WO2016116044A1 - 一种激光打标控制方法、激光打标头以及激光打标机 - Google Patents

一种激光打标控制方法、激光打标头以及激光打标机 Download PDF

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Publication number
WO2016116044A1
WO2016116044A1 PCT/CN2016/071443 CN2016071443W WO2016116044A1 WO 2016116044 A1 WO2016116044 A1 WO 2016116044A1 CN 2016071443 W CN2016071443 W CN 2016071443W WO 2016116044 A1 WO2016116044 A1 WO 2016116044A1
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WO
WIPO (PCT)
Prior art keywords
rail
laser
sliding device
mirror
marking
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PCT/CN2016/071443
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English (en)
French (fr)
Inventor
居剑
蒋峰
Original Assignee
深圳市创鑫激光股份有限公司
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Application filed by 深圳市创鑫激光股份有限公司 filed Critical 深圳市创鑫激光股份有限公司
Publication of WO2016116044A1 publication Critical patent/WO2016116044A1/zh
Priority to US15/654,587 priority Critical patent/US20170326684A1/en

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/0869—Devices involving movement of the laser head in at least one axial direction
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0643—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising mirrors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/0869—Devices involving movement of the laser head in at least one axial direction
    • B23K26/0876—Devices involving movement of the laser head in at least one axial direction in at least two axial directions
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/009—Working by laser beam, e.g. welding, cutting or boring using a non-absorbing, e.g. transparent, reflective or refractive, layer on the workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
    • B23K26/046—Automatically focusing the laser beam
    • B23K26/048—Automatically focusing the laser beam by controlling the distance between laser head and workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0648—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/10—Devices involving relative movement between laser beam and workpiece using a fixed support, i.e. involving moving the laser beam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/12—Working by laser beam, e.g. welding, cutting or boring in a special atmosphere, e.g. in an enclosure
    • B23K26/127—Working by laser beam, e.g. welding, cutting or boring in a special atmosphere, e.g. in an enclosure in an enclosure
    • B23K26/128—Laser beam path enclosures
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/70—Auxiliary operations or equipment

Definitions

  • the invention relates to the technical field of laser control, in particular to a laser marking control method, a laser marking head and a laser marking machine.
  • a laser marking machine refers to a device that uses a laser beam to illuminate an object to evaporate a surface layer of the object to expose a deep substance, thereby patterning marks, trademarks, and characters on the surface of the object.
  • the laser marking machine is mainly divided into: carbon dioxide laser marking machine, semiconductor laser marking machine, fiber laser marking machine and so on.
  • the laser light emitted by the laser generator in the laser marking head is incident on two mirrors, and the deflection angle of the laser beam is controlled by controlling the reflection angle thereof, thereby controlling the position of the laser light on the object.
  • the reflection angle of the mirror is required, so that the laser marking head is too large in size and takes up a lot of space, and the laser is limited by the angle of reflection.
  • the marking machine cannot achieve large-format marking operations.
  • the technical problem mainly solved by the present invention is to provide a laser marking control method, a laser marking head and a laser marking machine.
  • the laser marking head is not only smaller in size, but also capable of realizing large-scale and large-scale marking operations.
  • a technical solution adopted by the present invention is to provide a laser marking head including a laser generator for emitting laser light, a first guiding rail, a first sliding device, and the first a sliding device is sleeved on the first rail, and the first sliding device is slidable along the first rail; a first mirror, the first mirror is fixed on the first sliding device; a second rail fixed to the first sliding device, the second rail is perpendicular to the first rail; and a second sliding device, the second sliding device is sleeved on the second rail And the second sliding device is slidable along the second rail; the second mirror is fixed on the second sliding device; the laser light emitted by the laser generator is opposite to the first a rail is parallel and incident on the first mirror, the first mirror reflects the laser light to a second mirror, wherein the laser reflected by the first mirror is parallel to the second rail The second mirror reflects the laser downward to locate the marking.
  • the laser marking machine further comprises a focusing lens; the focusing lens is fixed on the second sliding device, and the focusing lens is located below the second mirror, and the focusing lens is used for Laser focusing reflected by the second mirror.
  • the laser marking machine further comprises a collimator; the collimator is located between the laser generator and the first mirror, and the collimator is used to emit the laser generator
  • the laser collimation is a parallel beam.
  • the first sliding device comprises a first stepping motor and a first sliding block, the first sliding block and the first guiding rail are both provided with a thread; the first guiding rail is fixed on the first stepping motor The first slider is screwed to the first rail, the first stepping motor drives the first rail to rotate, and the first slider slides along the first rail; the second slider The device includes a second stepping motor and a second slider, the second slider and the second rail block are provided with a thread; the second stepping motor is fixed to the first slider, the second rail Fixed to the second stepping motor, the second slider is screwed to the second rail, and the second stepping motor drives the second rail to rotate to drive the second slider along the second The two rails slide.
  • a laser marking head including a first guiding rail; a first sliding device, the first sliding device is sleeved on the first guiding rail, And the first sliding device is slidable along the first rail; the second rail is fixed to the first sliding device, and the second rail is perpendicular to the first rail; the second sliding a device, the second sliding device is sleeved on the second rail, and the second sliding device is along the a second guide rail sliding; a laser generator; a mirror, the mirror and the laser generator are both fixed on the second sliding device; the laser light emitted by the laser generator is incident on the mirror, the reflection The mirror reflects the laser downward to locate the marking.
  • the laser marking head further comprises a focusing lens; the focusing lens is fixed on the second sliding device, and the focusing lens is located below the mirror for focusing the reflection of the mirror laser.
  • a laser marking machine including the laser marking machine comprising the above laser marking head, a frame and a marking station;
  • the table is used for carrying the object to be marked, the laser marking head and the marking table are both disposed on the frame, and the laser marking head is located above the marking table, the laser marking head The laser light emitted downward in the middle is incident on the marking table.
  • first guide rail in the laser marking head is parallel to the Y axis of the marking table; the second guide rail in the laser marking head is parallel to the X axis of the marking table; The laser emitted downward in the header is perpendicular to the marking table.
  • the laser marking machine further comprises a lifting device; the lifting device is fixed on the frame, the marking station is arranged on the lifting device, and the lifting device is used for lifting the marking table .
  • the inner side of the first sliding device and the second sliding device in the laser marking head are respectively provided with a grating scale.
  • a laser marking control method including: a laser marking head including a laser generator, a first guiding rail, a first sliding device, a first reflecting mirror, a second rail, a second sliding device and a second mirror, the first sliding device is sleeved on the first rail, and the first sliding device is slidable along the first rail, the first a mirror fixed to the first sliding device, the second rail is fixed to the first sliding device, the second rail is perpendicular to the first rail, and the second sliding device is sleeved at the first a second guide rail, and the second sliding device is slidable along the second guide rail, the second mirror is fixed to the second sliding device, and the laser light emitted by the laser generator and the first guide rail Parallel and incident to the first a mirror, the first mirror reflects the laser light to a second mirror, wherein the laser reflected by the first mirror is parallel to the second rail, and the second mirror is reflected downward
  • the second guide rail of the present invention is fixed on the first sliding device, and when the first sliding device slides along the first guiding rail, the second guiding rail slides along with the first sliding device.
  • the reflection angle of the mirror adjusts the position of the output point of the laser light output by the laser marking head.
  • the laser marking head of the present invention is not only small in size, but also capable of realizing a large-format and large-scale marking operation.
  • FIG. 1 is a schematic structural view of a first embodiment of a laser marking head according to the present invention.
  • FIG. 2 is a schematic structural view of a second embodiment of the laser marking head of the present invention.
  • FIG. 3 is a schematic structural view of an embodiment of a laser marking machine of the present invention.
  • FIG. 4 is a flow chart of an embodiment of a laser marking control method of the present invention.
  • the laser marking head 20 includes a laser generator 21, a first guide rail 22, a first sliding device 23, a first mirror 24, a second rail 25, a second sliding device 26, and a second mirror 27.
  • the first sliding device 23 is sleeved on the first rail 22, and the first sliding device 23 is slidable along the first rail 22, the first mirror 24 is fixed on the first sliding device 23, and the second rail 25 is fixed on the first rail On the sliding device 23, the second rail 25 is perpendicular to the first rail 22, the second sliding device 26 is sleeved on the second rail 25, and the second sliding device 26 is slidable along the second rail 25, and the second mirror 27 is fixed to On the second sliding device 26, the laser light emitted by the laser generator 21 is parallel to the first guide rail 22 and incident on the first mirror 24, and the first mirror 24 reflects the laser light to the second mirror 27, wherein the first reflection The laser light reflected by the mirror 24 is parallel to the second guide rail 25, and the second mirror 27 reflects the laser light downward.
  • the second rail 25 is perpendicular to the first rail 22, and the first rail 22 and the second rail 25 are respectively the Y-axis and the X-axis in the same plane, because the second rail 25 is fixed to the first sliding.
  • the first sliding device 23 slides within the first guide rail 22, synchronously adjusting the coordinates of the first mirror 24 and the second mirror 27 on the Y-axis, and the second sliding device 26 is on the second rail 25.
  • the coordinates of the second mirror 27 on the X-axis are adjusted, thereby adjusting the coordinates of the laser light reflected by the second mirror 27 on the Y-axis and the X-axis, thereby adjusting the marking coordinates of the laser marking head 20.
  • the first sliding device 23 drives the first mirror 24 to slide on the first guide rail 22, and the laser light emitted by the laser generator 21 remains incident on the first stage.
  • the angle of reflection of the laser light reflected by the first mirror 24 remains unchanged, further, due to the first mirror 24 and The second mirror 27 moves in the same direction in synchronization, so that the laser light is reflected by the first mirror 24 and remains incident on the second mirror 27.
  • the laser light reflected by the first mirror 24 is parallel to the second rail 25, and the second sliding device 26 drives the second mirror 27 to slide on the second rail 25, the laser light reflected by the first mirror 24 remains incident on the second mirror 25. On the second mirror 27, the angle of incidence remains unchanged.
  • the first sliding device 23 includes a first stepping motor 231 and a first slider 232.
  • Second sliding device 26 A second stepping motor 261 and a second slider 262 are included.
  • the first rail 22, the first slider 232, the second rail 25, and the second slider 262 are each provided with a thread.
  • the first guide rail 22 is fixed to the first stepping motor 231, the first slider 232 is screwed to the first rail 22, and the first stepping motor 231 drives the first rail 22 to rotate, and drives the first slider 232 along the first rail. 22 slides.
  • the second stepping motor 261 is fixed on the first slider 232, the second rail 25 is fixed on the second stepping motor 261, the second slider 262 is screwed to the second rail 25, and the second stepping motor 261 is connected.
  • the second guide rail 25 is driven to rotate, and the second slider 262 is driven to slide along the second guide rail 25.
  • the sliding manner of the first sliding device 23 on the first rail 22 and the sliding manner of the second sliding device 26 on the second rail 25 are not limited to the above manner, for example, the first rail 22 and the second rail 25 are both grooves. Both the first sliding device 23 and the second sliding device 26 slide within the recess.
  • a grating scale (not shown) is disposed on the inner side of the first sliding device 23 and the second sliding device 26, and the moving distances of the first reflecting mirror 24 and the second reflecting mirror 27 are measured by the grating scale.
  • a grating scale (not shown) is disposed on the first rail 22 and the second rail 25, and the moving distances of the first slider 232 and the second slider 262 are measured by the grating scale, thereby measuring the first mirror 24 and the second reflection. The moving distance of the mirror 27.
  • the laser marking head 20 also includes a focusing lens 28, a collimator 29, and a housing (not shown).
  • the focus lens 28 is fixed below the second slider 26, and the focus lens 28 and the second mirror 27 move in synchronization, wherein the focus lens 28 is located below the second mirror 27, and the focus lens 28 is used for the second mirror 27 Reflected laser focusing.
  • the collimator 29 is located between the laser generator 21 and the first mirror 24, and the collimator 29 is used to collimate the laser light emitted by the laser generator 21 into a parallel beam.
  • the first stepping motor 231 is fixed to the inner surface of the casing, and the laser generator 21 and the collimator 29 are fixed to the inner surface of the casing or the first rail 22 is away from the other end of the first stepping motor 231.
  • An opening (not shown) is disposed on the housing, and the laser light reflected by the second mirror 27 is emitted through the opening.
  • the housing may further include a lens (not shown), and the lens is disposed at the opening.
  • the first sliding device and the second sliding device are respectively slid along the first rail and the second rail, and the first mirror and the second mirror are respectively fixed on the first sliding device and the second sliding device.
  • a laser beam emitted by the laser generator is parallel to the first rail and incident on the first mirror
  • the laser light reflected by the first mirror is parallel to the second rail and enters the second mirror
  • the second The mirror reflects the laser downward, slides in the first rail through the first sliding device, synchronously adjusts the coordinates of the first mirror and the second mirror on the Y-axis, and slides on the second rail through the second sliding device Adjusting the coordinates of the second mirror on the X axis, thereby adjusting the coordinates of the laser reflected by the second mirror on the Y axis and the X axis, thereby adjusting the coordinates of the marking of the laser marking head, compared to the passing of the mirror
  • the reflection angle adjusts the position of the output point of the laser light output by the laser marking head.
  • the laser marking head 30 includes a first guide rail 31, a first slide device 32, a second guide rail 33, a second slide device 34, a laser generator 35, and a mirror 36.
  • the first sliding device 32 is sleeved on the first rail 31, and the first sliding device 32 is slidable along the first rail 31, the second rail 33 is fixed on the first sliding device 32, and the second rail 33 and the first rail are 31 is vertical, the second sliding device 34 is sleeved on the second guide rail 33, and the second sliding device 34 is slidable along the second guiding rail 33.
  • the mirror 36 and the laser generator 35 are both fixed on the second sliding device 34, and the laser light is generated. The laser light emitted from the device 35 is incident on the mirror 36, which reflects the laser light downward.
  • the second guide rail 33 slides along with the first sliding device 32, thereby adjusting the Y-axis coordinate of the second guide rail 33, thereby adjusting the Y-axis coordinate of the mirror 36, and the second sliding device 34 slides along the second guide rail 33.
  • the X-axis coordinates of the mirror 36 are adjusted to adjust the coordinates of the laser marking head 30.
  • the first sliding device 32 includes a first stepping motor 321 and a first slider 322.
  • the second sliding device 34 includes a second stepping motor 341 and a second slider 342.
  • the first rail 31, the first slider 322, the second rail 33, and the second slider 342 are each provided with a thread.
  • the first guide rail 31 is fixed to the first stepping motor 321
  • the first slider 322 is screwed to the first rail 31
  • the first stepping motor 321 drives the first rail 31 to rotate, and drives the first slider 322 along the first rail. 31 slides.
  • the second stepping motor 341 is fixed on the first slider 322, the second rail 33 is fixed on the second stepping motor 341, the second slider 342 is screwed to the second rail 33, and the second stepping motor 341 is connected.
  • the second guide rail 33 is driven to rotate, and the second slider 342 is driven to slide along the second guide rail 33.
  • the sliding manner of the first sliding device 32 on the first rail 31 and the sliding manner of the second sliding device 34 on the second rail 33 are not limited to the above manner, for example, the first rail 31 and the second rail 33 are both grooves. Both the first slide 32 and the second slide 34 slide within the recess.
  • the laser marking head 30 also includes a focusing lens 37 and a collimator 38.
  • the focus lens 37 is fixed to the second slider 34, and the focus lens 37 and the mirror 36 are moved in synchronization, wherein the focus lens 37 is positioned below the mirror 36, and the focus lens 37 is used to focus the laser light reflected by the mirror 36.
  • the collimator 38 is located between the laser generator 35 and the mirror 36, and the collimator 38 is used to collimate the laser light emitted by the laser generator 35 into a parallel beam.
  • the second rail is fixed to the first sliding device.
  • the first sliding device slides along the first rail
  • the second rail slides with the first sliding device, thereby adjusting the Y-axis coordinate of the second rail.
  • the second sliding device slides along the second guide rail, adjusting the X-axis coordinate of the mirror, thereby adjusting the coordinates of the laser marking head, and adjusting the laser marking head compared to the reflection angle through the mirror.
  • the laser marking head of the present invention is not only small in size, but also capable of achieving a large-format, large-span marking operation.
  • the laser marking machine 40 includes a laser marking head 41, a frame 42 and a marking table 43.
  • the marking table 43 is used for carrying the object to be marked, the laser marking head 41 and the marking table 43 are fixed on the frame 42, and the laser marking head 41 is located above the marking table 43, and the laser marking head 41 is The downwardly emitted laser light is incident on the marking table 43 to mark the object to be marked.
  • the specific structure of the laser marking head 41 can be referred to the above embodiment, and details are not described herein again.
  • the first guide rail in the laser marking head 41 is parallel to the Y axis of the marking table
  • the second guide rail in the laser marking head 41 is parallel to the X axis of the marking table, and is emitted downward from the laser marking head 41.
  • the laser is perpendicular to the marking table 43.
  • the second rail is fixed to the first sliding device.
  • the first sliding device slides along the first rail
  • the second rail slides with the first sliding device, thereby adjusting the Y-axis coordinate of the second rail.
  • the second sliding device slides along the second guide rail, adjusting the X-axis coordinate of the mirror, thereby adjusting the coordinates of the laser marking head, and adjusting the laser marking head compared to the reflection angle of the mirror
  • the laser marking head of the present invention is not only small in size, but also capable of achieving a large-format, large-span marking operation.
  • the present invention also provides an embodiment of a laser marking control method. Please refer to Figure 4, where the laser marking head
  • the method includes:
  • Step S501 receiving a marking instruction
  • the marking instruction is used to indicate laser marking.
  • Step S502 parsing a marking instruction, acquiring laser control parameters and marking coordinates, wherein the laser control parameters include marking power, laser frequency, pulse width, first mirror control parameters, and second mirror control parameters;
  • the laser control parameters are used to control the laser output to meet the requirements of the laser
  • the marking power range is 1-20
  • the laser frequency is adjustable
  • the size is determined by the specific marking material
  • the specific range is 25-60Khz
  • pulse width The range is 80-140 ns or 4-260 ns
  • the pulse width of the Q-switched laser is 80-140 ns
  • the pulse width of the mopa tunable laser is 4-260 ns.
  • the first mirror control parameter and the second mirror control parameter are The angle of incidence is determined.
  • the marking coordinates refer to the position of the laser marking.
  • Step S503 controlling the first sliding device and the second sliding device to slide, so that the position of the output point of the laser light output by the laser marking head is the marking coordinate;
  • Step S504 Control the laser generator to emit laser marking according to the laser control parameter.
  • the second rail is fixed to the first sliding device.
  • the first sliding device slides along the first rail
  • the second rail slides with the first sliding device, thereby adjusting the Y-axis coordinate of the second rail.
  • the second sliding device slides along the second guide rail, adjusting the X-axis coordinate of the mirror, thereby adjusting the coordinates of the laser marking head, and controlling the sliding of the second sliding device and the second sliding device, so that
  • the laser position output by the laser marking head is the marking coordinate
  • the laser generator is controlled to emit laser marking according to the laser control parameter
  • the output point of the laser output by the laser marking head is adjusted compared to the reflection angle of the mirror.
  • the present invention can realize a marking operation with a large format and a large span.

Abstract

本发明公开了一种激光打标控制方法、激光打标头以及激光打标机，激光打标头包括激光发生器，用于发射激光；第一导轨；第一滑动装置，可沿第一导轨滑动；第一反射镜，固定于第一滑动装置上；第二导轨，固定于第一滑动装置上，第二导轨与第一导轨垂直；第二滑动装置，可沿第二导轨滑动；第二反射镜，固定于第二滑动装置上；激光发生器所发射的激光与第一导轨平行且入射至第一反射镜，第一反射镜将激光反射至第二反射镜，第一反射镜反射的激光与第二导轨平行，第二反射镜向下反射激光，定位打标。本发明的激光打标头可大幅面、跨度大的打标。

Description

一种激光打标控制方法、激光打标头以及激光打标机 【技术领域】
本发明涉及激光控制技术领域，特别是涉及一种激光打标控制方法、激光打标头以及激光打标机。
【背景技术】
激光打标机是指利用激光束照射物体，以使物体表层蒸发露出深层物质，从而在物体的表面上刻画出图案、商标和文字等标记的设备。根据激光生成方式划分，激光打标机主要分为：二氧化碳激光打标机，半导体激光打标机、光纤激光打标机等等。
为了在物体表面上刻画出精美的标记，需要准确控制激光打标机中的激光打标头所输出的激光照射在物体上的位置。现有技术中，是将激光打标头中的激光发生器所发射的激光入射至两个反射镜上，通过控制其反射角度，实现激光光束的偏转，进而控制激光照射在物体上的位置。而通过控制反射镜的反射角度来控制激光光束的偏转的方式，需要较大的空旷空间，从而使得激光打标头体积过大，占用空间多等缺点，另外，由于受到反射角度的限制，激光打标机无法实现大幅面的打标操作。
【发明内容】
本发明主要解决的技术问题是提供一种激光打标控制方法、激光打标头以及激光打标机，激光打标头不仅体积更小，并且能够实现大幅面、跨度大的打标操作。
为解决上述技术问题，本发明采用的一个技术方案是：提供一种激光打标头，包括激光发生器，所述激光发生器用于发射激光；第一导轨；第一滑动装置，所述第一滑动装置套接在所述第一导轨上，并且所述第一滑动装置可沿所述第一导轨滑动；第一反射镜，所述第一反射镜固定于所述第一滑动装置上； 第二导轨，所述第二导轨固定于所述第一滑动装置上，所述第二导轨与第一导轨垂直；第二滑动装置，所述第二滑动装置套接在所述第二导轨，并且所述第二滑动装置可沿所述第二导轨滑动；第二反射镜，所述第二反射镜固定于所述第二滑动装置上；所述激光发生器所发射的激光与所述第一导轨平行且入射至所述第一反射镜，所述第一反射镜将所述激光反射至第二反射镜，其中，所述第一反射镜反射的激光与所述第二导轨平行，所述第二反射镜向下反射所述激光，以定位打标。
其中，所述激光打标机还包括聚焦透镜；所述聚焦透镜固定于所述第二滑动装置上，并且所述聚焦透镜位于所述第二反射镜的下方，所述聚焦透镜用于对所述第二反射镜反射的激光聚焦。
其中，所述激光打标机还包括准直器；所述准直器位于所述激光发生器与所述第一反射镜之间，所述准直器用于将所述激光发生器所发射的激光准直为平行光束。
其中，所述第一滑动装置包括第一步进电机和第一滑块，所述第一滑块和第一导轨均设置有螺纹；所述第一导轨固定于所述第一步进电机上，所述第一滑块与所述第一导轨螺接，所述第一步进电机驱动所述第一导轨转动，带动所述第一滑块沿第一导轨滑动；所述第二滑块装置包括第二步进电机和第二滑块，所述第二滑块和第二导轨块设置有螺纹；所述第二步进电机固定于所述第一滑块上，所述第二导轨固定于所述第二步进电机上，所述第二滑块与所述第二导轨螺接，所述第二步进电机驱动所述第二导轨转动，带动所述第二滑块沿第二导轨滑动。
为解决上述技术问题，本发明采用的另一个技术方案是：提供一种激光打标头，包括第一导轨；第一滑动装置，所述第一滑动装置套接在所述第一导轨上，并且所述第一滑动装置可沿所述第一导轨滑动；第二导轨，所述第二导轨固定于所述第一滑动装置上，并且所述第二导轨与第一导轨垂直；第二滑动装置，所述第二滑动装置套接在所述第二导轨，并且所述第二滑动装置可沿所述 第二导轨滑动；激光发生器；反射镜，所述反射镜和激光发生器均固定于所述第二滑动装置上；所述激光发生器所发射的激光入射至所述反射镜，所述反射镜向下反射所述激光，以定位打标。
其中，所述激光打标头还包括聚焦透镜；所述聚焦透镜固定于所述第二滑动装置上，并且所述聚焦透镜位于所述反射镜的下方，用于聚焦所述反射镜所反射的激光。
为解决上述技术问题，本发明采用的又一个技术方案是：提供一种激光打标机，包括所述激光打标机包括上述的激光打标头、机架和打标台；所述打标台用于承载待打标物，所述激光打标头和打标台均设置于所述机架上，并且所述激光打标头位于所述打标台的上方，所述激光打标头中向下发射的激光入射至所述打标台上。
其中，所述激光打标头中的第一导轨与所述打标台的Y轴线平行；所述激光打标头中的第二导轨与所述打标台的X轴线平行；所述激光打标头中向下发射的激光与打标台垂直。
其中，所述激光打标机还包括升降装置；所述升降装置固定于所述机架上，所述打标台设置于所述升降装置上，所述升降装置用于升降所述打标台。
其中，所述激光打标头中的第一滑动装置和第二滑动装置的内侧分别设置有光栅尺。
为解决上述技术问题，本发明采用的再一个技术方案是：提供一种激光打标控制方法，包括：激光打标头包括激光发生器、第一导轨、第一滑动装置、第一反射镜、第二导轨、第二滑动装置和第二反射镜，所述第一滑动装置套接在所述第一导轨上，并且所述第一滑动装置可沿所述第一导轨滑动，所述第一反射镜固定于所述第一滑动装置上，所述第二导轨固定于所述第一滑动装置上，所述第二导轨与第一导轨垂直，所述第二滑动装置套接在所述第二导轨，并且所述第二滑动装置可沿所述第二导轨滑动，所述第二反射镜固定于所述第二滑动装置上，所述激光发生器所发射的激光与所述第一导轨平行且入射至所述第 一反射镜，所述第一反射镜将所述激光反射至第二反射镜，其中，所述第一反射镜反射的激光与所述第二导轨平行，所述第二反射镜向下反射所述激光，或者，所述激光打标头包括激光发生器、第一导轨、第一滑动装置、第二导轨、第二滑动装置和反射镜，所述第一滑动装置套接在所述第一导轨上，并且所述第一滑动装置可沿所述第一导轨滑动，所述第二导轨固定于所述第一滑动装置上，并且所述第二导轨与第一导轨垂直，所述第二滑动装置套接在所述第二导轨，并且所述第二滑动装置可沿所述第二导轨滑动，所述反射镜和激光发生器均固定于所述第二滑动装置上，所述激光发生器所发射的激光入射至所述反射镜，所述反射镜向下反射所述激光，方法包括：接收打标指令；解析所述打标指令，获取所述激光控制参数和打标坐标；根据所述打标坐标控制所述第二滑动装置和第二滑动装置滑动，以使所述激光打标头所输出的激光的输出点的位置为所述打标坐标；根据所述激光控制参数控制激光发生器发射激光打标。
本发明的有益效果是：区别于现有技术的情况，本发明第二导轨固定于第一滑动装置上，在第一滑动装置沿第一导轨滑动时，第二导轨随第一滑动装置滑动，从而调节第二导轨的Y轴坐标，进而调节反射镜的Y轴坐标，第二滑动装置沿第二导轨滑动，调节反射镜的X轴坐标，进而调节激光打标头的坐标，相比于通过反射镜的反射角度调节激光打标头所输出的激光的输出点的位置的方式，本发明的激光打标头不仅体积小，而且能够实现大幅面、跨度大的打标操作。
【附图说明】
图1是本发明激光打标头第一实施方式的结构示意图；
图2是本发明激光打标头第二实施方式的结构示意图；
图3是本发明激光打标机实施方式的结构示意图；
图4是本发明激光打标控制方法实施方式的流程图。
【具体实施方式】
下面结合附图和实施方式对本发明进行详细说明。
请参阅图1，激光打标头20包括激光发生器21、第一导轨22、第一滑动装置23、第一反射镜24、第二导轨25、第二滑动装置26和第二反射镜27。
第一滑动装置23套接在第一导轨22上，并且第一滑动装置23可沿第一导轨22滑动，第一反射镜24固定于第一滑动装置23上，第二导轨25固定于第一滑动装置23上，第二导轨25与第一导轨22垂直，第二滑动装置26套接在第二导轨25，并且第二滑动装置26可沿第二导轨25滑动，第二反射镜27固定于第二滑动装置26上，激光发生器21所发射的激光与第一导轨22平行且入射至第一反射镜24，第一反射镜24将激光反射至第二反射镜27，其中，第一反射镜24反射的激光与第二导轨25平行，第二反射镜27向下反射激光。需要说明的是：第二导轨25与第一导轨22垂直，相当于，第一导轨22和第二导轨25分别为同一平面内的Y轴和X轴，由于第二导轨25固定于第一滑动装置23上时，第一滑动装置23在第一导轨22内滑动，同步调整第一反射镜24和第二反射镜27的在Y轴上的坐标，第二滑动装置26在第二导轨25上滑动时，调整第二反射镜27在X轴上的坐标，从而调整第二反射镜27反射的激光在Y轴和X轴上的坐标，进而调整激光打标头20的打标坐标。另外，由于激光发生器21所发射的激光与第一导轨22平行，则第一滑动装置23带动第一反射镜24在第一导轨22上滑动，激光发生器21所发射的激光保持入射到第一反射镜24内，并且激光入射到第一反射镜24的入射角度也保持不变，则激光经第一反射镜24反射的反射角也保持不变，进一步的，由于第一反射镜24和第二反射镜27同步同方向移动，所以激光经第一反射镜24反射，保持入射到第二反射镜27。另外，由于第一反射镜24反射的激光与第二导轨25平行，第二滑动装置26带动第二反射镜27在第二导轨25上滑动时，第一反射镜24反射的激光保持入射到第二反射镜27上，并且入射的角度也保持不变。
第一滑动装置23包括第一步进电机231和第一滑块232。第二滑动装置26 包括第二步进电机261和第二滑块262。第一导轨22、第一滑块232、第二导轨25和第二滑块262均设置有螺纹。第一导轨22固定于第一步进电机231上，第一滑块232与第一导轨22螺接，第一步进电机231驱动第一导轨22转动，带动第一滑块232沿第一导轨22滑动。第二步进电机261固定于所述第一滑块232上，第二导轨25固定于第二步进电机261上，第二滑块262与第二导轨25螺接，第二步进电机261驱动第二导轨25转动，带动第二滑块262沿第二导轨25滑动。当然，第一滑动装置23在第一导轨22的滑动方式和第二滑动装置26在第二导轨25上滑动方式不限于上述方式，例如：第一导轨22和第二导轨25均为凹槽，第一滑动装置23和第二滑动装置26均在凹槽内滑动。进一步的，第一滑动装置23和第二滑动装置26的内侧上均设置有光栅尺(图未示)，通过光栅尺测量第一反射镜24和第二反射镜27的移动距离，具体的，第一导轨22和第二导轨25上设置有光栅尺(图未示)，通过光栅尺测量第一滑块232和第二滑块262的移动距离，进而测量第一反射镜24和第二反射镜27的移动距离。
激光打标头20还包括聚焦透镜28、准直器29和壳体(图未示)。
聚焦透镜28固定于第二滑动装置26下方，并且聚焦透镜28和第二反射镜27同步移动，其中，聚焦透镜28位于第二反射镜27的下方，聚焦透镜28用于对第二反射镜27反射的激光聚焦。准直器29位于激光发生器21与第一反射镜24之间，准直器29用于将激光发生器21所发射的激光准直为平行光束。第一步进电机231固定于壳体的内表面，激光发生器21和准直器29固定于壳体的内表面或者第一导轨22远离第一步进电机231的另一端。壳体上设置有开口(图未示)，第二反射镜27所反射的激光经开口射出，当然，壳体还可包括镜片(图未示)，镜片设置于开口处。
在本发明实施方式中，第一滑动装置和第二滑动装置可分别沿第一导轨和第二导轨滑动，第一反射镜和第二反射镜分别固定于第一滑动装置和第二滑动装置上，激光发生器所发射的激光与所述第一导轨平行且入射至所述第一反射镜，所述第一反射镜反射的激光与第二导轨平行并且入至第二反射镜，第二反 射镜向下反射激光，通过第一滑动装置在第一导轨内滑动，同步调整第一反射镜和第二反射镜的在Y轴上的坐标，通过第二滑动装置在第二导轨上滑动时，调整第二反射镜在X轴上的坐标，从而调整第二反射镜反射的激光在Y轴和X轴上的坐标，进而调整激光打标头打标的坐标，相比于通过反射镜的反射角度调节激光打标头所输出的激光的输出点的位置的方式，本发明的激光打标头不仅体积小，而且能够实现大幅面、跨度大的打标操作。
请参阅图2，激光打标头30包括第一导轨31、第一滑动装置32、第二导轨33、第二滑动装置34、激光发生器35和反射镜36。
第一滑动装置32套接在第一导轨31上，并且第一滑动装置32可沿第一导轨31滑动，第二导轨33固定于第一滑动装置32上，并且第二导轨33与第一导轨31垂直，第二滑动装置34套接在第二导轨33，并且第二滑动装置34可沿第二导轨33滑动，反射镜36和激光发生器35均固定于第二滑动装置34上，激光发生器35所发射的激光入射至反射镜36，反射镜36向下反射激光。需要说明的是：第二导轨33随第一滑动装置32滑动，从而调节第二导轨33的Y轴坐标，进而调节反射镜36的Y轴坐标，第二滑动装置34沿第二导轨33滑动，调节反射镜36的X轴坐标，进而调节激光打标头30的坐标。
第一滑动装置32包括第一步进电机321和第一滑块322。第二滑动装置34包括第二步进电机341和第二滑块342。第一导轨31、第一滑块322、第二导轨33和第二滑块342均设置有螺纹。第一导轨31固定于第一步进电机321上，第一滑块322与第一导轨31螺接，第一步进电机321驱动第一导轨31转动，带动第一滑块322沿第一导轨31滑动。第二步进电机341固定于所述第一滑块322上，第二导轨33固定于第二步进电机341上，第二滑块342与第二导轨33螺接，第二步进电机341驱动第二导轨33转动，带动第二滑块342沿第二导轨33滑动。当然，第一滑动装置32在第一导轨31的滑动方式和第二滑动装置34在第二导轨33上滑动方式不限于上述方式，例如：第一导轨31和第二导轨33均为凹槽，第一滑动装置32和第二滑动装置34均在凹槽内滑动。
激光打标头30还包括聚焦透镜37和准直器38。聚焦透镜37固定于第二滑动装置34上，并且聚焦透镜37和反射镜36同步移动，其中，聚焦透镜37位于反射镜36的下方，聚焦透镜37用于对反射镜36反射的激光聚焦。准直器38位于激光发生器35与反射镜36之间，准直器38用于将激光发生器35所发射的激光准直为平行光束。
在本发明实施方式中，第二导轨固定于第一滑动装置上，在第一滑动装置沿第一导轨滑动时，第二导轨随第一滑动装置滑动，从而调节第二导轨的Y轴坐标，进而调节反射镜的Y轴坐标，第二滑动装置沿第二导轨滑动，调节反射镜的X轴坐标，进而调节激光打标头的坐标，相比于通过反射镜的反射角度调节激光打标头所输出的激光的输出点的位置的方式，本发明的激光打标头不仅体积小，而且能够实现大幅面、跨度大的打标操作。
请参图3，激光打标机40包括激光打标头41、机架42和打标台43。打标台43用于承载待打标物，激光打标头41和打标台43均固定于机架42上，并且激光打标头41位于打标台43的上方，激光打标头41中向下发射的激光入射至打标台43上，从而对待打标物进行打标。
值得说明的是：激光打标头41的具体结构可参阅上述实施方式，此处不再一一赘述。另外，激光打标头41中的第一导轨与打标台的Y轴线平行，激光打标头41中的第二导轨与打标台的X轴线平行，激光打标头41中向下发射的激光与打标台43垂直。
在本发明实施方式中，第二导轨固定于第一滑动装置上，在第一滑动装置沿第一导轨滑动时，第二导轨随第一滑动装置滑动，从而调节第二导轨的Y轴坐标，调用反射镜的Y轴坐标，第二滑动装置沿第二导轨滑动，调节反射镜的X轴坐标，进而调节激光打标头的坐标，相比于通过反射镜的反射角度调节激光打标头所输出的激光的输出点的位置的方式，本发明的激光打标头不仅体积小，而且能够实现大幅面、跨度大的打标操作。
本发明还提供激光打标控制方法实施方式。请参阅图4，其中，激光打标头 的具体结构可参阅上述实施方式，此处不再一一赘述，方法包括：
步骤S501：接收打标指令；
打标指令用于指示进行激光打标。
步骤S502：解析打标指令，获取激光控制参数和打标坐标，所述激光控制参数包括打标功率、激光频率、脉冲宽度、第一反射镜控制参数和第二反射镜控制参数；
其中，激光控制参数用于控制激光发生器输出符合要求的激光，打标功率的范围为1-20,激光频率可调，其大小由具体打标材料决定，具体范围在25-60Khz，脉冲宽度的范围为80-140ns或4-260ns，调Q激光器的脉冲宽度为80-140ns，mopa可调激光器的脉冲宽度为4-260ns，所述第一反射镜控制参数和第二反射镜控制参数由入射角决定。打标坐标是指激光打标的位置。
步骤S503：控制第一滑动装置和第二滑动装置滑动，以使激光打标头所输出的激光的输出点的位置为打标坐标；
步骤S504：根据激光控制参数控制激光发生器发射激光打标。
在本发明实施方式中，第二导轨固定于第一滑动装置上，在第一滑动装置沿第一导轨滑动时，第二导轨随第一滑动装置滑动，从而调节第二导轨的Y轴坐标，调用反射镜的Y轴坐标，第二滑动装置沿第二导轨滑动，调节反射镜的X轴坐标，进而调节激光打标头的坐标，通过控制第二滑动装置和第二滑动装置滑动，以使激光打标头所输出的激光位置为打标坐标，然后根据激光控制参数控制激光发生器发射激光打标，相比于通过反射镜的反射角度调节激光打标头所输出的激光的输出点的位置的方式，本发明能够实现大幅面、跨度大的打标操作。
以上所述仅为本发明的实施方式，并非因此限制本发明的专利范围，凡是利用本发明说明书及附图内容所作的等效结构或等效流程变换，或直接或间接运用在其他相关的技术领域，均同理包括在本发明的专利保护范围内。

Claims (11)

  1. 一种激光打标头，其特征在于，包括：
    激光发生器，所述激光发生器用于发射激光；
    第一导轨；
    第一滑动装置，所述第一滑动装置套接在所述第一导轨上，并且所述第一滑动装置可沿所述第一导轨滑动；
    第一反射镜，所述第一反射镜固定于所述第一滑动装置上；
    第二导轨，所述第二导轨固定于所述第一滑动装置上，所述第二导轨与第一导轨垂直；
    第二滑动装置，所述第二滑动装置套接在所述第二导轨，并且所述第二滑动装置可沿所述第二导轨滑动；
    第二反射镜，所述第二反射镜固定于所述第二滑动装置上；
    所述激光发生器所发射的激光与所述第一导轨平行且入射至所述第一反射镜，所述第一反射镜将所述激光反射至第二反射镜，其中，所述第一反射镜反射的激光与所述第二导轨平行，所述第二反射镜向下反射所述激光，以定位打标。
  2. 根据权利要求1所述的激光打标头，其特征在于，
    所述激光打标头还包括聚焦透镜；
    所述聚焦透镜固定于所述第二滑动装置上，并且所述聚焦透镜位于所述第二反射镜的下方，所述聚焦透镜用于对所述第二反射镜反射的激光聚焦。
  3. 根据权利要求1所述的激光打标头，其特征在于，
    所述激光打标头还包括准直器；
    所述准直器位于所述激光发生器与所述第一反射镜之间，所述准直器用于将所述激光发生器所发射的激光准直为平行光束。
  4. 根据权利要求1～3中任意一项所述的激光打标头，其特征在于，
    所述第一滑动装置包括第一步进电机和第一滑块，所述第一滑块和第一导轨均设置有螺纹；
    所述第一导轨固定于所述第一步进电机上，所述第一滑块与所述第一导轨螺接，所述第一步进电机驱动所述第一导轨转动，带动所述第一滑块沿第一导轨滑动；
    所述第二滑动装置包括第二步进电机和第二滑块，所述第二滑块和第二导轨块设置有螺纹；
    所述第二步进电机固定于所述第一滑块上，所述第二导轨固定于所述第二步进电机上，所述第二滑块与所述第二导轨螺接，所述第二步进电机驱动所述第二导轨转动，带动所述第二滑块沿第二导轨滑动。
  5. 一种激光打标头，其特征在于，包括：
    第一导轨；
    第一滑动装置，所述第一滑动装置套接在所述第一导轨上，并且所述第一滑动装置可沿所述第一导轨滑动；
    第二导轨，所述第二导轨固定于所述第一滑动装置上，并且所述第二导轨与第一导轨垂直；
    第二滑动装置，所述第二滑动装置套接在所述第二导轨，并且所述第二滑动装置可沿所述第二导轨滑动；
    激光发生器；
    反射镜，所述反射镜和激光发生器均固定于所述第二滑动装置上；
    所述激光发生器所发射的激光入射至所述反射镜，所述反射镜向下反射所述激光，以定位打标。
  6. 根据权利要求5所述的激光打标头，其特征在于，
    所述激光打标头还包括聚焦透镜；
    所述聚焦透镜固定于所述第二滑动装置上，并且所述聚焦透镜位于所述反射镜的下方，用于聚焦所述反射镜所反射的激光。
  7. 一种激光打标机，其特征在于，
    所述激光打标机包括机架、打标台和如权利要求1～6中任意一项的激光打标头；
    所述打标台用于承载待打标物，所述激光打标头和打标台均设置于所述机架上，并且所述激光打标头位于所述打标台的上方，所述激光打标头中向下发射的激光入射至所述打标台上。
  8. 根据权利要求7所述的激光打标机，其特征在于，
    所述激光打标头中的第一导轨与所述打标台的Y轴线平行；
    所述激光打标头中的第二导轨与所述打标台的X轴线平行；
    所述激光打标头中向下发射的激光与打标台垂直。
  9. 根据权利要求7或者8所述的激光打标机，其特征在于，
    所述激光打标机还包括升降装置；
    所述升降装置固定于所述机架上，所述打标台设置于所述升降装置上，所述升降装置用于升降所述打标台。
  10. 根据权利要求7或者8所述的激光打标机，其特征在于，所述激光打标头中的第一滑动装置和第二滑动装置的内侧分别设置有光栅尺。
  11. 一种激光打标控制方法，其特征在于，
    激光打标头包括激光发生器、第一导轨、第一滑动装置、第一反射镜、第二导轨、第二滑动装置和第二反射镜，所述第一滑动装置套接在所述第一导轨上，并且所述第一滑动装置可沿所述第一导轨滑动，所述第一反射镜固定于所述第一滑动装置上，所述第二导轨固定于所述第一滑动装置上，所述第二导轨与第一导轨垂直，所述第二滑动装置套接在所述第二导轨，并且所述第二滑动装置可沿所述第二导轨滑动，所述第二反射镜固定于所述第二滑动装置上，所述激光发生器所发射的激光与所述第一导轨平行且入射至所述第一反射镜，所述第一反射镜将所述激光反射至第二反射镜，其中，所述第一反射镜反射的激光与所述第二导轨平行，所述第二反射镜向下反射所述激光，
    或者，
    所述激光打标头包括激光发生器、第一导轨、第一滑动装置、第二导轨、第二滑动装置和反射镜，所述第一滑动装置套接在所述第一导轨上，并且所述第一滑动装置可沿所述第一导轨滑动，所述第二导轨固定于所述第一滑动装置上，并且所述第二导轨与第一导轨垂直，所述第二滑动装置套接在所述第二导轨，并且所述第二滑动装置可沿所述第二导轨滑动，所述反射镜和激光发生器均固定于所述第二滑动装置上，所述激光发生器所发射的激光入射至所述反射镜，所述反射镜向下反射所述激光，
    方法包括：
    接收打标指令；
    解析所述打标指令，获取所述激光控制参数和打标坐标，所述激光控制参数包括打标功率、激光频率、脉冲宽度、第一反射镜控制参数和第二反射镜控制参数；
    根据所述打标坐标控制所述第一滑动装置和第二滑动装置滑动，以使所述激光打标头所输出的激光的输出点的位置为所述打标坐标；
    根据所述激光控制参数控制激光发生器发射激光打标。
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