WO2016150216A1 - 扬声器模组 - Google Patents

扬声器模组 Download PDF

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Publication number
WO2016150216A1
WO2016150216A1 PCT/CN2015/098728 CN2015098728W WO2016150216A1 WO 2016150216 A1 WO2016150216 A1 WO 2016150216A1 CN 2015098728 W CN2015098728 W CN 2015098728W WO 2016150216 A1 WO2016150216 A1 WO 2016150216A1
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Prior art keywords
cavity
speaker module
sound
speaker
module
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PCT/CN2015/098728
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English (en)
French (fr)
Inventor
钟明杰
霍新祥
Original Assignee
歌尔声学股份有限公司
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Application filed by 歌尔声学股份有限公司 filed Critical 歌尔声学股份有限公司
Priority to US15/549,043 priority Critical patent/US10299030B2/en
Publication of WO2016150216A1 publication Critical patent/WO2016150216A1/zh

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    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/20—Arrangements for obtaining desired frequency or directional characteristics
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/02—Casings; Cabinets ; Supports therefor; Mountings therein
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/06—Arranging circuit leads; Relieving strain on circuit leads
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/20—Arrangements for obtaining desired frequency or directional characteristics
    • H04R1/22—Arrangements for obtaining desired frequency or directional characteristics for obtaining desired frequency characteristic only 
    • H04R1/28—Transducer mountings or enclosures modified by provision of mechanical or acoustic impedances, e.g. resonator, damping means
    • H04R1/2869—Reduction of undesired resonances, i.e. standing waves within enclosure, or of undesired vibrations, i.e. of the enclosure itself
    • H04R1/2873—Reduction of undesired resonances, i.e. standing waves within enclosure, or of undesired vibrations, i.e. of the enclosure itself for loudspeaker transducers
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R9/00—Transducers of moving-coil, moving-strip, or moving-wire type
    • H04R9/02—Details
    • H04R9/025—Magnetic circuit
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R9/00—Transducers of moving-coil, moving-strip, or moving-wire type
    • H04R9/06—Loudspeakers

Definitions

  • the present invention relates to the field of acoustic-electrical conversion technology, and more particularly to a speaker module.
  • an object of the present invention is to provide a speaker module for reducing the SPL at Fh and the harmonic distortion caused by the cavity structure, and improving the acoustic performance and sound quality of the speaker.
  • the air passage is disposed on the side wall of the front chamber sound passage; the airtight chamber communicates with the front chamber sound passage through the communication hole.
  • the speaker module is a side sound speaker module.
  • the diameter of the communication hole is 0.3 mm to 1.5 mm.
  • the length of the communication hole is 0.4 mm to 0.8 mm.
  • the volume of the closed cavity is 0.008 cc to 0.1 cc.
  • the number of the communication holes is 1 to 5.
  • the number of closed chambers is at least one.
  • the communication hole is located at any position on the side wall of the sound channel of the front cavity.
  • the housing comprises a module upper shell and a module lower shell, and the speaker unit is accommodated in a space formed by the module upper shell and the module lower shell.
  • a closed cavity is arranged on the side wall of the sound outlet passage of the front cavity, and then the closed cavity and the front cavity sound passage are communicated through the communication hole, thereby forming the closed cavity and the front cavity sound passage.
  • the resonant energy absorbing structure filters out some of the high frequency sound waves, thereby reducing the SPL at Fh and improving the harmonic distortion caused by the cavity structure.
  • the invention can improve the acoustic performance of the speaker and improve the sound quality.
  • the principle is that the sealed cavity and the communication hole form a Helmholtz resonator, and the acoustic energy is absorbed by the incident acoustic wave at Fh to absorb the sound absorption function. Its resonant frequency is calculated as follows:
  • l is the length of the channel
  • S b is the cross-sectional area of the channel.
  • V b is the volume of the cavity
  • c 0 is the speed of sound
  • ⁇ 0 is the density of the air.
  • FIG. 1 is a cross-sectional structural view of a speaker module according to an embodiment of the present invention.
  • FIG. 2 is a schematic exploded view of a speaker module according to an embodiment of the present invention.
  • Figure 3 is a graph showing the change of the sensitivity test curve (FR curve) before and after encrypting the closed cavity;
  • Figure 4 is a graph showing the variation of the distortion test curve (THD curve) before and after the closed cavity is encrypted.
  • front cavity sounding passage 11 module upper casing 12; sealed cavity 13; sounding hole 14; communication hole 15; module lower casing 16; rear cavity 17; speaker unit 21; basin frame 211; 212; side magnet 213; center Huasi 214; Bianhuasi 215; diaphragm 221; DOME 222.
  • the SPL corresponding to Fh is too high, which easily affects the sound effect of the speaker module.
  • the present invention provides a closed cavity on the side wall of the front cavity sound passage, and then communicates with the closed cavity through the communication hole.
  • the cavity exits the acoustic channel, so that the closed cavity and the front cavity sound path form a resonant energy absorbing structure to filter out some of the high frequency sound waves, thereby reducing the SPL at Fh and improving the harmonic distortion caused by the cavity structure.
  • FIGS. 1 and 2 respectively show a cross-sectional structure and an exploded structure of a speaker module according to an embodiment of the present invention.
  • the speaker module provided by the present invention comprises a speaker unit 21, a module upper case 12 and a sound hole 14 formed in the module upper case 12, wherein the speaker unit 21 and the module
  • the space formed by the upper casing 12 and the sound hole 14 is the front cavity sounding passage 11.
  • the speaker unit 21 is composed of a vibration system including a diaphragm 221 and a DOME 222, and a magnetic circuit system including a basin frame 211, a central magnet 212 disposed in the basin frame 211, and a central magnet disposed therein.
  • the side magnets 213 on both sides of the 212, and the center washer 214 and the edge washer 215 which are disposed on the center magnet 212 and the side magnet 213, respectively.
  • the speaker module provided by the present invention further includes a module lower case 16, wherein the speaker list
  • the sealed space formed by the body 21 and the module lower case 16 is the rear cavity 17 of the speaker module, and the space formed by the module upper case 12 and the module lower case 16 is used for fixing and accommodating the speaker unit 21.
  • the housing of the speaker module provided by the present invention includes a module upper case 12 and a module lower case 16, and the speaker unit 21 is housed in a space formed by the module upper case 12 and the module lower case 16.
  • the vibration system operates under the driving of the magnetic circuit system, and the generated sound is emitted from the sound emission hole 14 via the front cavity sound passage 11.
  • the present invention also includes a closed cavity 13 and a communication hole 15.
  • the closed cavity 13 is disposed on the sidewall of the front cavity sounding passage 11, and the closed cavity 13 communicates with the front cavity sounding passage 11 through the communication hole 15, so that the closed cavity 13 and the front cavity sounding passage 11 form a resonance energy absorption. structure. Through the formed resonant energy absorbing structure, some high frequency sound waves can be filtered out, thereby improving the sound effect of the speaker module.
  • the front cavity sounding passage 11 is constituted by the space formed by the speaker unit 21, the module upper casing 12 and the sound emitting hole 14, and the sound emitting hole 14 is disposed on the module upper casing 12, then
  • the closed cavity 13 formed on the side wall of the front cavity sounding passage 11 is equivalent to being disposed on the module upper case 12.
  • the volume of the closed cavity and the size of the communication hole connecting the closed cavity and the front cavity sound path determine the resonance frequency point.
  • the position of the communicating hole connecting the closed cavity and the front cavity sounding passage is adjustable, and may be any position on the side wall of the front cavity sounding passage (ie, the communicating hole is located at any position of the side wall of the front cavity sounding passage), As long as the closed cavity and the front cavity sound passage can be connected.
  • the thickness of the casing is 0.5 mm and the peak value of Fh is 5.3 kHz.
  • two closed cavities are added to the side wall of the sound channel of the front chamber to form a resonant energy absorbing structure.
  • the diameter of the hole formed by the anterior chamber sound channel and the two sealed chambers added is 0.33 mm
  • the volume of the two chambers added is: the volume of the chamber 1 is 0.009 cc; the volume of the chamber 2 is 0.015cc.
  • the speaker module provided by the invention can effectively reduce the SPL of the Fh point by adding a resonant energy absorbing structure on the side wall of the sound channel of the front cavity, and the effect is most obvious especially for the speaker module of the side sounding. Therefore, the speaker module provided by the present invention may be a side sound speaker module but is not limited to such a speaker module.
  • the closed cavity 13 is encrypted on the side wall of the front cavity sounding passage 11 of the speaker module, and then communicates with the closed cavity 13 and the front cavity sounding passage 11 through the communication hole 15.
  • the inductor and the capacitor form a loop that attenuates the signal near the resonant frequency and thus acts as a filter.
  • Figure 3 shows the FR curve comparison before and after the addition of the resonance energy absorbing structure.
  • the abscissa represents frequency and the ordinate represents sound pressure level.
  • the dotted line is the sensitivity test curve before adding the resonant energy absorption structure, and the solid line is the sensitivity test curve after adding the resonant energy absorption structure. It can be seen from Figure 3 that the two sensitivity test curves each have two peaks.
  • the closed cavity 13 is encrypted on the side wall of the front cavity sounding passage 11 of the speaker module, and then the closed cavity 13 and the front cavity are connected through the communication hole 15.
  • Channel 11 the above method is equivalent to adding a filter capacitor in the electric-force-acoustic analog line, which can filter out harmonic components, thereby effectively reducing distortion caused by cavity resonance.
  • FIG. 4 shows the variation of the front and rear distortion test curve (THD curve) of the resonant energy absorbing structure.
  • TDD curve front and rear distortion test curve
  • the abscissa represents the frequency and the ordinate represents the distortion value.
  • the dotted line is the distortion test curve before the resonance energy absorption structure, and the solid line is the distortion test curve after adding the resonance energy absorption structure.

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Health & Medical Sciences (AREA)
  • Otolaryngology (AREA)
  • Obtaining Desirable Characteristics In Audible-Bandwidth Transducers (AREA)
  • Details Of Audible-Bandwidth Transducers (AREA)
  • Audible-Bandwidth Dynamoelectric Transducers Other Than Pickups (AREA)

Abstract

本发明提供一种扬声器模组，包括：由扬声器单体、壳体和在壳体上开设的出声孔形成的前腔出声通道，其特征在于，还包括密闭腔和连通孔；其中，密闭腔设置在前腔出声通道的侧壁上，密闭腔与前腔出声通道通过连通孔连通。通过本发明能够降低Fh处的SPL尖峰和由前腔共振引起的谐波失真，从而在提升扬声器的声学性能，改善音质效果。

Description

扬声器模组 技术领域
本发明涉及声电转换技术领域，更为具体地，涉及一种扬声器模组。
背景技术
扬声器作为将电能转变为声能的常用电声换能器件，音质是衡量扬声器质量的重要指标之一。在现有的扬声器中，尤其对于侧出声的扬声器模组而言，其不可避免会存在前腔谐振点较低，谐振点SPL过高、THD升高等所导致的声音尖锐和失真问题。为了得到优美的音质，则必须要求Fh对应的SPL(Sound Pressure Level，声压级)不能太高。否则，则声音会在Fh处表现得比较尖锐，从而影响整个扬声器模组的音效。
为了降低Fh对应的SPL，通常的做法是在扬声器模组的前腔贴吸音材料或是其他的方法来增加阻尼，但相应地会降低其他频段SPL，尤其是f0附近频段的SPL。
发明内容
鉴于上述问题，本发明的目的是提供一种扬声器模组，以降低Fh处的SPL和由腔体结构造成的谐波失真，提升扬声器的声学性能和音质效果。
本发明提供的扬声器模组包括：由扬声器单体、壳体和在壳体上开设的出声孔形成的前腔出声通道，其特征在于，还包括密闭腔和连通孔；其中，密闭腔设置在前腔出声通道的侧壁上；密闭腔与前腔出声通道通过连通孔连通。
其中，扬声器模组为侧出声扬声器模组。
其中，连通孔的直径为0.3mm～1.5mm。
其中，连通孔的长度为0.4mm～0.8mm。
其中，密闭腔的体积为0.008cc～0.1cc。
其中，连通孔的数量为1～5个。
其中，密闭腔的数量至少为一个。
其中，连通孔位于前腔出声通道侧壁的任意位置。
其中，壳体包括模组上壳和模组下壳，扬声器单体容纳在模组上壳与模组下壳形成的空间中。
利用上述根据本发明的扬声器模组，通过在前腔出声通道的侧壁上设置密闭腔，然后通过连通孔连通密闭腔与前腔出声通道，从而使密闭腔与前腔出声通道形成共振吸能结构，以滤掉部分高频段的声波，进而降低Fh处的SPL和改善由腔体结构造成的谐波失真。通过本发明能够提升扬声器的声学性能，改善音质效果。其原理为密封腔体与连通孔形成亥姆霍兹共鸣器，在Fh处与入射声波共振吸收部分声能，起到滤波吸声的作用。其谐振频率计算公式如下：
Figure PCTCN2015098728-appb-000001
其中，
Figure PCTCN2015098728-appb-000002
为通道的声质量，l为通道的长度，Sb为通道的截面积，
Figure PCTCN2015098728-appb-000003
为共鸣器的腔体声容，Vb为腔体体积，c0为声速，ρ0为空气密度。
为了实现上述以及相关目的，本发明的一个或多个方面包括后面将详细说明并在权利要求中特别指出的特征。下面的说明以及附图详细说明了本发明的某些示例性方面。然而，这些方面指示的仅仅是可使用本发明的原理的各种方式中的一些方式。此外，本发明旨在包括所有这些方面以及它们的等同物。
附图说明
通过参考以下结合附图的说明及权利要求书的内容，并且随着对本发明的更全面理解，本发明的其它目的及结果将更加明白及易于理解。在附图中：
图1为根据本发明实施例的扬声器模组的剖面结构示意图；
图2为根据本发明实施例的扬声器模组的分解结构示意图；
图3为加密闭腔前和加密闭腔后的灵敏度测试曲线(FR曲线)的变化图；
图4为加密闭腔前和加密闭腔后的失真测试曲线(THD曲线)的变化图。
图中：前腔出声通道11；模组上壳12；密闭腔13；出声孔14；连通孔15；模组下壳16；后腔17；扬声器单体21；盆架211；中心磁铁212；边磁铁213；中心华司214；边华司215；振膜221；DOME 222。
在所有附图中相同的标号指示相似或相应的特征或功能。
具体实施方式
以下将结合附图对本发明的具体实施例进行详细描述。
针对前述现有的扬声器存在Fh处对应的SPL太高，容易影响扬声器模组音效的问题，本发明通过在前腔出声通道的侧壁上设置密闭腔，然后通过连通孔连通密闭腔与前腔出声通道，从而使密闭腔与前腔出声通道形成共振吸能结构，以滤掉部分高频段的声波，进而降低Fh处的SPL和改善由腔体结构造成的谐波失真。
为了说明本发明提供的扬声器模组，图1和图2分别示出了根据本发明实施例的扬声器模组的剖面结构和分解结构。
如图1和图2所示，本发明提供的扬声器模组包括扬声器单体21、模组上壳12和在模组上壳12上开设的出声孔14，其中，扬声器单体21、模组上壳12与出声孔14形成的空间为前腔出声通道11。其中，扬声器单体21由振动系统和磁路系统组成，其中，振动系统包括振膜221和DOME 222，磁路系统包括盆架211、设置在盆架211中的中心磁铁212和设置在中心磁铁212两侧的边磁铁213，以及对应设置在中心磁铁212和边磁铁213上的中心华司214和边华司215。
另外，本发明提供的扬声器模组还包括模组下壳16，其中，扬声器单 体21与模组下壳16形成的密闭空间为扬声器模组的后腔17，而模组上壳12与模组下壳16形成的空间用于固定容纳扬声器单体21。也就是说，本发明提供的扬声器模组的壳体包括模组上壳12和模组下壳16，扬声器单体21容纳在模组上壳12与模组下壳16形成的空间中。
需要说明的是，振动系统在磁路系统的驱动下进行工作，其产生的声音经由前腔出声通道11从出声孔14发出。为了降低Fh处对应的SPL，本发明还包括密闭腔13和连通孔15。其中，密闭腔13设置在前腔出声通道11的侧壁上，密闭腔13与前腔出声通道11通过连通孔15进行连通，使得密闭腔13与前腔出声通道11形成共振吸能结构。通过所形成的共振吸能结构可以过滤掉部分高频段的声波，从而提升扬声器模组的音效。
需要说明的是，由于前腔出声通道11由扬声器单体21、模组上壳12与出声孔14形成的空间构成，而出声孔14被设置在模组上壳12上，那么在前腔出声通道11的侧壁上所开设的密闭腔13也就相当于被设置在了模组上壳12上。
另外，需要说明的是，密闭腔的体积以及连接密闭腔与前腔出声通道的连通孔的大小决定了共振频率点。连通密闭腔与前腔出声通道的连通孔的位置是可以调整的，其可以是前腔出声通道侧壁上的任意位置(即连通孔位于前腔出声通道侧壁的任意位置)，只要使得密闭腔与前腔出声通道能够连通即可。
此外，对于通过密闭腔13与前腔出声通道11形成的共振吸能结构的共振频率，需要结合产品的实际性能曲线，调整通孔(即连通孔)与腔体(即密闭腔腔体)的Mb(通道的声质量)与Cb(腔体声容)来调整共振的频率；对于对共振频率的SPL削减程度，则要在Mb与Cb乘积不变的前提下通过改变腔体体积来调整。为了达到最理想的效果，可以增加多个共鸣结构(通道+腔体，即在前腔出声通道的侧壁上开设多个密闭腔)来微调，这里不再赘述。
在本发明的一个具体实施例中，壳体厚度为0.5mm，Fh峰值在5.3kHz，为了使Fh处相对平坦，在前腔出声通道侧壁增加两个密闭腔形成共振吸能结构。根据前面所述公式，前腔出声通道与所加的两个密闭腔形成的孔直径为0.33mm，所增加的两个腔体的体积为：腔体1体积为0.009cc；腔体2体积0.015cc。结果对比见图3，可以看到f0-Fh段灵敏度幅值差距明显减小。
另外，需要说明的是，对于侧出声的扬声器模组而言，其Fh处对应的SPL如果太高，声音则会在Fh处表现得比较尖锐。而本发明提供的扬声器模组通过在前腔出声通道的侧壁上增加共振吸能结构的方式能够有效降低Fh点的SPL，尤其对侧出声的扬声器模组而言，效果最为明显。因此，本发明提供的扬声器模组可以为侧出声扬声器模组但不仅限于此种扬声器模组。
以下将对本发明提供的扬声器模组带来的有益效果作具体说明。
在扬声器模组的前腔出声通道11的侧壁上加密闭腔13，然后通过连通孔15连通密闭腔13与前腔出声通道11。在其电-力-声类比线路中，电感和电容形成一回路，可削弱谐振频率附近的信号，进而起到滤波的作用。
其中，图3示出了加共振吸能结构前后的FR曲线对比。在图3中，横坐标代表频率，纵坐标代表声压级。虚线为加共振吸能结构之前的灵敏度测试曲线，实线为加共振吸能结构后的灵敏度测试曲线。通过图3可以看出，两条灵敏度测试曲线各有两个峰值，很明显，当频率在1000以下(低频)时，加共振吸能结构对声压级造成的影响微乎其微；然而，当频率在4000～5000这个区间时，加共振吸能结构前，其声压级在100～110dB之间；增加共振吸能结构后，其声压级却降至100dB以下。
另外，对某些由前腔造成扬声器模组失真的情况，在扬声器模组的前腔出声通道11的侧壁上加密闭腔13，然后通过连通孔15连通密闭腔13与前腔出声通道11，上述方式就相当于在电-力-声类比线路中加入一滤波电容，能够滤掉谐波成分，从而有效降低由于腔体谐振引起的失真。
其中，图4示出了加共振吸能结构前后失真测试曲线(THD曲线)的变化。在图4中，横坐标代表频率，纵坐标代表失真值。虚线为加共振吸能结构前的失真测试曲线，实线为加共振吸能结构后的失真测试曲线。
如图4所示，两条失真测试曲线的最高峰值都出现在同一频率区间。然而很明显，在扬声器模组的前腔出声通道的侧壁上加共振吸能结构后，失真会有明显降低。
如上参照附图以示例的方式描述了根据本发明的扬声器模组。但是，本领域技术人员应当理解，对于上述本发明所提出的扬声器模组，还可以 在不脱离本发明内容的基础上做出各种改进。因此，本发明的保护范围应当由所附的权利要求书的内容确定。

Claims (9)

  1. 一种扬声器模组，包括：由扬声器单体、壳体和在所述壳体上开设的出声孔形成的前腔出声通道，其特征在于，还包括密闭腔和连通孔；其中，
    所述密闭腔设置在所述前腔出声通道的侧壁上；
    所述密闭腔与所述前腔出声通道通过所述连通孔连通。
  2. 权利要求1所述的扬声器模组，其中，所述扬声器模组为侧出声扬声器模组。
  3. 如权利要求1所述的扬声器模组，其中，所述连通孔的直径为0.3mm～1.5mm。
  4. 如权利要求1所述的扬声器模组，其中，所述连通孔的长度为0.4mm～0.8mm。
  5. 如权利要求1所述的扬声器模组，其中，所述密闭腔的体积为0.008cc～0.1cc。
  6. 如权利要求1所述的扬声器模组，其中，所述连通孔的数量为1～5个。
  7. 根据权利要求1所述的扬声器模组，其中，所述密闭腔的数量至少为一个。
  8. 如权利要求1～7所述的扬声器模组，其中，所述连通孔位于所述前腔出声通道侧壁的任意位置。
  9. 如权利要求1所述的扬声器模组，其中，所述壳体包括模组上壳和模组 下壳，所述扬声器单体容纳在所述模组上壳与所述模组下壳形成的空间中。
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