WO2016134981A1 - Verfahren zur herstellung von optoelektronischen halbleiterbauteilen und optoelektronisches halbleiterbauteil - Google Patents
Verfahren zur herstellung von optoelektronischen halbleiterbauteilen und optoelektronisches halbleiterbauteil Download PDFInfo
- Publication number
- WO2016134981A1 WO2016134981A1 PCT/EP2016/053018 EP2016053018W WO2016134981A1 WO 2016134981 A1 WO2016134981 A1 WO 2016134981A1 EP 2016053018 W EP2016053018 W EP 2016053018W WO 2016134981 A1 WO2016134981 A1 WO 2016134981A1
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- WIPO (PCT)
- Prior art keywords
- layer
- connecting means
- semiconductor chips
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- potting
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- 230000005693 optoelectronics Effects 0.000 title claims abstract description 27
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- 238000004382 potting Methods 0.000 claims abstract description 105
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
- H01L33/486—Containers adapted for surface mounting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/54—Encapsulations having a particular shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/561—Batch processing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/568—Temporary substrate used as encapsulation process aid
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/04105—Bonding areas formed on an encapsulation of the semiconductor or solid-state body, e.g. bonding areas on chip-scale packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
- H01L2224/19—Manufacturing methods of high density interconnect preforms
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73267—Layer and HDI connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/005—Processes relating to semiconductor body packages relating to encapsulations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0066—Processes relating to semiconductor body packages relating to arrangements for conducting electric current to or from the semiconductor body
Abstract
Description
Claims
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US15/553,565 US10128424B2 (en) | 2015-02-25 | 2016-02-12 | Method for producing optoelectronic semiconductor components and optoelectronic semiconductor component |
DE112016000901.1T DE112016000901B4 (de) | 2015-02-25 | 2016-02-12 | Verfahren zur Herstellung von optoelektronischen Halbleiterbauteilen |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102015102699.6 | 2015-02-25 | ||
DE102015102699.6A DE102015102699A1 (de) | 2015-02-25 | 2015-02-25 | Verfahren zur Herstellung von optoelektronischen Halbleiterbauteilen und optoelektronisches Halbleiterbauteil |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2016134981A1 true WO2016134981A1 (de) | 2016-09-01 |
Family
ID=55349857
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/EP2016/053018 WO2016134981A1 (de) | 2015-02-25 | 2016-02-12 | Verfahren zur herstellung von optoelektronischen halbleiterbauteilen und optoelektronisches halbleiterbauteil |
Country Status (3)
Country | Link |
---|---|
US (1) | US10128424B2 (de) |
DE (2) | DE102015102699A1 (de) |
WO (1) | WO2016134981A1 (de) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10622523B2 (en) | 2015-06-19 | 2020-04-14 | Osram Oled Gmbh | Light-emitting diode and method of producing a light-emitting diode |
CN111033761A (zh) * | 2017-07-17 | 2020-04-17 | 欧司朗Oled股份有限公司 | 用于制造光电子器件的方法及光电子器件 |
EP3188261B1 (de) * | 2015-12-30 | 2024-04-24 | Maven Optronics Co., Ltd. | Chipmassgehäuse für eine lichtemittierende vorrichtung und herstellungsverfahren davon |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102015101143A1 (de) | 2015-01-27 | 2016-07-28 | Osram Opto Semiconductors Gmbh | Optoelektronisches Halbleiterbauelement und Verfahren zu dessen Herstellung |
DE102015107588B4 (de) | 2015-05-13 | 2023-08-03 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Verfahren zur Herstellung optoelektronischer Bauelemente und oberflächenmontierbares optoelektronisches Bauelement |
DE102015107586B4 (de) | 2015-05-13 | 2023-10-26 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Verfahren zur Herstellung optoelektronischer Bauelemente und oberflächenmontierbares optoelektronisches Bauelement |
DE102021103369A1 (de) * | 2021-02-12 | 2022-08-18 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Halbleitervorrichtung und verfahren zu dessen herstellung |
DE102021117801A1 (de) | 2021-07-09 | 2023-01-12 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Herstellungsverfahren und optoelektronischer halbleiterchip |
DE102021118706A1 (de) | 2021-07-20 | 2023-01-26 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Optoelektronischer halbleiterchip und herstellungsverfahren |
DE102021128151A1 (de) | 2021-10-28 | 2023-05-04 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Verfahren zum herstellen eines optoelektronischen bauelements und optoelektronisches bauelement |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20100171135A1 (en) | 2007-04-26 | 2010-07-08 | Karl Engl | Optoelectronic Semiconductor Body and Method for Producing the Same |
DE102012002605A1 (de) * | 2012-02-13 | 2013-08-14 | Osram Opto Semiconductors Gmbh | Verfahren zur Herstellung eines optoelektronischen Halbleiterbauteils und optoelektronisches Halbleiterbauteil |
US20140231850A1 (en) * | 2013-02-19 | 2014-08-21 | Michael A. Tischler | Engineered-phosphor led packages and related methods |
WO2015013399A1 (en) * | 2013-07-24 | 2015-01-29 | Cooledge Lighting Inc. | Light-emitting dies incorporating wavelength-conversion materials and related methods |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7838868B2 (en) * | 2005-01-20 | 2010-11-23 | Nanosolar, Inc. | Optoelectronic architecture having compound conducting substrate |
DE102007030129A1 (de) | 2007-06-29 | 2009-01-02 | Osram Opto Semiconductors Gmbh | Verfahren zur Herstellung einer Mehrzahl optoelektronischer Bauelemente und optoelektronisches Bauelement |
DE102009036621B4 (de) * | 2009-08-07 | 2023-12-21 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Optoelektronisches Halbleiterbauteil |
US8956922B2 (en) * | 2010-09-06 | 2015-02-17 | Heraeus Noblelight Gmbh | Coating method for an optoelectronic chip-on-board module |
DE102011087886A1 (de) | 2011-12-07 | 2013-06-13 | Osram Gmbh | Halbleiterleuchte |
DE102012216552A1 (de) | 2012-09-17 | 2014-03-20 | Osram Gmbh | Herstellen einer LED-Leuchtvorrichtung mit Konverterschicht |
DE102013207611A1 (de) | 2013-04-25 | 2014-10-30 | Osram Gmbh | Beleuchtungsvorrichtung mit optoelektronischem Bauelement |
DE102015101143A1 (de) | 2015-01-27 | 2016-07-28 | Osram Opto Semiconductors Gmbh | Optoelektronisches Halbleiterbauelement und Verfahren zu dessen Herstellung |
-
2015
- 2015-02-25 DE DE102015102699.6A patent/DE102015102699A1/de not_active Withdrawn
-
2016
- 2016-02-12 DE DE112016000901.1T patent/DE112016000901B4/de active Active
- 2016-02-12 WO PCT/EP2016/053018 patent/WO2016134981A1/de active Application Filing
- 2016-02-12 US US15/553,565 patent/US10128424B2/en active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20100171135A1 (en) | 2007-04-26 | 2010-07-08 | Karl Engl | Optoelectronic Semiconductor Body and Method for Producing the Same |
DE102012002605A1 (de) * | 2012-02-13 | 2013-08-14 | Osram Opto Semiconductors Gmbh | Verfahren zur Herstellung eines optoelektronischen Halbleiterbauteils und optoelektronisches Halbleiterbauteil |
US20140231850A1 (en) * | 2013-02-19 | 2014-08-21 | Michael A. Tischler | Engineered-phosphor led packages and related methods |
WO2015013399A1 (en) * | 2013-07-24 | 2015-01-29 | Cooledge Lighting Inc. | Light-emitting dies incorporating wavelength-conversion materials and related methods |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10622523B2 (en) | 2015-06-19 | 2020-04-14 | Osram Oled Gmbh | Light-emitting diode and method of producing a light-emitting diode |
EP3188261B1 (de) * | 2015-12-30 | 2024-04-24 | Maven Optronics Co., Ltd. | Chipmassgehäuse für eine lichtemittierende vorrichtung und herstellungsverfahren davon |
CN111033761A (zh) * | 2017-07-17 | 2020-04-17 | 欧司朗Oled股份有限公司 | 用于制造光电子器件的方法及光电子器件 |
CN111033761B (zh) * | 2017-07-17 | 2023-07-21 | 欧司朗Oled股份有限公司 | 用于制造光电子器件的方法及光电子器件 |
Also Published As
Publication number | Publication date |
---|---|
DE112016000901B4 (de) | 2021-10-07 |
DE112016000901A5 (de) | 2017-11-16 |
US20180248091A1 (en) | 2018-08-30 |
DE102015102699A1 (de) | 2016-08-25 |
US10128424B2 (en) | 2018-11-13 |
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