WO2018212611A1 - Composite de dissipation de chaleur et son procédé de fabrication - Google Patents

Composite de dissipation de chaleur et son procédé de fabrication Download PDF

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Publication number
WO2018212611A1
WO2018212611A1 PCT/KR2018/005678 KR2018005678W WO2018212611A1 WO 2018212611 A1 WO2018212611 A1 WO 2018212611A1 KR 2018005678 W KR2018005678 W KR 2018005678W WO 2018212611 A1 WO2018212611 A1 WO 2018212611A1
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Prior art keywords
thermally conductive
heat dissipation
polymer matrix
composite material
parts
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PCT/KR2018/005678
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English (en)
Korean (ko)
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김문회
Original Assignee
주식회사 아모그린텍
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Priority claimed from KR1020170127683A external-priority patent/KR20180127148A/ko
Application filed by 주식회사 아모그린텍 filed Critical 주식회사 아모그린텍
Publication of WO2018212611A1 publication Critical patent/WO2018212611A1/fr

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
    • B32B27/20—Layered products comprising a layer of synthetic resin characterised by the use of special additives using fillers, pigments, thixotroping agents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/10—Interconnection of layers at least one layer having inter-reactive properties
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/04—Carbon
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating

Definitions

  • the present invention relates to a heat dissipation composite material, and more particularly to a heat dissipation composite material and a manufacturing method thereof.
  • Heat accumulation in electronic components, lights, converter housings and other unwanted heat generating devices can shorten operating life and reduce operating efficiency.
  • a heat sink or a heat sink such as a heat sink or a heat exchanger is used together in a device that generates heat, and a heat sink or a heat sink is usually a metal which is an excellent heat conductor. come.
  • the metal has a problem of heavy weight and high production cost.
  • the present invention has been made in view of the above, the present invention is excellent in the bonding strength between the dissimilar materials, excellent thermal conductivity, heat dissipation performance and mechanical strength excellent heat dissipation composite material that can be applied to the support of the heating source, external housing and the like; It is an object to provide a method for producing the same.
  • the present invention is excellent in water resistance, heat dissipation and durability by preventing the separation or gap at the interface between dissimilar materials due to the difference in thermal expansion rate, shrinkage difference between the dissimilar materials, so that the heat dissipation performance can be fully expressed for a long time even in the outdoor environment.
  • Another object is to provide a heat dissipating composite material and a method of manufacturing the same.
  • the present invention is a polymer matrix comprising a heat dissipation filler; A metal member disposed to form at least one interface with the polymer matrix; And a thermally conductive joint interposed between the polymer matrix and the metal member and including a thermally conductive filler having an adhesive main resin and 65 to 170 parts by weight based on 100 parts by weight of the adhesive main resin.
  • a thermally conductive joint interposed between the polymer matrix and the metal member and including a thermally conductive filler having an adhesive main resin and 65 to 170 parts by weight based on 100 parts by weight of the adhesive main resin.
  • the thermally conductive filler may be included in 70 to 160 parts by weight based on 100 parts by weight of the adhesive main resin.
  • the polymer matrix may be provided with a receiving portion for accommodating at least a portion of the metal member.
  • the heat dissipation filler may include a graphite composite having nanoparticles bonded to the graphite surface and a catecholamine layer covering the nanoparticles.
  • the graphite composite may further include a polymer layer covering at least the catecholamine layer.
  • the graphite composite may have an average particle diameter of 50 ⁇ 600 ⁇ m.
  • the polymer matrix is polyamide, polyester, polyketone, liquid crystal polymer, polyolefin, polyphenylene sulfide (PPS), polyether ether ketone (PEEK), polyphenylene oxide (PPO), polyether sulfone (PES) It may include one compound selected from the group consisting of polyetherimide (PEI) and polyimide, or mixtures or copolymers of two or more thereof.
  • the metal member may include at least one metal or at least one metal selected from the group consisting of aluminum, magnesium, iron, titanium, and copper.
  • the thermally conductive junction may have a thickness of 10 ⁇ 220 ⁇ m.
  • the thermally conductive filler at least one metal selected from the group consisting of aluminum, silver, copper, nickel, gold and iron; At least one ceramic selected from the group consisting of silicon carbide, magnesium oxide, titanium dioxide, silicon dioxide, aluminum nitride, silicon nitride, boron nitride, aluminum oxide, silica, zinc oxide, barium titanate, strontium titanate, beryllium oxide and manganese oxide; And at least one carbon selected from the group consisting of graphite, graphene, carbon nanotubes, fullerene, and carbon black.
  • thermally conductive filler may be silicon carbide.
  • the thermally conductive filler may have an average particle diameter of 3 ⁇ 200 ⁇ m.
  • the thermally conductive filler may have an average particle diameter of 3 ⁇ 30 ⁇ m.
  • the present invention comprises the steps of (1) preparing a polymer matrix and a metal member comprising a heat dissipation filler; (2) treating the thermally conductive bonding composition comprising an adhesive main resin on the surface of the polymer matrix or the metal member and a thermally conductive filler having 65 to 170 parts by weight based on 100 parts by weight of the adhesive main resin, and polymer Assembling the matrix and the metal member; And (3) curing the treated thermally conductive bonding composition.
  • the thermally conductive bonding composition may include 30 to 90 parts by weight of a curing agent based on 100 parts by weight of the adhesive main resin.
  • the curing of the step (3) may be carried out at a temperature of 60 ⁇ 120 °C 0.16 ⁇ 4.5 hours.
  • the heat dissipating composite material has excellent bonding strength between dissimilar materials, excellent heat conduction performance and heat dissipation performance, and mechanical strength is secured, so that the heat dissipating composite material can be applied to a support of an heating source, an external housing, and the like.
  • the shrinkage / expansion characteristics between dissimilar materials it is possible to prevent separation, cracks, and peeling at the interface between dissimilar materials.
  • Physical and chemical stimulation of the heat dissipation performance can be expressed for a long time without deterioration in heat dissipation / mechanical strength, so that heat dissipation and mechanical strength is required, or can be widely applied even when the place of use is outdoors.
  • FIG. 1 is a cross-sectional view of a heat dissipating composite material according to the present invention
  • Figure 1a is a cross-sectional view of the heat dissipating composite material according to an embodiment of the present invention
  • Figure 1b is a cross-sectional view of a heat dissipating composite material according to another embodiment of the present invention
  • FIG. 2 is a view showing a graphite composite which is an example of a heat dissipation filler included in an embodiment of the present invention
  • FIG. 2a is a perspective view of the graphite composite
  • FIG. 2b is a sectional view taken along the line X-X 'of FIG. 2a
  • FIG 3 is a cross-sectional view of a graphite composite which is a heat radiation filler included in one embodiment of the present invention.
  • the heat dissipating composite material 1000 and 1000 ′ may include a polymer matrix 200 and 200 ′ including a heat dissipation filler 100; Metal members 300 and 300 'disposed to form at least one interface with the polymer matrix 200 and 200'; And a thermally conductive junction 400, 400 ′ interposed between the polymer matrix 200, 200 ′ and the metal member 300, 300 ′ and including an adhesive main resin 420 and a thermally conductive filler 410. Is implemented.
  • the polymer matrix 200 may include an accommodation part that may form an interface with an upper surface and both sides of the metal member 300, and the metal member 300 may accommodate the accommodation.
  • the heat dissipation composite material 1000 may be implemented in a form inserted into the portion.
  • the polymer matrix 200 ′ includes the first polymer matrix 210 a and the metal member 300 provided with an accommodating portion to form an interface with a part of both sides and an upper surface of the metal member 300 ′.
  • a second polymer matrix 210b having an accommodating portion to form an interface with the remaining portions of both sides and the lower surface of the '), and the first polymer matrix 210a in the up and down directions of the metal member 300'.
  • the second polymer matrix 210b may be assembled to implement the heat dissipation composite material 1000 '.
  • a receiving part is provided to correspond to the shape of the metal member to be provided at the central portion of the polymer matrix, and only the front and / or rear ends of the polymer matrix are opened, and the metal member is opened through the opened front and / or rear ends.
  • the interfacial formation between the polymer matrix and the metal member may be performed in various ways and shapes, such as to insert a heat dissipation composite material, and the present invention is not particularly limited thereto.
  • the polymer matrix (200, 200 ') is a form in which the heat dissipation filler 100 is dispersed in the molded polymer compound 150, and receives heat extracted from the metal member 300 or an external heat source to conduct heat to the outside and And / or perform a radiating function. Since the polymer matrix 200 and 200 ′ may be changed in thickness in consideration of the shape, size, and the like of the heat dissipating composite material 1000 and 1000 ′, the present invention is not particularly limited thereto.
  • the polymer compound 150 has good compatibility with the heat-dissipating filler 100 and the metal members 300 and 300 ', which will be described later, and is preferably a polymer compound that can be injection molded without affecting the dispersion of the heat-dissipating filler 100. If implemented, there is no limitation. As a preferred example for this, the polymer compound 150 may be a known thermoplastic polymer compound.
  • thermoplastic polymer compound is preferably polyamide, polyester, polyketone, liquid crystalline polymer, polyolefin, polyphenylene sulfide (PPS), polyether ether ketone (PEEK), polyphenylene oxide (PPO), polyether sulfone ( PES), polyetherimide (PEI) and polyimide, and a compound selected from the group consisting of two or more kinds or mixtures or copolymers.
  • the polyamide may be a known polyamide-based compound such as nylon 6, nylon 66, nylon 11, nylon 610, nylon 12, nylon 46, nylon 9T (PA-9T), kina and aramid.
  • the polyester may be a known polyester-based compound such as polyethylene terephthalate (PET), polytrimethylene terephthalate (PTT), polybutylene terephthalate (PBT), and polycarbonate.
  • PET polyethylene terephthalate
  • PTT polytrimethylene terephthalate
  • PBT polybutylene terephthalate
  • polycarbonate polycarbonate
  • the polyolefin may be a known polyolefin-based compound such as polyethylene, polypropylene, polystyrene, polyisobutylene, ethylene vinyl alcohol, and the like.
  • the liquid crystal polymer may be used without limitation in the case of a polymer showing liquid crystallinity in a solution or in a dissolved state, and may be a known kind, and thus the present invention is not particularly limited thereto.
  • the heat dissipation filler 100 may be used without limitation when the filler is formed of a material known to have thermal conductivity, and may be a metal, alloy, ceramic, and carbon-based filler.
  • the heat radiation filler 100 is at least one metal selected from the group consisting of aluminum, silver, copper, nickel, gold and iron, magnesium oxide, titanium dioxide, silicon dioxide, aluminum nitride, silicon nitride, nitride At least one ceramic selected from the group consisting of boron, aluminum oxide, silica, zinc oxide, barium titanate, strontium titanate, beryllium oxide and manganese oxide, and graphite, graphene, carbon nanotubes, fullerene and carbon black One or more of one or more carbons may be provided.
  • the heat dissipation filler 100 may be appropriately selected in consideration of required properties or heat dissipation performance of an application field of the heat dissipation composite material (1000, 1000 '), and may include a heat dissipation filler of the ceramic material if insulation is required. have.
  • the heat dissipation filler 100 may be granular, plate-like, needle-like, amorphous.
  • the heat dissipation filler 100 is preferably nanoparticles 20 and the nanoparticles 20 bonded to the graphite surface 10, as shown in Figures 2a and 2b in order to express more improved heat dissipation characteristics.
  • a graphite composite 101 having a catecholamine layer 30 coated thereon is preferably nanoparticles 20 and the nanoparticles 20 bonded to the graphite surface 10, as shown in Figures 2a and 2b in order to express more improved heat dissipation characteristics.
  • Korean application Nos. 10-2017-0051164 and 10-2017-0051169 by the applicant of the present invention are inserted by reference.
  • the graphite 10 may be of a kind known in the art, and specifically, may be natural graphite or artificial graphite of any one of impression graphite, high crystalline graphite, and earth graphite.
  • the shape of the graphite 10 may be a known shape such as spherical shape, plate shape or needle shape, or an amorphous shape, for example, may be a plate shape.
  • the graphite 10 may be a graphite of high purity having a purity of 99% or more, through which it may be advantageous to express more improved physical properties.
  • the nanoparticles 20 bonded to the surface of the graphite 10 is a medium capable of providing the catecholamine layer 30 on the graphite 10, and at the same time, the thermally conductive junction 400 described later by the graphite composite 101.
  • the polymer matrix 200 prevents the separation phenomenon of the metal member 300 from being lifted up. Perform.
  • the nanoparticles 20 may be a metal or a nonmetallic material present as a solid at room temperature.
  • Non-limiting examples thereof include alkali metals, alkaline earth metals, lanthanum groups, actinides, transition metals, transition metals, Metal, and the like.
  • the nanoparticles may be Ni, Si, Ti, Cr, Mn, Fe, Co, Cu, Sn, In, Pt, Au, Mg, and combinations thereof, preferably Cu, Ni, or Si.
  • the nanoparticles 20 may have an average particle diameter of 10 to 500nm, preferably 10 to 300nm.
  • the nanoparticles 20 is preferably in a crystallized particle state, and may be provided to occupy an area of 10 to 70%, more preferably 30 to 70% of the total surface area of each graphite 10. have.
  • the nanoparticles 20 may be provided with 5 to 70% by weight, preferably 20 to 50% by weight based on the total weight of the graphite composite 101. At this time, the nanoparticles 20 can form a stronger bond by forming a chemical bond with the graphite (10).
  • the catecholamine layer 30 provided on the surface of the nanoparticles 20 described above has excellent fluidity, dispersibility, and interfacial bonding properties between the graphite composite 101 and the polymer compound 150 in heterogeneous polymer compounds.
  • the thermally conductive joint is improved by performing a function of improving the bonding force between the graphite composite 101 and the thermally conductive joint 300 at the interface. The separation phenomenon that may occur at the interface between the 400 and the polymer matrix 200 may be further prevented.
  • the catecholamine layer 30 itself has a reducing power and at the same time, the amine functional group forms a covalent bond by Michael addition reaction to the catechol functional group on the surface of the layer, thereby making the secondary surface modification using the catecholamine layer as an adhesive material.
  • the polymer layer 40 for expressing further improved dispersibility in the polymer compound may function as a bonding material capable of introducing the graphite 10 into the graphite 10.
  • the catecholamine-based compound forming the catecholamine layer 30 has a hydroxy group (-OH) as the ortho-group of the benzene ring, and means a single molecule having various alkylamines as the para-group.
  • a hydroxy group (-OH) as the ortho-group of the benzene ring
  • various derivatives of these constructs dopamine, dopaminequinone, epinephrine, alpha-methyldopamine, norepinephrine, alpha-methyl Dopa (alphamethyldopa), droxidopa (droxidopa), indolamine (indolamine), serotonin (serotonin) or 5-hydroxy dopamine (5-Hydroxydopamine) and the like, for example, the catecholamine layer 30 is dopamine (dopamine) Layer).
  • the thickness of the catecholamine layer 30 may be 5 ⁇ 100nm, but is not limited thereto.
  • the polymer layer 40 ′ may be further coated on the catecholamine layer 30 ′ of the graphite composite 101 ′, thereby forming a matrix of the composite material due to the polymer layer 40 ′.
  • the compatibility with the polymer compound is increased, thereby further improving the fluidity, dispersibility and interfacial bonding characteristics of the heat dissipation filler.
  • the polymer layer 40 ′ may be implemented with a thermosetting polymer compound or a thermoplastic polymer compound, and specific types of the thermosetting polymer compound and the thermoplastic polymer compound may be known.
  • the thermosetting polymer compound may be one compound selected from the group consisting of epoxy, urethane, ester, and polyimide resins, or a mixture or copolymer of two or more thereof.
  • the thermoplastic polymer compound is polyamide, polyester, polyketone, liquid crystalline polymer, polyolefin, polyphenylene sulfide (PPS), polyether ether ketone (PEEK), polyphenylene oxide (PPO), polyether sulfone (PES), It may be one compound selected from the group consisting of polyetherimide (PEI) and polyimide, or mixtures or copolymers of two or more thereof.
  • the polymer layer may be a rubber elastomer including natural rubber and / or synthetic rubber and a similar material thereof.
  • the polymer layer 40 may have a thickness of 0.1 to 1000 nm.
  • the polymer layer 40 ′ may be included in an amount of 0.01 to 20 wt% based on the total weight of the graphite composite 101 ′.
  • the graphite composite may have an average particle diameter of 50 ⁇ 600 ⁇ m, preferably 100 ⁇ 550 ⁇ m.
  • the heat dissipation filler 100 may further include any one or more of graphite flake, expanded graphite and spherical graphite. These fillers, which are further included, suppress unintentional cohesion between the graphite composites 101 and 101 'due to the catecholamine layer provided in the graphite composites 101 and 101' so that the graphite composite 101 can be more dispersed in the polymer matrix 200. And further enhanced vertical and / or horizontal thermal conductivity. Any one or more of the graphite flakes, expanded graphite and spherical graphite may have an average particle diameter of 50 ⁇ 300 ⁇ m.
  • any one or more of the graphite flakes, expanded graphite and spherical graphite may be included in 5 to 200 parts by weight based on 100 parts by weight of the graphite composite. If less than 5 parts by weight of the heat dissipation filler is provided in addition to the graphite composite is less than the improvement of the heat dissipation performance according to the mixed use of the heat dissipation filler, it may be difficult to prevent the aggregation of the graphite composite, most of the heat dissipation filler There is a risk of cost increase as it should be provided with a graphite composite, it may be undesirable to reduce the weight of the composite material to be implemented.
  • the composite material may not be able to express the desired level of thermal conductivity and mechanical strength, and the interfacial bonding properties may deteriorate and the polymer matrix and the thermal conductivity may be reduced. There is a risk of causing separation between the junction 400.
  • the heat dissipation filler fluidity decreases in the manufacturing process of the polymer matrix 200, it may be concentrated in the center of the polymer matrix 200 composite rather than the surface portion thereof, and thus the radiation property of the conducted heat may be significantly reduced.
  • the polymer matrix (200,200 ') may further include other additives such as strength improver, impact improver, antioxidant, heat stabilizer, light stabilizer, plasticizer, dispersant, work improver, coupling agent, UV absorber, antistatic agent, flame retardant. have.
  • the strength improving agent can be used without limitation in the case of known components that can improve the strength of the polymer matrix (200,200 '), and as a non-limiting example, carbon fiber, glass fiber, glass beads, zirconium oxide, ulasto Consisting of nitrate, gibbsite, boehmite, magnesium aluminate, dolomite, calcium carbonate, magnesium carbonate, mica, talc, silicon carbide, kaolin, calcium sulfate, barium sulfate, silicon dioxide, ammonium hydroxide, magnesium hydroxide and aluminum hydroxide
  • One or more components selected from the group may be included as strength enhancers.
  • the strength improving agent may be included in an amount of 0.5 to 200 parts by weight based on 100 parts by weight of the heat dissipation filler, but is not limited thereto.
  • the diameter of the glass fiber may be 2 to 8 mm.
  • the impact modifier may be used without limitation in the case of known components that can improve the impact resistance by expressing the flexibility and stress relaxation of the polymer matrix (200, 200 '), for example, may be a thermoplastic resin. In addition, it may be a rubber-based resin as an example. The rubber resin may be natural rubber or synthetic rubber.
  • the synthetic rubber is styrene butadien rubber (SBR), butadiene rubber (BR), chloroprene rubber (CR), isoprene rubber (ISoprene rubber (IR), isobutene isoprene rubber (isobutene isoprene rubber) , IIR), acrylonitrile-butadiene rubber (NBR), ethylene propylene rubber (EPR), ethylene propylene diene monomer rubber, acrylic rubber, silicone rubber, fluorine It may be one or more selected from the group consisting of rubber and urethane rubber, but is not limited thereto.
  • the impact modifier may be an elastic particle of the core / shell structure.
  • the core may be an allyl-based resin
  • the shell portion may be a polymer resin having a functional group capable of reacting to increase compatibility with a thermoplastic polymer compound and increase bonding strength.
  • the impact improving agent may be included in 0.5 to 200 parts by weight based on 100 parts by weight of the heat dissipation filler is not limited thereto.
  • the antioxidant is prevented from breaking the main chain of the polymer compound, for example, the thermoplastic polymer compound to form a polymer matrix by shearing during extrusion, injection, it is provided for prevention of heat discoloration.
  • the antioxidant may be used without limitation known known antioxidants, non-limiting examples thereof include tris (nonyl phenyl) phosphite, tris (2,4-di-t-butylphenyl) phosphite, bis (2 Organic phosphites such as, 4-di-t-butylphenyl) pentaerythritol diphosphite, distearyl pentaerythritol diphosphite or the like; Alkylated monophenols or polyphenols; Alkylated reaction products of polyphenols with dienes, such as tetrakis [methylene (3,5-di-tert-butyl-4-hydroxyhydrocinnamate)] methane, or the like; Butylated reaction products of
  • thermal stabilizer may be used without limitation in the case of known thermal stabilizers, but non-limiting examples thereof include triphenyl phosphite, tris- (2,6-dimethylphenyl) phosphite, tris- (mixed mono- Organic phosphites such as tris- (mixed mono-and di-nonylphenyl) phosphate) or the like; Phosphonates such as dimethylbenzene phosphonate or the like, phosphates such as trimethyl phosphate, or else similar, or mixtures thereof.
  • the heat stabilizer may be included in an amount of 0.01 to 0.5 parts by weight based on 100 parts by weight of the polymer compound forming the polymer matrix.
  • the light stabilizer may be used without limitation in the case of known light stabilizers, but non-limiting examples thereof include 2- (2-hydroxy-5-methylphenyl) benzotriazole, 2- (2-hydroxy-5 Benzotriazoles or mixtures thereof, such as -tert-octylphenyl) -benzotriazole and 2-hydroxy-4-n-octoxybenzophenone or the like.
  • the light stabilizer may be included in an amount of 0.1 to 1.0 parts by weight based on 100 parts by weight of the polymer compound forming the polymer matrix.
  • the plasticizer may be used without limitation in the case of known plasticizers, but non-limiting examples thereof include dioctyl-4,5-epoxy-hexahydrophthalate, tris- (octoxycarbonylethyl) isocyanurate, Phthalic acid esters or mixtures thereof such as tristearin, epoxidized soybean oil or the like.
  • the plasticizer may be included in an amount of 0.5 to 3.0 parts by weight based on 100 parts by weight of the polymer compound forming the polymer matrix.
  • the antistatic agent may use a known antistatic agent without limitation, and as a non-limiting example, glycerol monostearate, sodium stearyl sulfonate, sodium dodecylbenzenesulfonate, polyether block Amides, or mixtures thereof, these include, for example, BASF under the trade name Irgastat; Arkema under the trade name PEBAX; And Sanyo Chemical Industries under the trade name Pelestat.
  • the antistatic agent may be included in an amount of 0.1 to 1.0 parts by weight based on 100 parts by weight of the polymer compound forming the polymer matrix.
  • the work improving agent may use any known work improving agent without limitation, as a non-limiting example, metal stearate, stearyl stearate, pentaerythritol tetrastearate, beeswax, montan wax (montan) wax), paraffin wax, polyethylene wax or the like or mixtures thereof.
  • the work improving agent may be included in an amount of 0.1 to 1.0 parts by weight based on 100 parts by weight of the polymer compound forming the polymer matrix.
  • UV absorber known UV absorbers can be used without limitation, non-limiting examples thereof, hydroxybenzophenone; Hydroxybenzotriazole; Hydroxybenzotriazine; Cyanoacrylate; Oxanilides; Benzoxazinones; 2- (2H-benzotriazol-2-yl) -4- (1,1,3,3, -tetramethylbutyl) -phenol; 2-hydroxy-4-n-octyloxybenzophenone; 2- [4,6-bis (2,4-dimethylphenyl) -1,3,5-triazin-2-yl] -5- (octyloxy) -phenol; 2,2 '-(1,4-phenylene) bis (4H-3,1-benzoxazine-4-one); 1,3-bis [(2-cyano-3,3-diphenylacryloyl) oxy] -2,2-bis [[(2-cyano-3,3-biphenylacryloyl) oxy] Methyl]
  • the coupling agent may use a known coupling agent without limitation, and as an example thereof, may be maleic acid grafted polypropylene.
  • the coupling agent may be included in an amount of 0.01 to 10.0 parts by weight based on 100 parts by weight of the polymer compound forming the polymer matrix.
  • the flame retardant may also be, for example, halogenated flame retardants, like tretabromo bisphenol A oligomers such as BC58 and BC52, brominated polystyrene or poly (dibromo-styrene), brominated epoxy, Decabromodiphenylene oxide, pentabrom penzyl acrylate monomer, pentabromobenzyl acrylate polymer, ethylene-bis (tetrabromophthalimide, bis (pentabromobenzyl) ethane, Mg (OH) 2 and Al ( Metal hydroxides such as OH) 3, melamine cyanurate, phosphor based FR systems such as red phosphorus, melamine polyphosphates, phosphate esters, metal phosphinates, ammonium polyphosphates, expandable graphite , Sodium or potassium perfluorobutane sulfate, sodium or potassium perfluorooctane sulfate, sodium or potassium dipe Nyl
  • the metal member 300, 300 ′ is a metal member, and serves as a housing along with a role of a heat sink that directly transfers heat extracted through a heat source to the outside or to the above-described polymer matrix 200, 200 ′. It can have a role as a support for collateral.
  • the metal members 300 and 300 ′ may be used without limitation in the case of a metal material capable of securing a predetermined thermal conductivity, mechanical strength, and the like.
  • the metal member 300 may be one metal selected from the group consisting of aluminum, magnesium, iron, titanium, and copper, or an alloy containing at least one metal.
  • the metal members 300 and 300 ′ may have any shape within a range capable of molding and manufacturing.
  • a plurality of wires or bars are spaced apart at predetermined intervals inside a bar-shaped wire having a predetermined aspect ratio, a plate-shaped shape having a predetermined width, or having a predetermined shape such as a square or a circle.
  • the honeycomb structure may have a shape having various structures in which they are combined with each other.
  • the size of the metal member 300 may be appropriately changed in consideration of the size of the desired composite radiator.
  • the thickness of the metal member 300 may also be appropriately changed in consideration of the desired strength, thermal conductivity, complexity of the shape, the thickness may be 0.5 to 90% of the total thickness of the heat dissipating composite (1000, 1000 '). . If the thickness of the metal member 300 is less than 0.5% of the total thickness of the heat dissipating composite material 1000, it may be difficult to ensure the desired level of mechanical strength, and if the thickness exceeds 90%, the desired level of heat dissipation performance. In particular, it is difficult to express the radiation characteristics, and the moldability to a complicated shape may also be lowered.
  • the present invention is not limited thereto, and the thickness of the metal member 300 may be appropriately changed in consideration of the mechanical strength required for the heat dissipating composite.
  • It may further include a microscale irregularities or protrusions.
  • the fine roughness may have a centerline average roughness (Ra) of 5 to 100 ⁇ m, more preferably 5 to 50 ⁇ m, thereby expressing more improved bonding properties and mechanical strength of the metal member 300, 300 ′. The fall can be prevented.
  • thermally conductive junctions 400 and 400 'interposed between the polymer matrix 200 and 200' and the metal members 300 and 300 ' will be described.
  • the thermally conductive junction 400, 400 ′ bonds the heterogeneous material between the polymer matrix 200, 200 ′ and the metal member 300, 300 ′ and at the same time, from one side of the polymer matrix 200, 200 ′ and the metal member 300, 300 ′. It removes the empty space of the corresponding interface between them so that it can conduct heat quickly, and it is responsible for minimizing the resistance of conducted heat by expressing excellent thermal conductivity on its own.
  • the thermally conductive junctions 400 and 400 ' are preferably configured to have similar thermal expansion coefficients as those of the metal members 300 and 300' so that the degree of shrinkage expansion according to the use temperature becomes similar between the polymer matrices 200 and 200 '. ) And the effect of minimizing the occurrence of bond breakage at the interface between the metal member (300, 300 ').
  • the thermally conductive junctions 400 and 400 ′ may include a thermally conductive filler 410 as shown in FIGS. 1A and 1B, and thermal conductivity through the thermally conductive filler 410.
  • a thermally conductive filler 410 as shown in FIGS. 1A and 1B
  • thermal conductivity through the thermally conductive filler 410 by making the thermal expansion rate of the thermally conductive joints 400 and 400 'similar to the metal members 300 and 300', cracks between the metal member and the thermally conductive joint due to thermal expansion and contraction can be prevented.
  • the thermally conductive joints 400 and 400 ′ may be formed by solidifying a thermally conductive bonding composition including an adhesive main resin 420 and a thermally conductive filler 410 through cooling or curing.
  • the adhesive main resin 420 has no problem in compatibility with the polymer compound 150 and the metal members 300 and 300 'of the polymer matrix 200 and 200' described above, and it is known that the adhesive main resin 420 can express excellent adhesion performance with each of them.
  • ingredients they can be used without limitation.
  • polyethylene, polypropylene, polystyrene, polyvinyl chloride are considered in consideration of adhesiveness, heat resistance which is not embrittled by incoming heat, insulation that is not embrittled by electrical stimulation, compatibility with mechanical strength and thermal conductive filler, and thermal conductivity.
  • Polyacrylonitrile resin acrylonitrile-butadiene-styrene (ABS), styrene-acrylonitrile (SAN), acrylic resin, methacrylic resin, polyamide, polyester, polycarbonate, polyphenyl Lensulfide, polyamideimide, polyvinylbutyral, polyvinyl formal, polyhydroxypolyether, polyether, polyphthalamide, phenoxy resin, polyurethane, nitrile butadiene resin, urea resin (UF ), Melamine-based resin (MF), unsaturated polyester resin (UP), silicone resin and one selected from the group consisting of epoxy resin, mixtures thereof or It may include a copolymer thereof. Specific types corresponding to each of the above resins may be resins known in the art, and thus the detailed description thereof will be omitted.
  • the resin when the resin is an epoxy resin, a glycidyl ether type epoxy resin, a glycidyl amine type epoxy resin, a glycidyl ester type epoxy resin, a linear aliphatic type epoxy resin, a rubber modified epoxy resin, and derivatives thereof It may include any one or more epoxy resin selected from the group.
  • the glycidyl ether type epoxy resin includes glycidyl ethers of phenols and glycidyl ethers of alcohols.
  • glycidyl ethers of the phenols bisphenol A type, bisphenol B type, bisphenol AD type, and bisphenol Bisphenol-based epoxys such as S-type, bisphenol-F and resorcinol, phenol novolac epoxy, aralkylphenol novolac, phenolic novolacs and terpene-phenol novolacs and o-cresolnovolac
  • cresol novolak-type epoxy resins such as epoxy, and these can be used individually or in combination of 2 or more types.
  • glycidyl amine type epoxy resin diglycidyl aniline, tetraglycidyl diaminodiphenylmethane, N, N, N ', N'- tetraglycidyl-m-xylylenediamine, 1 And triglycidyl-m-aminophenol and triglycidyl-p-aminophenol having both the structures of 3-bis (diglycidylaminomethyl) cyclohexane, glycidyl ether and glycidylamine, It can be used alone or in combination of two or more.
  • the glycidyl ester type epoxy resin may be an epoxy resin such as hydroxycarboxylic acid such as p-hydroxybenzoic acid or ⁇ -hydroxy naphthoic acid and polycarboxylic acid such as phthalic acid or terephthalic acid. It can be used together.
  • the rubber-modified epoxy resin is not particularly limited as long as it is an epoxy resin having rubber and / or polyether in its skeleton.
  • an epoxy resin chemically bonded to a carboxyl group-modified butadiene-acrylonitrile elastomer in a molecule ( CTBN-modified epoxy resins), acrylonitrile-butadiene rubber-modified epoxy resins (NBR-modified epoxy resins), urethane-modified epoxy resins, and silicone-modified epoxy resins such as silicone modified epoxy resins, and may be used alone or in combination of two or more. can do.
  • the thermally conductive bonding composition may further include a curing agent capable of crosslinking the adhesive main resin, and in this case, the thermally conductive bonding parts 400 and 400 'may be formed of the adhesive main resin.
  • the curing agent may be an adhesive polymer matrix including a crosslinked polymer compound.
  • the curing agent may be changed according to the specific type of the selected epoxy resin, and the specific type may use a curing agent known in the art.
  • a curing agent known in the art.
  • an acid anhydride type Preferably an acid anhydride type, an amine type, an imidazole type, a polyamide type, and a polymercaptan type.
  • anhydrides of compounds having a plurality of carboxyl groups in one molecule are preferable.
  • the acid anhydride is phthalic anhydride, trimellitic anhydride, pyromellitic anhydride, benzophenonetetracarboxylic acid, ethylene glycol bistrimellitate, glycerol tristrimellitate, maleic anhydride, tetrahydrophthalic anhydride, methyl Tetrahydrophthalic anhydride, endo methylene tetrahydro phthalic anhydride, methyl endo methylene tetrahydro phthalic anhydride, methyl butenyl tetrahydro phthalic anhydride, dodecenyl anhydrous succinic acid, hexahydro phthalic anhydride, methyl hexahydro phthalic anhydride, succinic anhydride, methylcyclohexene Dicarboxylic acid an
  • the amine system may be aromatic amines, aliphatic amines, or modified substances thereof.
  • aromatic amines for example, metaphenylenediamine, diaminodiphenylmethane, diaminodiphenylsulfone, azomethylphenol and the like may be used alone or in combination of two or more.
  • the aliphatic amines can be used alone or in combination of two or more diethylenetriamine, triethylenetetramine, for example.
  • the polyamides may be, for example, a reactant produced by condensation of a dimer acid and a polyamine having a fatty acid dimer, and may be a polyamideamine having a plurality of amino groups in a molecule and having at least one amide group.
  • the imidazole type is, for example, 2-methylimidazole, 2-ethyl-4-methylimidazole, 1-cyanoethyl-2-undecyl imidazolium trimellitate and epoxyimidazole adduct. (adduct) and the like.
  • the polymercaptan-based may be, for example, a mercaptan group is present at the end of the polypropylene glycol chain, or a mercaptan group is present at the end of the polyethylene glycol chain.
  • a known curing agent such as a phenol resin, an amino resin, a polysulfide resin or the like may be included depending on the purpose instead of or in combination with the curing agent described above.
  • the content of the curing agent may be appropriately changed in consideration of the type, equivalent, and the like of the curable resin to be selected, for example, 30 to 90 parts by weight, preferably 40 to 30, based on 100 parts by weight of the adhesive main resin. 80 parts by weight may be provided. If the curing agent is provided in less than 30 parts by weight there is a problem of uncured problems, durability degradation. In addition, when the amount of the curing agent exceeds 90 parts by weight, cracking or cracking may easily occur due to excessive curing, which may reduce durability, thermal conductivity, heat dissipation performance, and waterproof performance.
  • the thermally conductive bonding composition may further include a curing accelerator in addition to the curing agent.
  • the curing accelerator plays a role for adjusting the curing rate, the properties of the cured product, etc., and may be used by selecting a known curing accelerator according to the type of curing agent selected, and as a non-limiting example, amines, imidazoles , Organic phosphines, Lewis acid curing accelerators.
  • a polyamide-based curing agent may be used in combination with a curing accelerator of phenols and amines, for example, the addition amount may be appropriately changed in consideration of the equivalent of the epoxy resin.
  • the curing catalyst may be selected from the known curing catalyst in consideration of the type of the main resin, the type of curing agent, etc., the addition amount may be appropriately changed in consideration of the content of the main resin and the curing agent, curing conditions, etc. Is not particularly limited thereto.
  • thermally conductive joints 400 and 400 ′ may further include other additives such as antioxidants, heat stabilizers, light stabilizers, plasticizers, dispersants, work improving agents, coupling agents, UV absorbers, antistatic agents, flame retardants, and the like.
  • additives such as antioxidants, heat stabilizers, light stabilizers, plasticizers, dispersants, work improving agents, coupling agents, UV absorbers, antistatic agents, flame retardants, and the like.
  • the specific type and content of each of these additives can be used in the appropriate content of the known components in a range that does not lower the bonding performance or increase the thermal resistance, the present invention is not particularly limited thereto.
  • the thermally conductive filler 410 is to reduce the thermal resistance by the thermally conductive junction (400,400 ') to express the thermal conductivity, it can be used without limitation in the case of known thermal conductive filler, preferably insulating thermoelectric It may be a conductive filler and / or a non-insulating thermally conductive filler, more preferably a metal, alloy, ceramic and carbon-based filler.
  • the thermally conductive filler 410 is silicon carbide (SiC May be).
  • the thermally conductive filler 410 may be in the shape of granular, plate, needle, amorphous, or the like, but is not limited thereto.
  • the thermally conductive filler 410 may improve the thermal conductivity, improve the bonding strength, and reduce the thermal expansion and shrinkage difference between the metal members 300 and 300 'and the thermally conductive joints 400 and 400'. 75 to 170 parts by weight based on parts by weight, preferably 70 to 160 parts by weight. If the thermally conductive filler 410 is less than 75 parts by weight with respect to 100 parts by weight of the adhesive main resin 420, it is difficult to have a desired level of thermal conductivity. Accordingly, the heat dissipation of the heat dissipating composite due to the thermal resistance of the thermally conductive joint. Performance can be significantly reduced.
  • thermally conductive filler 410 exceeds 170 parts by weight, it may cause a decrease in the adhesive performance of the thermally conductive joint.
  • the thermally conductive filler 410 may have an average particle diameter of 3 ⁇ 200 ⁇ m, preferably an average particle diameter of 3 ⁇ 30 ⁇ m. If the average particle diameter of the thermally conductive filler 410 is less than 3 ⁇ m, as the dispersibility decreases, the thermally conductive filler 410 having a small particle size may be disposed on the surface side of the thermally conductive joints 400 and 400 ′, thereby providing a thermally conductive joint. May cause a decrease in the adhesion performance, the thermal conductivity may be lowered, and if the average particle diameter exceeds 200 ⁇ m, the thermal conductive filler 410 protruding from the surface of the thermally conductive junction 400, 400 ′ exists. It may cause a decrease in the adhesive performance of the joint.
  • the thermally conductive junctions 400 and 400 ′ may have a thickness of 10 ⁇ m to 220 ⁇ m, preferably 10 ⁇ m to 100 ⁇ m. If the thickness is less than 10 ⁇ m it may be difficult to express the desired level of adhesive performance, if the thickness exceeds 220 ⁇ m may increase the thermal resistance may lead to a decrease in the heat radiation performance of the heat dissipating composite material.
  • the thermally conductive joints 400 and 400 ′ may further include a filler to reduce a difference in thermal expansion and contraction between the thermally conductive joint and the metal member, and the filler may include 100 parts by weight of the adhesive main resin.
  • the total weight of the filler and the thermally conductive filler may be included in an amount of 65 parts by weight or more.
  • the polymer matrix 200 and 200 ′ and the metal members 300 and 300 ′ form a body of a heat dissipating composite material 1000 and 1000 ′, and a coating layer 500 and 500 on at least a portion of the body. ') May be further provided.
  • the coating layer (500, 500 ') covers the outside of the polymer matrix (200, 200') to prevent the separation of the heat dissipation filler 100 located on the surface of the polymer matrix (200, 200 '), and scratches due to physical stimulus applied to the surface Etc., and can be used in applications such as electronic devices that require insulation and heat dissipation by providing an insulation function depending on the material.
  • the coating layer (500, 500 ') is provided on the exposed surface of the metal member (300,300') to prevent scratches due to the physical stimulus applied to the surface, and provides insulation function and heat dissipation at the same time by providing an insulating function depending on the material It can also be used in applications such as electronic devices.
  • the coating layer 500, 500 ′ when the coating layer 500, 500 ′ is provided on the front surface of the body, the coating layer 500, 500 ′ may further perform a function of supplementing the bonding force between the polymer matrix 200, 200 ′ and the metal member 300, 300 ′.
  • the coating layer 500, 500 ' may be implemented by a known thermosetting polymer compound or a thermoplastic polymer compound.
  • the thermosetting polymer compound may be at least one compound selected from the group consisting of epoxy, urethane, ester, and polyimide resins, or mixtures or copolymers of two or more thereof.
  • the thermoplastic polymer compound is polyamide, polyester, polyketone, liquid crystal polymer, polyolefin, polyphenylene sulfide (PPS), polyether ether ketone (PEEK), polyphenylene oxide (PPO), polyether sulfone (PES) ), One compound selected from the group consisting of polyetherimide (PEI) and polyimide, or mixtures or copolymers of two or more thereof.
  • the coating layer (500, 500 ') may have a thickness of 0.1 ⁇ 1000 ⁇ m but is not limited thereto, and may be implemented by changing according to the purpose.
  • the heat dissipation composite material (1000, 1000 ') according to an embodiment of the present invention described above (1) preparing a polymer matrix and a metal member, each comprising a heat dissipation filler; (2) treating the thermally conductive bonding composition comprising an adhesive main resin and a thermally conductive filler on the surface of the polymer matrix or the metal member, and assembling the polymer matrix and the metal member; And (3) curing the treated thermally conductive bonding composition.
  • step (1) a polymer matrix including a heat dissipation filler and a metal member are prepared, respectively.
  • the polymer matrix 200 and 200 ′ may be formed by dissolving the melt or melt of the polymer compound 150 including the heat dissipation filler 100 into a predetermined shape.
  • a known molding method such as extrusion or injection may be employed, and a detailed description thereof will be omitted.
  • the thermally conductive bonding composition comprising an adhesive main resin and a thermally conductive filler on the surface of the polymer matrix (200,200 ') or the metal member (300,300'), and the polymer matrix (200,200 ') ) And metal members 300 and 300 '.
  • the thermally conductive bonding composition may include the components described in the above-described thermally conductive bonding parts 400 and 400 ', and may further include a solvent for dissolving and dispersing these components, and the solvent may be water or an organic solvent.
  • a known solvent can be appropriately selected.
  • the solvent may be dimethylformamide (DMF).
  • the content of the solvent may vary depending on the treatment method of the thermally conductive bonding composition, the present invention is not particularly limited thereto.
  • the treatment method may be a method of employing a known coating method or a thin coating through a spray coating method or a member such as a brush, but is not limited thereto.
  • the assembly may be a method of inserting the metal member 300 in the receiving portion of the polymer matrix 200 as shown in FIG. 1A, and in the case of FIG. 1B, the metal member 300 ′ may be inserted into the polymer matrix 200 ′. It may be coupled to be accommodated therein, in addition to this may be assembled in a variety of ways in consideration of the shape of the metal member, the shape, size, etc. of the desired heat dissipation composite material.
  • the treated thermally conductive bonding composition is cured.
  • the curing may be used without limitation as long as it is a condition commonly available in the art, preferably performed for 0.16 to 4.5 hours at a temperature of 60 to 120 °C, more preferably for 1.5 to 4 hours at a temperature of 70 to 110 °C can do. If the curing temperature is less than 60 °C or the curing time is less than 0.16 hours, the adhesive strength may be lowered as there is an uncured portion or the solvent may remain in the formed thermally conductive junction, the curing temperature exceeds 120 °C Alternatively, when the curing time exceeds 4.5 hours, the polymer matrix may be peeled and / or warped, thereby causing peeling between the polymer matrix and the metal member.
  • the heat dissipating composite material and its manufacturing method according to the present invention is excellent in bonding strength between different materials, excellent thermal conductivity and heat dissipation performance, and at the same time secured mechanical strength can be applied as a support, an external housing, etc. of a heating source.
  • Physical and chemical stimulation of the heat dissipation performance can be expressed for a long time without deterioration in heat dissipation / mechanical strength, so that heat dissipation and mechanical strength is required, or can be widely applied even when the place of use is outdoors.
  • a polymer matrix composition including polyamide-6, which is a thermoplastic polymer, as a polymer compound and 50 parts by weight of a heat dissipation filler, which is the graphite composite is prepared based on 100 parts by weight of the polymer compound.
  • a polymer matrix composition including polyamide-6, which is a thermoplastic polymer, as a polymer compound and 50 parts by weight of a heat dissipation filler, which is the graphite composite is prepared based on 100 parts by weight of the polymer compound.
  • a polymer matrix having a structure as shown in Figure 1 by injecting a masterbatch manufactured using a conventional injection device to have a receiving portion of 12cm wide, 6cm long and 1.5mm
  • the thermally conductive bonding composition is spray-coated with the thermally conductive bonding composition in a region where the metal member is in contact with the polymer matrix of an aluminum plate having a width of 12 cm, a length of 6 cm, and a thickness of 1.5 mm, and then the thermally conductive bonding composition prepared with the polymer matrix.
  • the spray-coated metal member was assembled into a structure as shown in FIG. 1, and heat-treated at a temperature of 90 ° C. for 3 hours to cure the thermally conductive bonding composition to prepare a heat dissipating composite.
  • the average thickness of the polymer matrix surrounding the metal member of the produced heat dissipating composite was 3 mm, and the thickness of the formed thermally conductive joint was 15 ⁇ m.
  • Example 2 Manufactured in the same manner as in Example 1, the content of the thermally conductive fillers, average particle diameter, inclusion, type, thickness and inclusion of the thermally conductive junction as shown in Table 1 to Table 3 by changing the table 1 to Table 4 A heat dissipating composite such as was prepared.
  • the heat dissipating composite material was prepared by joining a metal member having a width, length, and height of 40 mm ⁇ 77 mm ⁇ 1 mm, and a polymer matrix having a width, length, and height of 40 mm ⁇ 77 mm ⁇ 2 mm with a thermally conductive adhesive.
  • the metal matrix was placed under the metal matrix, and the planar heating element was attached to the lower part and heat was generated by applying a current of 350 mA. After maintaining for 60 minutes, the heat radiation performance was evaluated by measuring the temperature of the planar heating element.
  • high measurement temperature means that the heat dissipation performance is not good
  • low measurement temperature means that the heat dissipation performance is excellent
  • Crosscutting was performed with a knife so as to be 1 mm apart with respect to the specimen. After attaching the scotch tape to the cut surface and pulled at an angle of 60 ° to check the state of the polymer matrix peeled off.
  • the area of the polymer matrix peeled off the surface of the specimen was calculated, and the peeled area was expressed as a percentage. Specifically, in the case of 0%, there is no peeling, and in the case of 100%, all means peeling.
  • the surface state of the heat dissipating composite material was visually evaluated after 480 hours. As a result of the evaluation, cracks in the polymer matrix and the presence or absence of delamination (lifting) were confirmed.
  • Example 2 Example 3
  • Example 4 Example 5
  • Thermal conductive filler Content (parts by weight) 115 70 160 115 115 115 115 Average particle size ( ⁇ m) 5 5 5
  • One 12 25 kindss SiC SiC SiC SiC SiC SiC Thermally conductive junctions Thickness ( ⁇ m) 15 15 15 15 50 75
  • Heat dissipation performance (°C) 66.0 68.8 65.4 86.4 69.2 65.8 Interfacial Adhesion Performance (%) 29 28 34 68 27
  • Waterproof ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ durability ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇
  • Example 7 Example 8
  • Example 9 Example 10
  • Example 11 Thermal conductive filler Content (parts by weight) 115 115 115 115 115 115 115 115 115 Average particle size ( ⁇ m) 35 150 250 5 5 5 Kinds SiC Graphene Graphene SiC SiC SiC Thermally conductive junctions Thickness ( ⁇ m) 100 180 300 8 50 100 Heat dissipation performance (°C) 65.8 71.0 76.2 71.6 68.7 68.4 Interfacial Adhesion Performance (%) 47 54 80 70 28 28 Waterproof ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ durability ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇
  • Example 16 Thermal conductive filler Content (parts by weight) 115 115 115 115 115 115 Average particle size ( ⁇ m) 5 5 5 5 5 Kinds SiC SiC Al 2 O 3 ZrO 2 Thermally conductive junctions Thickness ( ⁇ m) 150 250 15 15 Heat dissipation performance (°C) 77.5 84.2 75.8 85.6 Interfacial Adhesion Performance (%) 28 27 30 32 Waterproof ⁇ ⁇ ⁇ ⁇ durability ⁇ ⁇ ⁇ ⁇ ⁇
  • Examples 1 to 3, 5 to satisfy the content, average particle diameter, inclusion, type, thickness and inclusion of the thermally conductive junction of the thermally conductive filler according to the present invention 8, 11 to 13 and 15 are all excellent at the same time excellent heat dissipation performance, interfacial adhesion between the heterogeneous, waterproof and durability compared to Examples 4, 9, 10, 14, 16 and Comparative Examples 1 to 4, which any one of them is missing. You can see that.

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Abstract

L'invention concerne un composite de dissipation de chaleur et son procédé de fabrication. Le composite de dissipation de chaleur, selon un mode de réalisation de la présente invention, comprend : une matrice polymère comprenant une charge de dissipation de chaleur ; un élément métallique agencé de façon à former au moins une interface avec la matrice polymère ; et une partie de liaison thermoconductrice intercalée entre la matrice polymère et l'élément métallique, et comprenant une résine de base adhésive, et 65-170 parties en poids d'une charge thermoconductrice par rapport à 100 parties en poids de la résine de base adhésive. Par conséquent, le composite de dissipation de chaleur, selon la présente invention, présente une excellente force de liaison entre des matériaux dissemblables, présente d'excellentes performances de conduction thermique et de dissipation de chaleur, et présente par ailleurs une résistance mécanique garantie, et peut ainsi être appliqué sous la forme d'un support de source de chauffage et d'un boîtier externe. En outre, des propriétés de contraction/expansion entre les matériaux dissemblables peuvent être commandées même lorsque le chauffage et le refroidissement sont répétés, grâce à quoi un espacement, un craquage et un pelage au niveau de l'interface entre les matériaux dissemblables liés peuvent être empêchés, et ainsi le composite de dissipation de chaleur présente une excellente étanchéité à l'eau et une excellente durabilité, et peut donc présenter des performances de dissipation de chaleur pendant une longue durée sans dégradation de la dissipation de chaleur/résistance mécanique même sous des stimuli physiques/chimiques tels que l'humidité, la chaleur extérieures, etc., et peut ainsi être largement appliqué lorsque la dissipation de chaleur et la résistance mécanique sont requises, ou même lorsque l'emplacement d'utilisation est à l'extérieur.
PCT/KR2018/005678 2017-05-18 2018-05-17 Composite de dissipation de chaleur et son procédé de fabrication WO2018212611A1 (fr)

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CN115820183A (zh) * 2022-12-23 2023-03-21 深圳市道尔科技有限公司 一种耐高温高强度、高导热胶的制备方法
CN115820183B (zh) * 2022-12-23 2023-06-27 深圳市道尔科技有限公司 一种耐高温高强度、高导热胶的制备方法

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