WO2016117334A1 - Dispositif de régulation de la température et procédé de régulation de la température - Google Patents

Dispositif de régulation de la température et procédé de régulation de la température Download PDF

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Publication number
WO2016117334A1
WO2016117334A1 PCT/JP2016/000256 JP2016000256W WO2016117334A1 WO 2016117334 A1 WO2016117334 A1 WO 2016117334A1 JP 2016000256 W JP2016000256 W JP 2016000256W WO 2016117334 A1 WO2016117334 A1 WO 2016117334A1
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Prior art keywords
temperature control
temperature
heat storage
heat
storage material
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PCT/JP2016/000256
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English (en)
Japanese (ja)
Inventor
展雄 佐々木
天野　雅彦
昌洋 松川
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凸版印刷株式会社
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Priority to JP2016570550A priority Critical patent/JP6711282B2/ja
Publication of WO2016117334A1 publication Critical patent/WO2016117334A1/fr

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    • C—CHEMISTRY; METALLURGY
    • C12—BIOCHEMISTRY; BEER; SPIRITS; WINE; VINEGAR; MICROBIOLOGY; ENZYMOLOGY; MUTATION OR GENETIC ENGINEERING
    • C12M—APPARATUS FOR ENZYMOLOGY OR MICROBIOLOGY; APPARATUS FOR CULTURING MICROORGANISMS FOR PRODUCING BIOMASS, FOR GROWING CELLS OR FOR OBTAINING FERMENTATION OR METABOLIC PRODUCTS, i.e. BIOREACTORS OR FERMENTERS
    • C12M1/00—Apparatus for enzymology or microbiology
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B21/00—Machines, plants or systems, using electric or magnetic effects
    • F25B21/02—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D20/00—Heat storage plants or apparatus in general; Regenerative heat-exchange apparatus not covered by groups F28D17/00 or F28D19/00
    • F28D20/02—Heat storage plants or apparatus in general; Regenerative heat-exchange apparatus not covered by groups F28D17/00 or F28D19/00 using latent heat
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
    • G05D23/00—Control of temperature
    • G05D23/19—Control of temperature characterised by the use of electric means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/10—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects
    • H10N10/13—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects characterised by the heat-exchanging means at the junction
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
    • Y02B30/00—Energy efficient heating, ventilation or air conditioning [HVAC]
    • Y02B30/70—Efficient control or regulation technologies, e.g. for control of refrigerant flow, motor or heating
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
    • Y02E60/14—Thermal energy storage

Definitions

  • the present invention relates to a temperature control technique using a Peltier device, and more particularly to a technique suitable for temperature control for biochemical reaction such as temperature control of a biological sample.
  • a technique for amplifying DNA is PCR (polymerase chain reaction). Since the amount of DNA that can be extracted from a biological sample is very small and difficult to detect directly, a method of detecting after amplification is often used.
  • This PCR amplification method is a technique for amplifying DNA exponentially in a short time by periodically raising and lowering the temperature of an aqueous solution containing DNA.
  • a temperature control device for heating and cooling control in such a PCR process there is a thermal cycler (temperature control device) that repeats a cycle in which temperature and time are set and a temperature control target is heated and absorbed.
  • a Peltier element may be used as a heat source of this thermal cycler. Since this Peltier element is electronic, it is excellent in controllability and responsiveness, and can be heated and absorbed by a single device by changing the direction of current flowing through the device.
  • the Peltier element is functionally a heat pump, and its performance is closely related to the temperature of the surface not in contact with the temperature control object. Driving a Peltier element generally causes an undesirable temperature difference on both sides of the Peltier element. If the temperature difference is too large, it will be difficult to pump the heat and adjust the temperature of the temperature control target. For this reason, in a conventional temperature control device using a Peltier element, an air-cooled heat sink composed of a fin and a fan is installed on the opposite surface of the Peltier element to suppress an increase in the temperature difference between both sides of the Peltier element.
  • Patent Document 1 discloses that the temperature is adjusted using a liquid circulation heat sink.
  • the apparatus When an air-cooled heat sink is used, the apparatus is increased in size by having a fan, and vibration is generated to drive the fan. Even when a liquid circulation heat sink is used, a tank for storing liquid, a pump for circulation, a fan and a radiator for temperature adjustment are required, and the apparatus is increased in size and the fan is driven. Therefore, vibration is generated.
  • the present invention has been made paying attention to the above points, and has as its object to provide a temperature control method and a temperature control apparatus that are miniaturized and further excellent in quietness.
  • one aspect of the present invention is to set a biological sample as a temperature control target, and perform at least one of heating to the temperature control target and endotherm from the temperature control target using a Peltier element.
  • the temperature control target is temperature-controlled within a preset control temperature range, and has a heat storage material capable of transferring heat to the heat dissipation surface of the Peltier element, and the heat storage material is within the temperature control range or within the control temperature range. It has a phase change temperature within a second temperature range that is lower than the lower limit value and higher than the ambient temperature during use.
  • the latent heat type heat storage material can be arranged to reduce the size and labor of the device. .
  • FIG. 10 is a partially enlarged view of FIG. 9. It is a figure which illustrates the electrophoresis as confirmation after reaction in the gene-analysis chip
  • thermocontrol of a biological sample a case where temperature control for biochemical reaction is targeted is illustrated. That is, a temperature control device for heating and cooling control in the PCR process will be described as an example, and a description will be given assuming that a cycle for heating and absorbing a temperature control target is repeated at a set temperature and time.
  • the temperature control may be performed in a control temperature range in which the temperature control target is set in advance by performing either heating to the temperature control target or heat absorption from the temperature control target using a Peltier element.
  • the temperature control device of the present embodiment includes a Peltier element 10, a heat storage material heat sink 11, and a preheating heater 13.
  • the Peltier element 10 has a first surface 10a on the temperature control target A side and a second surface 10b (heat radiation surface) on the heat storage material heat sink 11 side.
  • the first surface 10 a of the Peltier element 10 is in surface contact with the temperature control target A via the heat spreader 12.
  • the heat spreader 12 is disposed in order to reduce the temperature distribution deviation in the surface perpendicular to the cross section of FIG.
  • the heat spreader 12 may not be provided.
  • the heat storage material heat sink 11 includes a heat storage material 15 and a heat storage material container 16 that houses the heat storage material 15.
  • the heat storage material 15 is made of a latent heat type heat storage material. Since the latent heat type heat storage material is small and stores more heat, it is generally a heat storage material having a higher heat storage density than the sensible heat type heat storage material.
  • a heat storage material made of a material whose phase change temperature is within a control temperature range for temperature adjustment is selected.
  • the phase change temperature is a temperature close to the room temperature side within the control temperature range. Since an error occurs during actual control, the upper limit value and the lower limit value of the control temperature range are set to a wide range corresponding to the error. The error is, for example, 2 ° C. although it depends on the accuracy of control.
  • the heat storage material 15 a heat storage material in which the phase change temperature is lower than the lower limit value of the control temperature range and higher than the ambient temperature during use is employed. Assuming that the temperature control device is used at room temperature, the average temperature at room temperature is around 20 ° C., and it is assumed that the ambient temperature during use is at most less than 40 ° C.
  • the lower limit of the temperature range may be set as 40 ° C. or higher to determine the phase change temperature of the heat storage material 15. However, even in that case, the phase change temperature is preferably close to the control temperature range.
  • the heat storage material 15 is composed of a material having a phase change temperature of, for example, about 80 ° C. For example, it is composed of paraffin whose phase change temperature is set to around 80 ° C.
  • the heat storage amount of paraffin is approximately 200 J / g
  • the phase change temperature of paraffin can be selected according to the number of carbon chains. Therefore, paraffin having a phase change temperature in the second temperature range within the control temperature range or lower than the control temperature range may be used. Even when the second temperature range is selected, since it is preferable to be close to the control temperature range as described above, the second temperature range is, for example, 60 ° C. higher than the ambient temperature during use. Set to not less than 70 ° C and not less than 70 ° C.
  • the heat storage material container 16 includes a container portion 17 that houses the heat storage material 15 and a lid portion 18.
  • the accommodating part may be a cylindrical shape, a ball shape, or the like.
  • the heat storage material container 16 is made of a material having good thermal conductivity, such as copper, aluminum, or other metal, in order to promote heat transfer.
  • the cover part 18 comprises a heat transfer part.
  • At least the side part 17a of the container part 17 comprises the heat transfer body for thermal radiation.
  • the outer surface 18 a of the lid 18 is in contact with the second surface 10 b (surface on the heat sink side) of the Peltier element 10.
  • a plurality of protrusions 19 that protrude into the heat storage material 15 and are embedded in the heat storage material 15 are provided on the inner surface 18 b (surface facing the heat storage material 15) of the lid portion 18.
  • a cylindrical pin is exemplified as the shape of the protrusion 19.
  • the shape of the protrusion 19 embedded in the heat storage material 15 is not limited to a cylindrical shape, and may be a prismatic shape or a conical shape, and is not particularly limited.
  • the contact area between the lid 18 and the heat storage material 15 is increased, and the heat of the heat storage material 15 is efficiently transferred to the Peltier element 10 and the heat of the Peltier element 10 is efficiently transferred to the heat storage material 15. It becomes possible to heat. That is, the followability is improved by having the protrusions 19.
  • the protrusion 19 may not be provided.
  • the amount L of the protrusion 19 embedded in the heat storage material 15 is set to be not less than half the depth D of the heat storage material 15.
  • the amount of embedding of the protrusions 19 in the heat storage material 15 is set to more than half of the depth of the heat storage material 15 (depth in the protruding direction of the protrusions). Heat exchange between the bottom portion and the Peltier element 10 can also be performed quickly and efficiently.
  • the size (volume) and the number of the protrusions 19 may be set while taking into account the amount of the necessary heat storage material 15.
  • a preheating heater 13 is disposed on the lower surface of the container portion 17, and a heat insulating material 14 is disposed so as to cover the preheating heater 13. By disposing the heat insulating material 14, the heat of the preheating heater 13 can be efficiently input to the heat storage material 15.
  • the control unit 100 includes a heater control unit 104 that controls current to the preheating heater 13 and a Peltier control unit 102 that controls current to the Peltier element 10.
  • the processing of the control unit 100 includes a preheating process and a temperature control process performed after the preheating process is completed.
  • a first temperature sensor 103 is arranged in the heat storage material 15, and the first temperature sensor 103 supplies a detection signal to the heater control unit 104.
  • the heater control unit 104 energizes the preheating heater 13 until the heat storage material 15 reaches the target preheating temperature while referring to the signal from the first temperature sensor 103. This energization is performed before the temperature control step for performing temperature control.
  • the preheating heater 13 is energized in a preheating process in which the heat storage material heat sink 11 is preheated from room temperature to a control temperature range before the heating and heat absorption of the temperature control object A are repeated.
  • the preheater 13 is not energized in the temperature control process that repeatedly absorbs heat. This is to prevent unnecessary energization.
  • the second temperature sensor 101 supplies a detection signal to the Peltier control unit 102.
  • the Peltier control unit 102 regards the temperature of the heat spreader 12 as the temperature of the temperature control object A, and feedback-controls the current of the Peltier element 10. That is, when the control unit 100 first operates, as a preheating step, the control unit 100 preheats the heat storage material 15 from room temperature to a preheat temperature that is a heat storage initial temperature close to the lower limit temperature of the control temperature range. When it is detected that the heat storage material 15 has reached the preheating temperature, the energization to the heater 13 is stopped and the preheating is finished.
  • the Peltier control unit 102 When the preheating process is completed, the Peltier control unit 102 is activated, and a cycle for heating and absorbing the temperature control object A in a preset control temperature range and time interval while referring to the temperature of the second temperature sensor 101 is performed. Current control is performed on the Peltier element 10 so as to repeat a preset number of times at preset time intervals.
  • the base 4 includes a bottom surface portion 4a and a ceiling portion 4b that are vertically opposed to each other, and further includes a support portion 4c that connects and connects the bottom surface portion 4a and the ceiling portion 4b.
  • One (lower) temperature control device 1 is fixed to the upper surface of the bottom surface portion 4a of the base 4 with the heat insulating material 14 facing downward.
  • the other (upper) temperature control device 2 is supported by the ceiling portion 4b via a pressurizing mechanism including a screw feed mechanism.
  • the pressurizing mechanism is a device that moves the other temperature control device 2 up and down (approaches and leaves the one temperature control device 1).
  • the pressure mechanism includes a male screw portion 3 that is screwed into a female screw portion (not shown) formed in the ceiling portion 4b. In FIG. 3, only one male screw portion 3 is shown, but two male screw portions 3 are provided apart from each other in the direction orthogonal to the paper surface.
  • the other temperature control device 2 is attached to the lower end portions of the two male screw portions 3.
  • the temperature control device 2 is attached to the temperature control device 2 so that the temperature control device 2 does not rotate with respect to the shaft rotation of the male screw portion 3.
  • a motor may be connected to the male screw portion 3, and the motor may be driven up and down by a command from the control unit 100.
  • a pressure sensor such as a load cell may be provided, and the elevation may be adjusted by feedback control or the like so that the pressing pressure when sandwiched becomes a predetermined value.
  • the pressurizing mechanism may be a mechanism that can appropriately sandwich the temperature control object A between the temperature control device 1 and the temperature control device 2 other than the screw type shown in the drawing. For example, a combination of a motor and a gear, a combination of a motor, a gear and an endless belt, a link mechanism, a spring or other elastic body, a hydraulic pressure or a fluid pressure drive Is mentioned.
  • the temperature control object A is placed on the heat spreader 12 of one temperature control device 1, the pressure mechanism is operated, and the other temperature control device 2 located on the upper side is lowered, as shown in FIG.
  • the temperature control object A is sandwiched between the two heat spreaders 12 facing each other.
  • the other temperature control device 2 is lowered so as to pressurize at a predetermined pressure.
  • the control unit 100 is operated, and current control for repeating the above-described remaining heat and a cycle of heating and absorbing heat with respect to the temperature control target A is performed a predetermined number of times.
  • the amount of heat Q absorbed by the Peltier element 10 can be expressed by the following equation (1), where I in is the input current to the Peltier element 10 and ⁇ T is the temperature difference between both sides of the Peltier element 10.
  • Q ⁇ ⁇ I in + (1/2) ⁇ R ⁇ I in 2 ⁇ L ⁇ ⁇ T (1) here, ⁇ : Peltier coefficient R: Electric resistance 1 / L: Thermal resistance (value inherent to Peltier element 10) It is.
  • the first term on the right-hand side is the amount of heat transfer due to the Peltier effect from one surface of the Peltier element 10 to the other surface, and the second term is from the Peltier element 10 itself caused by flowing current.
  • the third term is the heat conduction associated with the temperature difference between the two surfaces of the Peltier element 10.
  • the three terms have comparable sizes, and the temperature of the temperature control object A increases or decreases due to the effects of these terms.
  • the input current I in to the Peltier element 10 has been positively controlled, but the temperature difference ⁇ T between the two surfaces of the Peltier element 10 has not been positively controlled in applications where heating and heat absorption are repeated.
  • FIG. 5A assumes the case where an air-cooled heat sink is used.
  • FIG. 5B by arranging the preheated heat storage material 15 on the second surface 10b of the Peltier element 10, as shown in FIG. 5B, the temperature difference between the Peltier surfaces can be reduced. .
  • the current supplied to the Peltier element 10 for temperature control can be reduced, and the rise in temperature change during heating and heat absorption can be accelerated.
  • the heat generated by the Peltier element 10 is also reduced accordingly. That is, the temperature difference between both surfaces of the Peltier element 10 is reduced during temperature control, and the Peltier element 10 can be driven with less input power, so that energy efficiency for temperature control is increased.
  • the latent heat type heat storage material 15 in which the phase change temperature is set within the control temperature range is employed as the heat storage material 15.
  • the apparatus can be downsized and the heat storage material 15 can absorb heat.
  • heat dissipation can be set to be executable with a sufficient heat storage capacity.
  • the structure is complicated, and the apparatus is large. It becomes.
  • the temperature of the liquid flowing through the entire system is adjusted separately, energy efficiency is lowered.
  • the temperature control device of the present embodiment by using the latent heat type heat storage material 15 instead of the large fins and the fan installed on the heat radiation surface of the Peltier element 10 of the conventional temperature control device, The size of the device can be reduced. Moreover, since there is no mechanical drive part, such as a fan, it is excellent in silence. In addition, a plurality of protrusions 19 embedded in the heat storage material 15 with respect to the lid 18 are provided. Providing the protrusion 19 increases the contact area between the heat storage material 15 and the lid 18 (heat transfer portion), so that heat transfer between the heat storage material 15 and the Peltier element 10 can be performed quickly and efficiently. It becomes executable.
  • the amount L of the protrusion 19 embedded in the heat storage material 15 is set to be half or more of the depth D of the heat storage material 15. According to this configuration, it is possible to efficiently exchange heat with the portion of the heat storage material 15 located away from the lid portion 18, and the heat storage capacity of the heat storage material 15 can be used more effectively.
  • the preheater 13 for preheating before heat-controlling the heat storage material 15 is provided. According to this configuration, the heat storage material 15 can be heated to the control temperature range or in the vicinity thereof by making the heat storage material 15 higher than room temperature before temperature control. As a result, as described above, the Peltier device 10 can be driven with a small input power, so that the energy efficiency for temperature control increases.
  • the heat storage material 15 Prior to temperature control, the heat storage material 15 is preheated to a temperature lower than the phase change temperature, for example, preheated to a temperature below the control temperature range.
  • the preheating temperature is higher than room temperature and is preferably near the lower limit of the control temperature range.
  • the inventor first conducted an experiment by setting the preheating temperature of the heat storage material 15 to the median value of the control temperature range. At this time, it was found that the temperature of the heat storage material 15 becomes higher than the control temperature range when the number of cycles is equal to or greater than a predetermined number.
  • the preheating temperature is set to a temperature higher than room temperature and lower than the phase change temperature, preferably lower than the lower limit value of the control temperature range.
  • the specific preheating temperature of the heat storage material 15 can be set by confirming in advance according to the control temperature range and the number of cycles. In this way, by setting the initial temperature of the heat storage material 15 to be equal to or lower than the phase change temperature, the temperature of the heat storage material 15 is controlled within a control temperature range over half of the temperature control time during the heating and heat absorption heat treatment. Alternatively, the temperature is in the vicinity thereof, the temperature difference between both surfaces of the Peltier element 10 becomes smaller during temperature control, and the Peltier element 10 can be reliably driven with less input power, so that energy efficiency is improved.
  • the preheating temperature of the heat storage material 15 may be set within the control temperature range, it is preferably set to the lower limit side of the control temperature range.
  • a pair of temperature control apparatuses 1 and 2 having the above-described configuration is used with the temperature control target A interposed therebetween.
  • the temperature control object A can be temperature-controlled with better response.
  • the temperature control object A may be temperature controlled by one temperature control device 1.
  • a pressing plate such as a metal plate or a heat insulating material 14 is attached to the pressurizing mechanism, and the temperature control is performed by the pressing plate and one temperature control device 1. It is good also as an apparatus structure which inserts the object A and controls temperature. Even in such a case, since there is no mechanical drive unit at the time of temperature control, it is possible to achieve quietness and downsizing of the apparatus.
  • FIG. 1 An apparatus structure which employ
  • FIG. 1 The heat storage material 15 is in contact with a heat transfer body (side surface portion 17a) for heat dissipation. According to this configuration, by promoting heat dissipation from the heat storage material 15, it is possible to suppress the temperature increase of the heat storage material 15 during temperature control, and the preheating temperature of the heat storage material 15 is within the control temperature range. Or it can be brought close to the vicinity.
  • a fin-like heat sink may be separately attached to the side surface portion 17 a of the container portion 17.
  • the Peltier element 10 can be used for a temperature control device that repeats heating and heat absorption.
  • it is not necessary to store the amplified product at 4 ° C. after the PCR process, and it can be used for a fully automatic gene analysis apparatus in which size and power consumption are prioritized over the versatility of temperature setting.
  • the temperature control devices 1 and 2 of the present embodiment are not specified for PCR, and are endothermic when there is a high demand for temperature control near the patient's bed and vibration removal of the air cooling fan as in a wine cellar. Suitable for use.
  • the temperature control device of the first example As the temperature control device of the first example, the device described in the embodiment (FIG. 4) was used. For comparison, a temperature control device as shown in FIG. 6 was used as a comparative example.
  • the temperature control device of the comparative example employs an air-cooled heat sink composed of fins and a fan instead of the heat storage material heat sink 11.
  • the temperature control object A was a gene analysis chip described in Japanese Patent No. 5003845, in which 23 reaction vessels were provided.
  • the gene analysis chip is made of polypropylene so as not to inhibit the reaction, has a disk-like outer shape with a diameter of 75 mm and a thickness of 2 mm, and each reaction tank is provided along the outermost periphery of the disk. ing.
  • Each reaction tank has a substantially cylindrical shape.
  • the heat spreader 12 was made of an aluminum alloy having a good thermal conductivity in accordance with the outer shape of the gene analysis chip in order to apply the same temperature to each reaction vessel.
  • the temperature to be controlled is controlled by opening holes for inserting thermocouples in any of the five reaction vessels, installing thermocouples in the reaction vessels, filling each reaction vessel with water for biochemical tests, The temperature was recorded.
  • Example device As Peltier element 10, 9501/242 / 160BS manufactured by Ferrotec Corporation was used.
  • the heat storage material 15 paraffin (JSR Corp. Calgrip) was used. Since this heat storage material 15 has a low paraffin thermal conductivity of 0.2 W / (m ⁇ K), in order to promote heat transfer, the heat storage material container 16 has a heat conductivity of 390 W / (m ⁇ K).
  • the lid 18 was made of a high tough pitch copper alloy, and 73 pins (projections 19) having a diameter of 4 mm and a height of 14 mm were provided.
  • the phase change temperature of the heat storage material 15 is about 72 ° C.
  • the outer size of the heat storage material container 16 is 80 mm wide, 80 mm deep, and 20 mm deep.
  • the total height of the heat storage material container 16 and the heat insulating material 14 is 41 mm.
  • the pins are embedded 14 mm in the depth direction of the heat insulating material 14.
  • FIG. 6 is a schematic cross-sectional view showing a configuration of a temperature control device of a comparative example in a state where the temperature control object A is set.
  • An air-cooled heat sink is disposed on the heat dissipation side (second surface 10 b) of the Peltier element 10.
  • the air-cooled heat sink is composed of fins 51 and fans 52.
  • the height of the air-cooled heat sink is 110 mm.
  • FIG. 7 is a part of a graph showing the time change of the input power to the Peltier element 10 and the time change of the temperature when the temperature control device of the example is driven in the above temperature control method.
  • FIG. 8 is a part of a graph showing the time change of the input power to the Peltier element 10 and the time change of the temperature when the temperature control device of the comparative example is driven in the above temperature control method.
  • electric power is shown by FIG.7 and FIG.8, the direction of an electric current is controlled reversely at the time of temperature rise and temperature fall.
  • FIG.7 and FIG.8 has overlapped and described the graph of the temperature of both the thermal storage materials to the upper and lower temperature control apparatuses, about the temperature of a heat spreader, in order to make a graph intelligible, an upper side is shown. The measured value on the temperature control target side is described. The temperature to be controlled is described in FIGS. 7 and 8 with one well temperature as a representative of the five wells subjected to the measurement described above.
  • the apparatus configuration of the example was equal to or higher than the apparatus configuration of the comparative example, although the size in the height direction of each temperature control apparatus was reduced by 37%. It was found that control was realized. “Equivalent or higher” means that the heating rate is higher in the example than in the comparative example when the power supply is adjusted to a maximum of ⁇ 9 A for comparison.
  • Example device In the first embodiment, a case where a temperature control device in which a pin (protrusion 19) is provided on the lid 18 is shown. On the other hand, the temperature control device of the second embodiment is different from the first embodiment in that the pin (projection 19) is not provided on the lid 18 and the amount of the heat storage material 15 is increased instead.
  • the other configuration is the same as that of the apparatus of the first embodiment. That is, the second embodiment is an embodiment in the case where the temperature control device is not provided with the pin (projection 19).
  • the temperature control (secondary processing) based on the present invention is performed after performing the primary processing as will be described later so that the PCR processing based on the apparatus of the present invention can be completed in 20 cycles.
  • the case is shown as an example. However, if the number of processing cycles of the PCR process in the secondary process is increased, the primary process is unnecessary.
  • the reaction liquid was adjusted so that it might become a composition of Table 2 containing the arrangement
  • the prepared reaction solution was placed in a 96-well plate, set in a real-time PCR system (Roche, “LightCycler”), and held at 95 ° C. for 2 minutes. Subsequently, 40 cycles of 2-step PCR at 95 ° C. for 18 seconds, 66 ° C. for 20 seconds, and finally the reaction was terminated by heating at 99 ° C. for 2 minutes.
  • the solution obtained by the primary treatment was prepared to have the composition shown in Table 3.
  • 260 ⁇ L of the solution after the adjustment was fed to the gene analysis chip described in Japanese Patent No. 5003845, centrifuged using a tabletop centrifuge, and the solution was fed to each reaction well.
  • 20 cycles of 2-step PCR at 93 ° C. for 45 seconds and 62 ° C. for 45 seconds were performed using the temperature control apparatus of the example, and the reaction results were confirmed as described below.
  • each primer in Table 1 and Hawk Taq in Table 2 are dried and solidified in each reaction well in advance.
  • the primers shown in Table 1 are designed so that an amplification product of about 200 bp can be obtained.
  • FIG. 9 is a graph showing the time change of the input power to the Peltier element 10 and the time change of the temperature when the temperature control device of the second embodiment is driven, and FIG. 10 is a partial enlarged view thereof. is there. Also in this second embodiment, it can be seen that the rise in temperature change is good when the control temperature is raised.
  • the first lane (leftmost lane) shown in FIG. 11 is a 20 bp ladder marker (TaKaRa), and the second lane (center lane) was prepared by adjusting the solution obtained from the PCR according to the composition described in Table 3. This was used for further amplification reaction in the gene analysis chip.
  • the third lane (rightmost lane) is prepared by adjusting the solution before PCR treatment according to the composition described in Table 3. As can be seen from FIG. 11, in the second example as well, it was confirmed that the amplification product was obtained in the vicinity of the target band 200 bp, so that the target product was amplified.

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Abstract

　L'invention concerne un dispositif de régulation de la température qui est de taille plus petite et qui consomme moins d'énergie, et qui est également silencieux. Ce dispositif de régulation de la température chauffe un objet A à température régulée à l'aide d'un élément Peltier (10) et/ou absorbe la chaleur en provenance de l'objet A à température régulée de façon à réguler la température de l'objet A à température régulée dans une plage de température régulée préétablie. Parmi les surfaces de l'élément Peltier (10), un dissipateur de chaleur (11) à accumulateur de chaleur est disposé sur la surface dudit élément Peltier (10) sur le côté opposé à la surface en regard de l'objet A à température régulée. Le dissipateur de chaleur (11) à accumulateur de chaleur comprend une partie de transfert de chaleur (18) qui est en contact avec l'élément Peltier (10), et un réservoir de chaleur (15) qui est en contact avec la partie de transfert de chaleur (18). Le réservoir de chaleur (15) est de type à chaleur latente dans lequel la température de changement de phase est dans la plage de température régulée ou à l'intérieur d'une seconde plage de température qui est inférieure à la plage de température régulée.
PCT/JP2016/000256 2015-01-20 2016-01-19 Dispositif de régulation de la température et procédé de régulation de la température WO2016117334A1 (fr)

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KR101964614B1 (ko) * 2018-03-07 2019-04-02 충남대학교산학협력단 웨스턴 블로팅용 전사탱크
JP2021511073A (ja) * 2018-01-24 2021-05-06 思納福（北京）医療科技有限公司Ｓｎｉｐｅｒ（Ｂｅｉｊｉｎｇ）Ｍｅｄｉｃａｌ Ｔｅｃｈｎｏｌｏｇｉｅｓ Ｃｏ．，Ｌｔｄ． 微小液滴の容器、微小液滴の容器製造方法、微小液滴敷き詰め方法、微小液滴生成試薬キット、温度制御装置、微小液滴生成用の油相組成物及びその処理方法

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JP2009171868A (ja) * 2008-01-22 2009-08-06 Toppan Printing Co Ltd 温度制御装置および温度制御方法
JP2010071476A (ja) * 2008-09-16 2010-04-02 Toppan Printing Co Ltd 温度制御装置およびその予熱または予冷方法
JP2013198409A (ja) * 2012-03-23 2013-10-03 Toppan Printing Co Ltd 温度制御装置及び温度制御方法
JP2015064842A (ja) * 2013-09-26 2015-04-09 凸版印刷株式会社 温度制御装置および温度制御方法

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JP2004317041A (ja) * 2003-04-17 2004-11-11 Yaskawa Electric Corp 温度制御装置
JP2007155269A (ja) * 2005-12-07 2007-06-21 Toshiba Corp 冷却装置
JP2009171868A (ja) * 2008-01-22 2009-08-06 Toppan Printing Co Ltd 温度制御装置および温度制御方法
JP2010071476A (ja) * 2008-09-16 2010-04-02 Toppan Printing Co Ltd 温度制御装置およびその予熱または予冷方法
JP2013198409A (ja) * 2012-03-23 2013-10-03 Toppan Printing Co Ltd 温度制御装置及び温度制御方法
JP2015064842A (ja) * 2013-09-26 2015-04-09 凸版印刷株式会社 温度制御装置および温度制御方法

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2021511073A (ja) * 2018-01-24 2021-05-06 思納福（北京）医療科技有限公司Ｓｎｉｐｅｒ（Ｂｅｉｊｉｎｇ）Ｍｅｄｉｃａｌ Ｔｅｃｈｎｏｌｏｇｉｅｓ Ｃｏ．，Ｌｔｄ． 微小液滴の容器、微小液滴の容器製造方法、微小液滴敷き詰め方法、微小液滴生成試薬キット、温度制御装置、微小液滴生成用の油相組成物及びその処理方法
JP7138301B2 (ja) 2018-01-24 2022-09-16 思納福（北京）医療科技有限公司 微小液滴の容器、微小液滴の容器製造方法、微小液滴敷き詰め方法、微小液滴生成試薬キット、温度制御装置、微小液滴生成用の油相組成物及びその処理方法
KR101964614B1 (ko) * 2018-03-07 2019-04-02 충남대학교산학협력단 웨스턴 블로팅용 전사탱크

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