 박영수 방열 도료 조성물 및 이를 이용한 방열시트
KR20130008855A (ko) * 2011-07-13 2013-01-23 주식회사 포스코 표면 처리용 수지 조성물 및 이에 의해 코팅된 강판
KR20140043031A (ko) * 2012-09-28 2014-04-08 한화케미칼 주식회사 방열 도료 조성물 및 방열 구조체
JP2015007214A (ja) * 2013-05-27 2015-01-15 Dic株式会社 硬化性樹脂組成物、その硬化物および熱伝導性接着剤

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2020507910A (ja) * 2017-09-18 2020-03-12 エルジー・ケム・リミテッド バッテリパック製造方法
CN109266008A (zh) * 2018-09-28 2019-01-25 桐城市双港森科塑料厂 一种导热新材料
CN115725104A (zh) * 2022-12-09 2023-03-03 合肥乐凯科技产业有限公司 一种防静电膜
CN115725104B (zh) * 2022-12-09 2023-08-08 合肥乐凯科技产业有限公司 一种防静电膜

Similar Documents

Publication Publication Date Title
WO2017204565A1 (fr) Composition de revêtement d'isolation et de dissipation de chaleur, et unité d'isolation et de dissipation de chaleur formée par cette dernière
EP3567083B1 (fr) Composition de revêtement isolant et thermorayonnant et produit isolant et thermorayonnant mis en oeuvre avec celle-ci
WO2017200310A1 (fr) Appareil d'émission d'énergie sans fil pour véhicule
KR101837512B1 (ko) 방열 코팅조성물 및 이를 통해 형성된 방열유닛
WO2018110929A1 (fr) Composition de revêtement transparente, isolante, thermorayonnante, unité thermorayonnante formée à partir de celle-ci, et carte de circuit thermorayonnante
WO2017171392A1 (fr) Unité à coefficient de température positif pour dispositif de chauffage de véhicule, dispositif de chauffage à coefficient de température positif la comprenant, et dispositif de climatisation pour véhicule
CN107429107B (zh) 散热涂敷组合物及通过其形成的散热单元
KR102076194B1 (ko) 방열복합재 및 이의 제조방법
WO2016163830A1 (fr) Composition de revêtement de dissipation de chaleur et unité de dissipation de chaleur formée par son utilisation
WO2013100502A1 (fr) Composition adhésive isolante pour un stratifié plaqué cuivre à base métallique (mccl), plaque métallique revêtue l'utilisant et son procédé de fabrication
US10856423B2 (en) Prepreg, printed circuit board, semiconductor package, and method for producing printed circuit board
WO2018084518A1 (fr) Composition de pâte époxyde comprenant des nanofils de cuivre revêtus d'argent ayant une structure cœur-écorce, et film conducteur comprenant celle-ci
JP2015061720A (ja) 部品封止用フィルムの製造方法
WO2018212611A1 (fr) Composite de dissipation de chaleur et son procédé de fabrication
KR102611441B1 (ko) 절연성 방열 코팅조성물 및 이를 통해 구현된 절연성 방열 물품
WO2020262980A1 (fr) Composition adhésive, film de couverture la comprenant et carte de circuit imprimé
KR102063667B1 (ko) 디스플레이 장치용 방열유닛 및 이를 포함하는 디스플레이 장치
KR101996605B1 (ko) 코어-쉘 구조의 은 코팅된 구리 나노와이어를 포함하는 에폭시 페이스트 조성물 및 이를 포함하는 도전성 필름
KR101866855B1 (ko) 도전성 조성물 및 도전성 성형체
WO2018164492A1 (fr) Dispositif de chauffage auxiliaire pour véhicule
WO2023003297A1 (fr) Composition de blindage électromagnétique contenant des métaux morphologiquement différents
JP2023018665A (ja) 導電性樹脂組成物
JP5691443B2 (ja) プリプレグ及びそれを用いた積層板並びにプリント配線板

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 16776933

Country of ref document: EP

Kind code of ref document: A1

WWE Wipo information: entry into national phase

Ref document number: 15564698

Country of ref document: US

ENP Entry into the national phase

Ref document number: 2017552955

Country of ref document: JP

Kind code of ref document: A

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 16776933

Country of ref document: EP

Kind code of ref document: A1