WO2016152932A1 - ガラス基板の製造方法 - Google Patents

ガラス基板の製造方法 Download PDF

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Publication number
WO2016152932A1
WO2016152932A1 PCT/JP2016/059251 JP2016059251W WO2016152932A1 WO 2016152932 A1 WO2016152932 A1 WO 2016152932A1 JP 2016059251 W JP2016059251 W JP 2016059251W WO 2016152932 A1 WO2016152932 A1 WO 2016152932A1
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WIPO (PCT)
Prior art keywords
glass substrate
face
cut
glass
manufacturing
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PCT/JP2016/059251
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English (en)
French (fr)
Japanese (ja)
Inventor
修 猪飼
小林　健二
Original Assignee
ＡｖａｎＳｔｒａｔｅ株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
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Application filed by ＡｖａｎＳｔｒａｔｅ株式会社 filed Critical ＡｖａｎＳｔｒａｔｅ株式会社
Priority to KR1020167010490A priority Critical patent/KR101909797B1/ko
Priority to CN201680000366.6A priority patent/CN106795042B/zh
Priority to JP2016524607A priority patent/JP6368364B2/ja
Publication of WO2016152932A1 publication Critical patent/WO2016152932A1/ja

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • B08B3/08—Cleaning involving contact with liquid the liquid having chemical or dissolving effect
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
    • B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
    • B24B7/24—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding or polishing glass
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B9/00—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B9/00—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
    • B24B9/02—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground
    • B24B9/06—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain
    • B24B9/08—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of glass
    • B24B9/10—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of glass of plate glass
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C15/00—Surface treatment of glass, not in the form of fibres or filaments, by etching
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C19/00—Surface treatment of glass, not in the form of fibres or filaments, by mechanical means
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C23/00—Other surface treatment of glass not in the form of fibres or filaments
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P40/00—Technologies relating to the processing of minerals
    • Y02P40/50—Glass production, e.g. reusing waste heat during processing or shaping
    • Y02P40/57—Improving the yield, e-g- reduction of reject rates

Definitions

  • the present invention relates to a method for manufacturing a glass substrate.
  • Glass substrates used for flat panel displays such as liquid crystal displays and plasma displays are required to have high flatness on the surface.
  • a glass substrate is manufactured by the overflow down draw method.
  • the overflow downdraw method as described in Patent Document 1 (US Pat. No. 3,338,696), molten glass that has been poured into the groove on the upper surface of the molded body and overflowed from the groove is A glass ribbon is formed by flowing down along both side surfaces and joining at the lower end of the formed body. The formed glass ribbon is gradually cooled while being pulled downward. The cooled glass ribbon is cut into a predetermined dimension to obtain a glass substrate.
  • end face processing for grinding and polishing the cut surface of the glass substrate is performed.
  • cullet which is a minute piece of glass, may be generated from the end face and adhere to the surface of the glass substrate. Since the cullet attached to the surface of the glass substrate causes disconnection and peeling of the TFT wiring formed on the surface, it is preferably removed from the surface as much as possible.
  • Patent Document 2 Japanese Patent Application Laid-Open No. 2008-87135
  • cullet generated during end face processing adheres to the glass substrate surface by spraying water in the form of a curtain from the center of the surface of the glass substrate toward the end face side. A method of suppressing this is disclosed.
  • the adhesion of cullet to the surface in the vicinity of the end face is suppressed, but the adhesion of cullet to the center of the surface may not be sufficiently suppressed.
  • the end surface of the glass substrate may vibrate during end surface processing, and the accuracy of end surface processing may be reduced.
  • glass substrates have become larger and thinner, and large glass substrates having a side dimension exceeding 2000 mm have been manufactured as glass substrates for high-definition displays. Since the TFT wiring electrode pattern that is finer and denser than the conventional pattern is formed on the surface of the glass substrate for high-definition displays, it is a microscopic level that has not been regarded as a problem with conventional glass substrates for displays. Even if a cullet is attached to the surface, there is a possibility that a problem occurs in the quality of the product. Further, in the manufacturing process of a large glass substrate, it is necessary to process the end surface of the glass substrate at a high speed in order to improve productivity. Therefore, cullet is easily generated and scattered during the end surface processing. As described above, since the surface of a large glass substrate for high-definition displays is required to have high cleanliness, a method for efficiently removing cullet attached to the surface of the glass substrate in the glass substrate manufacturing process is required. ing.
  • an object of the present invention is to provide a method for producing a glass substrate that can efficiently improve the cleanliness of the surface of the glass substrate.
  • the method for producing a glass substrate according to the present invention includes a cutting step for cutting a glass substrate, an end face processing step for processing a cut end surface that is a cut surface of the glass substrate cut in the cutting step, and a glass cut in the cutting step.
  • a surface treatment process for treating the main surface of the substrate In the end face processing step, the shape of the cut end face is processed while supplying a grinding liquid to the cut end face.
  • an alkaline liquid having a pH of less than 10 is applied to the main surface, and is performed simultaneously with the end face processing step.
  • the alkaline liquid agent preferably contains a surfactant.
  • the grinding liquid is an alkaline liquid and the content of the surfactant is adjusted so as to have a surface tension of 30 mN / m to 50 mN / m at 20 ° C.
  • the manufacturing method of a glass substrate further includes the washing
  • the glass substrate is preferably aluminosilicate glass or alkali aluminosilicate glass containing SiO 2 in an amount of 50 to 70% by mass and Al 2 O 3 in an amount of 10 to 25% by mass.
  • the glass substrate is preferably manufactured by an overflow down draw method.
  • the glass substrate is preferably a display glass substrate having a pair of main surfaces, which are an element formation surface and a roughened surface.
  • the roughened surface is preferably roughened by wet etching so that the arithmetic average roughness Ra becomes 0.3 nm to 0.7 nm.
  • the method for producing a glass substrate according to the present invention can efficiently improve the cleanliness of the surface of the glass substrate.
  • the glass substrate 10 manufactured by the manufacturing method of the glass substrate of this embodiment is used for manufacture of flat panel displays (FPD), such as a liquid crystal display, a plasma display, and an organic EL display.
  • the glass substrate 10 is also used for manufacturing a solar cell panel.
  • the glass substrate 10 has, for example, a thickness of 0.1 mm to 1.1 mm and a size of 360 mm to 3000 mm and 460 mm to 3200 mm.
  • FIG. 1 is a cross-sectional view of the glass substrate 10.
  • the glass substrate 10 has an element forming surface 12 that is one main surface and a roughened surface 14 that is the other main surface.
  • the element formation surface 12 is a surface on which a semiconductor element such as a TFT is formed in the FPD manufacturing process.
  • the element formation surface 12 is a surface on which, for example, a low-temperature polysilicon semiconductor or an oxide semiconductor is formed, and a low-temperature polysilicon thin film, an ITO (Indium Thin Oxide) thin film, and a multi-layer thin film made of a color filter or the like are formed. It is the surface to be done.
  • the thickness of the gate insulating film of the TFT is less than 100 nm.
  • the thickness of the gate insulating film is less than 50 nm.
  • the element formation surface 12 is an extremely smooth surface having Ra (arithmetic mean roughness: JIS B 0601: 2001) of 0.2 nm or less.
  • the glass substrate 10 on which the TFT is formed on the element formation surface 12 preferably has a circuit in which the minimum line width of the wiring is less than 4 ⁇ m and the thickness of the gate insulating film is less than 100 nm.
  • the material of the electrode used for the TFT panel is a Cu-based material such as Ti—Cu and Mo—Cu.
  • the roughened surface 14 is a surface on which minute irregularities are formed by an etching process in the manufacturing process of the glass substrate 10.
  • the roughened surface 14 is roughened so that the arithmetic average roughness Ra is 0.3 nm to 0.7 nm.
  • the etching process is, for example, a dry etching process or a wet etching process.
  • corrugation may be formed by surface treatments other than an etching process.
  • the roughened surface 14 may have irregularities formed by physical polishing such as tape polishing, brush polishing, pad polishing, abrasive polishing, and CMP (Chemical Mechanical Polishing).
  • the glass used for the glass substrate 10 is an aluminosilicate glass or an alkali aluminosilicate glass having the following composition.
  • the glass having the above composition is allowed to contain other trace components in the range of less than 0.1% by mass.
  • FIG. 2 is an example of a flowchart showing a manufacturing process of the glass substrate 10.
  • the manufacturing process of the glass substrate 10 mainly includes a forming process (step S1), a slow cooling process (step 2), a plate-making process (step S3), a cutting process (step S4), and an end face processing process (step S5). ), A surface treatment process (step S6), a roughening process (step S7), a cleaning process (step S8), an inspection process (step S9), and a packing process (step S10).
  • a sheet-like glass ribbon is formed from a molten glass obtained by heating a glass raw material by an overflow down draw method. Specifically, the glass ribbon overflowing from the upper part of the molding cell flows downward along both side surfaces of the molding cell and joins at the lower end of the molding cell, whereby the glass ribbon is continuously molded.
  • the molten glass is cooled to a temperature suitable for molding by the overflow downdraw method, for example, 1200 ° C. before flowing into the molding step S1.
  • the glass ribbon molded in the molding step S1 is gradually cooled to a glass annealing point or lower while the temperature is controlled so that distortion and warpage do not occur.
  • the glass ribbon is cooled while being conveyed downward.
  • the glass ribbon slowly cooled in the slow-cooling step S2 is cut for each predetermined length, and the end region is further cut to obtain a base plate glass.
  • the end regions are formed at both ends in the width direction of the glass ribbon and are thicker than the central region in the width direction of the glass ribbon.
  • the base glass obtained by the plate-drawing step S3 is alternately laminated together with the interleaving paper, and is conveyed to the cutting step S4.
  • the base glass obtained in the plate-drawing step S3 is cut into a predetermined size to obtain a glass substrate 10 having a product size.
  • the base glass is cut using, for example, a laser.
  • the end face processing step S5 mainly includes a grinding step and a polishing step.
  • the grinding process is a process of grinding the cut end face 16 while supplying the grinding liquid to the cut end face 16 to process the cut end face 16 into an R shape.
  • FIG. 3 is a cross-sectional view of the glass substrate 10 having the cut end face 16 ground in the grinding process.
  • the polishing step is a step of polishing the cut end surface 16 so that the arithmetic average roughness Ra of the cut end surface 16 ground in the grinding step is 0.1 ⁇ m or less.
  • the element formation surface 12 is subjected to a surface treatment by applying an alkaline liquid having a pH of less than 10 to the element formation surface 12 of the glass substrate 10 obtained in the cutting step S4.
  • the surface treatment step S6 is performed simultaneously with the end face processing step S5. Specifically, the step of applying the alkaline liquid agent to the element forming surface 12 in the surface treatment step S6 and the grinding step of grinding the cut end surface 16 using the grinding liquid in the end surface processing step S5 are simultaneously performed.
  • the alkaline liquid applied to the element forming surface 12 is removed after the grinding step of the end face processing step S5 is completed.
  • a surface treatment is performed to increase the surface roughness of the roughened surface 14 of the glass substrate 10 that has undergone the end face processing step S5 and the surface treatment step S6.
  • the surface treatment performed in the roughening step S7 is, for example, a wet etching process.
  • the glass substrate 10 that has undergone the roughening step S7 is cleaned with a cleaning liquid.
  • the cleaning liquid is a liquid agent different from the alkaline liquid agent used in the surface treatment step S6.
  • the glass substrate 10 cleaned in the cleaning step S8 is inspected.
  • the main surface of the glass substrate 10 is optically measured to detect a defect in the glass substrate 10.
  • the defects of the glass substrate 10 include, for example, striae formed on the main surface of the glass substrate 10, scratches and cracks existing on the main surface of the glass substrate 10, foreign matters attached to the main surface of the glass substrate 10, and These are minute bubbles or the like existing inside the glass substrate 10.
  • the glass substrate 10 that has passed the inspection in the inspection step S9 is alternately stacked on a pallet and packed with a slip sheet for protecting the glass substrate 10.
  • the packed glass substrate 10 is shipped to an FPD manufacturer or the like.
  • the FPD manufacturer manufactures FPDs by forming semiconductor elements such as TFTs on the element forming surface 12 of the glass substrate 10.
  • the surface treatment of the element forming surface 12 performed in the surface treatment step S6 will be described.
  • an alkaline liquid agent is applied to the element formation surface 12.
  • the alkaline solution is a solution having a pH of less than 10 and a solution containing a surfactant.
  • the pH of the alkaline solution is preferably 8-9.
  • An alkaline liquid agent is ammonia water, for example.
  • the alkaline solution may be an amine solution such as triethanolamine.
  • the surfactant is, for example, a nonionic surfactant.
  • FIG. 4 is a plan view of the glass substrate 10 on the element forming surface 12 side.
  • an alkaline liquid agent is applied to at least the central region 12a of the element forming surface 12.
  • the central region 12 a is a quadrangular region excluding an end portion around the element forming surface 12.
  • the distance L between the end of the central region 12a and the end of the element formation surface 12 is 2 mm to 20 mm.
  • the alkaline liquid applied to the element forming surface 12 is removed after the grinding process of the end face processing step S5 is completed.
  • the alkaline liquid agent adhering to the element forming surface 12 may be removed from the element forming surface 12 by spraying a fluid onto the element forming surface 12.
  • the alkaline liquid agent may be removed from the element forming surface 12 by spraying pure water from the nozzle toward the element forming surface 12 at a predetermined pressure.
  • the alkaline liquid agent may be removed from the element forming surface 12 by cleaning the element forming surface 12 with a brush. In any case, it is preferable to prevent the element forming surface 12 from drying by removing the alkaline liquid agent from the element forming surface 12 and then showering the element forming surface 12 with pure water.
  • the alkaline liquid agent removed from the element forming surface 12 is collected.
  • the recovered alkaline solution may be reused after passing through a filter and removing foreign substances contained in the alkaline solution.
  • the grinding wheel is molded with a metal bond grindstone.
  • a metal bond grindstone is a grindstone manufactured by fixing multiple types of metal powders or alloy powders with an iron-based or copper-based binder and sintering them, and then fixing the abrasive grains on the surface of the sintered body. It is.
  • the abrasive grains are fine grains such as diamond, aluminum oxide and silicon carbide.
  • the grain size of the abrasive grains of the grinding wheel is preferably # 500 to # 600.
  • the grinding wheel is driven to rotate around the rotation axis by an electric motor.
  • the cutting end face 16 is ground by the grinding wheel while supplying the grinding liquid to the cutting end face 16 of the glass substrate 10. Frictional heat is generated in a region where the cut end surface 16 of the glass substrate 10 and the rotating grinding wheel are in contact with each other. The frictional heat causes the glass substrate 10 to be altered by heating the cut end face 16.
  • the grinding fluid functions as a coolant that suppresses heating of the cut end face 16.
  • the same liquid as the alkaline liquid used in the surface treatment step S6 is used as the grinding liquid.
  • the grinding fluid is alkaline
  • the grinding fluid easily penetrates into the gap between the cut end face 16 and the grinding wheel, so that the cooling effect of the grinding fluid is improved.
  • the grinding fluid contains a surfactant
  • the surface tension of the grinding fluid is lowered, so that the permeability of the grinding fluid is increased and the cooling effect of the grinding fluid is further improved.
  • the content of the surfactant is preferably adjusted so that the grinding fluid has a surface tension of 30 mN / m to 50 mN / m at 20 ° C.
  • the content of the surfactant is adjusted so that the grinding liquid has a surface tension of 30 mN / m or more and less than 48 mN / m at 20 ° C.
  • a semiconductor element such as a TFT, specifically, a multi-layer thin film composed of a polysilicon thin film, an ITO thin film, etc. Is formed.
  • a wiring electrode of a semiconductor element is formed on the element formation surface 12, if foreign matter adheres to the element formation surface 12, the wiring electrode formed on the element formation surface 12 may be disconnected or peeled off. Therefore, in the manufacturing process of the glass substrate 10, it is preferable to remove foreign substances from the element forming surface 12 as much as possible.
  • a typical example of the foreign material is cullet, which is a small piece of glass.
  • the cullet is generated mainly from the cut surface that becomes the cut end surface 16 of the glass substrate 10 when the glass ribbon is cut in the plate-drawing step S3 and the cutting step S4.
  • a part of the cullet generated from the cut end face 16 adheres to the element forming surface 12 of the glass substrate 10.
  • the height of the cullet adhering to the element forming surface 12 is higher, the formation defect of the wiring electrode of the semiconductor element is more likely to occur.
  • Examples of other foreign substances include dust, dust, and organic substances present in the atmosphere.
  • an alkaline liquid agent is applied to the element forming surface 12 in the surface treatment step S6 in order to remove foreign matters attached to the element forming surface 12 of the glass substrate 10.
  • the pH of the alkaline solution is less than 10.
  • the glass substrate 10 is made of aluminosilicate glass or alkali aluminosilicate glass.
  • the main components of the glass composition of the glass substrate 10 are SiO 2 and Al 2 O 3 . Therefore, the cullet generated from the cut end face 16 of the glass substrate 10 is mainly composed of SiO 2 and Al 2 O 3 . In particular, the proportion of SiO 2 in the glass composition of cullet is large.
  • FIG. 5 is a graph showing the pH dependence of the zeta potential (electrokinetic potential) of SiO 2 and Al 2 O 3 which are the main components of cullet.
  • the vertical axis represents zeta potential (unit: mV)
  • the horizontal axis represents pH.
  • the zeta potential of SiO 2 and Al 2 O 3 decreases with increasing pH.
  • the zeta potential of SiO 2 greatly decreases at pH 5 to 6, and becomes a substantially constant negative value ( ⁇ 40 mV) above pH 6.
  • the zeta potential of SiO 2 becomes substantially constant at pH 6 or higher.
  • the grinding liquid is preferably alkaline from the viewpoint of the permeability of the grinding liquid.
  • the pH of the grinding fluid is preferably less than 10 and more preferably 8-9.
  • coated to the element formation surface 12 is also alkaline.
  • the zeta potential of Al 2 O 3 which is one of the main components of cullet becomes a negative value at pH 8 or higher. Therefore, in order to peel the cullet mainly composed of Al 2 O 3 from the element forming surface 12, the pH of the alkaline liquid applied to the element forming surface 12 is preferably 8-9.
  • the alkaline solution contains a surfactant.
  • the surfactant has an effect of separating and removing foreign matters other than cullet such as dust, dust and organic matter adhering to the element forming surface 12 from the element forming surface 12.
  • the alkaline liquid applied to the element forming surface 12 is removed by a brush or the like after the end face processing step S5 and the surface treatment step S6 are completed.
  • the cleaning liquid used for cleaning the glass substrate 10 in the cleaning step S8 is a liquid agent different from the alkaline liquid agent used in the surface treatment step S6. Therefore, in order to prevent the influence on the post-process, the alkaline liquid applied to the element formation surface 12 is removed from the element formation surface 12 as much as possible after the end face processing step S5 and before the start of the post-process. It is preferable to keep it.
  • the roughened surface 14 which is the main surface opposite to the element forming surface 12
  • an acidic liquid agent it adheres to the roughened surface 14.
  • the alkaline liquid agent is preferably removed with pure water.
  • the glass substrate manufacturing method according to the present embodiment can efficiently remove the cullet adhering to the element forming surface 12 by applying an alkaline liquid agent to the element forming surface 12. Therefore, in the process of manufacturing the FPD from the glass substrate 10, the occurrence of defects such as breakage and disconnection of the Cu-based wiring electrode of the semiconductor element formed on the element forming surface 12 is suppressed.
  • glass substrates have become larger and thinner, and large glass substrates having a side dimension exceeding 2000 mm have been manufactured as glass substrates for high-definition displays. Since wiring electrodes with finer and higher density than the conventional wiring electrodes are formed on the surface of a glass substrate for high-definition displays, there is a small cullet at a level that was not regarded as a problem with conventional glass substrates for displays. Even if it adheres to the surface, there may be a problem in the quality of the product. Moreover, in the manufacturing process of a large glass substrate, it is necessary to process the end surface of the glass substrate at a high speed in order to improve productivity, so that cullet is likely to occur during the end surface processing.
  • the glass substrate 10 is large sized by the process of apply
  • adhesion of the cullet to the element formation surface 12 can be suppressed. Even when adhering, cullet can be efficiently removed. Further, negatively charging the element formation surface 12 and the cullet suppresses adhesion of the cullet to the element formation surface 12, and reduces the amount of cullet adhesion to the element formation surface 12 even with a small cullet. it can. Even when the cullet adheres to the element forming surface 12, the cullet can be removed in the cleaning step S8 in a later step.
  • the glass substrate manufacturing method of the present embodiment can efficiently remove minute cullet and glass particles at a level that has not been regarded as a problem in the conventional display glass substrate from the element forming surface 12. Furthermore, in the surface treatment step S6, by using an alkaline liquid agent containing a surfactant, organic substances attached to the element formation surface 12 can also be removed.
  • an alkaline liquid agent is applied to the element formation surface 12 of the glass substrate 10.
  • an alkaline liquid agent may be applied to the roughened surface 14 of the glass substrate 10.
  • the cullet attached to the roughened surface 14 is removed.
  • the glass substrate 10 may be immersed in the alkaline solution.
  • the arithmetic average roughness Ra of the central region of the roughened surface 14 can be set within a range of 0.4 nm to 0.6 nm.
  • the central region of the roughened surface 14 is a region opposite to the central region 12 a of the element forming surface 12.
  • the roughening process of the roughened surface 14 is performed by the wet etching process using an acidic liquid agent.
  • the temperature of the acidic liquid applied to the roughened surface 14 is such that the temperature of the glass substrate 10 rises and the element forming surface 12 of the glass substrate 10 does not dry. It is preferable that it is 50 degrees C or less, and it is more preferable that it is 30 degrees C or less.
  • the grinding process of the end face processing step S5 of the present embodiment is a process of grinding the cut end face 16 while supplying the grinding liquid to the cut end face 16 to process the cut end face 16 into an R shape.
  • the same liquid as the alkaline liquid used in the surface treatment step S6 is used as the grinding liquid.
  • the grinding fluid may be a liquid different from the alkaline liquid used in the surface treatment step S6. For example, pure water may be used as the grinding fluid.

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Mechanical Engineering (AREA)
  • Organic Chemistry (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Materials Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Surface Treatment Of Glass (AREA)
  • Liquid Crystal (AREA)
  • Glass Compositions (AREA)
  • Cleaning By Liquid Or Steam (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
PCT/JP2016/059251 2015-03-24 2016-03-23 ガラス基板の製造方法 WO2016152932A1 (ja)

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Application Number Priority Date Filing Date Title
KR1020167010490A KR101909797B1 (ko) 2015-03-24 2016-03-23 유리 기판의 제조 방법
CN201680000366.6A CN106795042B (zh) 2015-03-24 2016-03-23 玻璃基板的制造方法
JP2016524607A JP6368364B2 (ja) 2015-03-24 2016-03-23 ガラス基板の製造方法

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JP2015061226 2015-03-24
JP2015-061226 2015-03-24

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KR (1) KR101909797B1 (zh)
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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111606353A (zh) * 2020-06-03 2020-09-01 福建阿石创新材料股份有限公司 一种从ito靶材磨削废液中回收ito粉末的方法

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001276759A (ja) * 2000-03-30 2001-10-09 Hitachi Plant Eng & Constr Co Ltd ガラス基板の洗浄液及び洗浄方法
JP2006527477A (ja) * 2003-06-06 2006-11-30 エグシル テクノロジー リミテッド 界面活性剤膜を用いるレーザ切削加工
WO2008004470A1 (fr) * 2006-07-03 2008-01-10 Konica Minolta Opto, Inc. Procédé de fabrication d'un substrat de verre pour support d'enregistrement d'informations
JP2009046353A (ja) * 2007-08-21 2009-03-05 Neos Co Ltd ガラス加工時のガラス表面への切り屑付着防止方法
JP2010215472A (ja) * 2009-03-18 2010-09-30 Nippon Electric Glass Co Ltd ガラス板の加工方法および加工装置
JP2012171831A (ja) * 2011-02-21 2012-09-10 Avanstrate Inc ガラス基板の製造方法およびガラス基板
JP2013193892A (ja) * 2012-03-16 2013-09-30 Avanstrate Inc ガラス板の製造方法
JP2014052622A (ja) * 2012-08-06 2014-03-20 Avanstrate Korea Inc カラーフィルタ用ガラスシートの製造方法、カラーフィルタパネルの製造方法、および、ディスプレイ用ガラス基板

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3338696A (en) 1964-05-06 1967-08-29 Corning Glass Works Sheet forming apparatus
EP0692318B1 (en) * 1994-06-28 2001-09-12 Ebara Corporation Method of and apparatus for cleaning workpiece
JP2008087135A (ja) 2006-10-04 2008-04-17 Nippon Electric Glass Co Ltd ガラス基板の端面研削装置およびその端面研削方法
US20090258187A1 (en) * 2008-04-10 2009-10-15 Michael Donavon Brady Protective coating for glass manufacturing and processing into articles
KR101522452B1 (ko) * 2012-04-17 2015-05-21 아반스트레이트 가부시키가이샤 디스플레이용 글래스 기판의 제조 방법, 글래스 기판 및 디스플레이용 패널
JP6352754B2 (ja) * 2014-09-29 2018-07-04 ＡｖａｎＳｔｒａｔｅ株式会社 ガラス基板の製造方法、および、ガラス基板の製造装置

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001276759A (ja) * 2000-03-30 2001-10-09 Hitachi Plant Eng & Constr Co Ltd ガラス基板の洗浄液及び洗浄方法
JP2006527477A (ja) * 2003-06-06 2006-11-30 エグシル テクノロジー リミテッド 界面活性剤膜を用いるレーザ切削加工
WO2008004470A1 (fr) * 2006-07-03 2008-01-10 Konica Minolta Opto, Inc. Procédé de fabrication d'un substrat de verre pour support d'enregistrement d'informations
JP2009046353A (ja) * 2007-08-21 2009-03-05 Neos Co Ltd ガラス加工時のガラス表面への切り屑付着防止方法
JP2010215472A (ja) * 2009-03-18 2010-09-30 Nippon Electric Glass Co Ltd ガラス板の加工方法および加工装置
JP2012171831A (ja) * 2011-02-21 2012-09-10 Avanstrate Inc ガラス基板の製造方法およびガラス基板
JP2013193892A (ja) * 2012-03-16 2013-09-30 Avanstrate Inc ガラス板の製造方法
JP2014052622A (ja) * 2012-08-06 2014-03-20 Avanstrate Korea Inc カラーフィルタ用ガラスシートの製造方法、カラーフィルタパネルの製造方法、および、ディスプレイ用ガラス基板

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111606353A (zh) * 2020-06-03 2020-09-01 福建阿石创新材料股份有限公司 一种从ito靶材磨削废液中回收ito粉末的方法
CN111606353B (zh) * 2020-06-03 2022-04-26 福建阿石创新材料股份有限公司 一种从ito靶材磨削废液中回收ito粉末的方法

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